EP2622259B1 - Lighting module assembly comprising an led on a circuit board - Google Patents

Lighting module assembly comprising an led on a circuit board Download PDF

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Publication number
EP2622259B1
EP2622259B1 EP11764521.8A EP11764521A EP2622259B1 EP 2622259 B1 EP2622259 B1 EP 2622259B1 EP 11764521 A EP11764521 A EP 11764521A EP 2622259 B1 EP2622259 B1 EP 2622259B1
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EP
European Patent Office
Prior art keywords
assembly according
pcb
led
luminaire assembly
modular
Prior art date
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Application number
EP11764521.8A
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German (de)
French (fr)
Other versions
EP2622259B2 (en
EP2622259A1 (en
Inventor
Michael Spiegel
Wolfgang Bechter
Wolfgang Rüf
Bernd Walser
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zumtobel Lighting GmbH Austria
Original Assignee
Zumtobel Lighting GmbH Austria
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Application filed by Zumtobel Lighting GmbH Austria filed Critical Zumtobel Lighting GmbH Austria
Publication of EP2622259A1 publication Critical patent/EP2622259A1/en
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/004—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by deformation of parts or snap action mountings, e.g. using clips
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/16—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting
    • F21V17/164—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by deformation of parts; Snap action mounting the parts being subjected to bending, e.g. snap joints
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a light module arrangement for a luminaire;
  • the lighting module arrangement in this case has at least one LED, and at least one circuit board, wherein the at least one LED is arranged on the at least one circuit board and also a support element on which the at least one circuit board is mounted.
  • the invention relates to a luminaire with such a lighting module arrangement.
  • the carrier element is designed as a heat sink. Accordingly, good thermal contact between the board and the heat sink is required.
  • the problem here is that the assembly of the arrangement requires relatively high effort. In particular, it is very labor intensive to make the corresponding surfaces to ensure good thermal contact between the board and the heat sink sufficiently flat.
  • this known arrangement there is the risk that the intensity of the thermal contact between the circuit board and the heat sink wears off in the course of the life of the arrangement.
  • an LED lamp according to the preamble of claim 1 in which an LED is arranged pressed by a holder against a heat sink.
  • the lamp has a lens for influencing the light emitted by the LED.
  • the invention has for its object to provide an improved light module assembly;
  • a particularly simple assembly with permanently good thermal contact between the board and the support element should be possible.
  • an improved luminaire is to be specified with such a luminous module arrangement.
  • a lighting module arrangement for a luminaire; the lighting module arrangement has at least one LED, at least one circuit board, wherein the at least one LED is arranged on the at least one circuit board, and a carrier element on which the at least one circuit board is mounted.
  • the lighting module arrangement has at least one pressing element which is arranged such that it presses the at least one printed circuit board against a surface region of the carrier element.
  • the pressure element is designed such that it presses the board with a spring force against the surface area. In this way, a "floating" storage of the board can be produced; This is particularly advantageous with respect to a permanent uniform contact pressure.
  • this is Pressure element made of plastic or metal; This is particularly advantageous with respect to the design of the spring force.
  • An embodiment as a plastic element is also advantageous because the pressure element acts in this case electrically insulating; This is particularly relevant if an electrical voltage of several hundred volts is provided on the board for operating a plurality of LEDs.
  • the light module assembly is designed such that the at least one pressing element can be connected via a latching connection with the carrier element. This allows a particularly simple installation of the light module arrangement.
  • the carrier element forms a heat sink for the at least one LED, wherein the at least one LED is thermally conductively connected to the carrier element. This allows a particularly good thermal transition from the at least one LED to the heat sink.
  • a thermal compound is disposed between the surface area and the at least one board.
  • the quality of the thermal transition between the board and the carrier element can be further improved.
  • the carrier element has a receiving area, in particular in the form of at least one groove, which is intended to receive an excess portion of the thermal paste.
  • a receiving area in particular in the form of at least one groove, which is intended to receive an excess portion of the thermal paste.
  • the at least one board is elongated;
  • a plurality of LEDs along the main extension of the printed circuit board defined by the elongated shape, so that a light emission area which appears to be oblong overall can be formed.
  • the LEDs can be arranged along a straight line on the circuit board.
  • the light module assembly further comprises at least one further pressing element, which is also arranged such that it presses the at least one board against the surface region of the support member.
  • the at least one further pressure element is preferably configured analogously and / or structurally to the first mentioned at least one pressure element.
  • a particularly effective light output by the light module arrangement can be achieved if, as provided according to the invention, it also has an optically effective element which is arranged such that it optically influences a light emitted by the at least one LED, for example in the form of a reflector element.
  • the at least one pressing element is furthermore designed to hold the optically active element. This allows a further simplified installation.
  • the at least one pressing element preferably has two arms, each having a projection, wherein the projections comprise pressure surfaces for pressing against the at least one circuit board.
  • a luminaire which has a luminous module arrangement according to the invention.
  • the luminaire is preferably a recessed or surface-mounted luminaire.
  • the lamp also has a luminaire housing, by which a light exit area is fixed, wherein the luminous module arrangement in the luminaire housing is arranged that a radiated from the Leuchtmödulanowski light through the light exit area through the lamp can leave.
  • Fig. 1 is a perspective view of the embodiment of a light module assembly according to the invention shown.
  • the light module assembly is suitable for use in a lamp, in other words as a light source unit for a lamp.
  • the light module arrangement comprises at least one LED 2 and at least one circuit board 4, wherein the at least one LED 2 is arranged on the at least one circuit board 4. Furthermore, the lighting module arrangement comprises a carrier element 6, on which the at least one circuit board 4 is held. As in the example shown, the case, the support member 6 may be advantageously formed as a heat sink. In this case, the at least one LED 2 is accordingly thermally conductively connected to the carrier element 6 or the heat sink.
  • Fig. 2 is an exploded view of the light module assembly outlined.
  • the light module arrangement has a flat surface region 10, which is provided or formed for surface contact with the circuit board 4. As a result, a good thermal transition between the circuit board 4 and the carrier element 6 allows.
  • the surface area 10 is also in Fig. 3 denotes, which shows a cross section through the light module assembly.
  • the lighting module arrangement comprises at least one pressing element 8 which is arranged such that it presses the at least one circuit board 4 against the surface region 10 of the carrier element 6.
  • the pressing member 8 is configured such that it presses the board 8 with a spring force against the surface portion 10, so that in particular the board 4 is supported on the support member 6 in this way.
  • the pressing element 8 for this consist of plastic or metal. This makes it possible, in particular, for a particularly uniform contact pressure to be maintained on the circuit board 4 over the service life of the luminous module arrangement, and thus for particularly good thermal contact between the circuit board 4 and the carrier element 6.
  • the at least one pressing element 8 has two arms 84, 86, each having a projection 90, 92, wherein the projections 90, 92 pressure surfaces, preferably the single pressure surfaces of the pressure element 8 for pressing against the at least one board 4 include.
  • the projections 90, 92 are rounded, so that a relative movement between the projections 90, 92 on the one hand and the board 4 on the other hand is made possible with particularly low resistance. This is advantageous if, due to temperature fluctuations, different length extensions of the carrier element 6 and the circuit board 4 occur.
  • the lighting module arrangement can be designed such that the at least one circuit board 4 can be ensured on the carrier element 6 only by the at least one pressing element 8.
