EP2750891B1 - Verfahren zum herstellen einer druckschablone für den technischen druck und druckschablone für den technischen druck - Google Patents

Verfahren zum herstellen einer druckschablone für den technischen druck und druckschablone für den technischen druck Download PDF

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Publication number
EP2750891B1
EP2750891B1 EP12758819.2A EP12758819A EP2750891B1 EP 2750891 B1 EP2750891 B1 EP 2750891B1 EP 12758819 A EP12758819 A EP 12758819A EP 2750891 B1 EP2750891 B1 EP 2750891B1
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EP
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Prior art keywords
carrier layer
opening
openings
laser beam
laser
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German (de)
English (en)
French (fr)
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EP2750891A1 (de
Inventor
Christian KOENEN
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Christian Koenen GmbH
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Christian Koenen GmbH
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
    • B41C1/00—Forme preparation
    • B41C1/14—Forme preparation for stencil-printing or silk-screen printing
    • B41C1/145—Forme preparation for stencil-printing or silk-screen printing by perforation using an energetic radiation beam, e.g. a laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00—Printing plates or foils; Materials therefor
    • B41N1/24—Stencils; Stencil materials; Carriers therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
    • B41N1/00—Printing plates or foils; Materials therefor
    • B41N1/24—Stencils; Stencil materials; Carriers therefor
    • B41N1/248—Mechanical details, e.g. fixation holes, reinforcement or guiding means; Perforation lines; Ink holding means; Visually or otherwise detectable marking means; Stencil units

Definitions

  • the present invention relates to a method for producing a printing stencil for technical printing, in particular for solar cell printing, for applying a printing pattern to a substrate, in particular a substrate of a solar cell, for example for printing a front or back side contacting of the solar cell.
  • the production method comprises providing a carrier layer of the printing stencil, providing a structural layer of the printing stencil under the carrier layer, working out a longitudinally extending printed image opening in the structural layer corresponding to at least a part of the printed pattern, and carving out carrier layer openings in the carrier layer in the region of the printed image opening by means of laser cutting, such that a print medium can be applied to the substrate through the carrier layer openings and the print image opening.
  • the present invention further relates to a printing stencil for technical printing, in particular for solar cell printing, for applying a printing pattern to a substrate, in particular a substrate of a solar cell, comprising a carrier layer of the printing stencil, a structural layer of the printing stencil lying below the carrier layer, wherein the structural layer a longitudinally extending, at least a portion of the printing pattern corresponding printed image opening in the structural layer, and wherein the carrier layer in the region of the print image opening comprises carrier layer openings.
  • Such printing stencils can be provided, for example, for solar cell printing, ie, for example, for applying a contacting, in particular front contacting, to a solar cell.
  • the longitudinally extending printed image openings of the structural layer can be provided, for example, for the printing of contact fingers of a front contact of the solar cell.
  • the present invention is not limited to printing stencils for solar cell printing, but also, for example, also relates to special or hybrid stencils having at least one carrier layer and at least one structural layer for applying metallizations on substrate surfaces.
  • Such printing screens have a wire screen fabric clamped in a frame, which is embedded in a structural layer, such as a thin photoemulsion layer (see eg a printing screen according to FIG DE 10 2007 052 679 A1 ) and which carries the structural layer or acts as a carrier layer of the structural layer.
  • a photoemulsion layer has the printing image openings corresponding to the printed image of the contacting to be printed, the screen fabric stabilizing the photoemulsion layer also extending in the region of the printed image openings of the structural layer.
  • the wire mesh fabric is usually mounted on a frame and then coated with a photosensitive material (eg, an emulsion layer or a film). Subsequently, the structuring of the printed image takes place, for example, by means of exposure of the photosensitive material.
  • the use of such printing screens results in the application of the contacting of the solar cell to the solar cell substrate with disadvantages, in particular with regard to the printing of the so-called contact fingers of a front contacting of the solar cell.
  • the contact fingers should be printed with as narrow a width as possible (eg in the range from about 20 ⁇ m to 100 ⁇ m) to the substrate as evenly as possible in order to allow a conductor cross section that is as uniform as possible (resistance) and to increase the energy efficiency of the solar cell.
  • the contact fingers must be formed with the largest possible aspect ratio, since the electrical resistance of the contact fingers depends on the cross section of the contact fingers. Any constrictions of the contact finger reduce the conductivity of the finger and thus reduce the overall efficiency of the solar cell.
  • the aspect ratio of the contact fingers should consequently be designed to be uniform over as much as possible over the entire length of the contact fingers.
  • the proposed printing stencil comprises a carrier layer and a structural layer of the printing stencil lying below the carrier layer, wherein the structural layer has an image opening in the structural layer which extends in an elongated manner and corresponds at least to a part of the printing pattern.
  • the longitudinally extending print image opening in the structural layer in this case corresponds, for example, to the print pattern of a contact finger of a front side contacting of a solar cell.
