Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/36—Removing material
  • B23K26/38—Removing material by boring or cutting
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/36—Removing material
  • B23K26/40—Removing material taking account of the properties of the material involved
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
  • B41F—PRINTING MACHINES OR PRESSES
  • B41F15/00—Screen printers
  • B41F15/14—Details
  • B41F15/34—Screens, Frames; Holders therefor
  • B41F15/36—Screens, Frames; Holders therefor flat
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
  • B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
  • B41N1/00—Printing plates or foils; Materials therefor
  • B41N1/24—Stencils; Stencil materials; Carriers therefor
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
  • H01L31/02—Details
  • H01L31/0224—Electrodes
  • H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
  • H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K2103/00—Materials to be soldered, welded or cut
  • B23K2103/16—Composite materials, e.g. fibre reinforced
  • B23K2103/166—Multilayered materials
  • B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
  • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
  • B41C1/00—Forme preparation
  • B41C1/14—Forme preparation for stencil-printing or silk-screen printing
  • B41C1/145—Forme preparation for stencil-printing or silk-screen printing by perforation using an energetic radiation beam, e.g. a laser
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
  • B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
  • B41C1/00—Forme preparation
  • B41C1/14—Forme preparation for stencil-printing or silk-screen printing
  • B41C1/147—Forme preparation for stencil-printing or silk-screen printing by imagewise deposition of a liquid, e.g. from an ink jet; Chemical perforation by the hardening or solubilizing of the ink impervious coating or sheet
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
  • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
  • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
  • H05K3/1225—Screens or stencils; Holders therefor
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
  • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
  • Y02E10/00—Energy generation through renewable energy sources
  • Y02E10/50—Photovoltaic [PV] energy

Definitions

• the present invention relates to a printing stencil for applying a printing pattern, in particular a contacting, to a substrate, in particular to a substrate of a solar cell, comprising a carrier layer and a structural layer underlying the carrier layer, the structural layer corresponding at least to at least one part of the printed image of the printing pattern Print image opening and the carrier layer has one or more carrier layer openings.
• the present invention further relates to a method for producing a printing pattern, in particular a contacting, to a substrate, in particular to a substrate of a solar cell, comprising a carrier layer and a structural layer underlying the carrier layer, the structural layer corresponding at least to at least one part of the printed image of the printing pattern Print image opening and the carrier layer has one or more carrier layer openings.
• the present invention further relates to a method for producing a printing stencil for applying a printing pattern, in particular a contacting, to a substrate, in particular to a substrate of a solar cell, comprising a carrier layer and a structural layer underlying the carrier
• Printing screens have a wire mesh cloth clamped in a frame which is embedded in a photoemulsion layer (see, for example, DE 10 2007 052 679 A1).
• the photoemulsion layer has the print image openings corresponding to the print image of the contact to be printed, wherein the screen fabric also fills the print image openings.
• the wire mesh fabric is stretched onto a frame and then coated with a photosensitive material. Subsequently, the structuring of the printed image.
• the contact fingers should be printed with the smallest possible width on the substrate To reduce shading of the solar cell substrate by the front side contacting and thus to increase the energy efficiency of the solar cell.
• a power line with the lowest possible electrical resistance i.
• the contact fingers must be formed with the largest possible aspect ratio, since the electrical resistance of the contact fingers depends on the cross section of the contact fingers.
• the aspect ratio of the contact fingers should in particular be formed uniformly over the entire length of the contact fingers as possible.
• a further object of the present invention is to provide an improved solution for applying a contacting to a substrate, in particular to a substrate of a solar cell, in which the contacting and in particular the contact fingers can be applied with a uniform printed image. In particular it is. It is an object of the present invention to provide an improved solution for applying a contacting to a substrate, in particular to a solar cell, in which the contact fingers can be applied with the highest possible uniform aspect ratio over the entire length of the contact fingers.
• a printing stencil for applying a printing pattern, in particular a contacting, to a substrate, in particular a substrate of a solar cell, according to The present invention comprises a carrier layer and a structural layer lying below the carrier layer or arranged below the carrier layer. In this case, it is preferably provided to provide the carrier layer on the rakel side and the structural layer on the substrate side.