  • it can thus be provided that, apart from the at least one pressing element 8, no other type of holding element, in particular no screw and no adhesive tape or the like, is provided for holding the plate 4 on the carrier element 6.
  • the at least one pressing element 8 via a - preferably reversibly releasable - locking connection with the support member 6 is connected.
  • the light module assembly is advantageously designed such that on the carrier element, a groove 62 is arranged and on the pressure element 8, a latching projection 82, for example in the form of a web, which can engage in detent groove 62.
  • This embodiment in particular allows a particularly simple installation of the lighting module arrangement.
  • thermal contact is also advantageous between the surface region 10 of the support member 6 on the one hand and the at least one board 8 on the other hand, a thermal paste arranged.
  • the thermal compound makes it possible to compensate for surface roughnesses of the affected areas, so that improved thermal contact is made possible.
  • the carrier element 6 has a receiving region 64, in particular in the form of a groove, which is provided to receive an excess portion of the thermal paste.
  • a receiving region 64 in particular in the form of a groove, which is provided to receive an excess portion of the thermal paste.
  • the at least one circuit board 4 can be elongated, so that - as in Fig. 2 sketched - a centrally along the board 4 extending straight line G is set.
  • the board 4 can be formed as a preferably plate-shaped profile body.
  • the straight line G thus runs along the direction of the main extension of the circuit board 4.
  • This embodiment is particularly suitable for the case where a plurality of LEDs 2 are provided which are arranged along the straight line G on the circuit board 4, preferably in an equidistant manner. This makes it possible to form a light emission area of the light module arrangement that appears to be oblong overall.
  • This Lichtabstrahl Symposium is particularly suitable as a light source of a lamp.
  • the carrier element 6 is also preferably formed as a profile body and thereby preferably oriented so arranged that the thus determined longitudinal extent of the support member 6 is parallel to the straight line G.
  • the carrier element 6 in this case preferably has a - in Fig. 2 exemplified - stop element 66 on, for example in the form of a parallel to the straight line G extending projection, which serves to secure the position of at least one board 4. Also advantageous is the groove that forms the receiving area 64 for the excess thermal paste, also parallel to the straight line G and thereby formed at the transition between the stop element 66 and the surface portion 10.
  • the carrier element 6 for securing the position of at least one board 4 further comprises a further stop element 66 ', preferably in the form of a further projection, which is formed in particular with respect to the straight line G mirror-symmetrical to the first-mentioned stop element 66 ,
  • the carrier element 6 preferably has a further groove, which forms a further receiving region 64 'which is mirror-symmetrical to the first-mentioned receiving region 64.
  • the light module assembly also has at least one further pressing element 8 ', which is also arranged such that it presses the at least one board 4 against the surface portion 10 of the support member 6.
  • the at least one further pressing element 8 ' is analog and / or - as in the example shown, the case - structurally identical to the first mentioned at least one pressing element 8 designed.
  • the configuration may be such that - with respect to the straight line G - the first mentioned at least one pressing element 8 and the at least one further pressing element 8 'on opposite sides or places on the at least board 4.
  • a total of several pressing elements 80 may be provided, which are identical in construction to the first-mentioned pressing element 8 and a plurality of further pressing elements 80 ', which are identical in construction to the at least one further pressure element 8';
  • the arrangement is advantageous such that these multiple pressing elements 80 and these other plurality of pressing elements 80 'with respect to the straight line G press from both sides against the at least one board 4. This makes it possible to produce a particularly uniform pressure distribution along the main extension of the at least one circuit board 4.
  • the board 4 is held on the carrier element 6 only by the respectively given pressing elements 8, 8 ', 80, 80', ie no other type of holding elements are provided.
  • the luminous module arrangement can furthermore have an optically active element which is arranged such that it optically influences a light emitted by the at least one LED 2.
  • the optical element may be in the form of a reflector element 12.
  • the reflector element 12 may be a foil, for example a so-called MC-PET foil, which reflects a particularly large amount of light.
  • the support member 6 may be made of aluminum, so that a surface of the support member 6, for example, has a reflectivity of about 85%.
  • a corresponding film may have a reflectivity of over 90%, for example about 99%. Therefore, the efficiency can be increased with a corresponding reflector element 12.
  • the embodiment is advantageous in that the reflector element 12 extends as far as close to the at least one LED 2 or close to the LEDs 2 along the straight line G. As in Fig. 1 indicated, it may be provided that a distance between the reflector element 12 and the LEDs 2 is smaller than a diameter of the at least one LED 2.
  • the reflector element 12 may be arranged in particular overlapping with the board 4.
  • the light module assembly also has another optically active element 14, for example in the form of an optically diffuse-acting element, which is arranged overlapping a Lichtabstrahl Scheme the at least one LED 2; In this case, there are generally multiple reflections between this further optically active element 14 and a surrounding area of the at least one LED 2. If the reflector element 12 is arranged in this surrounding area, more light can be generated from the side of the at least one LED 2 forth on the further optically active element 14, so that as a result the overall efficiency of the lighting module assembly is increased.
  • another optically active element 14 for example in the form of an optically diffuse-acting element, which is arranged overlapping a Lichtabstrahl Scheme the at least one LED 2;
  • this further optically active element 14 there are generally multiple reflections between this further optically active element 14 and a surrounding area of the at least one LED 2. If the reflector element 12 is arranged in this surrounding area, more light can be generated from the side of the at least one LED 2 forth on the further optically active element 14, so that as a result
  • the arrangement is advantageous in that - viewed in a cross section normal to the straight line G - the further optically active element 14 at least substantially extends as far as the reflector element 12.
  • the further optical element 14 may be connected to the carrier element 6 via a further latching connection, wherein both the further optical element 6 and the reflector element 12 extend at least substantially up to the latching connection.
  • This can be the Carrier element 6 advantageously have a still further groove 68 into which the further optical element 14 can be brought latching engaged.
  • the Reflektorlement 12 and / or the further optical element 14 and / or the still further groove 68 are preferably formed like a profile.
  • the arrangement described may be mirror-symmetrical, so that the lighting module arrangement has a further reflector element 12 'and a corresponding further groove 68'.
  • the at least one pressing element 8 is preferably also designed to hold the optically active element or the reflector element 12.
  • the reflector element 12 may have at least one recess 122, preferably recesses 122, 124, through which at least one further arm 85 or further arms 85, 87 of the at least one pressing element 8 engage, thereby forming the optically active element or the reflector element 12 is supported on the support member 6.
  • the recess 122, 124 are preferably made so large that the optically active element or the reflector element 12 is supported with movement play. In this way, it can be avoided that, in the case of temperature fluctuations, stresses occur which lead to undesirable bulges of the optically active element or of the reflector element 12.
  • the recesses 122, 124 are advantageously designed such that the at least one pressing element 8 can be snapped into the corresponding groove 62 by the reflector element 12 already positioned on the carrier element 6 as intended.
  • the recesses 122, 124 are furthermore advantageously designed in such a way that the waste part formed in the production of the recesses 122, 124 is in one piece and, accordingly, a seizure of many individual waste parts is avoided.
  • the recesses 122, 124 may be connected to one another via channel-like structures 126 and also to an edge region of the reflector element 12.
  • At least one elongate profile-like pressure element may be provided, which may preferably be clipped into corresponding grooves in the carrier element 6. This makes it possible to achieve a further improved uniformity of the contact pressure.
  • several individual pressing elements in the sense described above are advantageous with respect to the support or effectiveness of the reflector element 12.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Description

