EP3459326A1 - Procédé pour enrober une unité électrique et composant électrique - Google Patents

Procédé pour enrober une unité électrique et composant électrique

Info

Publication number
EP3459326A1
EP3459326A1 EP17723680.9A EP17723680A EP3459326A1 EP 3459326 A1 EP3459326 A1 EP 3459326A1 EP 17723680 A EP17723680 A EP 17723680A EP 3459326 A1 EP3459326 A1 EP 3459326A1
Authority
EP
European Patent Office
Prior art keywords
mold body
electrical unit
plastic material
leadframe
shielding plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP17723680.9A
Other languages
German (de)
English (en)
Inventor
Lothar Biebricher
Dietmar Huber
Svenja Raukopf
Jakob Schillinger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Continental Automotive Technologies GmbH
Original Assignee
Continental Teves AG and Co OHG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Continental Teves AG and Co OHG filed Critical Continental Teves AG and Co OHG
Publication of EP3459326A1 publication Critical patent/EP3459326A1/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P1/00—Details of instruments
    • G01P1/02—Housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/49531—Additional leads the additional leads being a wiring board
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely

Definitions

  • the invention relates to a method for sheathing an electrical unit and to an electrical component which has been produced by means of such a method.
  • Components can, for example, be in the form of sensors for measuring accelerations or yaw rates or else other measured variables such as magnetic rotating fields or
  • Streaming and forwarding the preprocessed measurement signals to a higher-level evaluation or control can be used.
  • Such components can for example have a populated printed circuit board on which various electrical or electronic components are present.
  • a populated printed circuit board is pressed for example in a thermoplastic housing, wherein subsequently a lid is poured and cured or is lasered.
  • Different designs and Ferti ⁇ supply concepts in this regard are for different types of devices, especially for different types of sensors known.
  • a disadvantage of the known embodiments is in particular that the respective circuit board is located in a cavity. Diffusing moisture can thereby lead to migration, Cor ⁇ rosion and shorts. It has been shown that customer-specified requirements with regard to the installation space can not always be fulfilled.
  • a shield plate from ⁇ can be displayed only with great effort. Highest tightness classes typically can not be achieved.
  • the invention relates to a method for covering an electrical unit, the method comprising the following steps:
  • the electrical unit is completely enclosed by a typical chemically and mechanically stable plastic material. No corrosion, migration and short-circuiting are to be expected.
  • ultrasonic welding of additional components can be used. Compared to process guides, which are known from the prior art, fewer processes are required overall, which speeds up and simplifies the process.
  • a shielding plate is particularly easy in the process control according to the invention.
  • Known from the prior art guides this a considerably greater effort was needed to provide a reliable mounting of such a shielding plate for him ⁇ possible.
  • a shielding plate can improve the interference immunity of electronics and / or sensors.
  • the joining can be understood in particular to include pressing in, soldering such as hard or soft soldering, gluing, welding such as ultrasonic welding, laser welding or resistance welding, or also sintering.
  • soldering such as hard or soft soldering
  • gluing such as ultrasonic welding
  • laser welding laser resistance welding
  • sintering also sintering.
  • the leadframe may comprise at ⁇ play plug or crimp terminals.
  • metal strips for external contact can already be part of the leadframe.
  • the leadframe may have index holes and thus additionally serve as a transport and adjustment aid.
  • the electrical unit can for example be any electrical component which is suitable for carrying out ir ⁇ quietly which electrical functions.
  • a shunt resistor can also be attached, which in particular can have a section which is formed from manganin. This is a ty ⁇ pically used and proven resistance material, which allows a reliable measurement of the current flowing through tapping the voltage drop across it.
  • manganin it is also possible, for example, to use another resistance material, in particular another copper -nickel-manganese alloy.
  • the shunt resistor can be contacted, for example, at two points or also at more points, for example at four points. The latter allows in particular a four-point measurement, which may be advantageous, for example, in the case that a non-temperature-stable material is used.
  • the electrical unit or a printed circuit board can be fully enclosed by means of the method according to the invention, namely by a chemically and mechanically stable thermoset material. No corrosion, migration and short-circuiting are to be expected. This meets the highest demands on mechanical and chemical Bestän ⁇ speed. A shield is displayed without significant additional effort.
