EP2787801A4 - Râtelier pour équipement électronique, et dispositif de traitement d'information - Google Patents

Râtelier pour équipement électronique, et dispositif de traitement d'information

Info

Publication number
EP2787801A4
EP2787801A4 EP11876495.0A EP11876495A EP2787801A4 EP 2787801 A4 EP2787801 A4 EP 2787801A4 EP 11876495 A EP11876495 A EP 11876495A EP 2787801 A4 EP2787801 A4 EP 2787801A4
Authority
EP
European Patent Office
Prior art keywords
rack
information processing
processing device
electronic equipment
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP11876495.0A
Other languages
German (de)
English (en)
Other versions
EP2787801A1 (fr
EP2787801B1 (fr
Inventor
Masao Kondo
Hiroyuki Fukuda
Shigeyoshi Umemiya
Hiroshi Endo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Publication of EP2787801A1 publication Critical patent/EP2787801A1/fr
Publication of EP2787801A4 publication Critical patent/EP2787801A4/fr
Application granted granted Critical
Publication of EP2787801B1 publication Critical patent/EP2787801B1/fr
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/206—Cooling means comprising thermal management
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/208—Liquid cooling with phase change
    • H05K7/20818—Liquid cooling with phase change within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20836—Thermal management, e.g. server temperature control
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
EP11876495.0A 2011-12-01 2011-12-01 Râtelier pour équipement électronique, et dispositif de traitement d'information Not-in-force EP2787801B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2011/077791 WO2013080356A1 (fr) 2011-12-01 2011-12-01 Râtelier pour équipement électronique, et dispositif de traitement d'information

Publications (3)

Publication Number Publication Date
EP2787801A1 EP2787801A1 (fr) 2014-10-08
EP2787801A4 true EP2787801A4 (fr) 2016-01-06
EP2787801B1 EP2787801B1 (fr) 2017-04-12

Family

ID=48534871

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11876495.0A Not-in-force EP2787801B1 (fr) 2011-12-01 2011-12-01 Râtelier pour équipement électronique, et dispositif de traitement d'information

Country Status (5)

Country Link
US (1) US9814161B2 (fr)
EP (1) EP2787801B1 (fr)
JP (1) JP5804078B2 (fr)
CN (1) CN103959925A (fr)
WO (1) WO2013080356A1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201521560A (zh) * 2013-11-22 2015-06-01 Hon Hai Prec Ind Co Ltd 數據中心及其散熱系統
CN203691803U (zh) * 2013-12-27 2014-07-02 中兴通讯股份有限公司 一种插箱及终端
CN104363739B (zh) * 2014-10-23 2017-04-26 国家电网公司 设备机柜冷风量自动平衡装置
TW201714042A (zh) * 2015-10-13 2017-04-16 鴻海精密工業股份有限公司 貨櫃型資料中心
US11076509B2 (en) 2017-01-24 2021-07-27 The Research Foundation for the State University Control systems and prediction methods for it cooling performance in containment
US10327359B1 (en) * 2018-04-30 2019-06-18 Baidu Usa Llc Coupling designs for a data center building using indirect evaporative cooling (IDEC) units
US10925187B1 (en) * 2019-08-30 2021-02-16 Dell Products, L.P. Remote heat exchanger arm for direct contact liquid cooling for rack mounted equipment
US11523546B1 (en) * 2019-10-11 2022-12-06 Meta Platforms, Inc. Rack-level aisle emulator
WO2022115852A1 (fr) 2020-11-25 2022-06-02 Digital Porpoise, Llc Système de refroidissement pour centre de données comprenant une technologie de refroidissement par décalage
WO2023139433A2 (fr) * 2022-01-18 2023-07-27 Liquidstack Holding B.V. Système et procédé de refroidissement par immersion à commande active

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090154096A1 (en) * 2007-12-17 2009-06-18 International Business Machines Corporation Apparatus and method for facilitating cooling of an electronics system
DE202009013664U1 (de) * 2009-11-02 2010-01-14 Weiss Klimatechnik Gmbh Klimatisierter Raum
EP2190276A2 (fr) * 2008-11-24 2010-05-26 Lukas Hilmar Dispositif et procédé de refroidissement de l'espace intérieur d'une armoire électronique
EP2525639A2 (fr) * 2011-05-18 2012-11-21 Hitachi Plant Technologies, Ltd. Système de refroidissement pour équipement électronique

