EP2797341B1 - Suspension for sound transducer - Google Patents

Suspension for sound transducer Download PDF

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Publication number
EP2797341B1
EP2797341B1 EP13004360.7A EP13004360A EP2797341B1 EP 2797341 B1 EP2797341 B1 EP 2797341B1 EP 13004360 A EP13004360 A EP 13004360A EP 2797341 B1 EP2797341 B1 EP 2797341B1
Authority
EP
European Patent Office
Prior art keywords
suspension
voice coil
sound transducer
film
conductive pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP13004360.7A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP2797341A1 (en
Inventor
Ji Hoon Kim
Joong Hak Kwon
Jung Hyung Lee
Hyeon Taek Oh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EM Tech Co Ltd
Original Assignee
EM Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EM Tech Co Ltd filed Critical EM Tech Co Ltd
Publication of EP2797341A1 publication Critical patent/EP2797341A1/en
Application granted granted Critical
Publication of EP2797341B1 publication Critical patent/EP2797341B1/en
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/06—Arranging circuit leads; Relieving strain on circuit leads
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/16—Mounting or tensioning of diaphragms or cones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/16—Mounting or tensioning of diaphragms or cones
    • H04R7/18—Mounting or tensioning of diaphragms or cones at the periphery
    • H04R7/20—Securing diaphragm or cone resiliently to support by flexible material, springs, cords, or strands
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/003—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor for diaphragms or their outer suspension