  • a design for a neutral part can be set and only needs custom Umspritzungssectionn needs to be varied. This means a significantly lower investment, fewer core processes and high volumes for the neutral part. Subassemblies with a lower number of pieces can be cost-effectively co-produced. The qualification, Design and Be ⁇ treuungsaufwand is reduced.
  • the shielding plate is attached by a step of punching out the shielding plate from the leadframe prior to the step of connecting the electrical unit to the leadframe. This allows a particularly simple provision of the shielding plate, which can be produced for example as part of the leadframe.
  • the shielding plate may be formed as a molded part and be attached by pressing into the electrical unit. This allows a separate production of the shielding and a greater freedom of design.
  • the shielding plate can in particular be mounted parallel to the electrical unit. This may in particular to respective extensions of the shielding plate or a
  • the electrical unit which may be formed in particular as a plate relate.
  • the shielding plate may be formed according to an advantageous embodiment as a trough, which receives the electrical unit.
  • a multi-sided enclosure of the electrical unit can be achieved.
  • the tub can preferably be covered by means of a tub cover. This can be achieved particularly advantageous all-round enclosure of the electrical unit. This allows a particularly advantageous protection against electromagnetic
  • a populated Lei ⁇ terplatte is preferably used as an electrical unit.
  • This may in particular be a circuit for measuring currents.
  • the method has proven to be particularly advantageous. It can also be an integrated Circuit (IC) can be used. In particular, this can be designed for a sensor.
  • IC integrated Circuit
  • the circuit board may for example be rigid, flexible or made of ceramic.
  • a Duro ⁇ plastic material can be used as a first plastic material. This is in particular chemically and mechanically stable.
  • thermo ⁇ plastic material As a second plastic material, in particular a thermo ⁇ plastic material can be used. This is easy to apply and has proven itself as an external protection. If contacts are to be connected during the process, these can in particular be connected to another element, in particular a shunt resistor, by welding, brazing, ultrasonic welding, laser welding, gluing, soldering, sintering and / or resistance welding. Such methods have proven themselves for typical applications.
  • the step of connecting the contacts to the shunt resistor is performed according to an embodiment after the step of sealing with the first plastic material.
  • the step of connecting the contacts to the shunt resistor may be performed prior to the step of surrounding the first plastic material.
  • a sensor is located on the electrical unit at least applied, and the method comprises step before the step of Ummanteins the electrical unit and the ex ⁇ shield sheet comprising a first plastic material following: Covering the sensor with a protective material, in particular with a low-viscosity material, preferably with a
  • the inner mold body is preferably connected after the step of Ummanteins with the first plastic material with a number of inserted or anchored support webs with the leadframe. This facilitates the process control and ensures a defined position of the inner mold body.
  • solid support ribs back ⁇ draggable support struts and designs can be used without support struts. This will be discussed further below.
  • An inserted support web can in particular be understood as a support web which can be completely removed from the mold body during punching.
  • Under an anchored support web can be understood in particular a support web, which is anchored in the mold body such that a part of the support web in each case remains in the mold body.
  • a number of convex and / or concave contours are formed according to an embodiment. These can be used to adjust other components or even during the mellow for fixing the first mold body in a second Moldtool, so a Moldtool for forming the outer mold body.
  • the contacts may advantageously each have a number of beads. This facilitates handling and leads to a better grip in surrounding structures. In addition, a creepage distance for any penetrating liquid verlän ⁇ siege.
  • the electrical unit may have a number of holes for
  • Anchoring in the first plastic material improves the hold of the electrical unit in the first plastic material, which prevents production errors.
  • a plug is formed, which allows easy provision of a connection component. Inserts can also be embedded so that prefabricated elements can be used and easily co-processed.
  • a rivet is gemoldet, in particular for connection to an additional component. This allows easy attachment and alignment of the additional component.
  • an additional surface activation of the inner mold body can take place, in particular before the step of Ummanteins with the second plastic material. This leads to an improved adhesion of the outer mold body on the inner mold body.
  • a second plastic material in particular PA (polyamide), PBT (polybutylene terephthalate), hotmelt or PU (polyurethane) can be used.
  • PA polyamide
  • PBT polybutylene terephthalate
  • hotmelt polyurethane
  • PU polyurethane
  • a step of connecting at least a first contact and a second contact to a shunt resistor may be performed. This can be done, in particular, before wrapping with the second plastic material to form an outer mold body.
