EP2622258A1 - Corps de refroidissement et agencement de module de lampe pour lampe - Google Patents

Corps de refroidissement et agencement de module de lampe pour lampe

Info

Publication number
EP2622258A1
EP2622258A1 EP11760493.4A EP11760493A EP2622258A1 EP 2622258 A1 EP2622258 A1 EP 2622258A1 EP 11760493 A EP11760493 A EP 11760493A EP 2622258 A1 EP2622258 A1 EP 2622258A1
Authority
EP
European Patent Office
Prior art keywords
segment
heat sink
luminaire
light module
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP11760493.4A
Other languages
German (de)
English (en)
Other versions
EP2622258B1 (fr
Inventor
Wolfgang Bechter
Bernd Walser
Michael Spiegel
Wolfgang Rüf
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zumtobel Lighting GmbH Austria
Original Assignee
Zumtobel Lighting GmbH Austria
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zumtobel Lighting GmbH Austria filed Critical Zumtobel Lighting GmbH Austria
Publication of EP2622258A1 publication Critical patent/EP2622258A1/fr
Application granted granted Critical
Publication of EP2622258B1 publication Critical patent/EP2622258B1/fr
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
    • F21S4/00—Lighting devices or systems using a string or strip of light sources
    • F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
    • F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V15/00—Protecting lighting devices from damage
    • F21V15/01—Housings, e.g. material or assembling of housing parts
    • F21V15/013—Housings, e.g. material or assembling of housing parts the housing being an extrusion
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/507—Cooling arrangements characterised by the adaptation for cooling of specific components of means for protecting lighting devices from damage, e.g. housings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to a heat sink according to the preamble of claim 1. Furthermore, the invention relates to a, such a heat sink having, light module assembly for a lamp, and a lamp with such a heat sink or with such a light module assembly.
  • a heat sink with a horizontal base plate is known from which extend upwards, a plurality of plate-shaped cooling fins.
  • the surface of the heat sink is particularly large, whereby an effective heat transfer from the heat sink to the surrounding air is possible.
  • the present invention is based on the object, an improved
  • a light module assembly is to be specified with such a heat sink, and an improved light with such a heat sink or with such a light module assembly.
  • a heat sink for a luminaire which has a first, at least to a first approximate plate-shaped segment and a second, at least to a first approximation plate-shaped segment, wherein the second segment with the first segment is directly and thereby connected in such a way that the second segment, at a horizontal orientation of the first segment, at least in
  • the heat sink Extends substantially vertically from a central portion of the first segment, measured vertically from an upwardly facing surface portion of the first segment, to a vertical extent.
  • the heat sink is designed such that, viewed in a vertical section through the first segment and the second segment, except for the second segment has no part which is located above a level which is defined by the half of the vertical extension, preferably through a quarter of the vertical extent.
  • this lateral heat dissipation is not hindered by cooling fins or other parts.
  • the heat radiation from the first segment upwards is also possible unhindered.
  • a corresponding heat dissipation via radiation is particularly advantageous if there is no or only a very small air circulation around the heat sink; Such a situation can be given, for example, in the case of recessed luminaires, in particular in the case of recessed ceiling luminaires.
  • the heat sink is thus particularly suitable for use under conditions in which there is no or only a particularly low air flow around the heat sink.
  • the heat sink can be characterized by the fact that it does not have a plurality of cooling fins, in contrast to the prior art, under significantly reduced
  • Heat output is obstructed, still allows effective heat dissipation over the second segment.
  • the second segment can continue to be formed a spacer.
  • this can be in the case of a recessed luminaire, the one
  • the heat sink prevent the light is installed in a too small or too low installation space.
  • the heat sink comprises a profile body, which is formed by the first segment and the second segment.
  • the heat sink consists of this profile body.
  • the heat sink is designed such that it has no part over the entire length of the profile body except the second segment, which is located above the level. As a result, a correspondingly unhindered heat radiation from the second segment over a particularly large area is made possible.
  • the heat sink is formed in one piece. This allows a particularly good heat conduction within the heat sink.
  • the heat sink is designed such that, viewed in the section, a material strength of the first segment, starting from the middle region to the right and / or to the left and / or a material thickness of the second segment, starting from the central region is reduced upwards.
  • the material requirement of the heat sink can be further reduced. It is sufficient with respect to an effective heat dissipation in the corresponding outer regions of a reduced material thickness, so that this material saving is possible, at least without significant impairment of heat dissipation.
  • the heat sink is made of aluminum or another material which has a similarly good thermal conductivity, for example steel. This is allows a particularly even distribution of heat over the areas intended for radiation.
  • the first segment has elements for holding further components of the luminaire.
  • the elements may in particular be at least one groove.
  • the further components may be a printed circuit board on which LEDs are arranged as the light source of the luminaire and / or a primary-optic element and / or a reflector element.
  • a lighting module arrangement is provided for a luminaire, wherein the luminous module arrangement has a cooling body according to the invention, and at least one LED, which is thermally conductively connected to the cooling body.
