EP3064827B1 - Arrangement for mounting a led module on a surface of a cooling body and led assembly - Google Patents

Arrangement for mounting a led module on a surface of a cooling body and led assembly Download PDF

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Publication number
EP3064827B1
EP3064827B1 EP16158385.1A EP16158385A EP3064827B1 EP 3064827 B1 EP3064827 B1 EP 3064827B1 EP 16158385 A EP16158385 A EP 16158385A EP 3064827 B1 EP3064827 B1 EP 3064827B1
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EP
European Patent Office
Prior art keywords
led module
heat sink
arrangement
screw
pressing element
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EP16158385.1A
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German (de)
French (fr)
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EP3064827A1 (en
Inventor
Michael Eidam
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Zumtobel Lighting GmbH Germany
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Zumtobel Lighting GmbH Germany
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Publication of EP3064827A1 publication Critical patent/EP3064827A1/en
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/005—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages with keying means, i.e. for enabling the assembling of component parts in distinctive positions, e.g. for preventing wrong mounting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/04—Optical design
    • F21V7/06—Optical design with parabolic curvature
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to an arrangement for mounting an LED module (LED: light-emitting diode) on a surface of a heat sink, as well as an LED arrangement with such an arrangement for mounting an LED module
  • LED light-emitting diode
  • the device comprises an annular retaining element, which is held by means of rivets and springs on the heat sink.
  • An arrangement which comprises an LED module which is kept pressed by a ring-like pressure element against a heat sink.
  • the pressure element can be connected during assembly of the arrangement only in a certain rotational position with the LED module.
  • the invention has for its object to provide an improved arrangement for mounting an LED module on a surface of a heat sink.
  • this arrangement should be suitable for generating a pressing force of the LED module against the surface of the heat sink, which is particularly constant over a long period of time.
  • an LED array with such an arrangement for mounting an LED module to be specified.
  • an arrangement for mounting an LED module on a surface of a heat sink which has a pressure element for pressing the LED module against the surface.
  • this arrangement has a spring element for a floating mounting of the pressure element relative to the surface.
  • the pressure element is designed annular, so that in this way an opening for the arrangement of the LED module is formed, wherein the pressure element is designed in particular as a frame for the LED module. In this way, a particularly uniform pressure of the LED module against the surface of the heat sink can be generated by the pressure element.
  • the pressure element has a particular annular pressure surface for pressing the LED module against the surface. In this way, a particularly suitable and uniform transfer of pressure from the pressure element on the LED module can be generated.
  • the arrangement further comprises a screw for a screw connection with the heat sink, wherein the screw has a head and the spring element is intended to be arranged on the one hand to the head of the screw and on the other hand on the pressure element.
  • the pressing force can produce manufacturing technology particularly advantageous.
  • the screw also has a shoulder surface for engagement with the surface of the heat sink. This can be achieved that by screwing in the screw until contacting the shoulder surface with the surface of the heat sink, a fixed distance for the two ends of the spring element in a simple and reliable manner is produced.
  • the arrangement further comprises at least one further spring element and at least one further screw, wherein the at least one further spring element and the at least one further screw are designed analogously to the first-mentioned spring element and the first-mentioned screw.
  • the at least one further spring element and the at least one further screw are designed analogously to the first-mentioned spring element and the first-mentioned screw.
  • the pressure element on a particular circumferential trained web to form an optical labyrinth.
  • the pressure element has a recess for receiving a protrusion formed on the LED module and pointing in a normal direction with respect to the surface of the heat sink.
  • the design is such that the projection of the LED module can only be introduced as intended in the recess when the LED module with respect to the pressure element - with respect to an axis parallel to the normal direction - occupies a certain intended rotational position. In this way it is particularly easy to establish a fixed orientation of the LED module with respect to the pressure element.
  • this is the pressure element to form a particularly uniform pressure force of metal.
  • an LED arrangement which has an LED module, a heat sink with a surface and an inventive arrangement for mounting the LED module on the surface of the Heatsink.
  • the pressure element is arranged by means of the spring element floatingly mounted relative to the surface.
  • the pressure element has a recess and the LED module has a projection corresponding to the recess, which is arranged engaging in the recess.
  • the LED arrangement preferably also has an optical element, in particular in the form of a reflector, which has an in particular circumferentially formed web for forming the optical labyrinth, the optical labyrinth preferably being formed by the web of the pressure element and the web of the optical element. This makes it particularly suitable to achieve a good light-tightness.
  • Fig. 1 shows a perspective sketch of an arrangement for mounting an LED module 1 on a surface of a heat sink, here also referred to briefly as a mounting arrangement.
  • the LED module 1 serves to generate a light during operation.
  • Fig. 6 shows by way of example a corresponding heat sink 2 with a surface 21, wherein the LED module 1 is mounted as intended on the surface 21 by means of the mounting arrangement.
  • the surface 21 is, in particular, a plane surface region of the heat sink 2.
  • the heat sink 2 serves to dissipate heat that arises during operation of the LED module 1. The heat is transmitted via an immediate contact between the LED module 1 and the surface 21 of the heat sink 2 of the LED module 1 to the heat sink 2.
  • the LED module 1 for example, a planar light emitting surface 19 for emitting the light, further preferably a main emission direction L of the light is normal to the light emitting surface 19.
  • the plane light emission surface 19 is aligned parallel to the planar surface region of the heat sink 2.
  • the mounting arrangement has a pressure element 3, which is designed to keep the LED module 1 pressed against the surface 21 of the heat sink 2. By the pressure element 3, therefore, a pressing force is generated, which presses the LED module 1 against the surface 21 of the heat sink 2.
  • the pressure element 3 as shown by way of example - annular, in particular circular shaped, so that in this way an opening is formed, in which the LED module 1 can be arranged engaging.
  • Fig. 2 which shows a corresponding sectional view.
  • the light emitting surface 19 of the LED module 1 is arranged so that the light generated by the LED module 1 is surrounded by the edge of the opening.
  • the pressure element 3 can be designed as a frame for the LED module 1.
  • the opening of the pressure element 3 is only slightly larger than the light emitting surface 19 of the LED module 1. In this way, the pressure element 3 can transmit the pressing force particularly concentrated on the LED module 1.
  • the area defined by the opening of the pressure element 3 is greater than the light emission area 19 by a factor x, where 1 ⁇ x ⁇ 5, preferably 1 ⁇ x ⁇ 3.
  • the mounting arrangement has a spring element 4, which is designed to form a floating mounting of the pressure element 3 with respect to the surface 21 of the heat sink 2.
  • the spring element 4 may be, for example, a compression spring, in particular a helical compression spring.
  • the mounting arrangement has a screw 5 for a screw connection of the mounting arrangement with the heat sink 2.
  • Fig. 5 shows a perspective sectional view of the mounting arrangement, and the heat sink 2, wherein the screw 5 is screwed as provided in a corresponding threaded opening 29 of the heat sink 2.
  • an optical element shown here in the form of a reflector 6. The reflector 6 is in this case arranged so that it influences the light emitted by the LED module 1 light.
  • the screw 5 has one, for example in Fig. 2 designated head 51, wherein the design is such that the spring element 4 arranged on the one hand to the head 51 of the screw 5 and on the other hand fitting against the pressure element 3, in particular can be clamped.
  • a first engagement surface for the spring element 4 is formed by the head 51 of the screw 5 and a second engagement surface by the pressure element.
  • the pressure element 3 has a passage opening which is provided for the passage of the screw 5, that is, a through hole without threaded engagement for the screw 5, so that the screw 5, passing through the passage opening, move back and forth parallel to its main axis without rotation leaves.
  • the corresponding second engagement surface for the spring element 4 is formed by the edge of the passage opening.
  • the pressure element 3 preferably has a particular circular pressure surface 31.
  • This pressure surface 31 is preferably designed such that it surrounds the light emitting surface 19 of the LED module 1 in particular closed annular with mounted LED module 1.
  • a particularly uniform pressure force can be achieved with which the LED module 1 is kept pressed against the surface 21 of the heat sink 2.
  • the pressure element 3 to achieve a suitable dimensional stability of metal.
  • the pressure element 3 in one piece, so be formed of only one piece.
  • the screw 5 further comprises a shoulder surface 52 for engagement with the surface 21 of the heat sink 2.
  • the shoulder surface 52 is designed so that the spring element 4 has a designated length along the normal direction N to achieve the desired pressure force when the screw 5 so with the heat sink 2 is connected, that is screwed so far into the threaded opening 29, that the shoulder surface 52 of the screw 5, the surface 21 of the heat sink 2 contacted.
  • the intended length of the spring element 4 can be produced in a simple and reliable manner.
  • the mounting arrangement preferably has at least one further spring element 4 'and at least one further screw 5', wherein the at least one further spring element 4 'and the at least one further screw 5' analogous to the first mentioned spring element 4 and the first-mentioned screw 5 are designed.
  • further corresponding threaded openings are provided in the heat sink 2.
  • Fig. 3 shows a sectional view showing the mounting arrangement in connection with the LED module 1 and the above-mentioned reflector 6;
  • Fig. 4 shows a detail Fig. 3 ,
  • the pressure element 3 also has a recess 33 for receiving a projection 11 formed on the LED module 1.
  • the design can be such that the projection 11 of the LED module 1 can only be introduced into the recess 33 as intended when the LED module 1 faces the pressure element 3 with reference to an axis parallel to the normal direction N. - occupies a certain intended rotational position.
  • the pressure element 3 further comprises a particular circumferentially formed web 32 for forming an optical labyrinth.
  • the ridge 32 is shaped to extend around the light emitting surface 19.
  • the optical labyrinth is preferably formed by the web 32 of the pressure element 3 and the web 61 of the optical element.
  • the LED module 1 may have lateral channels 17 which serve to supply power.
  • the lateral channels 17 are preferably designed such that corresponding lines can be arranged for power supply so that they do not enforce the surface 21 of the heat sink 2;
  • the channels 17 may be formed at least substantially perpendicular to the normal direction N or to the main emission direction L oriented.
  • the mounting arrangement can be achieved that the LED module is pressed with a pressing force against the heat sink, which is particularly constant over a long period, for example, a lifetime of a corresponding lighting device. This allows a constant heat transfer to be achieved permanently.
  • the LED module can be easily and safely mounted on the heat sink.
  • the LED module can be easily replaced if necessary.
  • light-tightness can be achieved in a particularly suitable manner.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Description

