Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
  • H10N10/01—Manufacture or treatment
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
  • F01N—GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR MACHINES OR ENGINES IN GENERAL; GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR INTERNAL COMBUSTION ENGINES
  • F01N5/00—Exhaust or silencing apparatus combined or associated with devices profiting by exhaust energy
  • F01N5/02—Exhaust or silencing apparatus combined or associated with devices profiting by exhaust energy the devices using heat
  • F01N5/025—Exhaust or silencing apparatus combined or associated with devices profiting by exhaust energy the devices using heat the device being thermoelectric generators
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
  • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
  • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
  • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
  • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
  • Y02T10/00—Road transport of goods or passengers
  • Y02T10/10—Internal combustion engine [ICE] based vehicles
  • Y02T10/12—Improving ICE efficiencies

Definitions

• the present invention relates to a method for producing a thermoelectric module according to claim 1,
• thermoelectric generator thermoelectric generator
• TEM thermoelectric module
• the TEG can be accommodated with different benefits at any point in the exhaust system or in the exhaust gas recirculation. Due to their design and connection technology, conventional TEM according to your prior art are not optimally suited for use in a TEG and also less effective. Furthermore, the TEM must be optimally electrically connected and connected.
• thermoelectric materials thermoelectric materials, ie materials that have the property of generating electrical energy from thermal energy.
• integration of the TEM in a heat exchanger is not practical and the bonding techniques of the components used are sometimes not high temperature stable, but this is necessary to implement the particular advantages of such an approach.
• a low heat transfer to the gas-side contacting of the TEM in the heat exchanger can be realized and only a poor electrical connection of the TE materials can be produced.
• thermoelectric see module according to claim 1
• thermoelectric module according to claim 10.
• thermoelectric module The present invention provides a method for producing a thermoelectric module, the method comprising the following steps:
• thermoelectric module Arranging at least one thermoelectrically active material on the housing element, wherein the arranging takes place such that the ceramic layer and the conductor tracks are located between the metallic housing element and the thermoelectrically active material; and - Attaching a further housing element, so that the thermo-electrically active material is fluid-tightly sealed between the housing member and the other housing member and electrically contacted to produce the thermoelectric module.
• thermoelectric module having the following features:
• a further housing member which is disposed on the side of the metallic housing member having the ceramic layer and wherein the further housing member and the metallic housing member are connected to a fluidic housing;
• thermoelectrically active material which is arranged in the fluid-tight housing, in particular on the electrical conductor tracks.
• the present invention is based on the finding that a very good insulating property between the thermoelectrically active elements and a metallic housing wall can be achieved if a ceramic layer is applied to at least one housing element.
• This ceramic layer allows very high electrical insulation of the thermoelectric materials at very high temperatures, which is exposed to the thermoelectric module, in particular when operating in exhaust gas trains of vehicles. Other insulation materials would already be destroyed or seriously damaged at such temperatures.
• the present invention provides a significant advantage when a thermoelectric module is to be used in an environment of use where very high temperatures prevail.
• the materials used should have the same or at least similar thermal expansion coefficients. For this purpose, it is useful to expand the heat exchanger as possible by thermal spray layers to the entry of Solders with different thermal expansion coefficients to minimize the other materials as possible.
• the step of applying comprises a substep of the injection of ceramic base material to the metallic housing element, wherein the ceramic base material is formed to form the ceramic layer.
• the ceramic base material is formed to form the ceramic layer.
• spraying provides a technically very simple and cost-effective way of applying the ceramic layer.
• a surface of the metallic housing element can also be roughened before spraying, for example by sandblasting or pickling, in order to ensure an improvement in the mechanical adhesion of the ceramic base material to the metallic housing element.
• the natural oxide layer of the stainless steel can be removed, which could adversely affect the adhesion of the applied material.
• the ceramic base material can then harden after spraying and form the ceramic layer. Particularly preferred for spraying ceramics is plasma spraying.
• a material may be applied to the case member configured to form a ceramic layer having a coefficient of thermal expansion within a tolerance range corresponding to a metallic material of the case member.