  • a battery sensor can be advantageously formed.
  • the second mold body is formed according to an advantageous embodiment, at least partially in the form of a cage structure surrounding the inner mold body.
  • the outer mold body lies only partially on the inner mold body and is partially spaced from the inner mold body. This allows an advantageous decoupling to avoid the emergence of voltages which can falsify, for example, measurement results of a sensor.
  • the outer mold body has a cage area with a number of mutually spaced struts or brackets which are each spaced from the inner mold body. This allows protection of the inner mold body similar to a surrounding bicycle helmet. If, for example, impacts on the outer moldings occur, they are not forwarded directly to the inner mold body, which likewise helps to avoid tension and associated measuring errors.
  • the invention further relates to an electrical component which has been produced by means of a method according to the invention.
  • the method be ⁇ signed versions and variations may be resorted to all herein.
  • the outer Mold stresses is thereby typically, gegebe ⁇ appropriate, with protruding contacts, the device is.
  • Fig. 12 a modification with additionally protected
  • Fig. 13 the modification of Fig. 12 in a later
  • FIG. 16 shows the modification of FIG. 15 in a side view
  • Fig. 17 the modification of Figs. 15 and 16 in one
  • FIG. 18 shows the state of FIG. 17 in a side view
  • FIG. 19 shows a modification with additional support webs
  • FIG. 20 shows the state of FIG. 19 in a side view
  • Fig. 22 the modification of Fig. 21 in a plan view.
  • Fig. 1 shows an arrangement as typically occurs at the beginning of a method according to the invention.
  • a leadframe 10 is arranged, in which in ⁇ dexlöcher 11 are formed.
  • the leadframe 10 is used for stabilization and for transport, wherein it can be easily grasped and moved by means of the in ⁇ dexlöcher 11.
  • the index holes 11 are used in particular for transporting the leadframe 10 and for fine fixing in a mold tool. By means of the index holes, a mechanical adjustment of the lead frame 10 and thus of the already assembled component or of a sensor in the various devices and / or mold tools, which are used in the context of the method.
  • the leadframe 10 has dambars 12, which stabilize the leadframe 10 and are also designed for attaching further components.
  • Fixierlöcher 13 are formed, which can serve for fixing the leadframe 10 or other components.
  • the fixing holes 13 are used in particular for fixing the punched-out part in the Overmoldtool.
  • the leadframe 10 further includes a number of presently three terminals in the form of connector terminals 14, which serve as electrical contacts after completion of the manufacturing process. Furthermore, the leadframe 10 has two
  • the leadframe 10 has an anchored support web 16 and an inserted support web 18. Their function will be discussed later. It should be understood that none or a plurality of the support webs 16, 18 can also be present in each case.
  • An electrical unit in the form of a printed circuit board 20 is connected to the leadframe 10.
  • the circuit board 20 is attached to the connector terminals 14 and the shunt connection terminals 15, in the present case soldered. It can be here, however In principle, the other connection techniques described above are used, for example
  • a shield plate 45 is attached. This is arranged parallel to and above the printed circuit board 20. Furthermore, a number of holes 24 are formed in the printed circuit board 20, which serve to fix in a mold body described below.
  • the assembled printed circuit board 20 is shown in the lead frame composite.
  • the printed circuit board 20 serves in particular as a wiring carrier for sensors and additional circuitry.
  • sensors for example, acceleration sensors and yaw rate sensors in any combination are possible.
  • magnetic field sensors and current sensors can be used or manufactured.
  • the circuit board 20 may be in the process described below Mold stresses anchored through the holes 24 to ⁇ sharmlichen better Duroplast.
  • the connector terminals 14 are preferably already pre-punched. But it is also possible to connect the leadframe 10 in a separate connection process with the connector terminals 14.
  • the shielding plate 45 can be punched directly from the leadframe 10 or pressed into the printed circuit board 20 as a molded part.
  • the printed circuit board 20 is preferably pressed into the leadframe 10. But there are also other connection techniques, such as soldering and gluing, conceivable.
  • molded Ste ⁇ terminal terminals 14 can be attached.
  • the connection of the leadframe 10 with the molded connector terminals 14 can be made, inter alia, by welding, soldering, gluing or splicing.