  • the carrier layer comprises in the region of the print image opening elongate, extending in the longitudinal direction of the print image opening, in Substantially rectangular or at the corners optionally slightly rounded support layer openings, which are separated from each other by a stabilizing web.
  • the printing stencil is suitable for applying a printing medium, such as contacting material, to the substrate through at least one opening by overlapping the substrate layer openings with the printed image opening in a plan view of the printing stencil such that the printing stencil has an opening formed from the printed image opening and the substrate openings the pressure medium such as bonding material can be applied to the substrate.
  • the print medium runs below the carrier layer to a uniform 3-dimensional shape.
  • the carrier layer openings in the carrier layer can be produced by means of laser cutting.
  • the laser beam is focused substantially directly on the surface of the carrier layer (ie focused essentially in a focal point directly on the surface of the carrier layer), optionally depending on the laser cutting method a few microns above or below the surface of the carrier layer.
  • the focusing device is controlled such that the laser beam is guided to cut out the carrier layer opening along the edge of the carrier layer opening to be cut out to cut out the carrier layer opening along the edge of the carrier layer (see, eg Fig. 3A ).
  • the print image opening of the structure layer is a print image opening for a contact finger of a front contact of a solar cell, it is necessary to cut out a multiplicity of individual carrier layer openings for each of the numerous contact fingers, so that very long times are required for working out the carrier layer openings when producing a single printing template occur, for which also still very expensive laser cutting devices must be used.
  • the EP 2 292 440 A1 relates to a screen stencil for technical screen printing, with openings and areas of reduced thickness, the base material of at least two superimposed layers with different physical and / or chemical Characteristics is that the openings are made by lasers and the areas of reduced thickness are made by a process which attacks only one layer because of its particular chemical or physical property.
  • the DE 20 2008 004821 U1 relates to a screen printing plate having a perforated plate, the holes of which are produced or manufactured by means of a laser assembly, and which plate is completely provided with such holes or only partially with such holes, in the latter case, the holes form a template pattern comparable hole pattern.
  • the present invention is based on the idea not to excise the carrier layer openings of the carrier layer by means of a focused laser beam circumferentially along the edge of the Unezu.den carrier layer openings from the carrier layer, as is known according to conventional laser cutting method, but
  • a defocused laser beam or "herauszusch manen” the laser beam is not (as usual) focused, but is defocused depending on the width of the carrier layer openings.
  • the defocused cross section of the laser beam at the level of the laser entrance side surface of the carrier layer has a selected depending on the width of the carrier layer openings width, and is not substantially bundled to a focal point, as in conventional methods of Case is.
  • an opening in the carrier layer corresponding to a width of the carrier layer opening to be worked out can already be worked out or "shot out” at a position of the carrier layer by means of one or possibly more laser pulses whose cross-sectional shape substantially the cross-sectional shape of the defocused laser beam corresponds.
  • the production of a printing stencil can thus be carried out in a simpler, cheaper and more time-efficient manner, since the carrier layer openings do not have to be cut out by time-intensive method of a focused laser beam along the circumference of the carrier layer openings to be worked out, but already by means of one or more laser pulses carrier layer openings with widths in the range of 20 ⁇ m to 100 microns worked out or "shot out" can be.
  • a width of the cross section of the defocused laser beam at the level of the laser entrance side surface of the carrier layer slightly smaller than the desired width of the carrier layer opening to be worked out (about 50% to 95%, depending on the thickness and material of the carrier layer), since the By means of the laser beam introduced heat energy can cause the carved out carrier layer opening is greater than the cross section of the defocused laser beam used.
  • a method for producing a printing stencil for the technical printing for applying a printing pattern to a substrate comprising the steps of providing a carrier layer of the printing stencil, providing a structural layer of the stencil sheet lying below the carrier layer, in particular with a layer thickness greater than 5 microns, working out a longitudinally extending or extending in a longitudinal direction, at least a portion of the print pattern corresponding print image opening in the structural layer, and working out of carrier layer openings in the carrier layer in the print image opening, such that a print medium through the carrier layer openings and the print image opening the substrate can be applied.
  • the inventive method is characterized in that when working out the carrier layer openings a defocused depending on the width of the adoptedzu.den carrier layer openings laser beam is used, i. in particular, a laser beam which is not concentrated in a focal point lying substantially at the level of the surface of the carrier layer or slightly above or below the surface of the carrier layer, as in conventional methods, but at the level of the surface of the carrier layer is substantially defocused, and in particular at the level of the surface of the carrier layer has a cross-section with widths greater than 10 microns, preferably over 20 microns.
  • the production of a printing stencil can thus be carried out in a simpler, cheaper and more time-efficient manner, since the carrier layer openings do not have to be cut out by time-consuming operation of a focused laser beam along the circumference of the carrier layer openings to be worked out, but wider or smaller substrate openings have already been worked out by means of one or more laser pulses can be "shot out".