• thermoelectrically active materials can in the step of Aufbrin- gens a sub-step of forming electrically conductive areas, such as bonding layers, carried on the ceramic layer, wherein in the step of arranging the at least one thermoelectrically active material is applied to the electrically conductive region.
• electrically conductive areas such as bonding layers
• Such an embodiment of the present invention offers the advantage that also the at least one electrically conductive region can be produced very simply by technically mature and therefore cost-effective methods.
• the sub-step of forming may include spraying an electrically conductive material to form the electrically conductive regions.
• thermal spraying such as e.g. a wire flame spraying can be used.
• An injection of the good electrically conductive elements Cu or Ag or their alloys is possible.
• thermoelectric module A very high durability of the thermoelectric module can be achieved if in the partial step of forming a material is applied to the ceramic layer, which corresponds to the thermal expansion coefficient of the material from which the metallic housing element is formed or in which nickel in the substep of forming is applied to the ceramic layer to form the electrically conductive region.
• This makes it possible, on the one hand, that the thermal expansion of the individual materials does not lead to high thermo-mechanical stresses and, on the other hand, when using nickel, a barrier layer can be formed to suppress unwanted element diffusion of foreign atoms into the thermoelectrically active material. It is also advantageous that Ni has a relatively low specific electrical resistance.
• thermoelectrically active material A reliable electrical contacting of the thermoelectrically active material can be carried out particularly efficiently if, in the step of arranging, a silver sintering or silver-printing sintering method is used for materially connecting the thermoelectrically active material to the at least one electrically conductive region. If necessary, the silver sintered or sil- be made porous (with porosities of at least 15, typically 30 °%) to compensate for any differences with thermal expansion coefficient of the adjacent materials.
• thermoelectrically active material to the at least one electrically conductive region, in which a (reactive nano) solder foil is used.
• a method for materially joining the thermoelectrically active material to the at least one electrically conductive region in which a (reactive nano) solder foil is used.
• thermoelectrically active material in order to achieve a high mechanical stability at high operating temperatures, can be injected to the electrically conductive region in the step of arranging.
• thermoelectrically active material by molding the thermoelectrically active material onto the electrically conductive region, it can be achieved that the substance-coherent connection between the electrically conductive region and the thermoelectrically active material is very stable even at very high temperatures.
• On a second side of the thermoelectrically active material may then be used a material connection based on a different connection method, so that for example this connection can be used with the other connection method for the side of the thermoelectric module, at the same in the operation of the colder of the two Fluide is performed. In this way, a durable even at very high operating temperatures thermoelectric module can be produced.
• the present invention also provides a thermoelectric device having a first thermoelectric module as described above, which has a projection on the housing element or on the further housing element of the first thermoelectric module.
• a thermoelectric module further comprises a second thermoelectric module as it is has been described, in which the housing member or the further housing member of the second thermoelectric module is fluid-tightly secured to the projection, such that between the first and second thermoelectric module, a chamber for guiding a fluid is formed.
• Such an embodiment of the present invention offers the advantage of a very compact construction of a thermoelectric device, since a fluid flowing in the chamber flows past both sides of the first thermoelectric module and on one side of the second thermoelectric module and thus the available installation space the fluid guide can be used very efficiently.
• thermoelectric device may include a first and a second thermoelectric
• thermoelectric device may include a support fluid-tightly interconnecting the first and second thermoelectric modules, such that a chamber for conducting a fluid is formed between the first and second thermoelectric modules.
• a support fluid-tightly interconnecting the first and second thermoelectric modules such that a chamber for conducting a fluid is formed between the first and second thermoelectric modules.
• Such an embodiment of the present invention also offers the advantage of a very compact construction, since a fluid flowing in the chamber flows by both on one side of the first thermoelectric module and on one side of the second thermoelectric module.
• the holder can be used or used as a very simple ausgestaltetes and thus cost-effective element.
• thermoelectric device it is also favorable if the housing element or the further housing element of the first thermoelectric module has a projection, wherein the second second thermoelectric module is arranged on the projection such that the projection acts as a thermal separating element between the first and second thermoelectric module , In this way, advantageously a thermal insulation or a more difficult heat transfer from the first to the second thermoelectric module can take place, so that the efficiency of the thermoelectric device can be optimized.