Die Erfindung betrifft eine Leuchtmodulanordnung für eine Leuchte; die Leuchtmodulanordnung weist dabei wenigstens eine LED auf, sowie wenigstens eine Platine, wobei die wenigstens eine LED auf der wenigstens einen Platine angeordnet ist und außerdem ein Trägerelement, an dem die wenigstens eine Platine gehaltert ist. Außerdem betrifft die Erfindung eine Leuchte mit einer derartigen Leuchtmodulanordnung.The invention relates to a light module arrangement for a luminaire; The lighting module arrangement in this case has at least one LED, and at least one circuit board, wherein the at least one LED is arranged on the at least one circuit board and also a support element on which the at least one circuit board is mounted. Moreover, the invention relates to a luminaire with such a lighting module arrangement.

Bei einer derartigen Leuchtmodulanordnung gemäß dem Stand der Technik ist das Trägerelement als Kühlkörper ausgebildet. Hierbei ist dementsprechend ein guter thermischer Kontakt zwischen der Platine und dem Kühlkörper erforderlich. Problematisch ist hierbei, dass die Montage der Anordnung vergleichsweise hohen Aufwand erfordert. Insbesondere ist es hierbei sehr arbeitsintensiv, die entsprechenden Oberflächen zur Gewährleistung einer guten thermischen Kontaktierung zwischen der Platine und dem Kühlkörper ausreichend plan zu gestalten. Außerdem besteht bei dieser bekannten Anordnung die Gefahr, dass die Intensität der thermischen Kontaktierung zwischen der Platine und dem Kühlkörper im Laufe der Lebensdauer der Anordnung nachlässt.In such a lighting module arrangement according to the prior art, the carrier element is designed as a heat sink. Accordingly, good thermal contact between the board and the heat sink is required. The problem here is that the assembly of the arrangement requires relatively high effort. In particular, it is very labor intensive to make the corresponding surfaces to ensure good thermal contact between the board and the heat sink sufficiently flat. In addition, with this known arrangement, there is the risk that the intensity of the thermal contact between the circuit board and the heat sink wears off in the course of the life of the arrangement.

Bekannt ist dabei auch, zur Herstellung die Platine mit einem doppelseitigen Klebeband auf den Kühlkörper aufzukleben. Allerdings ist auch dies mit hohem Aufwand verbunden; insbesondere ist hierbei eine erhebliche Vorbehandlung der betroffenen Bauteile erforderlich.It is also known to glue the board with a double-sided adhesive tape on the heat sink for production. However, this is also associated with high costs; In particular, this requires a considerable pretreatment of the affected components.

Wenn zur Fixierung der Platine auf dem Kühlkörper Schrauben verwendet werden und dabei zwischen der Platine und dem Kühlkörper eine Wärmeleitpaste eingebracht ist, besteht die Gefahr, dass die Wärmeleitpaste im Laufe der Zeit zu fließen beginnt und sich in der Folge die Kontaktierung durch entsprechende Spaltenbildung verschlechtert.If screws are used to fix the circuit board on the heat sink and a heat conducting paste is introduced between the circuit board and the heat sink, there is a risk that the thermal paste will begin to flow over time and, as a result, the contacting will be impaired by corresponding formation of gaps.

Aus der US 2007/0098334 A1 ist eine LED-Leuchte nach dem Oberbegriff des Anspruchs 1 bekannt, bei der eine LED durch eine Halterung gegen einen Kühlkörper gedrückt angeordnet ist. Außerdem weist die Leuchte eine Linse zur Beeinflussung des von der LED abgegebenen Lichts auf.From the US 2007/0098334 A1 an LED lamp according to the preamble of claim 1 is known, in which an LED is arranged pressed by a holder against a heat sink. In addition, the lamp has a lens for influencing the light emitted by the LED.

Aus der US 2009/0303712 A1 ist eine LED-Leuchte mit einem Gehäuse bekannt, bei der ein Kühlkörper über zwei Bügel am Gehäuse gehalten ist.From the US 2009/0303712 A1 an LED lamp with a housing is known in which a heat sink is held on the bracket via two brackets.

Zwei weitere LED-Anordnungen sind aus den Schriften US 2006/0146502 A1 und WO 2010/004503 A1 bekannt.Two more LED arrays are from the fonts US 2006/0146502 A1 and WO 2010/004503 A1 known.

Der Erfindung liegt die Aufgabe zugrunde, eine verbesserte Leuchtmodulanordnung anzugeben; insbesondere soll eine besonders einfache Montage bei dauerhaft guter thermischer Kontaktierung zwischen der Platine und dem Trägerelement ermöglicht sein. Außerdem soll eine verbesserte Leuchte mit einer derartigen Leuchtmodulanordnung angegeben werden.The invention has for its object to provide an improved light module assembly; In particular, a particularly simple assembly with permanently good thermal contact between the board and the support element should be possible. In addition, an improved luminaire is to be specified with such a luminous module arrangement.

Diese Aufgabe wird gemäß der Erfindung mit den in den unabhängigen Ansprüchen genannten Gegenständen gelöst. Besondere Ausführungsarten der Erfindung sind in den abhängigen Ansprüchen angegeben.This object is achieved according to the invention with the objects mentioned in the independent claims. Particular embodiments of the invention are indicated in the dependent claims.

Gemäß der Erfindung ist eine Leuchtmodulanordnung für eine Leuchte vorgesehen; die Leuchtmodulanordnung weist wenigstens eine LED auf, wenigstens eine Platine, wobei die wenigstens eine LED auf der wenigstens einen Platine angeordnet ist, sowie ein Trägerelement, an dem die wenigstens eine Platine gehaltert ist. Außerdem weist die Leuchtmodulanordnung wenigstens ein Andrückelement auf, das derart angeordnet ist, dass es die wenigstens eine Platine gegen einen Oberflächenbereich des Trägerelements drückt.According to the invention, a lighting module arrangement is provided for a luminaire; the lighting module arrangement has at least one LED, at least one circuit board, wherein the at least one LED is arranged on the at least one circuit board, and a carrier element on which the at least one circuit board is mounted. In addition, the lighting module arrangement has at least one pressing element which is arranged such that it presses the at least one printed circuit board against a surface region of the carrier element.

Durch die Ausgestaltung mit einem derartigen Andrückelement ist keine Klebeverbindung zwischen der Platine und dem Trägerelement erforderlich. Hierdurch ist ein verbesserter thermischer Übergang zwischen der Platine und dem Trägerelement ermöglicht. Ausserdem Lässt sich durch das Andrückelement erzielen, dass auf die Platine eine Anspresskraft wirkt, die im Laufe der Lebendauer der Leuchtmodulanordnung derart gleichmäßig aufrecht erhalten bleibt, dass ein Nachlassen der Güte der thermischen Kontaktierung praktisch ausgeschlossen werden kann oder zumindest im Vergleich zum Stand der Technik deutlich reduziert werden kann.Due to the configuration with such a pressing element no adhesive connection between the board and the carrier element is required. This is an improved thermal transition between the board and the Carrier element allows. In addition, it can be achieved by the pressure element that acts on the board a Anspresskraft that remains so uniformly maintained in the course of the life of the light module assembly that a decrease in the quality of the thermal contact can be virtually eliminated or at least compared to the prior art clearly can be reduced.

Vorzugsweise ist dabei das Andrückelement derart ausgestaltet, dass es die Platine mit einer Federkraft gegen den Oberflächenbereich drückt. Auf diese Weise lässt sich eine "schwimmende" Lagerung der Platine erzeugen; dies ist insbesondere mit Bezug auf eine dauerhafte gleichmäßige Anpresskraft von Vorteil. Vorzugsweise besteht das Andrückelement aus Kunststoff oder aus Metall; dies ist insbesondere von Vorteil mit Bezug auf die Ausbildung der Federkraft. Eine Ausgestaltung als Kunststoffelement ist außerdem vorteilhaft, weil das Andrückelement in diesem Fall elektrisch isolierend wirkt; dies ist insbesondere relevant, wenn auf der Platine zum Betrieb mehrerer LEDs eine elektrische Spannung von mehreren hundert Volt vorgesehen ist.Preferably, the pressure element is designed such that it presses the board with a spring force against the surface area. In this way, a "floating" storage of the board can be produced; This is particularly advantageous with respect to a permanent uniform contact pressure. Preferably, this is Pressure element made of plastic or metal; This is particularly advantageous with respect to the design of the spring force. An embodiment as a plastic element is also advantageous because the pressure element acts in this case electrically insulating; This is particularly relevant if an electrical voltage of several hundred volts is provided on the board for operating a plurality of LEDs.