  • a laser device which comprises a focusing device and is adapted to emit the laser beam in laser pulses and to adjust it by means of the focusing device such that the laser beam is defocused at the level of the surface of the carrier layer as a function of the width of the carrier layer openings to be worked out ,
  • both pulse laser devices which emits a pulsed laser beam as well as laser devices comprising a laser source which emit a continuous laser beam which is influenced by means of a periodically opening or closing shut-off device, in particular by means of a high-frequency opening or closing shut-off device.
  • the laser beam is defocused such that the width of the cross section of the laser beam at the level of the surface of the carrier layer has approximately 50% to 95% of the width of the carrier layer openings to be worked out by means of one or more laser pulses.
  • it is preferably appropriate to dimension a width of the cross section of the defocused laser beam at the level of the laser entrance side surface of the carrier layer slightly smaller than the desired width of the Maszu.den carrier layer opening (about 50% to 95%, depending on the thickness and material of Carrier layer), since the heat energy introduced by means of the laser beam can lead to the fact that the processed carrier layer opening is larger than the cross section of the defocused laser beam used.
  • the working out of the carrier layer openings comprises working out a series of carrier layer openings extending in the longitudinal direction of the print image opening, wherein the position of the laser beam is moved between two successive laser pulses after working out of a carrier layer opening relative to the carrier layer and in the longitudinal direction of the print image opening to a position of the subsequently opened carrier layer opening ,
  • This makes it possible to form a stabilizing web between carrier layer openings in a time-efficient manner and in a simple manner in the carrier layer such that the position of the laser is moved between one carrier layer opening and the next carrier layer opening to be processed between two laser pulses relative to the carrier layer.
  • the position of the laser beam when working out a respective carrier layer opening of the row, is positioned at a position of the respective carrier layer opening and preferably the respective carrier layer opening is worked out by means of one or more laser pulses at this position, in particular preferably one or two to ten laser pulses.
  • the position of the laser beam during the working out of the respective carrier layer opening by means of one or more laser pulses is essentially not moved.
  • the above-mentioned particularly expedient preferred embodiment is based on the idea not cut out individual carrier layer openings as in conventionally known laser cutting method each by means of a focused laser beam from the support layer by the laser beam is guided along the edge of commezu productsden carrier layer opening, but rather it is provided according to the invention , the individual carrier layer openings in each case by single positioning of the laser beam on the carrier layer in the region of the print image opening of the structure layer at the position of réellezu productsden carrier layer opening by preferably one or even two to multiple laser pulses of a pulsed laser beam to work out in substantially the same position.
  • the spacing of the carrier layer openings can here be controlled by means of the pulse frequency of the laser and / or by the feed.
  • the individual carrier layer openings are given in the method according to the above-described particularly useful embodiment in shape mainly by the shape of the cross section of the laser beam at the level of the carrier layer (in particular the shape of the cross section of the laser beam at the level of the laser entrance side surface of the carrier layer), since the respective Carrier layer openings are worked out or "shot out” by individual laser pulses at a position of the carrier layer, and are not cut out by guiding a focused laser beam along the circumference of the carrier layer opening.
  • the individual carrier layer openings are thus hereby worked out, for example, substantially circularly, if the carrier layer is not moved relative to the focussing device or to the laser beam. If the carrier layer is moved during the application of the laser pulse, corresponding to the movement, elongated, rounded-off carrier layer openings with a shape corresponding to a slot, that is to say at the ends, are produced. there are slot-shaped carrier layer openings.
  • the width of the carrier layer openings is determined essentially by the size of the defocused cross section of the laser beam on the surface of the carrier layer, whereby a broader carrier layer opening can generally occur due to the introduced heat energy.
  • a 20 ⁇ m wide laser cross section by radiating the heat energy to the sides of a support layer opening with a width up to 25 ⁇ m work out without changing the position of the laser beam.
  • carrier layer opening diameters of up to 300 .mu.m can be achieved in the practical application range and, in particular, can be achieved it is possible with usual carrier layer thicknesses of 20 .mu.m to 800 .mu.m to work out carrier layer openings with diameters in the range of below 20 .mu.m up to approximately 150 .mu.m already with only one laser pulse at frequencies of 0.9 to 3 kHz.
  • respective webs may remain in the carrier layer between two carrier layer openings.
  • the width of the webs can be influenced as required by the time between two laser pulses (ie for example by the difference of period T and pulse duration ⁇ at any duty cycle of the pulsed laser, or at a 50% duty cycle by half the period T or Reciprocal from twice the frequency) and by the feed rate of the carrier layer relative to the positioning of the laser beam between two laser pulses.
  • an applied printing paste can merge perfectly under the fused ridges and results in a clean printed image over the entire length of the printed image opening.
  • a uniform height of the print medium can be achieved. This is particularly advantageous for the pressure of contact fingers of a front contact of a solar cell, since over the entire region of the contact finger a sufficient finger height can be achieved, so that the electrical resistance of the contact finger can be kept low due to a high uniform aspect ratio. Accordingly, the printed image when printing contact fingers of a front contact of a solar cell can be significantly improved compared to the printed image of printing screens and also printing stencils in which the carrier layer openings are formed by means of a conventional laser cutting process.