  • the at least one LED can be arranged via a circuit board on the first segment, preferably in the central region.
  • Directions can be dissipated, namely along the first segment in two lateral directions and along the second segment upwards.
  • the at least one LED is preferably arranged on the first segment on a side opposite the second segment. This allows a light output that is not adversely affected by the second segment.
  • the light module arrangement particularly advantageously has a plurality of LEDs which are arranged on the first segment along a straight line which runs in a plane which is defined by the shape of the second segment. The described, particularly effective heat dissipation is thereby made possible for all LEDs along the straight line.
  • a luminaire which has a heat sink according to the invention or an inventive Lighting module arrangement.
  • the luminaire is particularly advantageously a recessed luminaire, in particular a recessed ceiling luminaire.
  • a particularly effective heat dissipation is made possible if the surface area points upward in an orientation intended for operation of the luminaire, forming an outwardly facing surface of the luminaire.
  • the lamp also has a trough-shaped luminaire housing with a bottom wall and adjoining side walls, wherein the bottom wall has a passage opening and the heat sink is inserted through the passage opening at least substantially covering in the bottom wall.
  • Fig. 1 is a schematic, perspective view of a
  • Fig. 2 is a sectional view of the heat sink and others
  • Lighting components which are arranged on the heat sink,
  • Fig. 3 is a schematic, perspective view of the heat sink with other lighting components
  • Fig. 4 is a schematic sectional view of a lamp with the
  • Fig. 1 is a schematic, perspective view of the embodiment of a heat sink according to the invention for a luminaire is shown
  • Fig. 2 shows a corresponding cross section.
  • the heat sink has a first segment 2, which is plate-shaped, at least to a first approximation, as well as a second segment 4, which is likewise plate-shaped, at least to a first approximation.
  • the plate-shaped design of the first segment 2 defines a plane SI; that is the level that the
  • Distance a of the surface of the first segment 2 from the plane SI is not greater than the said percentage, for example, not greater than 5%, of one
  • Extension L of the segment 2 in the plane SI The same applies to the second segment 4 and a corresponding level S2.
  • the second segment 4 is directly connected to the first segment 2.
  • the two segments 2, 4 may be formed in one piece as a whole. This allows a particularly good heat conduction within the heat sink.
  • the connection is such that the second segment 4, in horizontal
  • Alignment of the first segment 2, at least substantially from a central region 6 of the first segment 2 extends vertically upward. This orientation corresponds to the illustration in FIG. 2; the first segment 2 is oriented horizontally, in other words, the plane SI is oriented horizontally.
  • the second segment 4 extends vertically upwards, so the corresponding plane S2 is oriented vertically; the second segment 4 thus forms, so to speak, an upwardly projecting "fin"
  • At least substantially is expressed that an angle W between the plane S2, which is defined by the second segment 4, on the one hand and that other plane SI, which is defined by the first segment 2, on the other hand, about 90 ° is, for example, between 80 ° and 100 °.
  • the second segment 4 extends by a "height" or by a vertical extent F.
  • the "fin” can, however, also be required take other forms. This can be the case, for example
  • ribs, -nasen or grooves are desired or required.
  • the heat sink is designed such that, viewed in a vertical section through the first segment 2 and the second segment 4, with the exception of the second segment 4, it has no part which is above a level N which lies through half of the vertical extension V, preferably by a quarter of
  • this level N is shown by way of example at a height of one quarter of the vertical extent V. In other words, above the level N is with sole
  • Heat release allows, if the heat sink is not appreciably flows around by air. Analogous is a correspondingly unhindered, effective heat dissipation? from the upwardly facing surface 8 of the first segment 2 allows upwards.
  • the heat sink according to the invention does not require a plurality of cooling fins arranged in parallel; This can be achieved in particular a material saving.
  • the heat sink can therefore in particular have an upside-down T-shape, wherein the first segment 2 forms the top line of the T ' s and the second segment 4 forms the stem of the T ' s.
  • the heat sink comprises a profile body which is formed by the first segment 2 and the second segment 4.
  • the heat sink - as shown - consist of this profile body. It may be, for example, an extrusion profile.
  • a particularly large, correspondingly effective Ab beam surface can be achieved if the heat sink is designed such that it over the entire length /
  • Profile body with the exception of the second segment 4 has no part which is located above the level N.
  • the heat sink is made in one piece; This allows a particularly good thermal conductivity within the heat sink.
  • the heat sink is made of aluminum or another material which has a similarly good thermal conductivity, for example steel.
  • a further saving in material is made possible when viewed in the said vertical section through the first segment 2 and the second segment 4, starting from the central region 6, a material strength of the first segment 2, starting from the central region 6 to the right and / or to the left and / or a material strength of the second segment 4, starting from the central region 6 is reduced upward.
  • this is exemplified outlined; starting from the central region 8 reduces the material thickness of the first segment 2 to the left, ie in the direction of the left edge 10 of the first segment 2, from a first
  • Material strength dl to a second, to lower material thickness d2. The same applies to the region of the first segment 2 from the middle region 6 to the right, ie in the direction of the right edge 12 or for a corresponding material strength of the second segment 4 upwards or in the direction of the upper edge 14th
  • the first segment 2 elements for mounting further components of the lamp may be, for example, at least one groove 16.