Definitions

  • the present invention relates to a suspension for a sound transducer.
  • FIG. 1 is a view showing an example of a conventional sound transducer.
  • a yoke 21, an inner ring magnet 22, an outer ring magnet 23, an inner ring top plate 24, and an outer ring top plate 25 are installed within a frame 10, and a voice coil 30 is placed in an air gap between the inner ring magnet 22 and the outer ring magnet 23 and vibrates vertically when power is applied to the voice coil 30.
  • the voice coil 30 is mounted to the bottom side of a suspension 40, and a side diaphragm 51 and a center diaphragm 52 are installed on the top and bottom sides of the suspension 40 and vibrate in synchrony with the vibration of the voice coil 30, producing a sound.
  • a protector 60 is connected to the top of the side diaphragm 51 and center diaphragm 52 to protect the parts located inside a speaker.
  • the protector 60 includes a ring-shaped steel portion 61 with an opening in the middle to emit a sound, and a ring-shaped injection portion 62, through which the steel portion 61 is inserted and injection-molded and which is laminated on top of the frame 10, the outer periphery of the side diaphragm 51, and the outer periphery of the suspension 40.
  • a bonding surface for attaching the suspension 40 and the center diaphragm 52 is required, and a bonding layer is required between the suspension 40 and the center diaphragm 52, thus causing an increase in laminate thickness and large deviations in operation.
  • FIG. 2 is a view showing another example of a conventional sound transducer.
  • This sound transducer is identical to the conventional sound transducer of FIG. 1 in that a yoke 21, an inner ring magnet 22, an outer ring magnet 23, an inner ring top plate 24, and an outer ring top plate 25 are installed within a frame 10, a voice coil 30 is placed in an air gap between the inner ring magnet 22 and the outer ring magnet 23, and the voice coil 30 is mounted to the bottom side of a suspension 40'.
  • this sound transducer is different from the conventional sound transducer of FIG. 1 in that no center diaphragm is manufactured and attached separately, but instead the central portion of the suspension 40' serves as the center diaphragm because it is not perforated.
  • the side diaphragm 51 is attached to the top and bottom sides of the suspension, and a protector 60 is also provided to protect the parts located within a speaker.
  • a protector 60 is also provided to protect the parts located within a speaker.
  • the central portion of the suspension 40' takes the place of a center diaphragm, it lowers sound pressure due to its heavy weight.
  • the suspension is made thinner to reduce the weight, it weakens the rigidity of the suspension and therefore causes dips in sound pressure at high frequencies, resulting in deterioration of acoustic characteristics.
  • EP 1 128 705 A2 discloses a speaker where by forming a flange portion protruding inward in a radial direction at an upper end portion of a voice coil, a coiling sectional shape of the voice coil is set to a L-shape. The upper end portion of this voice coil is bonded and fixed to a central flat portion of a diaphragm. Hereby, the large bonding area can be obtained between the voice coil and the diaphragm, so that separation of the voice coil can be prevented.
  • EP 2 490 461 A2 discloses a sound converter which can solve a problem In that a vibration space decreases in the sound converter requiring high outputs, as the overall height of a voice coil increases.
  • An object of the present invention is to provide a suspension which reduces the laminate thickness of a sound transducer and which is rigid enough to enhance acoustic characteristics at high frequencies.
  • the suspension includes a base film, a conductive pattern attached to both sides of the base film, and a cover layer attached on the conductive pattern, and at least one of the conductive pattern and cover layer attached on at least one side of the mold portion is removed.
  • the base film is made of any one of a PI film, a PEI-F film, a PEEK film, and a PEN film.
  • the cover layer is made of any one of a PI film, a PEI-F film, a PEEK film, and a PEN film.
  • the suspension has a bonding portion formed inside a voice coil attachment position to bond the lead wire of the voice coil, and the suspension has an escape portion provided at the voice coil attachment position, which is formed by removing a predetermined size of conductive pattern and cover layer so as to take out the lead wire of the voice coil towards the bonding portion without interference.
  • the mold portion includes a forward dome portion that projects upward and a reverse dome portion that projects downward.
  • the suspension has a bonding portion formed in the central portion to bond the lead wire of the voice coil, and the mold portion is formed avoiding the bonding portion.
  • the suspension has a bonding portion formed inside a voice coil attachment position to bond the lead wire of the voice coil, and the suspension has a perforated portion of a predetermined size formed at the voice coil attachment position so as to take out the lead wire of the voice coil towards the bonding portion without interference.
  • the mold portion further includes an additional conductive pattern layer for increasing rigidity.
  • the suspension consists of an FPCB, and an FPCB pattern is formed by etching or electrodeposition.
  • the suspension for the sound transducer provided by the present invention can improve the rigidity of the suspension's central portion serving as a center diaphragm since a mold portion is provided in the central portion in a forward dome shape or reverse dome shape, thereby improving acoustic characteristics at high frequencies.
  • the suspension for the sound transducer provided by the present invention can simplify the assembly process and reduce the overall laminate thickness of the sound transducer because it is not necessary to manufacture and attach a center diaphragm separately.
  • the suspension for the sound transducer provided by the present invention can reduce the rate of defects caused by deviations in operation because it is not necessary to manufacture and attach a center diaphragm separately.
  • FIG. 3 is a view showing a suspension for a sound transducer according to a first embodiment of the present invention.
  • the suspension 100 for the sound transducer according to the first embodiment of the present invention includes a central portion 110 to which the inner periphery of a side diaphragm (not shown) and a voice coil (not shown) are attached, an outer peripheral portion 120 resting on a frame (not shown), and a connecting portion 130 connecting the central portion 110 and the outer peripheral portion 120.
  • the central portion 110 includes a flat surface 112 being flat and having the same height as the outer peripheral portion 120 and the connecting portion 130, a forward dome portion 114 projecting upward from the flat surface 112, and a reverse dome portion 116 projecting downward from the flat surface 112.
  • the bottom side refers to the side where the voice coil 300 is attached
  • the top side refers to the side of a protector (not shown) of the sound transducer.
  • the reverse dome portion 116 is formed at the center of the central portion 110, and the forward dome portion 114 is provided in pair to surround both sides of the reverse dome portion 116.
  • the forward dome portion 114 and the reverse dome portion 116 may be arranged in a reverse order, and the design of the forward dome portion 114 and reverse dome portion 116 may be changed regardless of the first embodiment, including their number of units and their shape. Otherwise, the forward dome portion 114 alone or the reverse dome portion 116 alone may be formed.
  • the suspension 100 consists of an FPCB, and a conductive pattern layer 100b is formed in a predetermined pattern on a base film 100a, and a cover layer 100c is attached onto the conductive pattern layer 100b.
  • the conductive pattern layer 100b is formed in pair to transmit positive and negative electrical signals and extends from a terminal bonding portion 140 formed at one side of the outer peripheral portion 120 to a bonding portion 150, which is to be described later, formed inside the central portion 110 through the outer peripheral portion 120, the connecting portion 130, and the central portion 110.
