EP2718051A1 - Support avec surface de test pouvant être enduite de liquide de brasage ainsi que procédé correspondant à cette application - Google Patents

Support avec surface de test pouvant être enduite de liquide de brasage ainsi que procédé correspondant à cette application

Info

Publication number
EP2718051A1
EP2718051A1 EP12735230.0A EP12735230A EP2718051A1 EP 2718051 A1 EP2718051 A1 EP 2718051A1 EP 12735230 A EP12735230 A EP 12735230A EP 2718051 A1 EP2718051 A1 EP 2718051A1
Authority
EP
European Patent Office
Prior art keywords
test
carrier according
border
carrier
selective soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP12735230.0A
Other languages
German (de)
English (en)
Inventor
Ulrich Wittreich
Bernd Müller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of EP2718051A1 publication Critical patent/EP2718051A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N13/00—Investigating surface or boundary effects, e.g. wetting power; Investigating diffusion effects; Analysing materials by determining surface, boundary, or diffusion effects
    • G01N13/02—Investigating surface tension of liquids
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/044—Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12222—Shaped configuration for melting [e.g., package, etc.]

Definitions

  • the invention relates to a carrier having at least one test surface which is wettable with liquid solder. Moreover be ⁇ the invention applies a method of using such a carrier in a test procedure. With this test method, a plant for selective soldering can be tested.
  • a carrier of the type specified is described for example in DE 10 2006 023 325 AI. Thereafter, a test plate which can be printed with solder paste as a test, has a test area, which is rectangular. This can be soldered with a pattern that allows conclusions to be drawn as to what the wettability of the solder paste on the test surface. This makes it possible to draw conclusions about the quality of the solder material. Test panels provided the stated type have proven themselves to obtain a comparatively cost-favorable means ⁇ comparatively realistic test result ⁇ se for soldering.
  • the first object is achieved with the support specified above according to the invention in that the at least one test surface is designed as at least partially bordering a saudimen ⁇ sional reference surface, and this reference surface corresponds in at least one dimension of the required wetting surface of a selective solder to be tested ⁇ process.
  • the reference surface is difficult to wet with liquid solder compared to the test area.
  • the test surface of the required wetting area of the test selective soldering process speaks ent ⁇
  • the border of the reference surface is only partially available. It thus forms the boundary of the reference surface.
  • the test surface for example, provided as a metal ⁇ capitalization on a circuit board, there is a reference surface from the difficult to wet PCB Mate ⁇ rial itself, wherein the reference surface is defined by the fact that the test surface has a border of this reference surface bil ⁇ det.
  • a partial border may be, for example, by two paral ⁇ Lele straight paths are formed of parallel test areas. The distance of these parallel test surfaces to each other then just corresponds to the radius of the required wetting surface, wherein this is formed only in the perpendicular to the course of the test area dimension, while at right angles to the reference surface does not border ⁇ so is open.
  • the carrier according to the invention advantageously provides a comparatively simple test agent.
  • This can be manufactured in certain standard sizes for printed circuit boards, so that these carriers can be inserted without major problems in an ongoing manufacturing process and can be soldered instead of one of the normally to be soldered circuit boards.
  • a random sample can be taken in the running process in order to check certain parameters of the selective soldering system (more on this in the following).
  • An evaluation of the test result can advantageously be determined in a simple manner by examining the result of the Belotungsergeb- on the carrier.
  • a frame is provided at a uniform distance from the border, which also forms a test area.
  • the distance between the border and the border is also difficult to wet with liquid solder in comparison to the test areas, so that no solder bridges can be formed between the border and the border. While the forms To ⁇ randung the edge of the reference surface, the frame around it, so to speak, an outer frame within which both the reference surface as well as the border. As a result, additional test results can advantageously be generated.
  • the distance between the border and framing is chosen so that the frame outside the Tole ⁇ ranz Schemes for the positioning of the soldering head un ⁇ terrenz the support.
  • the permissible tolerance range for the selective soldering process has been exceeded. This can be be that the Selektivlötkopf was positioned inaccurately below the carrier or that the emerging from the selective solder head liquid solder material does not have the required ⁇ Liche geometry. In any case, a subsequent de troubleshooting can be started in order to guarantee the required quality ⁇ tuschsstandards on.
  • a central test surface is provided, which does not touch the border.
  • This central test surface is, so to speak, the simulation of solder pads or solder bonds, as they are usually provided on printed conductors. These are to be be ⁇ explores means of the selective soldering process, so that the Belotungscut points on these solder or solder traces can be optically examined.
  • these central test areas have a different purpose. If, for example, the process of selective Belo's disturbed to such an extent that the entire border of a certain reference surface is no longer wetted, it would not be apparent after the soldering process whether this reference surface has ever been approached by the selective soldering head.
  • a circular reference surface is provided.
  • a circular reference surface can be used in both dimensions for evaluating the positioning accuracy of the Selektivlötkop ⁇ fes, since a border of the circular reference surface around the entire circumference of the reference surface around is possible.
  • circular reference surfaces can be advantageous therefore a punctual Beloten particularly easy and safe rate.
  • An alternative embodiment of the invention provides that an elongate reference surface is provided, whose
  • Width corresponds to the radius of the required wetting surface of a selective soldering process to be tested and which has the border at least on the longitudinal sides.
  • the longitudinal sides, which have the border are straight at right angles to the dimension (direction), which should be taken into account in the selective soldering process with respect to the positioning accuracy .
  • the other dimension have preferably ⁇ , on no border, so that the selective soldering head can be moved in the direction of the elongate extent of the reference surface, that is parallel to the longitudinal sides.
  • the Selektivlötkopf is moved in an x and in egg ⁇ ner perpendicular thereto y-direction, whereby all points can be approached, for example, in a circuit board.
  • the positioning accuracy in each case in the x-direction and in the y-direction is of particular importance.
  • the selective soldering head is preferably moved in each case in the x-direction or in the x-direction, while the liquid solder which is passed between the respective edges forming the longitudinal sides and thereby wets the reference surface. From the wetting result of the border and possibly an outside of the border framing then it can be concluded on the quality of se ⁇ -selective soldering process.
  • a plurality of elongated reference surfaces are provided with different, in particular at right angles to each other standing alignment with each other.
  • the typi ⁇ rule traversing the Selektivlötkopfes in x-direction and y-direction can thereby be detected. Due to the fact that several stretched reference surfaces are present, it is above all also possible to test various movement pattern of Selektivlötkopfes on a carrier test. In this case, for example, solder paths and the x and y directions can be traveled.
  • Einzelellöt can be approached.
  • the Einzelellöta and the Lötbahnen can be approached from opposite directions to check whether the positioning accuracy is the same in all directions.
  • This also tolerance deviations can be due to a backlash, that is, due to a hand ⁇ application of the movement of the soldering head 180 degrees, determine in each axis.
  • the Belotungsographer in knowledge of the elapsed movement profile of the Selektivlöt ⁇ head can be evaluated by the user.
  • the carrier is designed as a carrier plate with an upper side and a lower side, wherein the at least one test surface is provided on the underside.
  • a carrier imitates the conventional printed circuit boards, which are used by default for the construction of electronic Bau ⁇ groups use. With the underside down such a support plate can be easily inserted into a soldering process for selective soldering and be soldered according to the applicable regulations. After removal of the carrier plate from the Selektivlötstrom the Belotungsten can be paid ⁇ careful.