• the structural layer has at least one printed image opening corresponding to at least one part of the printed image of the printed pattern
• the carrier layer has one or more carrier layer openings and the one or more carrier layer openings overlap one another in a top view of the printing template with the printed image opening such that the printing stencil forms one of the at least one a printing image opening and the one or more carrier layer openings formed opening and is adapted to a printing medium such as Apply contact material through the opening on the substrate.
• a printing stencil according to the invention for applying a printing pattern, in particular a contacting, to a substrate, in particular to a substrate of a solar cell, instead of a conventional screen printing stencil, results with the carrier layer, preferably of a stable carrier material, such as e.g. Metal or plastic, a lot of advantages.
• the support layer which preferably forms the entire surface of a main body of the printing stencil, results in an advantageously higher mechanical strength.
• the stretching of the pressure body can be reduced upon pressure application by the doctor, whereby a more uniform, positionally accurate and especially undistorted total print image is made possible, even when printing the printing pattern or the contacting in several steps (so-called stacking) with a plurality of different printing images having printing stencils ,
• a longer service life than when using the conventionally known pressure screens is still possible.
• the one or more carrier layer openings have circumferentially exposed opening walls.
• the at least one print image opening according to a first embodiment of the present invention is narrower, i. in particular with a smaller opening width, is formed as the one or more carrier layer openings.
• This has the advantage that a cleaning of the printing stencil after printing from the doctor side can be further facilitated.
• this makes it possible to work more efficiently when working out the carrier layer openings with lower accuracy, since a high accuracy of the geometry of the carrier layer openings for high quality of the printed image is not required because the printed image and its quality depends only on the narrower openings in the structural layer.
• the production of the carrier layer can thus be carried out more simply and more efficiently, since lower quality requirements can be imposed on the geometry of the carrier layer openings.
• the one or more carrier layer openings are narrower, ie in particular with a smaller opening width, than the printed image opening.
• the paste can be applied to the substrate during printing through the narrower openings of the carrier layer with a higher squeegee pressure, so that the paste can be completely and uniformly filled in the area between the carrier layer and the substrate to be printed, in particular also in areas below any Webs of the carrier layer, which optionally separate a plurality of carrier layer openings for stabilizing the template and below which no material of the structural layer is provided.
• Another great advantage of a printing stencil in which the one or more carrier image openings narrower, ie, in particular formed with a smaller opening width than the one or more print image openings results from the flexibility regarding the possibilities in the manufacturing process of the printing stencil.
• Carrier layer openings formed substantially rectangular. Essentially rectangular is intended to mean that the corners can be rounded.
• the printing stencil preferably has a first carrier layer opening and a second carrier layer opening which are separated by a web of the carrier layer, in particular preferably a web having a width of less than or equal to 50 ⁇ m, particularly preferably less than 35 ⁇ m.
• a web preferably runs transversely, in particular preferably perpendicular, to the longitudinal direction of the print image opening and / or carrier openings.
• the printing stencil itself even with an elongated printing image opening, e.g. can be formed according to an elongated contact finger of the contacting by one or more webs between adjacent carrier layer openings.
• the web preferably bridges the print image opening in the structure layer, so that the first and second carrier layer openings separated by the web overlap with the same print image opening of the structure layer.
• one or more webs are provided, wherein the distance between two
• Webs or the distance of a web to an end portion of the support opening in a range between 100 and 500 ⁇ is, preferably between 250 and 500 pm. With printing image opening widths in the range between 50 and 100 pm, this results in a high Stability of the printing stencil while avoiding irregularities in the printed image due to a too high web density similar to irregularities due to the Siebgewebemaschen and mesh knots in the printing area in the printing screens described above.
• the material of the carrier layer preferably comprises metal, in particular stainless steel or nickel, and / or plastic.
• the carrier layer consists of metal, in particular stainless steel or nickel, and / or plastic.
• the carrier layer comprises one or more metal layers and / or one or more plastic layers.
• the carrier layer preferably comprises or the carrier layer consists of a metal sheet.
• the carrier layer preferably has a layer height of greater than or equal to 10 ⁇ m.
• the structural layer is made of a liquid or solid, preferably photosensitive, material, especially preferably a photosensitive photoemulsion.