• Advantageous embodiments of the present invention will be explained below with reference to the accompanying drawings. 1 is a flow chart of an embodiment of the present invention as a method
• Fig. 2 is a perspective view of a TEM envelope body bottom
• FIG. 3 is a perspective view of a TEM-envelope body lower part with ellektrischen conductors.
• FIG. 4 is a perspective view of a TEM shell body bottom with electrical conductors and TE materials
• FIG. 5 is a perspective view of a joining process of a TEM
• Fig. 6 is a transverse or longitudinal sectional view in section of upper and lower components of the TEM or TEM tube during joining;
• Fig. 7 is a transverse or longitudinal sectional view in section of upper and lower components of the TEM or TEM tube after joining;
• Fig. 8 is a perspective view of a TEM
• FIG. 9 is a perspective view of a holder
• FIG. 10 is a perspective view of a joining operation of the TEM with
• Fig. 1 1 is a perspective view of a TEM with holder
• Fig. 12 is a cross-sectional view of a TEM with holder
• Fig. 13 is a longitudinal sectional view of a TEG with TEM and holder
• Fig. 14 is a perspective view of a TEM tube
• Fig. 1 5 is a perspective view of a joining operation of a TEM tube with cover
• Fig. 16 is a perspective view of a TEM tube with TEM tube cover
• Fig. 1 7 is a perspective view of a joining operation of a TEG with TEM tube.
• Fig. 18 is a perspective view of a holder
• Fig. 1 shows a Abiaufdiagramm an embodiment of the present invention as a method 100 for producing a thermoelectric module.
• the method 100 includes a step of depositing a ceramic layer 110 and electrical traces on a metallic package member. Furthermore, the method comprises a step of arranging 120 at least one thermoelectrically active material on the housing element, wherein the arranging 120 takes place such that the ceramic layer is located between the metallic housing element and the thermoelectric material. Finally, the method 100 comprises a step of attaching a further housing element such that the thermoelectric material is fluid-tightly sealed between the housing element and the further housing element and electrically contacted in order to form the thermoelectric module.
• thermoelectric module 2 At least one manufacturing method or a process technique for producing a thermoelectric module is disclosed.
• a thermoelectric module 2, 24 in particular special using a thermal spraying method and / or a soldering, as will be described in more detail below.
• materials are disclosed, which are combined with the described process technology to form a thermoelectric module.
• a thermoelectric generator 1 will experience temperature differences of 500 K or more across the component and rapid heating cycles when operating in an automotive environment. Both solves thermomechanical
• the basic idea of the present invention is that for at least one housing element better but for a plurality of housing elements which are fluid-tightly interconnected, metallic 3, 4, 6, 21, 22, 23 and ceramic materials are selected, which are suitably of the thermal expansion coefficient fit together, ie within a tolerance range of, for example, 40 percent, conveniently 20 percent.
• metallic 3, 4, 6, 21, 22, 23 and ceramic materials are selected, which are suitably of the thermal expansion coefficient fit together, ie within a tolerance range of, for example, 40 percent, conveniently 20 percent.
• the coefficient of expansion of one of the materials deviates by no more than 40 percent, advantageously 20 percent, from the expansion coefficient of the other material. Since metals have a rather high coefficient of thermal expansion and ceramics a rather lower coefficient of thermal expansion, the metals should be at the lower end and the ceramics should be at the upper end.
• a metallic candidate material is for example ferritic stainless steel 3, 4, 6, 21, 22, 23, such as the stainless steel material 1.4509 or 14512. They have a thermal expansion coefficient of 10 ppm / K at room temperature and 1 1 ppm / K at 600 ° C .
• An additional advantage of such materials is that ferritic stainless steel is ferromagnetic and thus can be magnetically clamped to the coating 5.
• a soft annealed material is roughened prior to coating, for example by means of sandblasting or pickling, for better mechanical engagement of the ceramic layer 5.
• an oxide layer which disturbs the adhesion is reduced or even removed.
• the thickness of the stainless steel material could be 0.5 mm.
• a housing The element which can be produced by the method presented above is shown in FIG. 2 as a perspective view.