  • the pattern of the FPCB may be formed by etching or electrodeposition.
  • FIG. 4 is a view showing a laminated section of a suspension for a sound transducer according to a second embodiment of the present invention.
  • the suspension for the sound transducer according to the present invention is manufactured by forming a conductive pattern layer 100b such as Cu on both sides of a base film 100a made of a PI film, a PEI-F film, a PEEK film, or a PEN film, and forming a cover layer 100c likewise made of a PI film, a PEI-F film, a PEEK film, or a PEN film on the conductive pattern layer 100b.
  • both the conductive pattern layer 100b and the cover layer 100c are removed from the upper and lower surfaces of a mold portion including the forward dome portion 114 and the reverse dome portion 116. Accordingly, the mold portion of the suspension 100 is made only of the base film 100a.
  • FIG. 5 is a view showing a laminated section of a suspension for a sound transducer according to a third embodiment of the present invention.
  • This embodiment is identical to the second embodiment in that the suspension for the transducer is manufactured by forming a conductive pattern layer 100b such as Cu on both sides of a base film 100a and forming a cover layer 100c on the conductive pattern layer 100b.
  • a conductive pattern layer 100b such as Cu
  • cover layer 100c on the conductive pattern layer 100b.
  • FIG. 6 is a view showing a laminated section of a suspension for a sound transducer according to a fourth embodiment of the present invention.
  • This embodiment is identical to the second and third embodiments in that the suspension for the transducer is manufactured by forming a conductive pattern layer 100b such as Cu on both sides of a base film 100a and forming a cover layer 100c on the conductive pattern layer 100b.
  • a conductive pattern layer 100b such as Cu
  • cover layer 100c on the conductive pattern layer 100b.
  • FIG. 7 is a view showing a laminated section of a suspension for a sound transducer according to a fifth embodiment of the present invention.
  • This embodiment is identical to the second to fourth embodiments in that the suspension for the transducer is manufactured by forming a conductive pattern layer 100b such as Cu on both sides of a base film 100a and forming a cover layer 100c on the conductive pattern layer 100b.
  • both the conductive pattern layer 100b and the cover layer 100c are removed from the lower surface of a mold portion, and only the conductive pattern layer 100b is removed from the upper surface thereof. Accordingly, the top side of the suspension for the sound transducer exposes the cover layer 100c, and the bottom side thereof exposes the base film 100a.
  • FIG. 8 is a view showing a laminated section of a suspension for a sound transducer according to a sixth embodiment of the present invention.
  • This embodiment is identical to the second to fifth embodiments in that the suspension for the transducer is manufactured by forming a conductive pattern layer 100b such as Cu on both sides of a base film 100a and forming a cover layer 100c on the conductive pattern layer 100b.
  • both the conductive pattern layer 100b and the cover layer 100c are removed from the upper surface of a mold portion, and only the conductive pattern layer 100b is removed from the lower surface thereof. Accordingly, the bottom side of the suspension for the sound transducer exposes the cover layer 100c, and the top side thereof exposes the base film 100a.
  • the second to sixth embodiments of the present invention relate to a laminated section of a mold portion of a suspension for a sound transducer. These embodiments may be applied in conjunction with any one of the first, seventh and eighth embodiments regarding the shape of the suspension.
  • FIG 9 and FIG. 10 are views showing a suspension for a sound transducer according to a seventh embodiment of the present invention.
  • the central portion 110 includes a flat surface 112 being flat and having the same height as the outer peripheral portion 120 and the connecting portion 130, a forward dome portion 114 projecting upward from the flat surface 112, and a reverse dome portion 116 projecting downward from the flat surface 112.
  • the forward dome portion 114 is formed in pair with a space between them so as to be symmetrical with respect to the long axis, and the reverse dome portion 116 is formed between the pair of forward dome portions 114.
  • the length of the reverse dome portion 116 is smaller than the length of the forward dome portion 114, and therefore the flat surface 112, as well as the reverse dome portion 116, is formed between the pair of forward dome portion 114. That is, the flat surface 112 consists of an outer periphery of the central portion 110, to which a voice coil 300 is attached, and a portion extended to a predetermined length between the outer periphery and the forward dome portion 114.
  • a bonding portion 150 for bonding the lead wire of the voice coil 300 is formed on the flat surface 112 on the bottom side of the suspension 100. Particularly, the bonding portion 150 is formed in extended regions between the forward dome portions 114 on the flat surface 112. The lead wire of the voice coil 300 is taken out towards the inside of the voice coil 300 and bonded to the bonding portion 150, so that electrical signals are transmitted to the voice coil 300 by a conductive pattern layer 100b running from the terminal bonding portion 140 (see FIG. 3 ) to the bonding portion 150.
  • FIG. 11 is a view showing a sound transducer including a suspension according to an eighth embodiment of the present invention.
  • a perforated portion 160 of a predetermined size is formed at a voice coil attachment position, so that the lead wire of the voice coil 300 is taken out towards the bonding portion 150 (see FIG. 10 ) without interference, when the bonding portion 150 (see FIG. 10 ) is provided on the flat surface 112 (see FIG. 10 ) of the central portion 110 (see FIG. 3 ) on the bottom side of the suspension 100, as in the seventh embodiment of the present invention.
  • a perforated portion 160 By forming a perforated portion 160 on a lead-out passage along which the lead wire of the voice coil is taken out from the voice coil 300 towards the bonding portion 150 (see FIG. 10 ), a number of problems are avoided, including deformation in the shape of the central portion 110 due to interference between the lead wire of the voice coil and the central portion 110 of the suspension.
  • FIG. 12 is a view showing a suspension for a sound transducer according to a ninth embodiment of the present invention.
  • a removed portion 170 formed by removing a predetermined size of cover layer 100c or cover layer 100c and conductive pattern layer 100c, is formed at a voice coil attachment position, so that the lead wire of the voice coil 300 is taken out towards the bonding portion 150 (see FIG. 10 ) without interference, when the bonding portion 150 (see FIG. 10 ) is provided on the flat surface 112 (see FIG. 10 ) of the central portion 110 (see FIG. 3 ) on the bottom side of the suspension 100, as in the seventh embodiment of the present invention.
  • FIG. 13 is a view showing a suspension for a sound transducer according to a tenth embodiment of the present invention.
  • the suspension 100 according to the tenth embodiment of the present invention can increase the rigidity of the reverse dome portion 116 and enhance acoustic characteristics at high frequencies, by providing an additional conductive pattern layer 180 on the reverse dome portion 116 formed in the central portion 110 (see FIG. 3 ) of the suspension 100.
  • the additional conductive pattern layer 180 shown in the tenth embodiment has a lattice form, the additional conductive pattern layer 180 may be in different forms, such as a plurality of parallel lines, cross lines, etc, which can improve rigidity while minimizing an increase in weight.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)
  • Diaphragms For Electromechanical Transducers (AREA)
EP13004360.7A 2013-04-24 2013-09-05 Suspension for sound transducer Not-in-force EP2797341B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20130045488A KR101483089B1 (ko) 2013-04-24 2013-04-24 음향변환장치의 서스펜션