Vorzugsweise ist die Leuchtmodulanordnung derart gestaltet, dass das wenigstens eine Andrückelement über eine Rastverbindung mit dem Trägerelement verbunden werden kann. Hierdurch ist eine besonders einfache Montage der Leuchtmodulanordnung ermöglicht.Preferably, the light module assembly is designed such that the at least one pressing element can be connected via a latching connection with the carrier element. This allows a particularly simple installation of the light module arrangement.

Vorzugsweise bildet das Trägerelement einen Kühlkörper für die wenigstens eine LED, wobei die wenigstens eine LED thermisch leitend mit dem Trägerelement verbunden ist. Hierdurch ist ein besonders guter thermischer Übergang von der wenigstens einen LED auf den Kühlkörper ermöglicht.Preferably, the carrier element forms a heat sink for the at least one LED, wherein the at least one LED is thermally conductively connected to the carrier element. This allows a particularly good thermal transition from the at least one LED to the heat sink.

Vorzugsweise ist zwischen dem Oberflächenbereich und der wenigstens einen Platine eine Wärmeleitpaste angeordnet. Hierdurch lässt sich die Güte des thermischen Übergangs zwischen der Platine und dem Trägerelement weitergehend verbessern.Preferably, a thermal compound is disposed between the surface area and the at least one board. As a result, the quality of the thermal transition between the board and the carrier element can be further improved.

Vorzugsweise weist das Trägerelement einen Aufnahmebereich, insbesondere in Form wenigstens einer Nut, auf, der dafür vorgesehen ist, einen überschüssigen Teil der Wärmeleitpaste aufzunehmen. Hierdurch ist die Herstellung einer besonders gleichmäßigen Schicht aus Wärmeleitpaste zwischen der wenigstens einen Platine und dem Oberflächenbereich erleichtert.Preferably, the carrier element has a receiving area, in particular in the form of at least one groove, which is intended to receive an excess portion of the thermal paste. As a result, the production of a particularly uniform layer of thermal compound between the at least one board and the surface area is facilitated.

Vorzugsweise ist die wenigstens eine Platine länglich geformt; in diesem Fall lassen sich längs der, durch die längliche Form festgelegten Haupterstreckung der Platine auf Letzterer mehrere LEDs anordnen, so dass ein insgesamt länglich erscheinender Lichtabstrahlbereich gebildet sein kann. Insbesondere können die LEDs längs einer Geraden auf der Platine angeordnet sein.Preferably, the at least one board is elongated; In this case, it is possible to arrange a plurality of LEDs along the main extension of the printed circuit board defined by the elongated shape, so that a light emission area which appears to be oblong overall can be formed. In particular, the LEDs can be arranged along a straight line on the circuit board.

Weiterhin vorzugsweise weist die Leuchtmodulanordnung außerdem wenigstens ein weiteres Andrückelement auf, das ebenfalls derart angeordnet ist, dass es die wenigstens eine Platine gegen den Oberflächenbereich des Trägerelements drückt. Auf diese Weise lässt sich vergleichsweise einfach ein besonders gleichmäßiger Druck zur Hälterung der wenigstens einen Platine an dem Oberflächenbereich erzeugen. Vorzugsweise ist dabei das wenigstens eine weitere Andrückelement analog und/oder baugleich zu dem zuerst genannten wenigstens einen Andrückelement ausgestaltet.Further preferably, the light module assembly further comprises at least one further pressing element, which is also arranged such that it presses the at least one board against the surface region of the support member. In this way it is comparatively easy to produce a particularly uniform pressure for keeping the at least one printed circuit board on the surface area. In this case, the at least one further pressure element is preferably configured analogously and / or structurally to the first mentioned at least one pressure element.

Eine besonders effektive Lichtabgabe durch die Leuchtmodulanordnung lässt sich erzielen, wenn diese - wie erfindungsgemäß vorgesehen - außerdem ein optisch wirksames Element aufweist, das derart angeordnet ist, dass es ein von der wenigstens einen LED abgestrahltes Licht optisch beeinflusst, beispielsweise in Form eines Reflektorelements.A particularly effective light output by the light module arrangement can be achieved if, as provided according to the invention, it also has an optically effective element which is arranged such that it optically influences a light emitted by the at least one LED, for example in the form of a reflector element.

Erfindungsgemäß ist dabei das wenigstens eine Andrückelement weiterhin zur Halterung des optisch wirksamen Elements ausgebildet. Hierdurch ist eine weiterhin vereinfachte Montage,ermöglicht.According to the invention, the at least one pressing element is furthermore designed to hold the optically active element. This allows a further simplified installation.

Das wenigstens eine Andrückelement weist vorzugsweise zwei Arme auf, die jeweils einen Vorsprung aufweisen, wobei die Vorsprünge Druckflächen zum Drücken gegen die wenigstens einen Platine umfassen. Hierdurch lässt sich bei vergleichsweise kleiner Gestaltung des wenigstens einen Andrückelements ein besonders gleichmäßiger Anpressdruck auf die Platine erzeugen. Eine entsprechend kleine Gestaltung des wenigstens einen Andrückelements ist im Hinblick auf eine Materialeinsparung vorteilhaft; wenn das optische Element vorgesehen ist, lässt sich durch die kleine Gestaltung außerdem eine mögliche negative Beeinflussung der Wirkung des optischen Elements reduzieren.The at least one pressing element preferably has two arms, each having a projection, wherein the projections comprise pressure surfaces for pressing against the at least one circuit board. As a result, with a comparatively small design of the at least one pressing element, a particularly uniform contact pressure can be generated on the circuit board. A correspondingly small design of the at least one pressing element is advantageous in terms of saving material; In addition, if the optical element is provided, the small design can reduce a possible negative influence on the effect of the optical element.

Gemäß einem weiteren Aspekt der Erfindung ist eine Leuchte vorgesehen, die eine erfindungsgemäße Leuchtmodulanordnung aufweist. Vorzugsweise handelt es sich bei der Leuchte um eine Einbau- oder Anbauleuchte. Weiterhin vorzugsweise weist die Leuchte außerdem ein Leuchtengehäuse auf, durch das ein Lichtaustrittsbereich festgelegt ist, wobei die Leuchtmodulanordnung derart in dem Leuchtengehäuse angeordnet ist, dass ein von der Leuchtmödulanordnung abgestrahltes Licht durch den Lichtaustrittsbereich hindurch die Leuchte verlassen kann.According to a further aspect of the invention, a luminaire is provided which has a luminous module arrangement according to the invention. The luminaire is preferably a recessed or surface-mounted luminaire. Furthermore, preferably, the lamp also has a luminaire housing, by which a light exit area is fixed, wherein the luminous module arrangement in the luminaire housing is arranged that a radiated from the Leuchtmödulanordnung light through the light exit area through the lamp can leave.

Die Erfindung wird im Folgenden anhand von Ausführungsbeispielen und mit Bezug auf die Zeichnungen näher erläutert. Es zeigen:

Fig. 1
eine perspektivische Ansicht eines Ausführungsbeispiels einer erfindungsgemäßen Leuchtmodulanordnung,
Fig. 2
eine der Fig. 1 entsprechende Explosionsdarstellung,
Fig. 3
einen Querschnitt durch die Leuchtmodulanordnung und
Fig. 4
eine schematische Querschnittdarstellung einer Leuchte, die eine erfindungsgemäße Leuchtmodulanordnung als Lichtquelle aufweist.
The invention is explained in more detail below with reference to exemplary embodiments and with reference to the drawings. Show it:
Fig. 1
a perspective view of an embodiment of a lighting module assembly according to the invention,
Fig. 2
one of the Fig. 1 corresponding exploded view,
Fig. 3
a cross section through the light module assembly and
Fig. 4
a schematic cross-sectional view of a lamp having a light module assembly according to the invention as a light source.