  • the difference to the embodiment described above is that the position of the laser beam relative to the carrier layer is also moved during the laser pulses and not only between the laser pulses of the laser beam.
  • the position of the laser beam is preferably positioned at a first position of the respective carrier layer opening to be worked out and the respective carrier layer opening is worked out by means of a laser pulse when the position of the laser beam is moved from the first position to a second position during the one laser pulse the respective carrier layer opening is moved.
  • the position of the laser beam during the one laser pulse is moved from the first position to the second position of the respective carrier layer opening in the longitudinal direction of the print image opening.
  • a carrier layer opening having a sectional shape corresponding to the cross-sectional shape of the defocused laser beam on the surface of the carrier layer is not formed, but a slot-shaped carrier layer opening whose ends have a shape due to the cross-sectional shape of the defocused laser beam (eg, semicircular ends in a circular cross section) the defocused laser beam or semi-elliptic ends in a elliptical cross section of the defocused laser beam).
  • the feed rate is preferably selected from the first to the second position of the carrier layer opening to be worked out and / or the pulse duration of the laser pulse as a function of the length of the carrier layer opening to be worked out.
  • the method according to the first aspect preferably further comprises a step of setting a shape and / or size of the cross section of the defocused laser beam at the level of the surface of the carrier layer by means of the focusing device of the laser device.
  • the width of the cross section of the laser beam at the level of the surface of the carrier layer is set transversely to the longitudinal direction of the print image opening as a function of the width of the print image opening.
  • the width of the carrier layer openings can be adapted to the width of the printed image opening of the structure layer by adjustments to the focusing device of the laser device become.
  • the laser beam is defocused by means of the focusing device with a substantially circular cross-section at the level of the surface of the carrier layer.
  • the laser beam is defocused by means of the focusing device with a substantially elliptical cross section at the level of the surface of the carrier layer.
  • the elliptical main axes of the carrier layer openings are preferably aligned transversely, in particular perpendicularly, to the longitudinal direction of the print image opening. This advantageously makes it possible to form the resulting shape of the webs more uniformly, in particular with a uniform width, due to the elliptical shape of the carrier layer openings in the transverse direction of the print image opening.
  • the method further comprises a step of setting one or more of the parameters frequency or period of the pulsed laser beam, pulse duration of the laser pulses, duty cycle of the pulsed laser beam, on-off ratio of the pulsed laser beam.
  • This makes it possible, for example, to influence or set the web width between adjacent processed carrier layer openings as a function of the set feed rate during the movement of the carrier layer relative to the focusing device of the laser device.
  • the parameters mentioned are interdependent and the other parameters are generally also determined by setting two of the mentioned parameters.
  • the position of the laser beam relative to the carrier layer between two successive laser pulses between two adjacent carrier layer openings of the row of carrier layer openings is formed a web in the carrier layer.
  • the feed rate is preferably selected from a position of a processed carrier layer opening to a position of a subsequently to be processed carrier layer opening in dependence on a predetermined web width.
  • the feed rate in the method of position of the laser beam relative to the carrier layer from a position of a processed carrier layer opening to a position of a subsequently processed carrier layer opening further depending on the width of the carrier layer openings in the longitudinal direction of the print image opening or depending on the width of the cross section of the defocused laser beam chosen at the level of the surface of the carrier layer.
  • the feed rate is preferably selected to be smaller or substantially equal to (BL + SB) / (T- ⁇ ), BL being the (This applies to an embodiment in which the position of the laser beam is not moved when working out a carrier layer opening; in methods in which the position of the laser beam is also moved when working out a carrier layer opening, BL depending on the width of the cross-section of the defocused laser, where BL is to be chosen somewhat larger), SB denotes the predetermined land width, T designates the period of the pulsed laser beam and ⁇ denotes the pulse duration of the laser pulses t.
  • the carrier layer relative to the focusing device of the laser device in the period between two laser pulses advantageously at least by a distance corresponding to the sum of the width of the carrier layer openings in the longitudinal direction of the print image opening and the predetermined web width are moved to a web of the to leave predetermined width in the carrier layer.
  • the focusing device is moved.
  • the carrier layer can also be moved relative to the carrier layer.
  • the method can be carried out continuously during the working out of a series of carrier layer openings, if the carrier layer openings are each worked out or "shot out" with only one laser pulse.
  • the method can also be carried out stepwise during the machining out of a row of carrier layer openings by traversing between two pulses substantially a distance corresponding to the sum of the width of the carrier layer openings in the longitudinal direction of the print image opening and the predetermined web width, in order to work out at the position of the next one Carrier layer opening to be stopped until the carrier layer opening is machined after a predetermined number of one or more laser pulses, then again between two successive pulses substantially a distance corresponding to the sum of the width of the carrier layer openings in the longitudinal direction of the print image opening and the predetermined web width to the position of to be moved next carrier layer opening to be worked out.