  • a vertical position can be displayed. This will be shown later in FIG. Fig. 2 shows the arrangement of Fig. 1 in a side view after the pressing. It can further be seen that on the circuit board 20, a sensor 6 and also a number of electrical components 9 are arranged. These are presently applied to the printed circuit board 20 in SMD technology.
  • a state after the application of a first mold body 30 is shown.
  • the printed circuit board 20 is surrounded by the first mold body 30, which consists of a thermoset material.
  • the first mold body 30 may also be referred to as an inner mold body.
  • the first mold body 30 was made by sheathing the circuit board 20 by means of a thermoset material.
  • both the anchored support web 16 and the inserted support web 18 protrude into the first mold body 30.
  • the anchored support web 16 is designed so that it has a Wi ⁇ derhaken in the first mold body 20. Therefore, it is also called “anchored.”
  • the inserted support bar 18 however, has no barbs, so that it can be easily and completely pulled out of the first mold body 30.
  • the anchored support web 16, however, in any case remains partially in the first mold body 30, where it can be broken off with its lying outside of the first mold body 30 part.
  • the first mold body 30 provides in particular by its Duro ⁇ plastic material for a chemical and mechanical protection of the circuit board 20, wherein only the connector terminals 14 and the shunt connection terminals 15 protrude from the first mold body 30.
  • Shunt connection terminals 15 formed U-shaped, so that a connection from the circuit board 20 is formed to an area adjacent to the circuit board 20. As will also be shown below, this serves to connect a shunt resistor.
  • the assembled printed circuit board 20 has no contact with the outside world in the state shown. It is completely surrounded by a Duro ⁇ plastic material. As a result, the risk that Feuch ⁇ ACTION or corrosive media act on the printed circuit board 20 or the sensor is low. Mechanical stresses on the assembled components of the printed circuit board are small or negligible, since the coefficient of expansion of the thermoset ⁇ material is approximately equal to the circuit board 20 and the components thereon. In addition, the adhesion of the materials to each other is very good.
  • the support webs 16, 18 can be designed embeddable or veran ⁇ kerbar. They serve in addition, the Moldève, which is held only on one side of the Dambarseite, in addition against to support gravity-induced bending. These webs have no connection to the circuit board 20th
  • Fig. 4 shows the arrangement of Fig. 3 in a side view.
  • Fig. 5 shows the arrangement shown in Fig. 4 in a modification.
  • the fixings 32, 34 serve to anchor the mold body 30 in a superordinate structure or to fix it or else to attach other components to the mold body 30.
  • they provide the possibility of forming form-fitting connections with other components or superordinate structures, for example with a mold tool for a further jacket.
  • they are used for positioning and locking of the thermoset molding body 30 in the thermoplastic overmold tool.
  • the fixings 32, 34 may also be referred to as contours. It may be mentioned that the Fi ⁇ embassies settled 32, 34 or corresponding elements, for example, also laterally, ie transversely to the paper plane of Fig. 5 is formed.
  • FIG. 6 shows the arrangement of FIG. 3 after a punching out of the first mold body 30 from the leadframe 10.
  • the printed circuit board 20 can be seen with the first mold body 30 surrounding it, wherein the terminals 14, 15 connected thereto are made of the first mold body 30 stand out, which were originally part of the leadframe 10.
  • the terminals 14, 15 connected thereto are made of the first mold body 30 stand out, which were originally part of the leadframe 10.
  • the rest of the lead frame 10 can still be seen on the outside.
  • a number of anchor holes 24, which are no longer visible, are formed in the printed circuit board 20, which serve to better fix the printed circuit board 20 in the first molded body 30.
  • a non-illustrated Ent ⁇ coupling zone may be formed, in which a certain mobility between the terminals 14, 15 and the circuit board 20 and the first mold body 30 is provided.
  • the decoupling zone has been found to be particularly advantageous in ultrasonic welding of the shunt connection terminals 15 to a shunt resistor, since possibly leading to delamination vibration coupling into the first mold body 30 can be prevented.
  • the terminals 14, 15 are now executed as single pins. If necessary, a programming pin can be provided, which is no longer accessible after the final mold.
  • All terminals 14, 15 can be beaded to extend the creepage distance for moisture and provide better anchoring in the overmold.