In Fig. 1 ist eine perspektivische Ansicht des Ausführungsbeispiels einer erfindungsgemäßen Leuchtmodulanordnung dargestellt. Die Leuchtmodulanordnung eignet sich für den Einsatz in eine Leuchte, also mit anderen Worten als Lichtquelleneinheit für eine Leuchte.In Fig. 1 is a perspective view of the embodiment of a light module assembly according to the invention shown. The light module assembly is suitable for use in a lamp, in other words as a light source unit for a lamp.

Die Leuchtmodulanordnung umfasst wenigstens eine LED 2 und wenigstens eine Platine 4, wobei die wenigstens eine LED 2 auf der wenigstens einen Platine 4 angeordnet ist. Weiterhin umfasst die Leuchtmodulanordnung ein Trägerelement 6, an dem die wenigstens eine Platine 4 gehaltert ist. Wie im gezeigten Beispiel der Fall, kann das Trägerelement 6 vorteilhaft als Kühlkörper ausgebildet sein. In diesem Fall ist die wenigstens eine LED 2 dementsprechend thermisch leitend mit dem Trägerelement 6 bzw. dem Kühlkörper verbunden.The light module arrangement comprises at least one LED 2 and at least one circuit board 4, wherein the at least one LED 2 is arranged on the at least one circuit board 4. Furthermore, the lighting module arrangement comprises a carrier element 6, on which the at least one circuit board 4 is held. As in the example shown, the case, the support member 6 may be advantageously formed as a heat sink. In this case, the at least one LED 2 is accordingly thermally conductively connected to the carrier element 6 or the heat sink.

In Fig. 2 ist eine Explosionsdarstellung der Leuchtmodulanordnung skizziert. Die Leuchtmodulanordnung weist einen flächigen Oberflächenbereich 10 auf, der zur flächigen Kontaktierung mit der Platine 4 vorgesehen bzw. ausgebildet ist. Hierdurch ist ein guter thermischer Übergang zwischen der Platine 4 und dem Trägerelement 6 ermöglicht. Der Oberflächenbereich 10 ist außerdem in Fig. 3 bezeichnet, die einen Querschnitt durch die Leuchtmodulanordnung zeigt.In Fig. 2 is an exploded view of the light module assembly outlined. The light module arrangement has a flat surface region 10, which is provided or formed for surface contact with the circuit board 4. As a result, a good thermal transition between the circuit board 4 and the carrier element 6 allows. The surface area 10 is also in Fig. 3 denotes, which shows a cross section through the light module assembly.

Weiterhin umfasst die Leuchtmodulanordnung wenigstens ein Andrückelement 8, das derart angeordnet ist, dass es die wenigstens eine Platine 4 gegen den Oberflächenbereich 10 des Trägerelements 6 drückt. Vorzugsweise ist das Andrückelement 8 derart ausgestaltet, dass es die Platine 8 mit einer Federkraft gegen den Oberflächenbereich 10 drückt, so dass insbesondere hierdurch die Platine 4 an dem Trägerelement 6 gehaltert ist. Beispielsweise kann das Andrückelement 8 hierfür aus Kunststoff oder aus Metall bestehen. Hierdurch ist insbesondere ermöglicht, dass über die Lebensdauer der Leuchtmodulanordnung hinweg ein besonders gleichmäßiger Anpressdruck auf die Platine 4 aufrecht erhalten wird und somit ein besonders guter thermischer Kontakt zwischen der Platine 4 und dem Trägerelement 6.Furthermore, the lighting module arrangement comprises at least one pressing element 8 which is arranged such that it presses the at least one circuit board 4 against the surface region 10 of the carrier element 6. Preferably, the pressing member 8 is configured such that it presses the board 8 with a spring force against the surface portion 10, so that in particular the board 4 is supported on the support member 6 in this way. For example, the pressing element 8 for this consist of plastic or metal. This makes it possible, in particular, for a particularly uniform contact pressure to be maintained on the circuit board 4 over the service life of the luminous module arrangement, and thus for particularly good thermal contact between the circuit board 4 and the carrier element 6.

Durch den federnden Druck, der durch das Andrückelement 8 erzeugt ist, lässt sich sozusagen eine schwimmende Lagerung der Platine 4 bewirken; auf diese Weise lässt sich insbesondere erzielen, dass durch Temperaturschwankungen bedingte, unterschiedliche Längenänderungen des Trägerelements 6 einerseits und der Platine 4 andererseits keine Verspannungen erzeugen, die in der Folge - beispielsweise durch Wölbungen der Platine 4 - zu einer Verschlechterung des flächigen Kontakts zwischen der Platine 4 und dem Trägerelement 6 führen.Due to the resilient pressure, which is generated by the pressing element 8, so to speak a floating mounting of the board 4 can be effected; In this way, it can be achieved in particular that caused by temperature variations, different changes in length of the support member 6 on the one hand and the board 4 on the other hand generate no tension, which in consequence - for example, by buckling of the board 4 - to a deterioration of the surface contact between the board. 4 and the support element 6 lead.

Vorteilhaft weist das wenigstens eine Andrückelement 8 zwei Arme 84, 86 auf, die jeweils einen Vorsprung 90, 92 aufweisen, wobei die Vorsprünge 90, 92 Druckflächen, vorzugsweise die einzigen Druckflächen des Andrückelements 8 zum Drücken gegen die wenigstens eine Platine 4 umfassen. Vorzugsweise sind die Vorsprünge 90, 92 abgerundet geformt, so dass eine Relativbewegung zwischen den Vorsprüngen 90, 92 einerseits und der Platine 4 andererseits bei besonders geringem Widerstand ermöglicht ist. Dies ist vorteilhaft, wenn es bedingt durch Temperaturschwankungen zu unterschiedlichen Längenausdehnungen des Trägerelements 6 und der Platine 4 kommt.Advantageously, the at least one pressing element 8 has two arms 84, 86, each having a projection 90, 92, wherein the projections 90, 92 pressure surfaces, preferably the single pressure surfaces of the pressure element 8 for pressing against the at least one board 4 include. Preferably, the projections 90, 92 are rounded, so that a relative movement between the projections 90, 92 on the one hand and the board 4 on the other hand is made possible with particularly low resistance. This is advantageous if, due to temperature fluctuations, different length extensions of the carrier element 6 and the circuit board 4 occur.

Insbesondere kann die Leuchtmodulanordnung derart gestaltet sein, dass die wenigstens eine Platine 4 an dem Trägerelement 6 lediglich durch das wenigstens eine Andrückelement 8 gewährleistet werden kann. Insbesondere kann also vorgesehen sein, dass außer dem wenigstens einen Andrückelement 8 kein andersartiges Halterungselement, insbesondere keine Schraube und kein Klebeband oder dergleichen, zur Halterung der Platine 4 an dem Trägerelement 6 vorgesehen ist.In particular, the lighting module arrangement can be designed such that the at least one circuit board 4 can be ensured on the carrier element 6 only by the at least one pressing element 8. In particular, it can thus be provided that, apart from the at least one pressing element 8, no other type of holding element, in particular no screw and no adhesive tape or the like, is provided for holding the plate 4 on the carrier element 6.

Wie im gezeigten Beispiel der Fall, ist das wenigstens eine Andrückelement 8 über eine - vorzugsweise reversibel lösbare - Rastverbindung mit dem Trägerelement 6 verbunden. Hierzu ist vorteilhaft die Leuchtmodulanordnung derart gestaltet, dass an dem Trägerelement eine Nut 62 angeordnet ist und an dem Andrückelement 8 ein Rastvorsprung 82, beispielsweise in Form eines Stegs, der rastend in die Nut 62 eingreifen kann. Diese Ausgestaltung ermöglicht insbesondere eine besonders einfache Montage der Leuchtmodulanordnung.As in the example shown, the case, the at least one pressing element 8 via a - preferably reversibly releasable - locking connection with the support member 6 is connected. For this purpose, the light module assembly is advantageously designed such that on the carrier element, a groove 62 is arranged and on the pressure element 8, a latching projection 82, for example in the form of a web, which can engage in detent groove 62. This embodiment in particular allows a particularly simple installation of the lighting module arrangement.