  • the material of the carrier layer comprises metal, in particular stainless steel or nickel, and / or plastic.
  • the structural layer comprises a photosensitive material, in particular a photosensitive emulsion or a film.
  • the working out of the print image opening preferably comprises the steps of exposing the structure layer by means of electromagnetic radiation of a predetermined wavelength or a predetermined wavelength range, in particular by means of infrared, visible and / or ultraviolet light, with a printed image of the printed pattern, and developing the photosensitive material of the structural layer.
  • the structural layer is preferably applied directly to the carrier layer or applied to an intermediate layer applied between the carrier layer and the structural layer.
  • the working out of the carrier layer openings preferably further comprises working out at least one further second series of carrier layer openings extending in the longitudinal direction of the print image opening and parallel to the first series of carrier layer openings.
  • a focusing device of the laser device can preferably be positioned at a position of the respective carrier layer opening, and preferably the respective carrier layer opening is worked out by means of one or more laser pulses at this position.
  • the focusing device of the laser device is moved after working out of a carrier layer opening between two successive laser pulses from the position of the processed carrier layer opening relative to the carrier layer and in the longitudinal direction of the elongated print image opening to the position of the subsequently to be processed carrier layer opening.
  • each carrier layer opening of the first row overlaps with a carrier layer opening of the at least one further second row in such a way that each carrier layer opening in the produced printing template is formed from two or more carrier layer openings of the at least two rows, wherein a web preferably exists between carrier layer openings adjacent in the longitudinal direction of the print image opening is trained.
  • the cross-section with a sufficient energy density are easily and time-efficiently worked out by the method according to the invention by two or more substantially parallel rows of carrier layer openings are worked out, wherein in the transverse direction to the print image opening adjacent carrier layer openings of the different parallel rows overlap and thus in the finished printing template in each case form a wider carrier layer opening, wherein further between webs carrier layer openings which are adjacent in the longitudinal direction of the print image opening, again respective webs may be formed.
  • a technical printing stencil for applying a printing pattern to a substrate produced by a method according to the above-mentioned first aspect, wherein the Printing template comprises a carrier layer of the printing stencil, and a lying under the carrier layer structure layer of the printing stencil.
  • the advantages of the printing stencil on advantages that have already been described above in connection with the method according to the invention and its preferred embodiments.
  • the structure layer has a longitudinally extending print image opening in the structure layer corresponding to at least one part of the print pattern
  • the carrier layer comprises one or more rows of carrier layer openings extending in the longitudinal direction of the print image opening in contrast to conventional laser cutting methods worked out carrier layer openings are not formed substantially rectangular, but either according to an effective cross-section of the laser have a round edge course.
  • they have a width transversely to the longitudinal direction of the print image opening, which corresponds approximately to the length in the longitudinal direction of the print image opening, or they are formed from two or more carrier layer openings overlapping in the transverse direction to the longitudinal direction of the print image opening, which each have a round edge profile corresponding to an effective cross section of the laser and optionally have a width transverse to the longitudinal direction of the print image opening, which corresponds approximately to the length in the longitudinal direction of the print image opening.
  • the carrier layer openings of a row are formed substantially circular.
  • the carrier layer openings of a row are preferably formed substantially elliptical.
  • the elliptical main axes of the carrier layer openings of a row are aligned transversely, in particular perpendicularly, to the longitudinal direction of the print image opening.
  • the carrier layer openings of a row are formed substantially oblong-shaped, i. oblong but with rounded ends, which are either substantially semi-circular or semi-elliptical.
  • the material of the carrier layer preferably comprises metal, in particular stainless steel or nickel, and / or plastic.
  • the structural layer comprises a photosensitive material, in particular a photosensitive emulsion or a film.
  • the structural layer is preferably applied directly to the carrier layer or applied to an intermediate layer applied between the carrier layer and the structural layer.
  • the carrier layer preferably has exactly one row of carrier layer openings extending in the longitudinal direction of the print image opening, wherein a respective web is preferably formed between adjacent carrier layer openings.
  • the respective web is melted on the side facing the structure layer and thus reduced in height compared to the height of the carrier layer.
  • the side of the carrier layer facing the structure layer is the laser entrance side, ie when the laser beam impinges on the side of the carrier layer facing the structure layer and continues rapidly, these desired height differences arise as a result of thermal effects.
  • each carrier layer opening of a first row overlaps with a carrier layer opening of at least one further second row such that each carrier layer opening in the printing template is formed from two or more carrier layer openings of the at least two rows, preferably between carrier layer openings adjacent in the longitudinal direction of the print image opening a respective web is formed.
  • a production method for a printing stencil in which respective carrier layer openings in the carrier layer of the printing stencil in the region of the printing image opening are respectively worked out or "shot out” by applying one or more laser pulses at a position which, in comparison with production methods, is at which carrier layer openings are conventionally cut out by means of a highly focused laser beam circumferentially from the carrier layer, can be performed more easily and efficiently and with a considerable gain of time.