• the structural layer can be easily applied to the carrier layer or a further intermediate layer, wherein the print image openings thereafter can be worked out particularly precisely and efficiently by substrate-side exposure of the printing stencil and subsequent development of the structure layer, in particular photoemulsion layer, produced from the photosensitive material.
• the photosensitive material is negatively exposable or positively exposed.
• the structural layer preferably has a layer height of greater than or equal to 5 ⁇ m.
• the structural layer is on the carrier layer or one between the
• the carrier layer preferably has a surface structure on the side on which the structural layer is applied. This facilitates the application of the structural layer to the carrier layer by providing a higher adhesive effect on the substrate-side surface of the carrier layer, in particular when using photoemulsions.
• the carrier layer and / or the entire stencil is surface-treated to improve the printing behavior, in particular by at least one of painting, coating and roughening.
• the width of the print image opening is greater than or equal to 35 m and / or less than or equal to 150 pm.
• a method of manufacturing a stencil sheet according to at least one of the above aspects.
• the method according to the invention comprises the steps of providing a carrier layer, providing a structural layer below (ie in particular on the substrate side), working out at least one corresponding print image opening in the structural layer and working out one or more carrier layer openings in at least one part of the print image of the print pattern the carrier layer.
• Carrier layer openings worked out such that the one or more carrier layer openings overlap in plan view of the printing template with the print image opening such that the printing stencil has an opening formed from the at least one print image opening and the one or more carrier layer openings and is suitable, a pressure medium through the opening to apply to the substrate.
• the step of providing a structural layer overlying the carrier layer comprises a step of coating the structural layer with the material of the structural layer or coating an intermediate layer with the material of the structural layer.
• the print image opening and the one or more carrier layer openings are preferably worked out in such a way that the print image opening is narrower than the one or more carrier layer openings.
• the print image opening and the one or more carrier layer openings are preferably worked out in such a way that the print image opening is narrower than the one or more carrier layer openings.
• the print image opening and the one or more carrier layer openings are preferably worked out such that the one or more carrier layer openings are formed narrower than the print image opening.
• the steps of the method are carried out in the following order: first providing the carrier layer, eg by clamping in a frame, then working out the one or more carrier layer openings in the carrier layer, eg by laser processing, etching and / or galvanic methods, then providing the under the structure layer already having the support openings and then working out the at least one print image opening in the structure layer, eg by exposure and development, when a photoemulsion layer or photosensitive structure layer is used.
• the steps of the method according to another embodiment are performed in the following order: first providing the carrier layer, eg by clamping in a frame, then providing the structural layer underlying the carrier layer, then working out at least one print image opening in the structural layer, eg by exposure and developing when a photoemulsion layer or photosensitive structural layer is used, and then working out the one or more carrier layer openings in the carrier layer.
• this is only advantageous if the print image opening is wider or of the same width as the at least one support layer opening to be worked out, since otherwise the structure layer could be damaged when working out the support layer opening.
• the step of working out the one or more carrier layer openings in the carrier layer is preferably carried out by means of laser cutting, etching and / or a galvanic method.
• the structural layer is made of a liquid or solid photosensitive material, in particular of a photosensitive photoemulsion, wherein the step of working out at least one printed image opening in the structural layer preferably comprises the following steps: exposing the structural layer by means of electromagnetic radiation of a predetermined wavelength or a predetermined wavelength range, in particular by means of infrared, visible and / or ultraviolet light, with a printed image and developing the exposed photosensitive material of the structural layer.
• the step of providing the structural layer underlying the carrier layer comprises the steps of providing an intermediate layer under the carrier layer and applying the structural layer on the intermediate layer.
• the step of providing the structural layer underlying the carrier layer preferably comprises the step of applying the structural layer to the carrier layer.
• the method comprises the further step of working out a surface structure on the side of the carrier layer facing the structural layer in order to be able to improve an adhesion effect when the structural layer is applied and to facilitate the application of the structural layer.
• the method preferably comprises the further step of surface-treating the carrier layer and / or the entire stencil to improve the printing behavior, in particular by means of at least one of painting, coating and roughening.
• Fig. 1 shows a plan view of a known from the prior art solar cell.