  • the support plate with at least ⁇ least is connected to a through hole which is closed on the front side with an indicator for feed.
  • a plurality of through holes may also be provided, which preferably have different hole widths.
  • the through holes are approached by the flux head from various ⁇ directions, so that extended statements regarding the achievable tolerances in the application of the flux are possible.
  • the carrier has a temperature indicator which is sensitive to the temperatures occurring during selective soldering and whose indicator reaction is irreversible.
  • the carrier has markings for positioning in a system for selective soldering.
  • the positioning of the carrier is facilitated in the Selektivlötstrom.
  • an automatic optical recognition system can be used for positioning. The more accurately the carrier can be positioned in the selective soldering machine, the more meaningful the results of the soldering with regard to the accessibility of certain tolerances, since the measurement uncertainties due to inaccurate positioning of the selective soldering can be largely excluded.
  • the second object is achieved by the method mentioned in the present invention that a carrier, as described above, is posi ⁇ tioned in the system. At least a part of the reference surfaces, preferably those that are designed due to their geometry for the Subject Author ⁇ fenden Selektivlötkopf, are then selectively brazing material. Finally, the carrier is removed from the system and the Belotungsient checked. This can be done for example by a visual inspection by an experienced user of Selektivlötstrom. It is also possible that from ⁇ evaluation by, for example, a digital image of Belötungslets is generated and this is subjected to image processing to make automated.
  • the method according to the invention for testing the system for selective soldering has the advantages already described.
  • the carrier can be easily integrated into an ongoing manufacturing process by being passed through the Belotungsstrom as a substitute for a self-soldering support plate for an electronic assembly.
  • statements about the quality of the selective Belotungsreaes are possible in a relatively simple manner.
  • the process parameters are correct, so that the result does not necessitate any objections, the test method can advantageously be concluded very quickly. If, however, faulty loading occurs, the cause must be investigated. For this purpose, further testing may be necessary, but these must only be initiated if the result of the test does not meet the expected quality standards.
  • Flux application is carried out on the test surfaces and the indi ⁇ capacitor for the flux is applied through the through holes with flux.
  • the application of flux to the test surfaces increases their wettability, as is the case with the selective soldering processes normally used in the selective soldering machine.
  • the flux through holes you can test whether the flux application process meets the required standards. As a result, additional advantageous statements regarding the quality of the selective soldering process are possible.
  • the reference surfaces are approached from different directions with a soldering head of the system. This makes it possible to determine the tolerance deviations depending on the process parameters of the selective soldering process. It has already been mentioned that this can be determined by, among other things, the reversal of a respective x-axis or y-axis, ie Toleranzabwei ⁇ chungen, resulting in dependence on the direction of movement of the Selektivlötkopfes during the Selective soldering.
  • Figures 4 and 5 the respective plan view of the Vordersei ⁇ te and the back of an embodiment ⁇ example of the carrier according to the invention.
  • FIG. 1 is shown how a test plate 11 from EI ⁇ ner lower side 12 forth can be applied by a flux head 13 with flux fourteenth
  • the flux head 13 is in this case moved in the horizontal direction 15, wherein flux can also be applied through a through hole 16 on a located on the upper side 17 of the support plate Indi ⁇ capacitor 18.
  • the indicator is a paper, which rests on the top 17 and in the case of wetting with the flux 14 shows a color change.
  • the through hole 16 can be used to determine the positioning of the flux head 13 in horizonta ⁇ ler direction 15 °.
  • the hole diameter of the through hole 16 corresponds to the allowable tolerance in the positioning of the flux head 13.
  • the beam of the flux 14 hits namely on the indicator 18 Strickpunk-
  • An impermissible position 19 is also shown, in which the jet of the flux strikes the underside 12 of the test plate 11, so that the indicator 18 is not wetted with flux. This can be taken into account in an evaluation of the test result of the test plate 11.
  • the underside 12 can also be provided with different test surfaces which are wettable by the liquid solder 21 applied by means of a soldering head 20 for selective soldering.
  • a border 22 surrounds a reference surface 23 which is difficult to wet by solder and which lies in the interior of the border 22.
  • a frame 25 which forms another test surface for wetting with solder.
  • loading the reference surface 23 is located in the center nor a center ⁇ rale test area 26th
  • the test surface which forms the boundary of the reference surface, ge ⁇ rade touched by the liquid solder material of the selective soldering process is so that there is a wetting of the Testflä ⁇ che.
  • the dimension of the two-dimensional reference surface may also be slightly smaller than the radius of he ⁇ ford variable wetting surface, since the border itself has a spatial extension. In this way, the test surface is also better reliable belotet.
  • the reference area including the border overall in the dimension considered can correspond to the radius of the required wetting area.
  • the soldering head 20 is to provide a wetting surface 29 is available, which is located on the outside of the edge 22 in the embodiment screened ⁇ de. If, however, not enough solder leaves the soldering head 20, then a contour 30a of the solder is established, which lies outside the permissible tolerance range for the wetting surface 29 and is therefore too small. Although the central test area 26 is still wetted by the solder, it can be seen in the test result that the soldering head 20 has been approximated to the test areas, but the border 22 remains unwetted. Another case occurs when too much solder emerges from the soldering head 20.
  • FIG. 4 shows an example of a test plate.
  • the underside which is provided with a pattern of test areas, to cover different test cases.
  • the board with marks 31 is provided to the assay plate 11 to posi tioning ⁇ well in the selective soldering.
  • a text box 32 may be provided containing manufacturer and product information.
  • the individual reference areas are also numbered so that an evaluation can be facilitated.
  • the reference surfaces 23 are intended for a selective approach by the soldering head.
  • Refe rence ⁇ surfaces 23 with different diameters are available to provide a test panel for various soldering head ⁇ sizes.
  • the border 22 can also be interrupted, what with
  • Positioning errors has the advantage that certain sectionberei ⁇ che the border 22 are not wetted and thus a conclusion is possible, in which direction the positioning error has been affected.
  • elongated reference surfaces 33 are provided on the test plate, which are each defined by a border 22 along its longitudinal extent. Transversely to its longitudinal extent, however, have the reference surfaces 33 randung, so that the soldering head longitudinally can be passed through the re ference ⁇ area through no environmental.
  • the reference surfaces 33 are each mounted with longitudinal extent in the x direction or in the Y direction on the test plate and labeled in accordance with x and y and, moreover, istnumme ⁇ riert (see also indicated in FIG 4 xy coordinate system).
  • a plurality of reference surfaces 33 are always chained together in one direction, the width of which being staggered, for example, by 12 mm, 8 mm, 6 mm, 4 mm and 3 mm.
  • This width extension corresponds to that dimension of the respective reference surface 33, which is smaller than or equal to the diameter of the required wetting surface of the selective soldering process to be tested.
  • the top of the test plate is shown. This has in addition to the evaluation on a Temperaturindika ⁇ gate 34, in which it can be seen on the basis of the discoloration, which temperature has reached the test plate.
  • a table 35 is printed, which can be labeled after evaluation of the test ⁇ result, so that the test result on the test plate is quickly read.
  • the indicator 18 can be seen, which consists of an indicator paper and covers the through holes (see Figure 4). Because this is therefore not visible, the hole pattern of through-holes 16 ACCORDING TO FIGURE 4 is on top of the test ⁇ plate 11 also shown as Figure 36, so that any discoloration on the indicator 18, indicating a wetting with flux, right can be interpreted.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