  • a printing stencil produced according to the invention has procedural structural improvements over printing screens and printing stencils in which carrier layer openings are cut out from the carrier layer conventionally by means of a strongly focused laser beam, since a significantly improved stability of the carrier layer and an improved doctor blade behavior is achieved and yet excellent print image can be achieved, especially in the pressure of contact fingers of a front contacting a solar cell.
  • Preferred areas of application for printing stencils according to the invention may be in particular the following: thick film applications, printing of conductive pastes, printing of resistor pastes, printing of thermal pastes, adhesives, silicones, acrylics, higher viscosity (according to the wet film thickness) pastes and emulsions, non-conductive pastes and emulsions.
  • Fig. 1 1 shows by way of example a plan view of a solar cell 100 known from the prior art.
  • the solar cell 100 comprises a substantially rectangular light-active semiconductor photovoltaic substrate layer, hereinafter referred to as substrate 1, on the front side a front contact with two (possibly also several) electrically conductive, mutually parallel busbars 102 for dissipating the electrical energy and for connecting the solar cell 100 with other solar cells to a solar cell module.
  • Perpendicular to the busbars 102 a plurality of also parallel to each other, but extending transversely to the busbars 102 contact fingers 101 are provided as part of the front contacting. These conduct the electrical energy generated by the incidence of light in the substrate 1 to the busbars 102.
  • the contact fingers 101 In order to enable a high energy efficiency of the solar cell by low electrical resistances of the conductor tracks and at the same time the lowest possible shading, the contact fingers 101 with a maximum and over the entire length the contact fingers 101 uniform aspect ratio, ie high altitude and minimum width can be applied.
  • Fig. 2A shows by way of example a plan view of a section of a known from the prior art printing screen 200 and Fig. 2B shows by way of example a cross section of the section of the known from the prior art printing screen 200 from Fig. 2B ,
  • the printing screen 200 comprises a photoemulsion layer 201 having a print image opening 203 for printing the front side contacting.
  • the photoemulsion layer is stabilized by a screen mesh 202, which is incorporated in the photoemulsion layer 201.
  • the screen fabric 202 also fills the free print area of the print image opening and thus can lead to an uneven paste imprint when printing the front side contacting, especially in the area of the mesh nodes of the mesh 202, especially if the mesh nodes of the mesh 202 in the edge region the printing line (print image opening 203) are arranged.
  • Fig. 3A shows a schematic, structure-layer-side plan view of a section of a printing stencil, in which the carrier layer openings are conventionally cut out by means of a focused laser beam circumferentially from the carrier layer.
  • Fig. 3B shows a schematic sectional view taken along section line A - Fig. 3A ,
  • Fig. 3A shows, in particular by way of example, a plan view of a printing stencil from the side of the structural layer 22, the printing stencil being produced by means of a conventionally known laser cutting method.
  • the carrier layer openings 21a are cut out of the carrier layer 21 along the edge of the carrier layer openings 21a to be worked out by means of the focused laser.
  • three substantially rectangular shaped carrier layer openings 21a are formed in the carrier layer 21, which are separated from each other by a web 21b.
  • the laser beam is first positioned in a corner, eg at position P1 in FIG Fig. 3A , and then, after opening the shutter means of the laser device along the edge of the substrate opening 21a to the positions P2, P3 and P4 in the respective other corners and then back to the position P1 until the substrate opening 21a is completely cut out of the substrate layer 21.
  • the focused laser beam can be guided into the area of the next carrier layer opening 21a to be cut out in order to cut out this next carrier layer opening 21a to be worked out of the carrier layer 21.
  • Fig. 4A shows a schematic, structure-layer-side plan view of a section of a printing stencil, in which the carrier layer openings 21a are worked out according to a method according to a first embodiment of the present invention.
  • Fig. 4B shows a schematic sectional view taken along section line A - Fig. 4A ,
  • a continuous elongated rectangular print image opening 22a (for example, for the pressure of a contact finger of a front contact of a solar cell) is formed.
  • a row of circular carrier layer openings 21a is worked out in the area of the print image opening 22a, between which a web 21b is formed in the carrier layer 21.
  • the diameter of the carrier layer openings 21a is adapted to the width of the print image opening 22a in the transverse direction of the print image opening 22a, or corresponds to FIG Fig. 4A essentially the width of the print image opening 22a.
  • the width of the print image opening 22a and the diameter of the carrier layer openings 21a in the range of about 20 to 100 microns and the web width of the webs 21b (measured approximately in the thin central region of the web) in the area 10th ⁇ m to 50 ⁇ m or preferably about 15 ⁇ m to 30 ⁇ m.
  • the carrier layer openings are worked out at positions P1, P2,... To PN according to the invention by means of one or more laser pulses of a defocused laser beam.
  • the carrier layer 21 and the laser device are moved from the position P1 to the position PN relative to each other in the longitudinal direction of the area of the print image opening 22a (see arrow in FIG Fig. 4A ).