• Fig. 2A is a plan view of a portion of a prior art screen and Fig. 2B is a cross-sectional view of the prior art screen of Fig. 2B.
• FIG. 3A shows a cross-section through a section of a printing stencil according to a first exemplary embodiment of the present invention
• FIG. 3B shows a blade-side plan view of the section of the printing stencil from FIG. 3A
• FIG. 3C shows a substrate-side plan view of the section . the printing stencil of Fig. 3A.
• FIG. 4A shows a cross section through a section of a printing template according to a second embodiment of the present invention
• FIG. 4B shows a squeegee-side plan view of the section of the printing template from FIG. 4A
• FIG. 4C shows a substrate-side plan view of the section of the printing template from FIG. 4A
• the solar cell 100 comprises a substantially rectangular photovoltaic semiconductor photovoltaic substrate layer, hereinafter referred to as substrate 1, on the front side a front contact with two (optionally also a plurality of) electrically conductive mutually parallel busbars 102 for dissipating the electrical energy and for connecting the solar cell 100 with other solar cells to a solar cell module.
• Perpendicular to the busbars 102 are a plurality of also parallel to each other, but extending transversely to the busbars 102 contact fingers 101 as part of the front contacting intended. These conduct the electrical energy generated by the incidence of light in the substrate 1 to the busbars 102.
• the contact fingers 101 In order to enable a high energy efficiency of the solar cell by low electrical resistances of the conductor tracks and at the same time the lowest possible shading, the contact fingers 101 with a maximum and over the entire length the contact finger 101 uniform aspect ratio, ie high altitude and minimum
• Width be applied.
• FIG. 2A shows by way of example a plan view of a section of a printing screen 200 known from the prior art
• FIG. 2B shows by way of example a cross-section of the section of the printing screen 200 of FIG. 2B known from the prior art
• the printing screen 200 includes a photo emulsion layer 201 having a print image opening for printing the front side contact.
• the photoemulsion layer is stabilized by a screen mesh 202, which is incorporated in the photoemulsion layer 201.
• This results in particular in the disadvantage that the screen fabric 202 also fills the free print area of the print image opening and thus can lead to an uneven paste imprint when printing the front side contacting, in particular in the area of the mesh nodes of the screen fabric 202.
• FIG. 3A shows, by way of example, a cross section through a section of a printing stencil 2 according to a first exemplary embodiment of the present invention.
• FIG. 3B shows by way of example a blade-side plan view of the section of the printing stencil 2 from FIG. 3A
• FIG. 3C shows by way of example a substrate-side top view 2 of the section the printing stencil of Fig. 3A.
• the cross-section in Fig. 3A is taken along the section line A - A in Figs. 3B and 3C.
• the printing stencil 2 comprises a squeegee-side carrier layer 21, e.g. made of a metal such as Stainless steel or nickel or even plastic, and a substrate-side structural layer 22, e.g. from a photo emulsion.
• a squeegee-side carrier layer 21 e.g. made of a metal such as Stainless steel or nickel or even plastic
• a substrate-side structural layer 22 e.g. from a photo emulsion.
• the carrier layer 21 comprises elongated, rectangular carrier layer openings 23b, which are separated from each other by a web 21a.
• the structure layer comprises an elongated, rectangular print image opening 23a which corresponds at least to a part of a print image of a front side contact of a solar cell 100 to be printed, in particular to at least one part of a print image corresponding to a contact finger 101 to be printed on the front side contact.
• an opening 23 is thus provided by the printing image opening 23a and the overlying carrier layer openings 23b, through the printing paste can be applied by means of a doctor blade to the substrate 1 for printing at least a portion of the front contact.
• the carrier layer openings 23b overlap in particular in plan view of the printing stencil 2 (ie in the viewing direction according to FIG. 3B or 3C) with the printed image opening 23a such that the printing stencil 2 has the openings 23 formed from the printed image opening 23a and the carrier layer openings (23b) and thereto is suitable to apply the printing paste through the openings 23 on the substrate 1.
• the carrier layer openings 23b in this case have circumferentially exposed opening walls.
• the webs 21a bridge the printed image opening 23a of the structural layer 22 and no material of the structural layer 22 is located under the webs 21a.