Die Erfindung betrifft eine Anordnung zur Montage eines LED-Moduls (LED: Licht emittierende Diode) auf einer Oberfläche eines Kühlkörpers, sowie eine LED-Anordnung mit einer solchen Anordnung zur Montage eines LED-ModulsThe invention relates to an arrangement for mounting an LED module (LED: light-emitting diode) on a surface of a heat sink, as well as an LED arrangement with such an arrangement for mounting an LED module

Aus dem Stand der Technik ist es bekannt, ein LED-Modul durch Anschrauben mit einem bestimmten Drehmoment unmittelbar auf einem Kühlkörper zu befestigen. Hierdurch soll eine flächige Verbindung zwischen dem LED-Modul und der Oberfläche des Kühlkörpers hergestellt werden, und zwar unter einem geeigneten Anpressdruck, so dass ein guter Abtransport von Wärme, die bei Betrieb des LED-Moduls entsteht, ermöglicht ist.From the prior art, it is known to fasten an LED module by screwing with a certain torque directly on a heat sink. In this way, a flat connection between the LED module and the surface of the heat sink to be produced, under a suitable contact pressure, so that a good removal of heat, which is produced during operation of the LED module, is possible.

Es hat sich allerdings gezeigt, dass es hierbei im Lauf der Zeit - beispielsweise im Fall einer Leuchte mit einem entsprechenden LED-Modul im Verlauf der Lebensdauer der Leuchte - zu unerwünschten Änderungen der Andruckkraft und damit des Wärmeübergangs kommen kann. Bedingt ist dies beispielsweise durch das eingebrachte Drehmoment, Bauteiltoleranzen oder alterungsbedingte Materialveränderungen. Insbesondere kann es auf diese Weise zur Ausbildung von Spalten kommen, durch die ein Ableiten der Wärme behindert wird.However, it has been shown that over time - for example in the case of a luminaire with a corresponding LED module over the life of the luminaire - undesired changes in the contact pressure and thus in the heat transfer can occur. This is caused for example by the introduced torque, component tolerances or aging-related material changes. In particular, this can lead to the formation of gaps, by which a dissipation of the heat is hindered.