  • a bead not shown in FIG. 6, may be provided, which extends a creeping distance for moisture and allows a better anchoring in a second mold body to be subsequently formed.
  • a shunt resistor not shown in FIG. 6, can be applied, which is shown below as shunt resistor 40.
  • the shunt Resistance 40 can in this case be secured by ultrasonic welding to welds to the shunt connection terminals 15. In principle, other connection techniques as described above can also be used.
  • a voltage can be measured, which drops approximately at a width of the first mold body 30 at the shunt resistor 40. This allows a conclusion on the current flowing through.
  • FIG. 7 shows a state of the arrangement of FIG. 6 after the application of a second mold body 50.
  • the second mold body 50 can also be referred to as an outer mold body.
  • the second Mold manipulate 50 present case consists of a thermoplastic material and surrounds the circuit board 20 and the first Moldève 30 as well as the most part, the shunt-connection terminals 15, the plug ⁇ terminals 14 and, if present, the shunt resistor is not shown here 40.
  • a shunt connection terminal 15, which is shown in the picture above, is slightly modified with regard to its contact to the outside, in particular in comparison to the state shown in FIG.
  • the connector terminals 14 protrude beyond the second mold body 50, so that an electrical contacting of the circuit board 20 is possible. Furthermore, if present, a first contacting surface and a second contacting surface of the shunt resistor 40 protrude beyond the second molded body 50 to allow connection of external components. For example, other electrical units or an external circuit can be connected to these contacting surfaces, wherein a current flowing through the shunt resistor 40 can be measured by the printed circuit board 20. Corresponding signals which are indicative of such a current can be given via the connector terminals 14 to further units.
  • the final wrapping of the Duroplastgemoldeten printed circuit board 20 is particularly preferably made with a thermoplastic material.
  • a plug 56 is formed. If necessary, further inserts, such as e.g. Sleeves, pivot bearings, shunts, etc. are embedded in the thermoplastic body.
  • an insert part in the form of a fastening part 53 is located in the second mold body 50. This allows, for example, attachment to other components.
  • Fig. 8 shows the arrangement of Fig. 7 in a side view.
  • a rivet 52 for hot caulking is formed on the underside of the second mold body 50.
  • the plug 56 is formed on the right, which allows easy contacting of the connector terminals 14 and / or the shunt connection terminals 15.
  • the finished arrangement shown in FIGS. 7 and 8 after completion of a possible embodiment of the method according to the invention can be referred to as electrical component 5.
  • This can be used in a higher-level component or a unit such as a motor vehicle, in particular ⁇ sondere to measure a current.
  • a motor vehicle in particular ⁇ sondere to measure a current.
  • different Pinkonfigurationen are possible, which are shown schematically in Figure 9.
  • FIG. 9 a modification to the embodiment according to FIG. 8 is shown.
  • a retractable support pin or support bar can be used. After closing the tool, it will be withdrawn accordingly. A possible result is shown in Fig. 9 by reference numeral 32a.
  • a fixed support pin or support bar can also be used.
  • the support pin forms the contour in the overmold.
  • a possible result is shown in Fig. 9 with Be ⁇ reference symbol 32b.
  • Duroplast body serves for example as a spacer in the Overmoldtool. A possible result is shown in Fig. 9 by reference numeral 32c.
  • Fig. 10 a modified embodiment is shown, in which the circuit board 20 is pressed perpendicular to the connector terminals 14.
  • Fig. 10 a modified embodiment is shown, in which the circuit board 20 is pressed perpendicular to the connector terminals 14.
  • other sensing directions for example, can be realized in the case of sensors with sensing axes that are orthogonal to the measuring direction.
  • FIG. 11 shows a modification in which the thermoplastic casing or the second mold body 50 is designed by partial shaping in such a way that the thermo-mechanical stress on the sensor element is minimized.
  • the second mold body As shown, it does not completely enclose the first mold body 30, but only partially.
  • FIG. 12 shows a modification from a state before the application of the first mold body 30, in which an envelope 7 made of a low-viscosity material, in particular Globtop, has been applied over the sensor 6. This serves in particular to protect the sensor against thermo-mechanical stress in a special way.
  • FIG. 13 shows the embodiment of FIG. 13 after encasing with the two moldings 30, 50, ie in particular as a finished component 5.