La présente invention concerne une plaque de support (11) avec des surfaces de test (22, 33, 26) permettant d'évaluer un procédé de brasage sélectif. Par ailleurs, un procédé permettant d'utiliser une telle plaque de support est également protégé. La présente invention prévoit que la plaque de support présente différentes zones pourvues de bordures (22). Les zones (23, 33) ne peuvent pas être enduites de liquide de brasage, tandis que les bordures (22) le peuvent. Si une tête de brasage sélectif est installée sur les surfaces de référence (33), il faut, dans la mesure où il n'y a aucun défaut de qualité, enduire de liquide de brasage chaque bordure de manière rectiligne, ce qui permet d'évaluer le procédé de brasage sélectif. L'avantage consiste en la possibilité, grâce à la plaque de test, d'effectuer une évaluation visuelle simplement, par exemple par une inspection.
EP12735230.0A 2011-07-19 2012-06-22 Support avec surface de test pouvant être enduite de liquide de brasage ainsi que procédé correspondant à cette application Withdrawn EP2718051A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102011079407A DE102011079407A1 (de) 2011-07-19 2011-07-19 Träger mit einer mit flüssigem Lot benetzbaren Testfläche sowie Verfahren zu dessen Anwendung
PCT/EP2012/062067 WO2013010748A1 (fr) 2011-07-19 2012-06-22 Support avec surface de test pouvant être enduite de liquide de brasage ainsi que procédé correspondant à cette application