Aus der US 7,182,627 B1 ist eine Anordnung zur Montage eines LED-Moduls bekannt, bei der das LED-Modul mittels einer Abdeckung gegen einen Kühlkörper gedrückt wird. Zur Befestigung der Abdeckung an dem Kühlkörper dienen Schrauben und Federn.From the US Pat. No. 7,182,627 B1 an arrangement for mounting an LED module is known in which the LED module is pressed by means of a cover against a heat sink. To fasten the cover to the heat sink are screws and springs.

Aus der US 2014/0301089 A1 ist eine Haltevorrichtung für ein LED-Modul an einem Kühlkörper bekannt. Die Vorrichtung umfasst ein ringförmiges Halteelement, das mittels Nieten und Federn an dem Kühlkörper gehalten wird.From the US 2014/0301089 A1 is a holding device for a LED module on a heat sink known. The device comprises an annular retaining element, which is held by means of rivets and springs on the heat sink.

Aus der JP 2006-310138 A ist eine Anordnung mit einem LED-Modul bekannt, das über ein konkav geformtes Halte-Element federnd gegen einen Kühlkörper gedrückt wird. Weitere Anordnungen mit LED-Modulen, die gegen einen Kühlkörper gedrückt gehalten werden, sind aus den Schriften WO 2013/174766 A1 und EP 1 780 804 A1 bekannt.From the JP 2006-310138 A An arrangement with an LED module is known, which is pressed by a concave-shaped retaining element resiliently against a heat sink. Other arrangements with LED modules, which are kept pressed against a heat sink, are from the writings WO 2013/174766 A1 and EP 1 780 804 A1 known.

Aus der US 2013/0051009 A1 ist eine Anordnung bekannt, die ein LED-Modul umfasst, das durch ein ringartiges Andruckelement gegen einen Kühlkörper gedrückt gehalten wird. Das Andruckelement lässt sich beim Zusammenbau der Anordnung lediglich in einer bestimmten Drehstellung mit dem LED-Modul verbinden.From the US 2013/0051009 A1 An arrangement is known which comprises an LED module which is kept pressed by a ring-like pressure element against a heat sink. The pressure element can be connected during assembly of the arrangement only in a certain rotational position with the LED module.

Der Erfindung liegt die Aufgabe zugrunde, eine verbesserte Anordnung zur Montage eines LED-Moduls auf einer Oberfläche eines Kühlkörpers anzugeben. Insbesondere soll sich diese Anordnung dazu eignen, eine Andruckkraft des LED-Moduls gegen die Oberfläche des Kühlkörpers zu erzeugen, die über einen langen Zeitraum besonders konstant ist. Außerdem soll eine LED-Anordnung mit einer solchen Anordnung zur Montage eines LED-Moduls angegeben werden.The invention has for its object to provide an improved arrangement for mounting an LED module on a surface of a heat sink. In particular, this arrangement should be suitable for generating a pressing force of the LED module against the surface of the heat sink, which is particularly constant over a long period of time. In addition, an LED array with such an arrangement for mounting an LED module to be specified.

Diese Aufgabe wird gemäß der Erfindung mit den in den unabhängigen Ansprüchen genannten Gegenständen gelöst. Besondere Ausführungsarten der Erfindung sind in den abhängigen Ansprüchen angegeben.This object is achieved according to the invention with the objects mentioned in the independent claims. Particular embodiments of the invention are indicated in the dependent claims.

Gemäß der Erfindung ist eine Anordnung zur Montage eines LED-Moduls auf einer Oberfläche eines Kühlkörpers vorgesehen, die ein Andruckelement zum Andrücken des LED-Moduls gegen die Oberfläche aufweist. Außerdem weist diese Anordnung ein Federelement für eine schwimmende Lagerung des Andruckelements gegenüber der Oberfläche auf.According to the invention, an arrangement for mounting an LED module on a surface of a heat sink is provided, which has a pressure element for pressing the LED module against the surface. In addition, this arrangement has a spring element for a floating mounting of the pressure element relative to the surface.

Durch die schwimmende Lagerung des Andruckelements gegenüber dem Kühlkörper lässt sich eine dauerhaft gute Pressung bzw. eine dauerhaft entsprechend konstante Andruckkraft erzeugen. Durch die schwimmende Lagerung lassen sich insbesondere Montagetoleranzen wie abweichende Drehmomente, Alterungserscheinungen, Schwund, nachlassende Materialspannung etc. ausgleichen.Due to the floating mounting of the pressure element relative to the heat sink, a permanently good pressure or a permanently correspondingly constant pressure force can be generated. In particular, assembly tolerances such as deviating torques, signs of aging, shrinkage, decreasing material tension etc. can be compensated by the floating mounting.

Erfindungsgemäß ist das Andruckelement kreisringförmig gestaltet, so dass hierdurch eine Öffnung für die Anordnung des LED-Moduls gebildet ist, wobei das Andruckelement insbesondere als Rahmen für das LED-Modul gestaltet ist. Auf diese Weise lässt sich durch das Andruckelement ein besonders gleichmäßiger Druck des LED-Moduls gegen die Oberfläche des Kühlkörpers erzeugen.According to the invention, the pressure element is designed annular, so that in this way an opening for the arrangement of the LED module is formed, wherein the pressure element is designed in particular as a frame for the LED module. In this way, a particularly uniform pressure of the LED module against the surface of the heat sink can be generated by the pressure element.

Vorzugsweise weist das Andruckelement eine insbesondere ringförmige Andruckfläche zum Andrücken des LED-Moduls gegen die Oberfläche auf. Auf diese Weise lässt sich eine besonders geeignete und gleichmäßige Übertragung von Druck von dem Andruckelement auf das LED-Modul erzeugen.Preferably, the pressure element has a particular annular pressure surface for pressing the LED module against the surface. In this way, a particularly suitable and uniform transfer of pressure from the pressure element on the LED module can be generated.

Erfindungsgemäß weist die Anordnung weiterhin eine Schraube für eine Schraubverbindung mit dem Kühlkörper auf, wobei die Schraube einen Kopf aufweist und das Federelement dafür vorgesehen ist, einerseits an dem Kopf der Schraube anliegend angeordnet zu werden und andererseits an dem Andruckelement. Auf diese Weise lässt sich die Andruckkraft herstellungstechnisch besonders vorteilhaft erzeugen.According to the invention, the arrangement further comprises a screw for a screw connection with the heat sink, wherein the screw has a head and the spring element is intended to be arranged on the one hand to the head of the screw and on the other hand on the pressure element. In this way, the pressing force can produce manufacturing technology particularly advantageous.