Mit Bezug auf einen guten thermischen Kontakt ist weiterhin vorteilhaft zwischen dem Oberflächenbereich 10 des Trägerelements 6 einerseits und der wenigstens einen Platine 8 andererseits eine Wärmeleitpaste angeordnet. Durch die Wärmeleitpaste lassen sich Oberflächenrauhigkeiten der betroffenen Flächen ausgleichen, so dass ein verbesserter thermischer Kontakt ermöglicht ist.With regard to a good thermal contact is also advantageous between the surface region 10 of the support member 6 on the one hand and the at least one board 8 on the other hand, a thermal paste arranged. The thermal compound makes it possible to compensate for surface roughnesses of the affected areas, so that improved thermal contact is made possible.

Insbesondere ist vorteilhaft zwischen dem Oberflächenbereich 10 und der Platine 4 lediglich eine Schicht aus Wärmeleitpaste angeordnet. Hierdurch lässt sich die Anzahl der Grenzflächen beim Wärmeübergang von der wenigstens einen LED 2 auf das Trägerelement 6 reduzieren und auf diese Weise der Widerstand gegen den Wärmeübergang verringern.In particular, it is advantageous to arrange only one layer of thermal compound between the surface region 10 and the printed circuit board 4. As a result, the number of interfaces in the heat transfer from the at least one LED 2 can be reduced to the support member 6 and reduce in this way the resistance to heat transfer.

Vorzugsweise weist das Trägerelement 6 einen Aufnahmebereich 64, insbesondere in Form einer Nut, auf, der dafür vorgesehen ist, einen überschüssigen Teil der Wärmeleitpaste aufzunehmen. Hierdurch ist die Herstellung einer besonders gleichmäßigen Schicht aus Wärmeleitpaste zwischen der wenigstens einen Platine 4 und dem Oberflächenbereich 10 erleichtert.Preferably, the carrier element 6 has a receiving region 64, in particular in the form of a groove, which is provided to receive an excess portion of the thermal paste. As a result, the production of a particularly uniform layer of thermal compound between the at least one board 4 and the surface area 10 is facilitated.

Wie im Ausführungsbeispiel exemplarisch gezeigt, kann die wenigstens eine Platine 4 länglich geformt sein, so dass - wie in Fig. 2 skizziert - eine mittig längs der Platine 4 verlaufende Gerade G festgelegt ist. Insbesondere kann die Platine 4 dabei als vorzugsweise plattenförmiger, Profilkörper ausgebildet sein. Die Gerade G verläuft somit längs der Richtung der Haupterstreckung der Platine 4. Diese Ausgestaltung eignet sich besonders für den Fall, dass mehrere LEDs 2 vorgesehen sind, die - vorzugsweise in äquidistanter Weise - längs der Geraden G auf der Platine 4 angeordnet sind. Hierdurch lässt sich ein insgesamt länglich erscheinender Lichtabstrahlbereich der Leuchtmodulanordnung bilden. Dieser Lichtabstrahlbereich eignet sich insbesondere als Lichtquelle einer Leuchte.As shown by way of example in the exemplary embodiment, the at least one circuit board 4 can be elongated, so that - as in Fig. 2 sketched - a centrally along the board 4 extending straight line G is set. In particular, the board 4 can be formed as a preferably plate-shaped profile body. The straight line G thus runs along the direction of the main extension of the circuit board 4. This embodiment is particularly suitable for the case where a plurality of LEDs 2 are provided which are arranged along the straight line G on the circuit board 4, preferably in an equidistant manner. This makes it possible to form a light emission area of the light module arrangement that appears to be oblong overall. This Lichtabstrahlbereich is particularly suitable as a light source of a lamp.

Das Trägerelement 6 ist ebenfalls vorzugsweise als Profilkörper ausgebildet und dabei vorzugsweise derart orientiert angeordnet, dass die so festgelegte Längserstreckung des Trägerelements 6 parallel zu der Geraden G verläuft.The carrier element 6 is also preferably formed as a profile body and thereby preferably oriented so arranged that the thus determined longitudinal extent of the support member 6 is parallel to the straight line G.

Das Trägerelement 6 weist in diesem Fall vorzugsweise ein - in Fig. 2 beispielhaft bezeichnetes - Anschlagelement 66 auf, beispielsweise in Form eines sich parallel zu der Geraden G erstreckenden Vorsprungs, das zur Lagesicherung der wenigstens einen Platine 4 dient. Weiterhin vorteilhaft ist dabei die Nut, die den Aufnahmebereich 64 für die überschüssige Wärmeleitpaste bildet, ebenfalls parallel zu der Geraden G und dabei am Übergang zwischen dem Anschlagelement 66 und dem Oberflächenbereich 10 ausgebildet.The carrier element 6 in this case preferably has a - in Fig. 2 exemplified - stop element 66 on, for example in the form of a parallel to the straight line G extending projection, which serves to secure the position of at least one board 4. Also advantageous is the groove that forms the receiving area 64 for the excess thermal paste, also parallel to the straight line G and thereby formed at the transition between the stop element 66 and the surface portion 10.

Wie weiterhin im Ausführungsbeispiel exemplarisch gezeigt, weist das Trägerelement 6 zur Lagesicherung der wenigstens einen Platine 4 weiterhin ein weiteres Anschlagelement 66', vorzugsweise in Form eines weiteren Vorsprungs auf, das insbesondere mit Bezug auf die Gerade G spiegelsymmetrisch zu dem zuerst genannten Anschlagelement 66 ausgebildet ist. Zur besonders sicheren Aufnahme überschüssiger Wärmeleitpaste weist das Trägerelement 6 vorzugsweise eine weitere Nut auf, die einen weiteren Aufnahmebereich 64' bildet, der spiegelsymmetrisch zu dem zuerst genannten Aufnahmebereich 64 ausgebildet ist.As further shown in the exemplary embodiment by way of example, the carrier element 6 for securing the position of at least one board 4 further comprises a further stop element 66 ', preferably in the form of a further projection, which is formed in particular with respect to the straight line G mirror-symmetrical to the first-mentioned stop element 66 , For particularly secure absorption of excess thermal paste, the carrier element 6 preferably has a further groove, which forms a further receiving region 64 'which is mirror-symmetrical to the first-mentioned receiving region 64.

Ein besonders gleichmäßiger Anpressdruck und damit ein besonders guter thermischer Kontakt lässt sich weiterhin erzielen, wenn die Leuchtmodulanordnung außerdem wenigstens ein weiteres Andrückelement 8' aufweist, das ebenfalls derart angeordnet ist, dass es die wenigstens eine Platine 4 gegen den Oberflächenbereich 10 des Trägerelements 6 drückt. Vorzugsweise ist dabei das wenigstens eine weitere Andrückelement 8' analog und/oder - wie im gezeigten Beispiel der Fall - baugleich zu dem zuerst genannten wenigstens einen Andrückelement 8 ausgestaltet.A particularly uniform contact pressure and thus a particularly good thermal contact can be further achieved if the light module assembly also has at least one further pressing element 8 ', which is also arranged such that it presses the at least one board 4 against the surface portion 10 of the support member 6. Preferably, the at least one further pressing element 8 'is analog and / or - as in the example shown, the case - structurally identical to the first mentioned at least one pressing element 8 designed.

Insbesondere kann im Fall einer länglichen Platine 4 die Ausgestaltung derart sein, dass - mit Bezug auf die Gerade G - das zuerst genannte wenigstens eine Andrückelement 8 und das wenigstens eine weitere Andrückelement 8' an einander gegenüberliegenden Seiten oder Stellen auf die wenigstens Platine 4 drücken.In particular, in the case of an elongate board 4, the configuration may be such that - with respect to the straight line G - the first mentioned at least one pressing element 8 and the at least one further pressing element 8 'on opposite sides or places on the at least board 4.