  • FIG. 14 a shows a modification of a finished component 5, in which the second mold body 50 does not comprise the first mold body 30 completely encloses, but only partially.
  • Fig. 14a shows a plan view.
  • Fig. 14b shows the state of Fig. 14a in a side view.
  • the two mold bodies 30, 50 are designed directly adjacent to one another.
  • an interface 59 is formed between the two Mold stresses 30, 50, which is to be protected in a special way against ingress of moisture. This will be discussed further below.
  • the second mold body 50 is designed in the form of protectors 58. These enclose the first mold body 30 only partially, so that the first mold body 30 can still be seen.
  • the protectors 58 are similar in effect to a bicycle helmet, ie, they hold shocks from the first one Mold body 30 remote and ensure a mechanical decoupling between the two Mold stresses 30, 50.
  • the occurrence of mechanical tension in the first mold body 30, which can lead to falsified measurement results, for example, in sensors, can be effectively prevented.
  • the occurrence of thermal stresses can be prevented with temperature changes.
  • thermoset material is typically hard and brittle. To protect it against mechanical damage, it can be protected by the protectors 58 against static and dynamic forces.
  • These pro ⁇ detectors 58 are designed in the form of a bow, in ⁇ example similar to a bicycle helmet, and keep external forces from the epoxy mold or from the first mold body 30 away.
  • FIGS. 14a, 14b In contrast to a full cladding with thermoplastic, which is shown for example in FIG. 7, the embodiment of FIGS. 14a, 14b has the advantage of decoupling the thermoset from the thermoplastic cladding through a gap. Thermo-mechanical forces of the thermoplastic on the thermoset and from there on a sensor element are largely suppressed.
  • a gap formation between protectors and thermoset housing is produced, for example, by a special adjustment of the overmold process or tool-bound.
  • thermoset material can be used to support the thermoset pre-molded part in the thermoplastic overmold tool.
  • thermoset body In an adhesion zone or the interface 59, which is achieved by special surface treatment of the thermoset body, there is an increased adhesion of the thermoplastic to Thermoset before. This ensures that no corrosive or conductive materials or liquids penetrate into the contact area of the Duroplast stressess and there damage or short circuit the electrical contact.
  • the surface treatment or surface treatment of a Duroplast stresses or more generally of the first Mold stresses 30 can be carried out in particular by plasma treatment or by laser treatment. This has proven itself for producing the desired permanent tightness.
  • circuit board 20 is mechanically and chemically protected in two molding steps.
  • thermoset body can increase the adhesion of the overmold to the thermoset mold.
  • the fully calibrated and tested sensors can be used as BGA or QFN (with and without internal additional circuitry).
  • On the circuit board 20 thereby a custom wiring is possible without increased effort.
  • the connection technique is preferably in soldering, as was provided in the design of the sensor.
  • the Duroplastmold can also be used as Underfiiier.
  • the plug can be replaced by a cable. It is advantageous if the dimension of the printed circuit board is standardized, since then the production facilities can be optimized to this / this format (s). This corresponds to the strategy of the IC manufacturers by determining the shape of the housing.
  • the leadframe acts as a holder, adjustment and electrical contact with the circuit board.
  • the circuit board 20 itself requires no direct connection to the outside. It is completely enveloped by the thermoset material, which lies very close to the printed circuit board material in the coefficient of expansion. The only occurs ⁇ ask to for contamination is in the range of terminals.
  • these channels are advantageously sealed because the duroplastic material makes a connection with the leadframe materials.
  • the printed circuit board 20 may be replaced by one or more integrated circuits (IC) which are connected to the leadframe by suitable techniques such as soldering, gluing or welding. Additional circuits such as capacitors can be fitted directly to the leadframe terminals within the thermoset.
  • IC integrated circuits
  • Thermoplastic referred are typically PA, PBT, hotmelt or PU into consideration.
  • the final coating can typically be done by injection mint or RIM mellow.
  • thermoset a thermoset material or a thermoset material for the inner mold body and also of a thermoplastic, a thermoplastic material or a thermoplastic material for the outer mold body. This refers only to the currently considered most suitable execution. It should be understood that these terms can in principle be generalized, in particular to more general plastic materials or in general materials or moldings. The disclosure of this application fully encompasses a corresponding modification or generalization.