Family Cites Families (21)

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JPH02278896A (ja) * 1989-04-20 1990-11-15 Nec Corp 電子機器類の冷却方式
AU2001249286A1 (en) * 2000-03-21 2001-10-03 Liebert Corporation Method and apparatus for cooling electronic enclosures
GB0207382D0 (en) * 2002-03-28 2002-05-08 Holland Heating Uk Ltd Computer cabinet
US7752858B2 (en) * 2002-11-25 2010-07-13 American Power Conversion Corporation Exhaust air removal system
DE202004016492U1 (de) * 2004-10-25 2004-12-30 Knürr AG Geräte- und Netzwerkschrank
JP2007335497A (ja) * 2006-06-13 2007-12-27 Sanyo Electric Co Ltd 冷却装置
US8498114B2 (en) * 2006-06-15 2013-07-30 Valan R. Martini Energy saving system and method for cooling computer data center and telecom equipment
JP2008084916A (ja) * 2006-09-26 2008-04-10 Sanyo Electric Co Ltd 冷却装置
JP5030631B2 (ja) * 2007-03-22 2012-09-19 富士通株式会社 情報機器の冷却システム
TW200934352A (en) * 2007-08-07 2009-08-01 Cooligy Inc Internal access mechanism for a server rack
US8113009B2 (en) * 2007-10-22 2012-02-14 Sanyo Electric Co., Ltd. Electronic device cooling system and electronic device cooling apparatus
US8583289B2 (en) * 2008-02-19 2013-11-12 Liebert Corporation Climate control system for data centers
JP2009216295A (ja) * 2008-03-10 2009-09-24 Hitachi Plant Technologies Ltd 電子機器の冷却システム及びその運転方法
JP4947558B2 (ja) * 2008-05-14 2012-06-06 日本ピーマック株式会社 ラック冷却システム
JP5283453B2 (ja) 2008-08-26 2013-09-04 高砂熱学工業株式会社 電子通信機器室等の空調システム
US8141374B2 (en) * 2008-12-22 2012-03-27 Amazon Technologies, Inc. Multi-mode cooling system and method with evaporative cooling
CN101813351A (zh) * 2009-02-24 2010-08-25 华为技术有限公司 散热系统和通信系统
US8789384B2 (en) * 2010-03-23 2014-07-29 International Business Machines Corporation Computer rack cooling using independently-controlled flow of coolants through a dual-section heat exchanger
JP5424971B2 (ja) 2010-04-22 2014-02-26 三機工業株式会社 データセンターの空調制御システム
JP2012007865A (ja) * 2010-06-28 2012-01-12 Hitachi Plant Technologies Ltd 冷却システム
TW201202960A (en) * 2010-07-09 2012-01-16 Hon Hai Prec Ind Co Ltd Multi-modular data center

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090154096A1 (en) * 2007-12-17 2009-06-18 International Business Machines Corporation Apparatus and method for facilitating cooling of an electronics system
EP2190276A2 (fr) * 2008-11-24 2010-05-26 Lukas Hilmar Dispositif et procédé de refroidissement de l'espace intérieur d'une armoire électronique
DE202009013664U1 (de) * 2009-11-02 2010-01-14 Weiss Klimatechnik Gmbh Klimatisierter Raum
EP2525639A2 (fr) * 2011-05-18 2012-11-21 Hitachi Plant Technologies, Ltd. Système de refroidissement pour équipement électronique

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2013080356A1 *

Also Published As

Publication number Publication date
WO2013080356A1 (fr) 2013-06-06
EP2787801A1 (fr) 2014-10-08
JP5804078B2 (ja) 2015-11-04
EP2787801B1 (fr) 2017-04-12
CN103959925A (zh) 2014-07-30
JPWO2013080356A1 (ja) 2015-04-27
US9814161B2 (en) 2017-11-07
US20140268547A1 (en) 2014-09-18

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