Wie im gezeigten Ausführungsbeispiel der Fall, können insgesamt mehrere Andrückelemente 80 vorgesehen sein, die baugleich zu dem zuerst genannten Andrückelement 8 ausgebildet sind und mehrere weitere Andrückelemente 80', die baugleich zu dem wenigstens einen weiteren Andrückelement 8' ausgebildet sind; dabei ist die Anordnung vorteilhaft derart, dass sich diese mehreren Andrückelemente 80 und diese weiteren mehreren Andrückelemente 80' mit Bezug auf die Gerade G von beiden Seiten gegen die wenigstens eine Platine 4 drücken. Hierdurch lässt sich eine besonders gleichmäßige Druckverteilung längs der Haupterstreckung der wenigstens einen Platine 4 erzeugen.As in the embodiment shown, a total of several pressing elements 80 may be provided, which are identical in construction to the first-mentioned pressing element 8 and a plurality of further pressing elements 80 ', which are identical in construction to the at least one further pressure element 8'; In this case, the arrangement is advantageous such that these multiple pressing elements 80 and these other plurality of pressing elements 80 'with respect to the straight line G press from both sides against the at least one board 4. This makes it possible to produce a particularly uniform pressure distribution along the main extension of the at least one circuit board 4.

In jedem Fall kann insbesondere entsprechend vorgesehen sein, dass die Platine 4 lediglich durch die jeweils gegebenen der genannten Andrückelemente 8, 8', 80, 80' an dem Trägerelement 6 gehaltert ist, also keine andersartigen weiteren Halteelemente vorgesehen sind.In any case, it may in particular be provided correspondingly that the board 4 is held on the carrier element 6 only by the respectively given pressing elements 8, 8 ', 80, 80', ie no other type of holding elements are provided.

Wie im gezeigten Ausführungsbeispiel der Fall, kann die Leuchtmodulanordnung außerdem ein optisch wirksames Element aufweisen, das derart angeordnet ist, dass es ein von der wenigstens einen LED 2 abgestrahltes Licht optisch beeinflusst. Beispielsweise kann das optische Element in Form eines Reflektorelements 12 gegeben sein. Hierdurch kann insbesondere ein Wirkungsgrad erhöht werden, der die Lichtabgabe der Leuchtmodulanordnung beschreibt. Das Reflektorelement 12 kann eine Folie sein, beispielsweise eine so genannte MC-Pet Folie, die besonders viel Licht reflektiert. Beispielsweise kann das Trägerelement 6 aus Aluminium bestehen, so dass eine Oberfläche des Trägerelements 6 beispielsweise ein Reflexionsvermögen von etwa 85% aufweist. Demgegenüber kann eine entsprechende Folie ein Reflexionsvermögen von über 90%, beispielsweise ca. 99% aufweisen. Daher lässt sich mit einem entsprechenden Reflektorelement 12 der Wirkungsgrad steigern.As in the exemplary embodiment shown, the luminous module arrangement can furthermore have an optically active element which is arranged such that it optically influences a light emitted by the at least one LED 2. For example, the optical element may be in the form of a reflector element 12. In this way, in particular, an efficiency can be increased, which the Light output of the light module assembly describes. The reflector element 12 may be a foil, for example a so-called MC-PET foil, which reflects a particularly large amount of light. For example, the support member 6 may be made of aluminum, so that a surface of the support member 6, for example, has a reflectivity of about 85%. In contrast, a corresponding film may have a reflectivity of over 90%, for example about 99%. Therefore, the efficiency can be increased with a corresponding reflector element 12.

Dementsprechend vorteilhaft ist die Ausgestaltung derart, dass sich das Reflektorelement 12 bis nahe an die wenigstens eine LED 2 bzw. bis nahe an die LEDs 2 längs der Geraden G erstreckt. Wie in Fig. 1 angedeutet, kann dabei vorgesehen sein, dass ein Abstand zwischen dem Reflektorelement 12 und den LEDs 2 kleiner ist als ein Durchmesser der wenigstens einen LED 2. Das Reflektorelement 12 kann dabei insbesondere überlappend mit der Platine 4 angeordnet sein.Accordingly, the embodiment is advantageous in that the reflector element 12 extends as far as close to the at least one LED 2 or close to the LEDs 2 along the straight line G. As in Fig. 1 indicated, it may be provided that a distance between the reflector element 12 and the LEDs 2 is smaller than a diameter of the at least one LED 2. The reflector element 12 may be arranged in particular overlapping with the board 4.

Diese Ausgestaltung ist besonders vorteilhaft, wenn die Leuchtmodulanordnung außerdem ein weiteres optisch wirksames Element 14, beispielsweise in Form eines optisch diffus wirkenden Elements, aufweist, das einen Lichtabstrahlbereich der wenigstens einen LED 2 überdeckend angeordnet ist; in diesem Fall kommt es im Allgemeinen zu mehrfachen Reflexionen zwischen diesem weiteren optisch wirksamen Element 14 und einem Umgebungsbereich der wenigstens einen LED 2. Falls in diesem Umgebungsbereich das Reflektorelement 12 angeordnet ist, lässt sich mehr Licht erzeugen, das von der Seite der wenigstens einen LED 2 her auf das weitere optisch wirksame Element 14 trifft, so dass in der Folge insgesamt der Wirkungsgrad der Leuchtmodulanordnung erhöht ist.This embodiment is particularly advantageous when the light module assembly also has another optically active element 14, for example in the form of an optically diffuse-acting element, which is arranged overlapping a Lichtabstrahlbereich the at least one LED 2; In this case, there are generally multiple reflections between this further optically active element 14 and a surrounding area of the at least one LED 2. If the reflector element 12 is arranged in this surrounding area, more light can be generated from the side of the at least one LED 2 forth on the further optically active element 14, so that as a result the overall efficiency of the lighting module assembly is increased.

Vorteilhaft ist in diesem Fall die Anordnung derart, dass sich - in einem Querschnitt normal zu der Geraden G betrachtet - das weitere optisch wirksame Element 14 zumindest im Wesentlichen bis zu dem Reflektorelement 12 hin erstreckt. Beispielsweise kann das weitere optische Element 14 über eine weitere Rastverbindung mit dem Trägerelement 6 verbunden sein, wobei sich sowohl das weitere optische Element 6, als auch das Reflektorelement 12 zumindest im Wesentlichen bis zu der Rastverbindung hin erstrecken. Hierzu kann das Trägerelement 6 vorteilhaft eine noch weitere Nut 68 aufweisen, in die das weitere optische Element 14 rastend in Eingriff gebracht werden kann.In this case, the arrangement is advantageous in that - viewed in a cross section normal to the straight line G - the further optically active element 14 at least substantially extends as far as the reflector element 12. For example, the further optical element 14 may be connected to the carrier element 6 via a further latching connection, wherein both the further optical element 6 and the reflector element 12 extend at least substantially up to the latching connection. This can be the Carrier element 6 advantageously have a still further groove 68 into which the further optical element 14 can be brought latching engaged.

Das Reflektorlement 12 und/oder das weitere optische Element 14 und/oder die noch weitere Nut 68 sind vorzugsweise profilartig ausgebildet. Mit Bezug auf die Gerade G kann die beschriebene Anordnung spiegelsymmetrisch ausgebildet sein, so dass die Leuchtmodulanordnung ein weiteres Reflektorelement 12' und eine entsprechende weitere Nut 68' aufweist.The Reflektorlement 12 and / or the further optical element 14 and / or the still further groove 68 are preferably formed like a profile. With reference to the straight line G, the arrangement described may be mirror-symmetrical, so that the lighting module arrangement has a further reflector element 12 'and a corresponding further groove 68'.

