EP2623643A4 - Aluminumgalvanisierungslösung - Google Patents

Aluminumgalvanisierungslösung

Info

Publication number
EP2623643A4
EP2623643A4 EP20110828690 EP11828690A EP2623643A4 EP 2623643 A4 EP2623643 A4 EP 2623643A4 EP 20110828690 EP20110828690 EP 20110828690 EP 11828690 A EP11828690 A EP 11828690A EP 2623643 A4 EP2623643 A4 EP 2623643A4
Authority
EP
European Patent Office
Prior art keywords
electroplating solution
aluminum electroplating
aluminum
solution
electroplating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP20110828690
Other languages
English (en)
French (fr)
Other versions
EP2623643A1 (de
Inventor
Hiroshi Nakano
Yoshinori Negishi
Haruo Akahoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of EP2623643A1 publication Critical patent/EP2623643A1/de
Publication of EP2623643A4 publication Critical patent/EP2623643A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/42—Electroplating: Baths therefor from solutions of light metals
    • C25D3/44—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/66—Electroplating: Baths therefor from melts
    • C25D3/665—Electroplating: Baths therefor from melts from ionic liquids

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
EP20110828690 2010-09-30 2011-09-01 Aluminumgalvanisierungslösung Withdrawn EP2623643A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010220239 2010-09-30
PCT/JP2011/069895 WO2012043129A1 (ja) 2010-09-30 2011-09-01 電気アルミニウムめっき液

Publications (2)

Publication Number Publication Date
EP2623643A1 EP2623643A1 (de) 2013-08-07
EP2623643A4 true EP2623643A4 (de) 2015-03-04

Family

ID=45892602

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20110828690 Withdrawn EP2623643A4 (de) 2010-09-30 2011-09-01 Aluminumgalvanisierungslösung

Country Status (4)

Country Link
US (1) US20130168258A1 (de)
EP (1) EP2623643A4 (de)
JP (1) JPWO2012043129A1 (de)
WO (1) WO2012043129A1 (de)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5704456B2 (ja) * 2011-05-31 2015-04-22 日立金属株式会社 電解アルミニウム箔製造装置
US9771661B2 (en) 2012-02-06 2017-09-26 Honeywell International Inc. Methods for producing a high temperature oxidation resistant MCrAlX coating on superalloy substrates
JP2014086139A (ja) * 2012-10-19 2014-05-12 Sumitomo Electric Ind Ltd タブリード及びタブリードの製造方法並びに電気化学デバイス
CN103290443B (zh) * 2013-05-15 2017-02-08 北京化工大学 一种超重力技术合成高择优取向铝镀层的方法
US20150101935A1 (en) 2013-10-14 2015-04-16 United Technologies Corporation Apparatus and method for ionic liquid electroplating
US9903034B2 (en) 2013-11-22 2018-02-27 Sikorsky Aircraft Corporation Methods and materials for electroplating aluminum in ionic liquids
US9758888B2 (en) * 2014-05-06 2017-09-12 Apple Inc. Preparation of metal substrate surfaces for electroplating in ionic liquids
US10087540B2 (en) * 2015-02-17 2018-10-02 Honeywell International Inc. Surface modifiers for ionic liquid aluminum electroplating solutions, processes for electroplating aluminum therefrom, and methods for producing an aluminum coating using the same
US10941499B2 (en) * 2015-07-31 2021-03-09 University Of South Florida Electrodeposition of Al—Ni alloys and Al/Ni multilayer structures
JP6471674B2 (ja) * 2015-10-14 2019-02-20 住友電気工業株式会社 アルミニウム膜及びその製造方法
WO2017155671A1 (en) * 2016-03-11 2017-09-14 Applied Materials, Inc. Aluminum electroplating and oxide formation as barrier layer for aluminum semiconductor process equipment
KR102210971B1 (ko) 2016-03-11 2021-02-01 어플라이드 머티어리얼스, 인코포레이티드 반도체 프로세싱 장비 상에 이트륨 산화물을 형성하기 위한 방법
US10407789B2 (en) 2016-12-08 2019-09-10 Applied Materials, Inc. Uniform crack-free aluminum deposition by two step aluminum electroplating process
CN106782980B (zh) * 2017-02-08 2018-11-13 包头天和磁材技术有限责任公司 永磁材料的制造方法
US11261533B2 (en) 2017-02-10 2022-03-01 Applied Materials, Inc. Aluminum plating at low temperature with high efficiency
US11142841B2 (en) 2019-09-17 2021-10-12 Consolidated Nuclear Security, LLC Methods for electropolishing and coating aluminum on air and/or moisture sensitive substrates
US11661665B2 (en) 2020-04-30 2023-05-30 The Boeing Company Aluminum and aluminum alloy electroplated coatings