  • FIG. 15 shows an alternative embodiment in a method stage prior to application of the first mold body 30, wherein a shielding trough 45 is used instead of a mere shielding plate.
  • the shielding trough 45 can be formed, in particular, with the leadframe 10, wherein the printed circuit board 20 is inserted into the formed shielding trough 45 or introduced in any other way.
  • Fig. 16 is a side view of the state shown in Fig. 15; In this case, the shielding trough 45 can be seen in its trough-like design. Covered is the shielding trough 45 with a cover 46. This ensures an all-round enclosure of the circuit board 20 and thus for a particularly effective protection against electromagnetic interference.
  • FIGS. 15 and 16 show the embodiment of FIGS. 15 and 16 after the application of the first mold body 30.
  • Fig. 18 shows the state of Fig. 17 in a side view. It should be noted that while the lid 46 is not shown. It should generally be noted that in one embodiment of the idea of the molded shielding plate, the shielding plate is designed as a trough or shielding trough.
  • the leadframe 10 can be punched and formed so that continuous shielding troughs 45 in the leadframe assembly can be manufactured, in which the fully assembled and balanced printed circuit board 20 can be inserted and contacted.
  • This intermediate product can now be punched free or molded in the leadframe composite, which preferably takes place with duroplastic molding material.
  • the shielding trough 45 may, for example, only be filled with molding material on the inside or it may also be completely ummoldet.
  • the shielding trough 45 may additionally contain fastening elements.
  • the trough shape is particularly advantageous in high frequency (RF) assemblies when effective and effective protection against spurious and spurious radiation is required.
  • this module can be screwed to the shielding trough 45 on the outside of a metal surface that takes over the shielding of the second half.
  • FIG. 19 shows a modification to the state of FIG. 3, wherein additional support webs 15 b are provided which carry the first mold body 30.
  • Fig. 20 shows the state of Fig. 19 in a side view. It can be seen that vertical parts of the additional support webs 15b, which are designated by the reference numeral 15b, are connected to the shunt connection terminals 15. If these are connected to a shunt resistor, which will be described in more detail below, thus, the vertical parts 15b can connect the shunt resistor to the circuit board 20, while the shunt resistor can also be contacted from the outside by means of the shunt connection terminals 15.
  • components 22 are mounted above the printed circuit board 20.
  • Fig. 21 shows a side view of a finished component 5 with separate protectors. It can be seen that in the right-hand part of the first mold body 30 and the second mold body 50 adjacent to each other directly at the interface 59, while in the left part of a gap 51 between the first mold body 30 and the second Mold stresses 50 is formed. Through the gap 51, the formation or transmission of tension, which can falsify measurement results, is effectively avoided. Furthermore, a shunt resistor 40 can be seen in the embodiment according to FIG. 21, which is embedded beneath the printed circuit board 20 in the second mold body 50, but not in the first mold body 30.
  • This shunt resistor 40 may in particular be a temperature-independent, for example, temperature and / or long-term stable reference resistance, which is used for the measurement of a current, in particular a battery current. It is in particular advantageous ⁇ sondere mechanically stabilized by the embodiment shown and protected.
  • Fig. 22 shows a plan view of the state shown in Fig. 21. It can be seen that a first contact region 44 and a second contact region 46 are formed on the shunt 40 laterally to the first mold body 30. This allows the shunt to be connected to cables or cables that carry a current to be measured.
  • the shunt 40 is connected in particular to the shunt connection terminals 15.
  • the shunt resistor 40 can also be referred to as an insert part with an electrical function, which can be connected to the terminals 15 via the frontal outlet or to the alternative terminals or vertical parts 15b via the lateral outlet to the printed circuit board 20.
  • This part can also be omitted and there is only a realized with a cage structure or a second Kochmoldung Moldève 50.
  • the cage structure of the second Mold stressess 50 is at ⁇ stress-sensitive components such.
  • advantageous because a positive connection is prevented locally in the region of the sensor.
  • cage structures can be carried out by means of slides mounted in the tool or else by targeted surface activation and non-activation.
  • steps of the method according to the invention can be carried out in the order given. However, they can also be executed in a different order.
  • the method according to the invention can be carried out in one of its embodiments, for example with a specific combination of steps, in such a way that no further steps are carried out. However, in principle also further steps can be carried out, even those which are not mentioned.