  • the method can be carried out continuously (in particular with very short laser pulses) if the carrier layer openings 21a are worked out by means of one laser pulse in each case, or preferably also stepwise, as described below with reference to FIGS Figs. 5a to 5D illustrated when the carrier layer openings 21a are worked out by means of one or more laser pulses.
  • the movement is carried out from one position (eg P1) to the adjacent position (eg P2), in particular between two laser pulses.
  • Figs. 5A to 5D illustrate steps of a method according to an embodiment of the present invention.
  • the laser device 10 comprising a laser source 11 and a focusing device 12, which comprises focusing optics, is positioned at a position P1 of a first carrier layer opening 21a to be worked out in the carrier layer 21.
  • the laser beam is aligned on the carrier layer 21 and defocused by means of the focusing optics of the focusing device 12 at the level of the surface or in the carrier layer 21 so that it has a laser cross section QL with a size dependent on the predetermined size QT of the carrier layer opening 21a to be worked out (FIG. about 50% to 90% of the specified size QT).
  • the laser beam has an energy density which is sufficient to work out a carrier layer opening as a function of the carrier layer thickness by means of one or more laser pulses of a predetermined number n.
  • the laser cross section QL is generally to be selected somewhat smaller than the predetermined size QT, since the heat energy radiates laterally in the carrier layer and works out a carrier layer opening, whose cross section is larger than the cross section QL of the defocused laser beam.
  • the laser device 10 is moved relative to the carrier layer 21 to the position P2 of the next carrier layer opening 21a to be worked out and positioned at the position P2, as shown in FIG Fig. 5C is shown schematically.
  • the movement is carried out between the nth and the subsequent (n + 1) th laser pulse.
  • the surprising and advantageous effect of reducing the height of the web 21b by melting on the laser entrance side of the carrier layer 21 at web widths below about 30 ⁇ m, in particular at about 20 ⁇ m and less, as described above.
  • the laser device 10 can be moved relative to the carrier layer 21 to the position of the next carrier layer opening 21a to be worked out and the steps can be repeated until the last position PN in the row of carrier layer openings 21a has been reached and the last carrier layer opening of the series has been worked out is.
  • Fig. 6 shows a schematic, structurally layer-side plan view of a section of a printing stencil, in which the carrier layer openings 21 a are worked out according to a method according to a second embodiment of the present invention.
  • This can be achieved by the cross section QT of the laser is defocused by means of the focusing device 12 is not circular but elliptical on the carrier layer or automatically arises especially in the feed direction by the speed when cutting (shoot through).
  • a continuous elongated rectangular print image opening 22a (for example, for the pressure of a contact finger of a front contact of a solar cell) is formed.
  • a row of elliptical carrier layer openings 21a is worked out in the region of the print image opening 22a, between which a web 21b is formed in the carrier layer 21.
  • the main axis of the elliptical carrier layer openings 21a is aligned transversely to the longitudinal direction of the print image opening 22a and is matched to the width of the print image opening 22a in the transverse direction of the print image opening 22a, or corresponds to FIG Fig. 6 essentially the width of the print image opening 22a.
  • the dimensions could be such that the width of the print image opening 22a or the length of the major axes of the elliptical support layer openings 21a is in the range of about 25 to 80 .mu.m and the web width of Webs 21b (measured approximately in the thin central region of the web) in the range 5 microns to 20 microns or preferably about 10 microns to 15 microns. Also occurs the above-described advantageous effect of reducing the height of the webs 21b by melting on the laser entrance side web widths of about less than 30 ⁇ m, in particular about 20 ⁇ m.
  • wider carrier layer openings 21a can be worked out by aligning the wider main axes of the ellipse shape transversely to the longitudinal direction of the print image opening 22a.
  • the webs 21b can be formed on the basis of the elliptical shape with respect to the main axis aligned transversely to the longitudinal direction of the print image opening 22a with a transverse width extending more uniformly.
  • Fig. 7 shows a schematic, structurally layer-side plan view of a section of a printing stencil, in which the carrier layer openings 21a are worked out according to a method according to a third embodiment of the present invention.
  • This can be achieved by analogy to Figs. 4A and 4B first according to the procedure Figs.
  • Fig. 8 shows a schematic, structure-layer-side plan view of a section of a printing stencil, in which the carrier layer openings 21a are worked out according to a method according to a fourth embodiment of the present invention.
  • the carrier layer openings 21a are each worked out by means of a laser pulse, wherein the laser cross-section of the defocused laser beam is chosen as an example circular.
  • a slot is an elongated hole, the cross section of which is composed of an elongated rectangular shape at the longitudinal ends of each a semi-circular shape connects (eg semicircles as in Fig. 8 or else semi-ellipses, if an elliptical cross-section of the defocused laser is selected).
  • the laser device 10 is first moved to a position P1 of the first carrier layer opening.