Weiterhin vorzugsweise weist dabei die Schraube außerdem eine Schulterfläche zur Anlage an die Oberfläche des Kühlkörpers auf. Hierdurch lässt sich erzielen, dass durch ein Eindrehen der Schraube bis zur Kontaktierung der Schulterfläche mit der Oberfläche des Kühlkörpers ein festgelegter Abstand für die beiden Enden des Federelements auf einfache und zuverlässige Weise hergestellt wird.Furthermore, preferably, the screw also has a shoulder surface for engagement with the surface of the heat sink. This can be achieved that by screwing in the screw until contacting the shoulder surface with the surface of the heat sink, a fixed distance for the two ends of the spring element in a simple and reliable manner is produced.

Vorzugsweise weist die Anordnung außerdem wenigstens ein weiteres Federelement und wenigstens eine weitere Schraube auf, wobei das wenigstens eine weitere Federelement und die wenigstens eine weitere Schraube analog zu dem zuerst genannten Federelement und der zuerst genannten Schraube gestaltet sind. Auf diese Weise lässt sich eine besonders gleichmäßige Andruckkraft erzeugen.Preferably, the arrangement further comprises at least one further spring element and at least one further screw, wherein the at least one further spring element and the at least one further screw are designed analogously to the first-mentioned spring element and the first-mentioned screw. In this way, a particularly uniform pressure force can be generated.

Grundsätzlich wäre es denkbar, das Andruckelement ohne Zwischenschaltung der Federelemente an dem Kühlkörper anzuschrauben; allerdings würden in diesem Fall durch die Schrauben quasi punktuell wirkende Kräfte erzeugt werden, die der Ausbildung einer gleichmäßigen Andruckkraft entgegenstehen würden.In principle, it would be conceivable to screw on the pressure element without interposition of the spring elements on the heat sink; However, in this case quasi-selectively acting forces would be generated by the screws, which would prevent the formation of a uniform pressure force.

Vorzugsweise weist das Andruckelement einen insbesondere umlaufend ausgebildeten Steg zur Bildung eines optischen Labyrinths auf. Hierdurch lassen sich besonders geeignete optische Eigenschaften des LED-Moduls erzeugen, insbesondere in Verbindung mit einem optischen Element, wie beispielsweise mit einem Reflektor, Lichtdichtheit.Preferably, the pressure element on a particular circumferential trained web to form an optical labyrinth. This makes it possible to produce particularly suitable optical properties of the LED module, in particular in conjunction with an optical element, such as a reflector, light-tightness.

Erfindungsgemäß weist das Andruckelement eine Ausnehmung zur Aufnahme eines, an dem LED-Modul ausgebildeten, mit Bezug auf die Oberfläche des Kühlkörpers in eine normale Richtung weisenden Vorsprungs auf. Dabei ist die Gestaltung derart, dass sich der Vorsprung des LED-Moduls nur dann wie vorgesehen in die Ausnehmung einbringen lässt, wenn das LED-Modul gegenüber dem Andruckelement - mit Bezug auf eine, zur normalen Richtung parallele Achse - eine bestimmte vorgesehene Drehstellung einnimmt. Auf diese Weise lässt sich besonders einfach eine festgelegte Ausrichtung des LED-Moduls gegenüber dem Andruckelement herstellen.According to the invention, the pressure element has a recess for receiving a protrusion formed on the LED module and pointing in a normal direction with respect to the surface of the heat sink. In this case, the design is such that the projection of the LED module can only be introduced as intended in the recess when the LED module with respect to the pressure element - with respect to an axis parallel to the normal direction - occupies a certain intended rotational position. In this way it is particularly easy to establish a fixed orientation of the LED module with respect to the pressure element.

Vorzugsweise besteht das das Andruckelement zur Ausbildung einer besonders gleichmäßigen Andruckkraft aus Metall.Preferably, this is the pressure element to form a particularly uniform pressure force of metal.

Gemäß einem weiteren Aspekt der Erfindung ist eine LED-Anordnung vorgesehen, die ein LED-Modul aufweist, einen Kühlkörper mit einer Oberfläche und eine erfindungsgemäße Anordnung zur Montage des LED-Moduls auf der Oberfläche des Kühlkörpers. Dabei ist das Andruckelement mithilfe des Federelements schwimmend gegenüber der Oberfläche gelagert angeordnet.According to a further aspect of the invention, an LED arrangement is provided, which has an LED module, a heat sink with a surface and an inventive arrangement for mounting the LED module on the surface of the Heatsink. In this case, the pressure element is arranged by means of the spring element floatingly mounted relative to the surface.

Vorzugsweise weist dabei das Andruckelement eine Ausnehmung auf und das LED-Modul einen zu der Ausnehmung korrespondierenden Vorsprung, der in die Ausnehmung eingreifend angeordnet ist. So lässt sich besonders eine festgelegte Ausrichtung des LED-Moduls gegenüber dem Andruckelement bewirken. Vorzugsweise weist die LED-Anordnung außerdem ein optisches Element, insbesondere in Form eines Reflektors auf, das einen insbesondere umlaufend ausgebildeten Steg zur Bildung des optischen Labyrinths aufweist, wobei vorzugsweise das optische Labyrinth durch den Steg des Andruckelements und den Steg des optischen Elements gebildet ist. Hierdurch lässt sich besonders geeignet eine gute Lichtdichtheit erzielen.Preferably, in this case, the pressure element has a recess and the LED module has a projection corresponding to the recess, which is arranged engaging in the recess. This makes it possible to effect a specific alignment of the LED module with respect to the pressure element. The LED arrangement preferably also has an optical element, in particular in the form of a reflector, which has an in particular circumferentially formed web for forming the optical labyrinth, the optical labyrinth preferably being formed by the web of the pressure element and the web of the optical element. This makes it particularly suitable to achieve a good light-tightness.