Publications (1)

Publication Number Publication Date
EP2718051A1 true EP2718051A1 (fr) 2014-04-16

Family

ID=46513713

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12735230.0A Withdrawn EP2718051A1 (fr) 2011-07-19 2012-06-22 Support avec surface de test pouvant être enduite de liquide de brasage ainsi que procédé correspondant à cette application

Country Status (5)

Country Link
US (1) US9498836B2 (fr)
EP (1) EP2718051A1 (fr)
CN (1) CN103813878B (fr)
DE (1) DE102011079407A1 (fr)
WO (1) WO2013010748A1 (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011079407A1 (de) 2011-07-19 2013-01-24 Siemens Aktiengesellschaft Träger mit einer mit flüssigem Lot benetzbaren Testfläche sowie Verfahren zu dessen Anwendung
DE202013012057U1 (de) * 2013-06-21 2015-03-05 Siemens Aktiengesellschaft Testplatte zur Überprüfung von Wellenlötprozessen
DE202018100279U1 (de) * 2018-01-18 2019-04-23 Ersa Gmbh Maschinenmodul für Wellenlötanlage

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Also Published As

Publication number Publication date
US20140284374A1 (en) 2014-09-25
CN103813878B (zh) 2016-08-24
DE102011079407A1 (de) 2013-01-24
WO2013010748A1 (fr) 2013-01-24
US9498836B2 (en) 2016-11-22
CN103813878A (zh) 2014-05-21

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