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0339536A1 (de) * 1988-04-26 1989-11-02 Nisshin Steel Co., Ltd. Plattierungsbad für die Elektroplattierung von Aluminium und Plattierungsverfahren, das dieses Bad verwendet
EP0398358A2 (de) * 1989-05-18 1990-11-22 Mitsubishi Petrochemical Co., Ltd. Verfahren zur Elektroplattierung von Aluminium
JPH06293991A (ja) * 1992-08-14 1994-10-21 Sony Corp アルミニウム非水電解液並びにそれを用いた電池及びアルミニウム電析方法
EP2130949A1 (de) * 2007-02-09 2009-12-09 Dipsol Chemicals Co., Ltd. Bad zur elektrischen abscheidung von al-zr-legierung unter verwendung eines bads von bei raumtemperatur schmelzflüssigem salz und abscheidungsverfahren unter verwendung davon

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2446349A (en) * 1944-02-29 1948-08-03 William Marsh Rice Inst For Th Electrodeposition of aluminum
JPH0613758B2 (ja) 1985-09-20 1994-02-23 日新製鋼株式会社 電気アルミニウムめっき方法
JP2678984B2 (ja) * 1988-04-26 1997-11-19 日新製鋼株式会社 電気アルミニウムめっき浴およびその浴によるめっき方法
JP2657991B2 (ja) 1988-04-26 1997-09-30 日新製鋼株式会社 電気アルミニウムめっき浴およびその浴によるめっき方法
US5336378A (en) * 1989-02-15 1994-08-09 Japan Energy Corporation Method and apparatus for producing a high-purity titanium
JPH03134193A (ja) * 1989-10-18 1991-06-07 Mitsubishi Petrochem Co Ltd 低融点組成物および電気アルミニウムめっき方法
JPH0361392A (ja) * 1989-07-28 1991-03-18 Mitsubishi Petrochem Co Ltd 低融点組成物およびその浴を用いる電気アルミニウムめっき方法
JPH0421794A (ja) * 1990-05-16 1992-01-24 Mitsubishi Petrochem Co Ltd 低融点組成物および電気アルミニウムめっき方法
JP3202072B2 (ja) * 1992-09-21 2001-08-27 三菱化学株式会社 電気アルミニウムめっき方法
WO1997002252A1 (en) * 1995-06-30 1997-01-23 Covalent Associates, Inc. Hydrophobic ionic liquids
JP2004076031A (ja) 2002-08-09 2004-03-11 Ishikawajima Harima Heavy Ind Co Ltd 電解めっき用めっき浴及び複合めっき用めっき浴並びにこれらの製造方法
JP4756462B2 (ja) 2004-11-09 2011-08-24 日立金属株式会社 電解アルミニウムめっき液
JP5080097B2 (ja) * 2007-02-09 2012-11-21 ディップソール株式会社 溶融塩電気アルミニウムめっき浴及びそれを用いためっき方法
EP1983592A1 (de) * 2007-04-17 2008-10-22 Nederlandse Organisatie voor Toegepast-Natuuurwetenschappelijk Onderzoek TNO Verfahren zur Herstellung einer Elektrode
EP1983079A1 (de) * 2007-04-17 2008-10-22 Nederlandse Organisatie voor Toegepast-Natuuurwetenschappelijk Onderzoek TNO Barriereschicht und Herstellungsverfahren dafür
JP5299814B2 (ja) * 2008-01-22 2013-09-25 ディップソール株式会社 常温溶融塩浴を用いた電気Ａｌ−Ｚｒ−Ｍｎ合金めっき浴、そのめっき浴を用いためっき方法及びＡｌ−Ｚｒ−Ｍｎ合金めっき皮膜
JP5581523B2 (ja) * 2009-10-19 2014-09-03 ディップソール株式会社 アルミニウムまたはアルミニウム合金バレル電気めっき方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0339536A1 (de) * 1988-04-26 1989-11-02 Nisshin Steel Co., Ltd. Plattierungsbad für die Elektroplattierung von Aluminium und Plattierungsverfahren, das dieses Bad verwendet
EP0398358A2 (de) * 1989-05-18 1990-11-22 Mitsubishi Petrochemical Co., Ltd. Verfahren zur Elektroplattierung von Aluminium
JPH06293991A (ja) * 1992-08-14 1994-10-21 Sony Corp アルミニウム非水電解液並びにそれを用いた電池及びアルミニウム電析方法
EP2130949A1 (de) * 2007-02-09 2009-12-09 Dipsol Chemicals Co., Ltd. Bad zur elektrischen abscheidung von al-zr-legierung unter verwendung eines bads von bei raumtemperatur schmelzflüssigem salz und abscheidungsverfahren unter verwendung davon

Also Published As

Publication number Publication date
US20130168258A1 (en) 2013-07-04
WO2012043129A1 (ja) 2012-04-05
JPWO2012043129A1 (ja) 2014-02-06
EP2623643A1 (de) 2013-08-07

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Legal Events

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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Effective date: 20150203

RIC1 Information provided on ipc code assigned before grant

Ipc: C25D 3/44 20060101AFI20150128BHEP

Ipc: C25D 3/66 20060101ALI20150128BHEP

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