Eine andere Anordnung zur Montage eines LED-Modules wird im Folgenden anhand eines Ausführungsbeispiels und mit Bezug auf die Zeichnungen näher erläutert. Es zeigen:

Fig. 1
eine perspektivische Skizze einer Anordnung zur Montage eines LED-Moduls,
Fig. 2
eine zu Fig. 1 korrespondierende Schnittdarstellung,
Fig. 3
eine entsprechende Schnittdarstellung, die die Anordnung in Verbindung mit einem Reflektor zeigt,
Fig. 4
ein Detail aus Fig. 3,
Fig. 5
eine, der Fig. 3 entsprechende Skizze, die die Anordnung in weiterer Verbindung mit einem Kühlkörper zeigt und
Fig. 6
eine perspektivische Skizze einer LED-Anordnung.
Another arrangement for mounting an LED module is explained below with reference to an embodiment and with reference to the drawings. Show it:
Fig. 1
a perspective sketch of an arrangement for mounting an LED module,
Fig. 2
one too Fig. 1 corresponding sectional view,
Fig. 3
a corresponding sectional view showing the arrangement in conjunction with a reflector,
Fig. 4
a detail from Fig. 3 .
Fig. 5
one of the Fig. 3 corresponding sketch showing the arrangement in further connection with a heat sink and
Fig. 6
a perspective sketch of an LED assembly.

Fig. 1 zeigt eine perspektivische Skizze einer Anordnung zur Montage eines LED-Moduls 1 auf einer Oberfläche eines Kühlkörpers, hier auch kurz als Montageanordnung bezeichnet. Das LED-Modul 1 dient dazu, bei Betrieb ein Licht zu erzeugen. Fig. 1 shows a perspective sketch of an arrangement for mounting an LED module 1 on a surface of a heat sink, here also referred to briefly as a mounting arrangement. The LED module 1 serves to generate a light during operation.

Fig. 6 zeigt beispielhaft einen entsprechenden Kühlkörper 2 mit einer Oberfläche 21, wobei das LED-Modul 1 mit Hilfe der Montageanordnung wie vorgesehen auf der Oberfläche 21 montiert ist. Bei der Oberfläche 21 handelt es sich insbesondere um einen planen Oberflächenbereich des Kühlkörpers 2. Durch das LED-Modul 1, das durch die Montageanordnung wie vorgesehen mit dem Kühlkörper 2 verbunden ist, ist eine LED-Anordnung gebildet. Der Kühlkörper 2 dient hierbei zur Abfuhr von Wärme, die beim Betrieb des LED-Moduls 1 entsteht. Die Wärme wird dabei über einen unmittelbaren Kontakt zwischen dem LED-Modul 1 und der Oberfläche 21 des Kühlkörpers 2 von dem LED-Modul 1 an den Kühlkörper 2 übertragen. Fig. 6 shows by way of example a corresponding heat sink 2 with a surface 21, wherein the LED module 1 is mounted as intended on the surface 21 by means of the mounting arrangement. The surface 21 is, in particular, a plane surface region of the heat sink 2. The LED module 1, which is connected to the heat sink 2 as intended by the mounting arrangement, forms an LED arrangement. The heat sink 2 serves to dissipate heat that arises during operation of the LED module 1. The heat is transmitted via an immediate contact between the LED module 1 and the surface 21 of the heat sink 2 of the LED module 1 to the heat sink 2.

Im gezeigten Beispiel weist das LED-Modul 1 eine beispielsweise plane Lichtabgabefläche 19 zur Abgabe des Lichts auf, wobei weiterhin vorzugsweise eine Hauptabstrahlrichtung L des Lichts normal zu der Lichtabgabefläche 19 verläuft. Insbesondere kann vorgesehen sein, dass zum Betrieb des LED-Moduls 1 die plane Lichtabgabefläche 19 parallel zu dem planen Oberflächenbereich des Kühlkörpers 2 ausgerichtet ist.In the example shown, the LED module 1, for example, a planar light emitting surface 19 for emitting the light, further preferably a main emission direction L of the light is normal to the light emitting surface 19. In particular, it can be provided that, for operation of the LED module 1, the plane light emission surface 19 is aligned parallel to the planar surface region of the heat sink 2.

Die Montageanordnung weist ein Andruckelement 3 auf, das dazu ausgestaltet ist, das LED-Modul 1 gegen die Oberfläche 21 des Kühlkörpers 2 gedrückt zu halten. Durch das Andruckelement 3 wird also eine Andruckkraft erzeugt, die das LED-Modul 1 gegen die Oberfläche 21 des Kühlkörpers 2 drückt.The mounting arrangement has a pressure element 3, which is designed to keep the LED module 1 pressed against the surface 21 of the heat sink 2. By the pressure element 3, therefore, a pressing force is generated, which presses the LED module 1 against the surface 21 of the heat sink 2.

Vorzugsweise ist das Andruckelement 3 - wie beispielhaft gezeigt - ringförmig, insbesondere kreisringförmig gestaltet, so dass hierdurch eine Öffnung gebildet ist, in die das LED-Modul 1 eingreifend angeordnet werden kann. Dies geht auch aus Fig. 2 hervor, die eine entsprechende Schnittdarstellung zeigt. Vorzugsweise ist dabei weiterhin vorgesehen, dass die Lichtabstrahlfläche 19 des LED-Moduls 1 so angeordnet wird, dass das von dem LED-Modul 1 erzeugte Licht vom Rand der Öffnung umgeben wird. Insbesondere kann das Andruckelement 3 als Rahmen für das LED-Modul 1 gestaltet sein.Preferably, the pressure element 3 - as shown by way of example - annular, in particular circular shaped, so that in this way an opening is formed, in which the LED module 1 can be arranged engaging. This is also possible Fig. 2 which shows a corresponding sectional view. Preferably is Furthermore provided that the light emitting surface 19 of the LED module 1 is arranged so that the light generated by the LED module 1 is surrounded by the edge of the opening. In particular, the pressure element 3 can be designed as a frame for the LED module 1.

Im gezeigten Beispiel ist die Öffnung des Andruckelements 3 lediglich geringfügig größer als die Lichtabstrahlfläche 19 des LED-Moduls 1. Auf diese Weise kann das Andruckelement 3 die Andruckkraft besonders konzentriert auf das LED-Modul 1 übertragen. Beispielsweise kann vorgesehen sein, dass die durch die Öffnung des Andruckelements 3 festgelegte Fläche um einen Faktor x größer als die Lichtabgabefläche 19 ist, wobei gilt 1 < x < 5, vorzugsweise 1 < x < 3.In the example shown, the opening of the pressure element 3 is only slightly larger than the light emitting surface 19 of the LED module 1. In this way, the pressure element 3 can transmit the pressing force particularly concentrated on the LED module 1. For example, it may be provided that the area defined by the opening of the pressure element 3 is greater than the light emission area 19 by a factor x, where 1 <x <5, preferably 1 <x <3.