• the carrier layer openings 23b in this exemplary embodiment of the present invention are narrower than the print image opening 23a.
• the substrate layer openings 23b have a smaller opening width than the printing image opening 23a. This allows a particularly great flexibility in the production of the printing stencil 2, since the carrier layer openings 23b can be worked out both before and after application of the structural layer 22 to the carrier layer 21 and working out of the printed image opening 23a, without the structural layer 21 or the possibly already worked out Print image opening 23a to damage.
• the generally softer structural layer can advantageously be stabilized by the carrier layer up to its edges at the openings 23a of the printed image.
• FIG. 4A shows by way of example a cross section through a detail of a printing stencil 2 according to a second embodiment of the present invention
• FIG. 4B shows by way of example a squeegee-side plan view of the detail of the stencil sheet from FIG. 4A
• FIG. 4C shows by way of example a substrate-side plan view of the section of the stencil sheet from Fig. 4A.
• the cross-section in Fig. 4A is taken along the section line A - A in Figs. 4B and 4C.
• the printing stencil 2 in turn comprises a squeegee-side carrier layer 21, e.g. made of a metal such as Stainless steel or nickel or even plastic, and a substrate-side structural layer 22, e.g. from a photo emulsion.
• a squeegee-side carrier layer 21 e.g. made of a metal such as Stainless steel or nickel or even plastic
• a substrate-side structural layer 22 e.g. from a photo emulsion.
• the carrier layer 21 comprises elongated carrier layer openings 23b, which are separated from each other by a web 21a.
• the structure layer comprises an elongated print image opening 23a.
• an opening 23 is thus provided by the printing image opening 23a and the overlying carrier layer openings 23b, through the printing paste can be applied by means of a doctor blade to the substrate 1 for printing the front contact.
• the carrier layer openings 23b overlap in particular in a top view of the printing template 2 (ie in the viewing direction according to FIG. 4B or 4C) with the printed image opening 23a such that the printing template 2 has the openings 23 formed from the printed image opening 23a and the carrier layer openings 23b " and is suitable for this purpose is to apply the printing paste through the openings 23 on the substrate 1.
• the carrier layer openings 23b have circumferentially exposed opening walls.
• the webs 21a bridge the print image opening 23a of the structure layer 22 and below the webs 21a in the region of the print image opening 23a is no material of the structure layer 22nd
• the carrier layer openings 23b in this embodiment of the present invention are made wider than the press image opening 23a.
• the substrate layer openings 23b have a higher opening width than the printing image opening 23a. This advantageously makes possible a simpler and more efficient production of the carrier layer, since the accuracy requirements in the working out of the carrier layer openings can be reduced, since the accuracy of the printed image is determined by the accuracy of the geometry of the processed print image openings in the structure layer, which results from an exposure method easy way can be guaranteed.
• the present invention provides an improved solution for applying a contacting to a substrate, in particular to a substrate of a solar cell, in which the contacting and in particular the contact fingers can be applied with a more uniform printed image.
• the present invention provides an improved solution for applying a contacting to a substrate, in particular to a substrate of a solar cell, in which the contact fingers can be applied with the highest possible uniform aspect ratio over the entire length of the contact fingers.
• the contact fingers can be applied with the highest possible uniform aspect ratio over the entire length of the contact fingers.

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• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Mechanical Engineering (AREA)
• Optics & Photonics (AREA)
• Plasma & Fusion (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• Sustainable Development (AREA)
• Sustainable Energy (AREA)
• Life Sciences & Earth Sciences (AREA)
• Electromagnetism (AREA)
• General Physics & Mathematics (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
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• Printing Plates And Materials Therefor (AREA)
• Electroplating Methods And Accessories (AREA)

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• 2011
  • 2011-01-27 DE DE102011003287A patent/DE102011003287A1/de not_active Withdrawn
• 2012
  • 2012-01-27 EP EP12702425.5A patent/EP2668040A1/fr not_active Withdrawn
  • 2012-01-27 WO PCT/EP2012/000363 patent/WO2012100951A1/fr active Application Filing
  • 2012-01-27 US US13/980,962 patent/US20140076231A1/en not_active Abandoned
  • 2012-01-27 CN CN2012800067636A patent/CN103347695A/zh active Pending

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