  • the position of the defocused laser beam whose defocused cross section has been selected to be circular in this exemplary embodiment, is moved from the first position P1 to the second position P2 of the carrier layer opening, wherein the feed rate is substantially chosen such that it the quotient of the pulse duration of the pulsed laser and the distance of the positions P1 and P2 corresponds.
  • the length of the then-processed carrier layer opening 21a is greater than the spacing of the positions P1 and P2 (see FIG Fig. 8 ).
  • the position of the laser beam between two laser pulses from the second position P2 of the carrier layer opening to a position P3 of the subsequently worked out Carrier layer opening 21a process are repeated until the position PN at the end of the print image opening is reached.
  • Fig. 9 shows a schematic, structure-layer-side plan view of a section of a printing stencil, in which the carrier layer openings are worked out according to a method according to a fifth embodiment of the present invention.
  • the carrier layer openings 21a are formed oval or elliptical, wherein the longitudinal direction of the carrier layer openings 21a extends in the longitudinal direction of the print image opening 22. This can be achieved, for example, in that the template is already moved when the laser pulse has not yet been switched off, ie by a "blurring" when working out the carrier layer openings 21a.
  • Fig. 10 shows by way of example a temporal pulse course of a pulsed laser, which is suitable for use in a method according to an embodiment of the present invention. It is not essential to the invention whether a pulsed laser beam is used or whether a continuous laser beam is used which is "pulsed" by means of a mechanical shutter device by periodically opening or closing a shutter.
  • laser pulses occur as in Fig. 10 illustrates periodically after a period T and each have a pulse duration ⁇ on. This results in the following relationships.
  • the period duration corresponds to the reciprocal of the frequency
  • the duty cycle is given by ⁇ / T and the on-off ratio results from ⁇ / (T - ⁇ ).
  • a production method for a printing stencil in which respective carrier layer openings in the carrier layer of the printing stencil in the region of the printing image opening are respectively worked out or "shot out” by applying one or more laser pulses at a position which, in comparison with production methods, is at which carrier layer openings are conventionally cut out by means of a highly focused laser beam circumferentially from the carrier layer, can be performed more easily and efficiently and with a considerable gain of time.
  • this improved time efficiency also means a significantly improved cost efficiency in the production of the printing stencil.
  • a printing stencil produced according to the invention has procedural structural improvements over printing screens and printing stencils in which carrier layer openings are cut out from the carrier layer conventionally by means of a strongly focused laser beam, since a significantly improved stability of the carrier layer and an improved doctor blade behavior is achieved and yet excellent Print image can be achieved, especially in the pressure of contact fingers of a front contacting a solar cell.

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  • Engineering & Computer Science (AREA)
  • Toxicology (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Photovoltaic Devices (AREA)
  • Printing Methods (AREA)
EP12758819.2A 2011-08-30 2012-08-30 Verfahren zum herstellen einer druckschablone für den technischen druck und druckschablone für den technischen druck Active EP2750891B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011081837.5A DE102011081837B4 (de) 2011-08-30 2011-08-30 Druckschablone für den technischen Druck
PCT/EP2012/066855 WO2013030273A1 (de) 2011-08-30 2012-08-30 Verfahren zum herstellen einer druckschablone für den technischen druck und druckschablone für den technischen druck

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EP2750891A1 EP2750891A1 (de) 2014-07-09
EP2750891B1 true EP2750891B1 (de) 2019-03-20

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US (1) US9296195B2 (ja)
EP (1) EP2750891B1 (ja)
JP (1) JP6231478B2 (ja)
CN (1) CN104023981B (ja)
DE (1) DE102011081837B4 (ja)
MY (1) MY185079A (ja)
WO (1) WO2013030273A1 (ja)

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ES2450077T3 (es) * 2009-10-23 2014-03-21 Spgprints Austria Gmbh Procedimiento para la fabricación de plantillas perforadas o perforadas parcialmente con relieve
CN110337193A (zh) * 2019-05-05 2019-10-15 天津光韵达光电科技有限公司 一种smt激光模板的mark点及其加工方法
EP4071776A1 (de) * 2021-04-08 2022-10-12 Siemens Aktiengesellschaft Druckschablone und verfahren zur bereitstellung einer druckschablone

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ATE216507T1 (de) * 1992-10-21 2002-05-15 Schablonentechnik Kufstein Ag Verfahren zur herstellung einer siebdruckschablone
ES2101409T3 (es) * 1994-08-24 1997-07-01 Schablonentechnik Kufstein Ag Dispositivo para fabricar una plantilla para impresion.
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CN104023981A (zh) 2014-09-03
DE102011081837B4 (de) 2021-08-05
JP6231478B2 (ja) 2017-11-15
JP2014531338A (ja) 2014-11-27
WO2013030273A1 (de) 2013-03-07
US9296195B2 (en) 2016-03-29
DE102011081837A1 (de) 2013-02-28
US20140305323A1 (en) 2014-10-16
CN104023981B (zh) 2016-08-17
MY185079A (en) 2021-04-30
EP2750891A1 (de) 2014-07-09

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