Weiterhin weist die Montageanordnung ein Federelement 4 auf, das zur Bildung einer schwimmenden Lagerung des Andruckelements 3 gegenüber der Oberfläche 21 des Kühlkörpers 2 ausgebildet ist. Bei dem Federelement 4 kann es sich beispielsweise um eine Druckfeder, insbesondere eine Schraubendruckfeder handeln.Furthermore, the mounting arrangement has a spring element 4, which is designed to form a floating mounting of the pressure element 3 with respect to the surface 21 of the heat sink 2. The spring element 4 may be, for example, a compression spring, in particular a helical compression spring.

Weiterhin weist die Montageanordnung eine Schraube 5 für eine Schraubverbindung der Montageanordnung mit dem Kühlkörper 2 auf. Fig. 5 zeigt eine perspektivische Schnittdarstellung der Montageanordnung, sowie den Kühlkörper 2, wobei die Schraube 5 wie vorgesehen in eine korrespondierende Gewindeöffnung 29 des Kühlkörpers 2 geschraubt ist. Außerdem ist in Fig. 5 als optionales weiteres Teil der LED-Anordnung ein optisches Element, hier in Form eines Reflektors 6 gezeigt. Der Reflektor 6 ist hierbei so angeordnet, dass er das von dem LED-Modul 1 abgestrahlte Licht beeinflusst.Furthermore, the mounting arrangement has a screw 5 for a screw connection of the mounting arrangement with the heat sink 2. Fig. 5 shows a perspective sectional view of the mounting arrangement, and the heat sink 2, wherein the screw 5 is screwed as provided in a corresponding threaded opening 29 of the heat sink 2. It is also in Fig. 5 as an optional further part of the LED array, an optical element, shown here in the form of a reflector 6. The reflector 6 is in this case arranged so that it influences the light emitted by the LED module 1 light.

Die Schraube 5 weist dabei einen, beispielsweise in Fig. 2 bezeichneten Kopf 51 auf, wobei die Gestaltung derart ist, dass das Federelement 4 einerseits an dem Kopf 51 der Schraube 5 anliegend und andererseits an dem Andruckelement 3 anliegend angeordnet, insbesondere eingespannt werden kann. Somit ist also eine erste Angriffsfläche für das Federelement 4 durch den Kopf 51 der Schraube 5 gebildet und eine zweite Angriffsfläche durch das Andruckelement 3.The screw 5 has one, for example in Fig. 2 designated head 51, wherein the design is such that the spring element 4 arranged on the one hand to the head 51 of the screw 5 and on the other hand fitting against the pressure element 3, in particular can be clamped. Thus, therefore, a first engagement surface for the spring element 4 is formed by the head 51 of the screw 5 and a second engagement surface by the pressure element. 3

Vorzugsweise weist das Andruckelement 3 eine Durchgangsöffnung auf, die zur Durchführung der Schraube 5 vorgesehen ist, also eine Durchgangsöffnung ohne Gewindeeingriff für die Schraube 5, so dass sich die Schraube 5, die Durchgangsöffnung durchsetzend, parallel zu ihrer Hauptachse ohne Drehung hin- und her bewegen lässt.Preferably, the pressure element 3 has a passage opening which is provided for the passage of the screw 5, that is, a through hole without threaded engagement for the screw 5, so that the screw 5, passing through the passage opening, move back and forth parallel to its main axis without rotation leaves.

Auf der zum Schraubenkopf 51 hin weisenden Seite ist dabei durch den Rand der Durchgangsöffnung die entsprechende zweite Angriffsfläche für das Federelement 4 gebildet. So lässt sich herstellungstechnisch vorteilhaft bewirken, dass bei entsprechender Verankerung der Schraube 5 an dem Kühlkörper 2, also wenn die Schraube 5 wie vorgesehen in die Gewindeöffnung 29 eingeschraubt ist, das Andruckelement 3 durch das Federelement 4 in normaler Richtung - wie in Fig. 2 mit einem Pfeil N angedeutet - gegen die Oberfläche 21 des Kühlkörpers 2 gedrückt wird. Dementsprechend kann also vorgesehen sein, dass die Hauptachse der Schraube 5 parallel zu der normalen Richtung N bzw. zu der hierzu parallelen Hauptabstrahlrichtung L orientiert ist.On the side facing the screw head 51 side, the corresponding second engagement surface for the spring element 4 is formed by the edge of the passage opening. Thus, manufacturing technology advantageously effect that with appropriate anchoring of the screw 5 on the heat sink 2, so when the screw 5 is screwed as provided in the threaded opening 29, the pressure element 3 by the spring element 4 in the normal direction - as in Fig. 2 indicated by an arrow N - is pressed against the surface 21 of the heat sink 2. Accordingly, it can thus be provided that the main axis of the screw 5 is oriented parallel to the normal direction N or to the main emission direction L parallel thereto.

Um den Druck besonders gleichmäßig an das LED-Modul 1 übertragen zu können, weist das Andruckelement 3 vorzugsweise eine insbesondere kreisförmige Andruckfläche 31 auf. Diese Andruckfläche 31 ist dabei vorzugsweise derart gestaltet, dass sie bei montiertem LED-Modul 1 die Lichtabgabefläche 19 des LED-Moduls 1 insbesondere geschlossen ringförmig umgibt. So lässt sich eine besonders gleichmäßige Andruckkraft bewirken, mit der das LED-Modul 1 gegen die Oberfläche 21 des Kühlkörpers 2 gedrückt gehalten wird.In order to transfer the pressure particularly evenly to the LED module 1, the pressure element 3 preferably has a particular circular pressure surface 31. This pressure surface 31 is preferably designed such that it surrounds the light emitting surface 19 of the LED module 1 in particular closed annular with mounted LED module 1. Thus, a particularly uniform pressure force can be achieved with which the LED module 1 is kept pressed against the surface 21 of the heat sink 2.