  • Characteristic or a group of features is not absolutely necessary, the applicant is now already seeking a formulation of at least one independent claim, which no longer has the feature or group of features. This may be a sub-combination of a present on at ⁇ meldetag claim or a one-ge Suse by other features sub-combination of a present at the filing claim, for example. Such to be reformulated Claims or feature combinations are to be understood as covered by the disclosure of this application.

Abstract

L'invention concerne un procédé pour enrober une unité électrique, ladite unité électrique étant reliée à une grille de connexion et présentant un enrobage double. L'invention concerne en outre un composant électrique correspondant.
EP17723680.9A 2016-05-20 2017-05-12 Procédé pour enrober une unité électrique et composant électrique Pending EP3459326A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102016208782.7A DE102016208782A1 (de) 2016-05-20 2016-05-20 Verfahren zum Ummanteln einer elektrischen Einheit und elektrisches Bauelement
PCT/EP2017/061505 WO2017198573A1 (fr) 2016-05-20 2017-05-12 Procédé pour enrober une unité électrique et composant électrique

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EP3459326A1 true EP3459326A1 (fr) 2019-03-27

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DE (1) DE102016208782A1 (fr)
WO (1) WO2017198573A1 (fr)

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Publication number Priority date Publication date Assignee Title
DE102017208076A1 (de) 2017-05-12 2018-11-15 Magna Powertrain Bad Homburg GmbH Bauteil mit EMV Schutz für elektronische Platine

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DE4430798A1 (de) * 1994-08-30 1996-03-07 Siemens Ag Stanzgitter zur Verbindung von elektrischen Bauelementen
DD113583A2 (de) * 1974-07-09 1975-06-12 Manfred Gruber Verfahren zur herstellung raeumlicher baukoerper
GB2191632A (en) * 1986-06-16 1987-12-16 George D Wolff Position sensor assemblies and methods for fabricating same
DE4325712C2 (de) * 1993-07-30 1996-03-21 Siemens Ag Verfahren zum Verkapseln von elektrischen oder elektronischen Bauelementen oder Baugruppen und Verkapselung von elektrischen oder elektronischen Bauelementen oder Baugruppen
DE19640255C2 (de) * 1996-09-30 2001-01-18 Tyco Electronics Logistics Ag Verfahren zur Herstellung eines elektronischen Moduls mit einem kunststoffumspritzten Leadframe
DE102009026804A1 (de) * 2009-06-08 2010-12-09 Robert Bosch Gmbh Verfahren zur Herstellung elektronischer Bauteile
DE112010003624T5 (de) * 2009-09-10 2012-08-02 Inteva Products, Llc Gehäusebauteil für eine Türschlossbaugruppe und Verfahren zu deren Herstellung
US8304887B2 (en) * 2009-12-10 2012-11-06 Texas Instruments Incorporated Module package with embedded substrate and leadframe
AT12317U1 (de) * 2010-04-13 2012-03-15 Austria Tech & System Tech Verfahren zur integration eines elektronischen bauteils in eine leiterplatte sowie leiterplatte mit einem darin integrierten elektronischen bauteil
US8636252B2 (en) * 2010-06-25 2014-01-28 The Boeing Company Composite structures having integrated stiffeners with smooth runouts and method of making the same
DE102010061750A1 (de) * 2010-11-23 2012-05-24 Robert Bosch Gmbh Bauteil mit einer elektronischen Einrichtung und Verfahren zu dessen Herstellung
US20150268261A1 (en) * 2014-03-18 2015-09-24 Trw Automotive U.S. Llc Circuit mounting apparatus and method using a segmented lead-frame
DE102015206299B4 (de) * 2014-04-24 2023-08-31 Continental Automotive Technologies GmbH Über Leiterplatte auf Leadframe verschaltete Sensorschaltung
DE102014213588A1 (de) * 2014-07-11 2016-02-18 Continental Teves Ag & Co. Ohg Kundenspezifischer Sensor hergestellt durch Dreifach-Molden
DE102014218711A1 (de) * 2014-09-17 2016-03-17 Continental Teves Ag & Co. Ohg Feuchtigkeitserfassung innerhalb eines Sensors

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WO2017198573A1 (fr) 2017-11-23

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