Vorzugsweise ist dabei das wenigstens eine Andrückelement 8 außerdem zur Halterung des optisch wirksamen Elements bzw. des Reflektorelements 12 ausgebildet. Hierdurch ist eine weiterhin vereinfachte Montage ermöglicht. Hierzu kann das Reflektorelement 12 wenigstens eine Ausnehmung 122, vorzugsweise Ausnehmungen 122, 124 aufweisen, durch die hindurch wenigstens ein weiterer Arm 85 bzw. weitere Arme 85, 87 des wenigstens einen Andrückelements 8 greifen, so dass hierdurch das optisch wirksame Element bzw. das Reflektorelement 12 an dem Trägerelement 6 gehaltert ist. Dabei sind die,Ausnehmung 122, 124 vorzugsweise derart groß gestaltet, dass das optisch wirksame Element bzw. das Reflektorelement 12 mit Bewegungsspiel gehaltert ist. Hierdurch lässt sich vermeiden, dass es bei Temperaturschwankungen zu Spannungen kommt, die zu unerwünschten Wölbungen des optisch wirksamen Elements bzw. des Reflektorelements 12 führen.In this case, the at least one pressing element 8 is preferably also designed to hold the optically active element or the reflector element 12. This allows a further simplified installation. For this purpose, the reflector element 12 may have at least one recess 122, preferably recesses 122, 124, through which at least one further arm 85 or further arms 85, 87 of the at least one pressing element 8 engage, thereby forming the optically active element or the reflector element 12 is supported on the support member 6. In this case, the recess 122, 124 are preferably made so large that the optically active element or the reflector element 12 is supported with movement play. In this way, it can be avoided that, in the case of temperature fluctuations, stresses occur which lead to undesirable bulges of the optically active element or of the reflector element 12.

Die Ausnehmungen 122, 124 sind vorteilhaft derart gestaltet, dass das wenigstens eine Andrückelement 8 durch das bereits wie vorgesehen am Trägerelement 6 positionierte Reflektorelement 12 hindurch in die entsprechend Nut 62 eingerastet werden kann.The recesses 122, 124 are advantageously designed such that the at least one pressing element 8 can be snapped into the corresponding groove 62 by the reflector element 12 already positioned on the carrier element 6 as intended.

Wie ebenfalls aus Fig. 1 beispielhaft ersichtlich, sind die Ausnehmungen 122, 124 weiterhin vorteilhaft derart gestaltet, dass der bei der Herstellung der Ausnehmungen 122, 124 entstehende Abfallteil einstückig ist und dementsprechend ein Anfall vieler einzelner Abfallteile vermieden ist. Hierzu können die Ausnehmungen 122, 124 über kanalartige Strukturen 126 untereinander und auch mit einem Randbereich des Reflektorelements 12 verbunden sein.Like also out Fig. 1 By way of example, the recesses 122, 124 are furthermore advantageously designed in such a way that the waste part formed in the production of the recesses 122, 124 is in one piece and, accordingly, a seizure of many individual waste parts is avoided. For this purpose, the recesses 122, 124 may be connected to one another via channel-like structures 126 and also to an edge region of the reflector element 12.

Anstelle mehrere einzelner Andrückelemente 8, 8', 80, 80' kann auch wenigstens ein längliches profilartiges Andrückelement (nicht in den Figuren gezeigt) vorgesehen sein, das vorzugsweise in entsprechende Nuten im Trägerelement 6 eingeklipst werden kann. Hierdurch lässt sich eine nochmals verbesserte Gleichmäßigkeit des Anpressdrucks erzielen. Allerdings sind mehrere einzelne Andrückelemente im weiter oben dargestellten Sinne von Vorteil mit Bezug auf die Halterung bzw. Wirksamkeit des Reflektorelement 12.Instead of a plurality of individual pressure elements 8, 8 ', 80, 80', at least one elongate profile-like pressure element (not shown in the figures) may be provided, which may preferably be clipped into corresponding grooves in the carrier element 6. This makes it possible to achieve a further improved uniformity of the contact pressure. However, several individual pressing elements in the sense described above are advantageous with respect to the support or effectiveness of the reflector element 12.

Claims (13)

  1. Modular luminaire assembly for a luminaire, comprising
    - at least one LED (2),
    - at least a PCB (4), whereby the at least one LED (2) is arranged on the at least one PCB (4),
    - a support element (6) on which the at least one PCB (4) is mounted,
    - at least a pressure element (8) which is arranged so that it at least presses a PCB (4) against a surface region (10) of the support element (6),
    - an optically active element (12) that is so arranged that it optically influences the light emitted from the at least one LED (2),
    characterised in that,
    - the at least one pressure element (8) is further formed to hold the optically active element (12), while the pressure element (12) holds the optically active element on the support element (6).
  2. Modular luminaire assembly according to claim 1,
    whereby the optically active element (12) is a reflector element.
  3. Modular luminaire assembly according to claim 1 or 2,
    whereby the pressure element (8) is so designed that it presses the PCB (4) with spring force against the surface region (10).
  4. Modular luminaire assembly according to one of the preceding claims,
    whereby the at least one pressure element (8) consists of plastic or metal.
  5. Modular luminaire assembly according to any one of the preceding claims,
    whereby it is so designed that the at least one pressure element (8) may be connected with the support element (6) via a snap-on connection.
  6. Modular luminaire assembly according to one of the preceding claims,
    whereby the support element (6) forms a heat sink for the at least one LED (2), while the at least one LED (2) is thermally conductively connected to the support element (6).
  7. Modular luminaire assembly according to one of the preceding claims,
    whereby a thermally conductive paste is arranged between the surface region (10) and the at least one PCB (4).
  8. Modular luminaire assembly according to claim 7,
    whereby the support element (6) has a receiving area (64), preferably in the form of at least a groove, which is intended to receive any excess thermal paste.
  9. Modular luminaire assembly according to one of the preceding claims,
    whereby the at least one PCB (4) is elongated in shape, and whereby preferably a plurality of LEDs (2) is arranged along the thereby specified main extension of the PCB (4).
  10. Modular luminaire assembly according to one of the preceding claims, further comprising
    - at least one further pressure element (8'), which is also so arranged that it presses at least one PCB (4) against the surface region of the support element (6), whereby the at least one further pressure element (8') is preferably designed analogously and/or built identically to the first mentioned at least one pressure element (8).
  11. Modular luminaire assembly according to one of the preceding claims,
    whereby the at least one pressure element (8) comprises two arms (84, 86) each having a projection (90, 92), whereby the projections (90, 92) have pressure surfaces to press against the at least one PCB (4).
  12. Luminaire, comprising
    a modular luminaire assembly according to one of the preceding claims.
  13. Luminaire according to claim 12,
    preferably in the form of a recessed or surface-mounted luminaire, further comprising a luminaire housing (100) in which a light outlet region is arranged,
    whereby the modular luminaire assembly is so arranged in the luminaire housing (100) that light emitted by the modular luminaire assembly may exit the luminaire through the light outlet region.
EP11764521.8A 2010-09-27 2011-09-26 Lighting module assembly comprising an led on a circuit board Active EP2622259B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010041471.9A DE102010041471B4 (en) 2010-09-27 2010-09-27 Light module arrangement with an LED on a circuit board
PCT/EP2011/066635 WO2012041795A1 (en) 2010-09-27 2011-09-26 Lighting module assembly comprising an led on a circuit board

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EP2622259A1 EP2622259A1 (en) 2013-08-07
EP2622259B1 true EP2622259B1 (en) 2015-09-02
EP2622259B2 EP2622259B2 (en) 2020-04-15

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CN (1) CN103119353B (en)
DE (1) DE102010041471B4 (en)
WO (1) WO2012041795A1 (en)

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Also Published As

Publication number Publication date
EP2622259B2 (en) 2020-04-15
CN103119353B (en) 2016-08-10
EP2622259A1 (en) 2013-08-07
CN103119353A (en) 2013-05-22
DE102010041471B4 (en) 2021-02-11
DE102010041471A1 (en) 2012-03-29
WO2012041795A1 (en) 2012-04-05

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