Vorzugsweise besteht das Andruckelement 3 zur Erzielung einer geeigneten Formstabilität aus Metall. Insbesondere kann hier das Andruckelement 3 einstückig, also aus lediglich einem Stück bestehend ausgebildet sein.Preferably, the pressure element 3 to achieve a suitable dimensional stability of metal. In particular, here the pressure element 3 in one piece, so be formed of only one piece.

Vorzugsweise weist die Schraube 5 weiterhin eine Schulterfläche 52 zur Anlage an die Oberfläche 21 des Kühlkörpers 2 auf. Die Schulterfläche 52 ist dabei so gestaltet, dass das Federelement 4 eine vorgesehene Länge entlang der normalen Richtung N zur Erzielung der gewünschten Andruckkraft aufweist, wenn die Schraube 5 derart mit dem Kühlkörper 2 verbunden ist, also soweit in die Gewindeöffnung 29 eingeschraubt ist, dass die Schulterfläche 52 der Schraube 5 die Oberfläche 21 des Kühlkörpers 2 kontaktiert. So lässt sich erzielen, dass sich die vorgesehene Länge des Federelements 4 auf einfache und zuverlässige Weise herstellen lässt.Preferably, the screw 5 further comprises a shoulder surface 52 for engagement with the surface 21 of the heat sink 2. The shoulder surface 52 is designed so that the spring element 4 has a designated length along the normal direction N to achieve the desired pressure force when the screw 5 so with the heat sink 2 is connected, that is screwed so far into the threaded opening 29, that the shoulder surface 52 of the screw 5, the surface 21 of the heat sink 2 contacted. Thus, it can be achieved that the intended length of the spring element 4 can be produced in a simple and reliable manner.

Wie im gezeigten Beispiel der Fall, weist die Montageanordnung vorzugsweise wenigstens ein weiteres Federelement 4' und wenigstens eine weitere Schraube 5' auf, wobei das wenigstens eine weitere Federelement 4' und die wenigstens eine weitere Schraube 5' analog zu dem zuerst genannten Federelement 4 und der zuerst genannten Schraube 5 gestaltet sind. Natürlich sind dementsprechend auch weitere entsprechende Gewindeöffnungen in dem Kühlkörper 2 vorgesehen. Im gezeigten Beispiel sind vorteilhaft insgesamt genau drei Schrauben 4, 4' vorgesehen, die in gleichmäßiger Weise um die Lichtabstrahlfläche 19 des LED-Moduls 1 herum angeordnet sind.As in the example shown, the mounting arrangement preferably has at least one further spring element 4 'and at least one further screw 5', wherein the at least one further spring element 4 'and the at least one further screw 5' analogous to the first mentioned spring element 4 and the first-mentioned screw 5 are designed. Of course, accordingly, further corresponding threaded openings are provided in the heat sink 2. In the example shown, a total of exactly three screws 4, 4 'are advantageously provided, which are arranged in a uniform manner around the light emitting surface 19 of the LED module 1 around.

Fig. 3 zeigt eine Schnittdarstellung, die die Montageanordnung in Verbindung mit dem LED-Modul 1 und dem oben bereits erwähnten Reflektor 6 zeigt; Fig. 4 zeigt ein Detail aus Fig. 3. Fig. 3 shows a sectional view showing the mounting arrangement in connection with the LED module 1 and the above-mentioned reflector 6; Fig. 4 shows a detail Fig. 3 ,

Wie beispielsweise aus Fig. 4 hervorgeht, weist im gezeigten Beispiel das Andruckelement 3 weiterhin eine Ausnehmung 33 zur Aufnahme eines an dem LED-Modul 1 ausgebildeten Vorsprungs 11 auf. Auf diese Weise lässt sich besonders einfach bei der Montage des LED-Moduls 1 eine festgelegte Ausrichtung des LED-Moduls 1 gegenüber dem Andruckelement 3 herstellen. Raumsparend kann dabei der Vorsprung 11 in die normale Richtung N weisend ausgebildet sein. Insbesondere kann die Gestaltung dabei derart sein, dass sich der Vorsprung 11 des LED-Moduls 1 nur dann wie vorgesehen in die Ausnehmung 33 einbringen lässt, wenn das LED-Modul 1 gegenüber dem Andruckelement 3 - mit Bezug auf eine zur normalen Richtung N parallele Achse - eine bestimmte vorgesehene Drehstellung einnimmt.Like, for example Fig. 4 As can be seen, in the example shown, the pressure element 3 also has a recess 33 for receiving a projection 11 formed on the LED module 1. In this way, it is particularly easy to produce a fixed orientation of the LED module 1 relative to the pressure element 3 during the assembly of the LED module 1. Space saving while the projection 11 may be formed pointing in the normal direction N. In particular, the design can be such that the projection 11 of the LED module 1 can only be introduced into the recess 33 as intended when the LED module 1 faces the pressure element 3 with reference to an axis parallel to the normal direction N. - occupies a certain intended rotational position.

Wie beispielsweise in Fig. 1 gezeigt, weist vorzugsweise das Andruckelement 3 weiterhin einen insbesondere umlaufend ausgebildeten Steg 32 zur Bildung eines optischen Labyrinths auf. Vorzugsweise ist der Steg 32 derart geformt, dass er sich um die Lichtabgabefläche 19 herum erstreckt. Weiterhin vorzugsweise weist das optische Element, hier also der Reflektor 6, einen entsprechenden, insbesondere umlaufend ausgebildeten Steg 61 zur Bildung des optischen Labyrinths auf; dabei ist vorzugsweise das optische Labyrinth durch den Steg 32 des Andruckelements 3 und den Steg 61 des optischen Elements gebildet. Durch dieses optische Labyrinth lässt sich erzielen, dass kein Teil des von dem LED-Modul 1 abgestrahlten Lichts ungewollt an der Grenze zwischen dem LED-Modul 1 und dem optischen Element nach außen dringt.Such as in Fig. 1 shown, preferably, the pressure element 3 further comprises a particular circumferentially formed web 32 for forming an optical labyrinth. Preferably, the ridge 32 is shaped to extend around the light emitting surface 19. Further preferably, the optical Element, here so the reflector 6, a corresponding, in particular circumferentially formed web 61 for forming the optical labyrinth on; In this case, the optical labyrinth is preferably formed by the web 32 of the pressure element 3 and the web 61 of the optical element. By means of this optical labyrinth it can be achieved that no part of the light emitted by the LED module 1 unintentionally penetrates outward at the boundary between the LED module 1 and the optical element.