• the ceramic insulating layer 5 is applied in a defined size, for example 80 x 60 mm, directly on the stainless steel 3, 4, 22, 23.
• the application method used is, for example, thermal spraying, in particular plasma spraying.
• the defined shape of the ceramic layer 5 is achieved by the use of masks between plasma torch and base material.
• the ceramic should be adapted in its thermal expansion coefficient of the ferritic stainless steel. This satisfies 2r0 2 with a value of 10 ppm / K at room temperature and 10.1 ppm / K at 600 ° C.
• the preferred variant is Y 2 O 3 -stabilized ZrO 2 because of its thermomechanical stability.
• AI2O3 or mixed oxides such as ceramic ⁇ 2 ⁇ 3 ⁇ 2 or AI 2 0 3 are used / MgO or Al 2 0 3 IZ, if the thermal expansion coefficient of the ceramic Ausdeh- is adapted to that of the ferritic base metal.
• the thickness of the ceramic spray layer 5 could be about 0.1 mm, but in principle it should be as thin as possible, possibly 30 pm.
• the 30 ⁇ m thin sprayed on AI2O3 layer achieves contact resistance to metallic base material of 10 ⁇ or more.
• electrical conductor tracks 6 are applied to the ceramic insulating layers 5, for example by thermal spraying such as wire flame spraying. Positioning of the electrical conductor tracks can also be done via masks.
• a housing element 4, as obtained after the application of the electrical conductor tracks, is shown in FIG.
• a material for the electrical conductor tracks 6 again offers ferritic stainless steel.
• Suitable candidate materials are 1,404,9, 1,4122 or similar materials.
• a variant is Nicket Anlagen devisspritzen as conductor 6.
• the motivation here is to provide a conductor track surface that can be soldered to a thermoelectric material without special aggressive flux.
• the coefficient of thermal expansion of nickel at about 13 ppm / K is greater than that of the composite ferrite / ceramic, it is not much larger.
• An advantage of the nickel compared to stainless steel is a factor of 10 lower specific electrical resistance, which compared to stainless steel allows significantly smaller cable cross-sections.
• barrier layers 9 for masking unwanted element diffusion during operation into the TE materials 7, 8 or out of the TE materials can also be sprayed onto the conductor tracks or onto the TE materials again via masks.
• Suitable materials for the barrier layer are, for example, Cr or Ni or their alloys.
• a nickel conductor would have the dual benefit of not only directing the thermoelectric current, but itself representing a barrier layer.
• a sprayed Ni barrier layer on the TE material would have the additional benefit that a technical joining of the structure to a conductor track by the mechanical engagement of the joining material is injected into the sprayed Ni layer significantly easier. Analogous to the metallic base material, it is also possible to remove an oxide layer which disturbs the adhesion of the sprayed layer by sandblasting, pickling etc. before spraying.
• Niockel also another barrier material can be injected, as e.g. Cr.
• thermoelectric module 2, 24 A housing element with a plurality of thermoelectric materials applied in this way is shown in FIG. 4 in a perspective view.
• the thermal Expansion coefficient of the thermoelectric material and the solder at room temperature (RT) should be in the range of, for example, 10 ppm / K, in order to ensure low-voltage operation as possible. This is for example met by n-type CoSb 3 T skutterudites having a thermal expansion coefficient between 200 ° C and 600 ° C of 12.2 ppm / K.
• An alternative joining method for TE materials in the form of blocks is the so-called silver sintering or silver-pressure sintering.
• the blocks and the tracks which are suitably wettable precoated, e.g. by a sprayed Ag layer, at about 200 ° C, or optionally at elevated temperature or pressure application using an Ag paste.
• the Ag joint then has a porosity of about 30%.
• the joining temperature and / or the joining pressure can be lowered.
• the porosity of the joint seam increases to about 50%, it still has a sufficiently high thermal conductivity.
• the Ag mechanically clings into the rough, sprayed ceramic layer and adheres very well.
• the use of Ag alloys is also possible.
• thermoelectric material 8 for example, onto a conductor track 6.