Publications (2)

Publication Number Publication Date
EP2797341A1 EP2797341A1 (en) 2014-10-29
EP2797341B1 true EP2797341B1 (en) 2016-03-30

Family

ID=49118280

Family Applications (1)

Application Number Title Priority Date Filing Date
EP13004360.7A Not-in-force EP2797341B1 (en) 2013-04-24 2013-09-05 Suspension for sound transducer

Country Status (5)

Country Link
US (1) US9185477B2 (zh)
EP (1) EP2797341B1 (zh)
JP (1) JP2014217042A (zh)
KR (1) KR101483089B1 (zh)
CN (1) CN104125529B (zh)

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KR101670589B1 (ko) * 2015-04-21 2016-11-10 주식회사 이엠텍 슬림형 마이크로스피커
KR101673296B1 (ko) * 2015-06-12 2016-11-08 주식회사 비에스이 패턴 다이어프램 및 이의 제조방법
KR101673297B1 (ko) * 2015-06-19 2016-11-08 주식회사 비에스이 스피커용 서스펜션 및 그 제조방법
US20170099536A1 (en) * 2015-10-06 2017-04-06 Sound Solutions International Co., Ltd. Electroacoustic transducer with flexible coilwire connection
CN105578364B (zh) * 2016-03-21 2019-09-17 歌尔股份有限公司 振动系统的制作方法以及扬声器单体
KR20200016327A (ko) * 2017-06-07 2020-02-14 가부시키가이샤 아사히 덴카 겐큐쇼 가요성 복합 필름, 그것을 이용한 가요성 회로 필름
CN109218958A (zh) * 2017-06-30 2019-01-15 鹏鼎控股(深圳)股份有限公司 柔性电路板及其制造方法和包含所述柔性电路板的扬声器
CN108810767B (zh) * 2018-08-03 2020-11-17 瑞声科技(新加坡)有限公司 扬声器及扬声器的制作方法
CN208638634U (zh) * 2018-08-05 2019-03-22 瑞声科技(新加坡)有限公司 扬声器
KR102120768B1 (ko) * 2019-03-25 2020-06-18 삼원액트 주식회사 서스펜션 제조 방법, 이에 의해 제조된 서스펜션
CN111246661B (zh) * 2020-04-27 2020-08-04 共达电声股份有限公司 一种柔性电路板及扬声器

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Also Published As

Publication number Publication date
US9185477B2 (en) 2015-11-10
US20140321691A1 (en) 2014-10-30
EP2797341A1 (en) 2014-10-29
CN104125529A (zh) 2014-10-29
JP2014217042A (ja) 2014-11-17
KR101483089B1 (ko) 2015-01-19
CN104125529B (zh) 2018-06-26
KR20140127432A (ko) 2014-11-04

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