Wie beispielsweise in Fig. 1 angedeutet, kann das LED-Modul 1 seitliche Kanäle 17 aufweisen, die zur Stromzufuhr dienen. Die seitlichen Kanäle 17 sind dabei vorzugsweise derart gestaltet, dass sich entsprechende Leitungen zur Stromzufuhr so anordnen lassen, dass sie die Oberfläche 21 des Kühlkörpers 2 nicht durchsetzen; beispielsweise können die Kanäle 17 zumindest im Wesentlichen senkrecht zu der normalen Richtung N bzw. zu der Hauptabstrahlrichtung L orientiert ausgebildet sein.Such as in Fig. 1 indicated, the LED module 1 may have lateral channels 17 which serve to supply power. The lateral channels 17 are preferably designed such that corresponding lines can be arranged for power supply so that they do not enforce the surface 21 of the heat sink 2; For example, the channels 17 may be formed at least substantially perpendicular to the normal direction N or to the main emission direction L oriented.

Wichtige Vorteile der Anordnung lassen sich wie folgt zusammenfassen:
Mit der Montageanordnung lässt sich erzielen, dass das LED-Modul mit einer Andruckkraft gegen den Kühlkörper gedrückt wird, die über eine lange Dauer, beispielsweise eine Lebensdauer einer entsprechen Leuchtvorrichtung besonders konstant ist. So lässt sich dauerhaft ein konstanter Wärmeübergang erzielen.Important advantages of the arrangement can be summarized as follows:
With the mounting arrangement can be achieved that the LED module is pressed with a pressing force against the heat sink, which is particularly constant over a long period, for example, a lifetime of a corresponding lighting device. This allows a constant heat transfer to be achieved permanently.

Mit der Montageanordnung lässt sich das LED-Modul einfach und sicher an dem Kühlkörper montieren. Zudem lässt sich das LED-Modul bei Bedarf einfach austauschen.With the mounting arrangement, the LED module can be easily and safely mounted on the heat sink. In addition, the LED module can be easily replaced if necessary.

In Verbindung mit einem optischen Element, beispielsweise einem Reflektor, lässt sich besonders geeignet Lichtdichtheit erzielen.In conjunction with an optical element, for example a reflector, light-tightness can be achieved in a particularly suitable manner.

Claims (10)

  1. Arrangement for mounting an LED module on a surface of a heat sink, having
    - a pressing element for pressing the LED module against the surface,
    - a spring element for a floating support of the pressing element relative to the surface,
    wherein the pressing element is configured in the form of a circular ring, thus creating an opening for the engaging arrangement of the LED module,
    wherein the pressing element has a recess for receiving a projection, which is formed on the LED module and points in a normal direction with respect to the surface of the heat sink, wherein the configuration is such that the projection of the LED module can be inserted into the recess as intended only when the LED module assumes a specific provided rotational position relative to the pressing element with respect to an axis parallel to the normal direction,
    characterized by
    - a screw for a screw connection with the heat sink, wherein the screw has a head and the spring element is provided to be placed against the head of the screw on the one side and the pressing element on the other.
  2. Arrangement according to Claim 1,
    in which the pressing element is configured as a frame for the LED module.
  3. Arrangement according to Claim 1 or 2,
    in which the pressing element has an in particular annular pressing surface for pressing the LED module against the surface.
  4. Arrangement according to any one of the preceding Claims, in which the screw further has a shoulder surface for resting against the surface of the heat sink.
  5. Arrangement according to Claim 4, further having
    - at least one further spring element and at least one further screw,
    wherein the at least one further spring element and the at least one further screw are configured analogously to the first-mentioned spring element and the first-mentioned screw.
  6. Arrangement according to any one of the preceding Claims, in which the pressing element has an in particular circumferentially configured web for forming an optical labyrinth.
  7. Arrangement according to any one of the preceding Claims, in which the pressing element is made of metal.
  8. LED array, comprising
    - an LED module,
    - a heat sink having a surface and
    - an arrangement for mounting the LED module on the surface of the heat sink according to any one of the preceding claims,
    wherein the pressing element is mounted in a floating manner with respect to the surface with the aid of the spring element.
  9. LED array according to Claim 8,
    in which the pressing element comprises a recess and the LED module has a projection corresponding to the recess, which is arranged so as to engage into the recess.
  10. LED array according to Claim 8 or 9,
    wherein the arrangement for mounting the LED module has the features mentioned in Claim 6, and further having
    - an optical element, in particular in the form of a reflector, which has an in particular circumferentially configured web for forming the optical labyrinth, wherein the optical labyrinth is preferably formed by the web of the pressing element and the web of the optical element.
EP16158385.1A 2015-03-04 2016-03-03 Arrangement for mounting a led module on a surface of a cooling body and led assembly Active EP3064827B1 (en)

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EP3064827B1 true EP3064827B1 (en) 2019-05-08

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Citations (1)

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US20130051009A1 (en) * 2009-09-24 2013-02-28 Molex Incorporated Light module system

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JP2006310138A (en) * 2005-04-28 2006-11-09 Matsushita Electric Ind Co Ltd Light emitting unit, lighting system and display device
EP1780804A1 (en) * 2005-10-25 2007-05-02 L&C Lighting Technology Corp. LED device with an active heat-dissipation device
US7182627B1 (en) * 2006-01-06 2007-02-27 Advanced Thermal Devices, Inc. High illumosity lighting assembly
CN101210664A (en) * 2006-12-29 2008-07-02 富准精密工业(深圳)有限公司 Light-emitting diode lamps and lanterns
DE202010004776U1 (en) * 2010-04-09 2011-09-02 Zumtobel Lighting Gmbh Luminaire with swiveling LED
DE102010033092A1 (en) * 2010-08-02 2012-02-02 Osram Opto Semiconductors Gmbh Optoelectronic light module and car headlights
US10104812B2 (en) * 2011-09-01 2018-10-16 Infineon Technologies Ag Elastic mounting of power modules
DE202011051187U1 (en) * 2011-09-02 2012-12-07 Zumtobel Lighting Gmbh Heatsink for a downlight, as well as downlight
ITMI20112061A1 (en) * 2011-11-14 2013-05-15 A A G Stucchi Srl MODULE HOLDER AND SINK ELEMENT, PARTICULARLY FOR LED AND SIMILAR MODULES
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