• a lot as Disruption of the coordinated CTE composite material must then not be used. It would then only be soldered on one side of a conductor. The advantage would be that you could put this one seam on the cold side of the module and thus the thermo-mechanical stress of the joint in thermocycling would be rather low.
• a preferred dimension for the blocks 7, 8 (either assembled as a soldering pad or constructed by thermal spraying) is about 0.5 x 0.5 mm to 1.0 x 1.0 mm. Or 1, 0 x 1, 0 mm to 5.0 x 5.0 mm. The reason is that, with these rather small dimensions, the thermal expansion also tends to form small difference lengths d1 between the blocks and adjacent interconnects connected in a cohesive manner to the blocks, which tend to result in lower thermomechanical stresses.
• thermoelectric module can now be completed by placing a further housing element 3 on the exposed thermoelectric materials and connecting it in a fluid-tight manner to the (first) housing element.
• a further housing element 3 can be previously treated in an analogous manner as the housing element 4, for example, be provided with a ceramic layer and / or electrical conductor tracks, which are contacted with the thermoelectric materials 7, 8.
• the contacting could be done by the above-described soft solder.
• bonding with a temperature-stable adhesive for example based on silicone or by means of Ag sintering or Ag pressure sintering, is also possible.
• Fig. 6 and Fig. 7 show cross-sectional views of the assembly of the individual housing parts to the thermoelectric module, wherein Fig. 6 is not yet closed state of the thermoelectric module and Fig. 7 shows the closed state of the thermoelectric module.
• the finished module which terminates on both sides, for example, with a sheet of ferritic stainless steel, can finally be assembled by laser welding with a heat exchanger 1.
• the heat transfer material preferably also consists of ferritic stainless steel.
• thermoelectric module using the above-mentioned components.
• the TEM 2 is formed by a metallic shell body top 3 (e.g., stainless steel) and a metallic shell body bottom 4 (e.g., stainless steel), between which are substantially TE active materials 7, 8.
• the metallic enveloping body upper part 3 of the TEM 2 is externally in contact with one of the two fluids flowing through the TEG 1, the metallic enveloping body lower part 4 of the TEM 2 is in contact with the other fluid 19 flowing through the TEG 1 due to the temperature differences between Fluid 1 19 and 2 20 creates an electric current in the TEM 2.
• the upper part 3 and the lower part 4 have, for example, a shell-like shape, as shown for example in FIG. 2.
• the lower part 4 additionally forms a lateral projection 16 which, together with the expansion bellows of the holder 15, delimits a thermal separation 17, as shown in FIG.
• This thermal separation 17 prevents heat flow losses in the lateral region of the TE M / holder 2, 1 1, the thermal separation 17 may be a nearly quiescent fluid or a heat-insulating material.
• the enveloping body parts 3, 4 are both coated with a non-conductor 5, for example.
• This non-conductor 5 is a ceramic and is applied to the enveloping body parts 3, 4, for example by means of plasma spraying.
• the conductors 6 are preferably applied to the non-conductor 5 by plasma spraying.
• the TE materials 7, 8 are connected to the conductors 6, and can either be sprayed onto them 8 or they are present as a block 7. As blocks 7, they are connected to the conductors on the hot side, for example by means of Ag or AgCu soldering or by means of silver sintering or silver pressure sintering. If the TE materials 8 are sprayed on, this preferably takes place on the hot side.
• the TE materials 7, 8 are cold-bonded to the conductors 6 by means of Ag or AgCu or Sn soldering or by means of silver sintering or silver pressure sintering.
• FIG. 10 shows a cross-sectional view of a thermoelectric module 2 after assembly.
• thermoelectric modules 2 may be assembled into a thermoelectric generator 1 as shown in the longitudinal sectional view of FIG.
• the upper part 3 is preferably exposed to the outside of the hot gaseous fluid 19, 20 and is for this purpose preferably profiled 10 in order to increase the heat transfer and the transfer surface.
• the lower part 4 can be profiled if necessary.
• the profiling 10 is For example, a stamped and / or formed sheet metal 10 is shown in FIG. 14, the TEM tube 24th On such a profiled thermoelectric module, a lid 25 can then be placed, as shown in the perspective view of FIG. 15. As a result, a thermoelectric module is obtained, as shown for example in FIG. 16.
• the TEM 2 is connected to the passage of the TEM recess 12 of the holder 1 1 1, 12, preferably by means of laser welding.
• the holder 1 is equipped on the top and bottom with one TEM 2 each.
• the holder 1 1 has openings 14, via which one of the two fluids 19, 20 the TEM 2 and the tops / bottoms 3, 4 of the TEM 2 can be supplied.
• the second fluid 20, 19 flows around the construct TEM with holder 2, 11 on the outside.
• the expansion bellows of the holder 15 serves to form a thermal separation 17.
• the holder 11 is not limited to the use of a TEM 2 with metallic enveloping body 3, 4, but may optionally also be joined with a TEM with a ceramic enveloping body.
• the expansion bellows of the holder 15 can also serve to intercept the differences in the thermal expansions of the various materials during operation so that the TEMs with ceramic enveloping body are not damaged.
• the holder may alternatively or additionally have a plurality of vertically and / or horizontally extending material thinning 31, which also serve this purpose.
• the holder 1 1 can be additionally provided with an insulating material 18 in particular in the lateral area (inside or outside), in order to avoid heat losses, whereby the expansion bellows of the holder 15 may be omitted if necessary.
• an insulating material 18 in particular in the lateral area (inside or outside), in order to avoid heat losses, whereby the expansion bellows of the holder 15 may be omitted if necessary.
• thermoelectric module described above is not limited to the TEM 2 with holder 11 described here, but refers to any TEM design using a metallic envelope.
• the TEM 2 with brackets 1 1 and the TEM tubes 24 are installed in a TEG 1 in any number of columns and / or line by line.
• the holders 11 of the TEM 2 are connected to their opening areas 14 with bottoms 28 (preferably by laser welding).
• the TEG 1 therefore consists essentially of a plurality of stacked TEM 2 with holder 11 and TEM tubes 24, and floors 28, diffusers 27, a housing 29 and various electronic components such. Cables and / or plugs, which connect the TEG 1 to the outside electronically, as well as, if appropriate, the TEM 2 or the TEM tubes 24 interconnect in series or in parallel.
• the diffusers 27 and / or the housing 29 are designed with relevant openings.
• thermoelectric generator 1 can be taken from FIG. 17.
• the first fluid 19 or second fluid 20 is supplied to the TEG 1 via the opening 26 to the diffuser 27. Subsequently, it is 19, 20 to the interior of the brackets 1 1 and the inner tubes 22 of the TEM tubes 24, respectively. Afterwards, it reaches 19, 20 in the second diffuser 27 and is finally carried out beyond the opening 26.
• the second fluid 20, 19 communicates with the TEG 1 via an opening 26 in the housing 29.
• the second fluid 20, 19 flows around the exterior of the constructs TEM 2 with holder 11 and the outer tubes 23 of the TEM tubes 24 in the housing 29 via a second opening 26 in the housing 29 out again.
• the second fluid 20, 19 can be deflected several times in the housing.
• the TEM 2 with holder 1 1 or TEM tubes 24 and / or the housing 29 are equipped with one or more baffles 30.
• the plates 28 separate the first fluid (19) region in the TEG 1 from the second fluid (20) region in the axial direction.
• FIG. 18 shows a perspective view of a material thinning support as may be used to fabricate a thermoelectric module as described above.
• thermoelectric heater or cooler TE-HK can also be used as a thermoelectric heater or cooler TE-HK.
• the approach described above makes it possible to generate very good electrical energy from thermal energy and to optimize the TEG and / or TEMs.
• Plasma spraying method e.g., alumina or zirconia
• thermoelectric active materials e.g., Half-Heusler, Skutteridite, silicides, BiTe, PbTE
• thermoelectric module 32 double TEM: two TEMs are connected to each other 00 Process for making a thermoelectric module

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• Combustion & Propulsion (AREA)
• Mechanical Engineering (AREA)
• General Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Measuring Temperature Or Quantity Of Heat (AREA)
• Coating By Spraying Or Casting (AREA)
• Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
• Resistance Heating (AREA)

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• 2011
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