  • the further components can be at least one LED 22, which is preferably arranged on a circuit board 20, the circuit board 20 being good thermally conductive, for example via a layer of thermal compound, with the
  • Heat sink is contacted.
  • the at least one LED 22 in particular via the board 20, is particularly preferably arranged on the first segment 2, specifically on a side opposite the second segment 4, that is to say with reference to the said section on the underside of the first segment 2.
  • the at least one LED 22 is arranged in the middle region 6. In this way, a particularly effective heat dissipation from the LED 22 is possible, via the first segment 2 to the right and to the left and over the second segment 4 upwards.
  • a particularly effective radiation for heat dissipation is made possible if the corresponding surfaces of the heat sink are comparatively large. For example, it can be provided that viewed in the said vertical section, the
  • Extension L of the first segment 2 is at least five times the extension p of the board 20.
  • the extent or vertical extent F of the second segment 4 is at least twice the extent p of the board 20.
  • the ratio of the extent L of the first segment 2 to the vertical extent V is advantageously in the said section between 2: 1 and 6: 1.
  • the lighting module arrangement - as shown in FIG. 3 - has a plurality of LEDs 22 which are arranged on the first segment 2 along a straight line G which is in the (S2 in Fig. 2) designated level S2 runs, which is determined by the shape of the second segment 4. Therefore, the heat sink or the light module assembly is particularly suitable for the case that a plurality of LEDs arranged along a line are provided as the light source.
  • the board 20 is designed accordingly elongated.
  • the first segment 2 for arranging the circuit board 20 on the heat sink or on the first segment 2 can the first segment 2 in particular two lateral stops 162, 164, by which a lateral securing position of the board 20 is ensured relative to the heat sink.
  • a planar surface region of the first segment 2 is preferably formed, which serves for planar connection to the circuit board 20, wherein advantageously with respect to a good thermal connection between the circuit board 20 and the planar surface region, a thermal compound is arranged.
  • a respective one is preferably between this last-mentioned, plane surface area and the two stops 162, 162
  • Receiving groove 163 formed, which serves to receive excess thermal paste.
  • Two further grooves 166 may be provided on the underside of the first segment 2, which serve to hold locking elements 180, which hold the board 20 upwardly pressing against the underside of the first segment 2.
  • Two further grooves 16 may be provided on the underside of the first segment 2, which serve to hold an optical element 24, which serves to influence a light emitted by the LEDs 22.
  • the optical element 24 can also have structures 242, for example in the form of ribs, for holding reflector elements 40, 42.
  • a luminaire is furthermore provided which has a heat sink according to the invention or a luminous module arrangement according to the invention.
  • the luminaire may in particular have a luminaire housing 30, which is designed, for example, trough-shaped, with a trough bottom 302 and adjoining side wall w he oak 304.
  • a luminaire housing 30 which is designed, for example, trough-shaped, with a trough bottom 302 and adjoining side wall w he oak 304.
  • Well bottom 302 provided a through hole into which the heat sink and the light module assembly is used, and preferably such that is covered or closed by the heat sink, in particular by the first segment 2, the through hole and the second segment 4 with respect to the Luminaire housing 30 protrudes outward.
  • the passage opening can take, for example, between 25% and 75% of that area which is defined by the edge of the trough bottom 302.
  • the heat sink may further comprise holding elements 28, the arrangement for releasably holding the heat sink or the light module arrangement in the
  • the heat sink is particularly suitable in the case where the luminaire is a recessed luminaire, in particular a recessed ceiling luminaire.
  • the luminaire is a recessed luminaire, in particular a recessed ceiling luminaire.
  • an installation space is provided in this case, which - with built-in lamp - no significant air flow around the heat sink allows. Accordingly, it is particularly advantageous if the lamp is designed such that in the intended for the operation of the lamp alignment of the er Chemistryb area 8 of the first segment 2 upwards, ie towards the installation space, and thereby forms an outer surface of the lamp.
  • the second segment 4 can continue to serve advantageously as a spacer in this case. This can reduce the risk that the light in a
  • Installation space is installed, which is too low.
  • the heat sink is not interchangeable disposed in the lamp housing, but that the lamp housing itself as such forms the heat sink by appropriate design. However, in this case, in particular the production of the second segment is associated with more effort.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

La présente invention concerne un corps de refroidissement destiné à une lampe, ledit corps de refroidissement présentant un premier segment (2) plat au moins aux premiers abords, ainsi qu'un second segment (4) plat au moins aux premiers abords, le second segment (4) étant relié au premier segment (2) directement, et ainsi de sorte que le second segment (4), lorsque le premier segment (2) est orienté horizontalement, s'étend verticalement vers le haut au moins sensiblement à partir d'une zone intermédiaire (6) du premier segment (2), à savoir, mesuré depuis une zone de surface (8) du premier segment (2), orientée vers le haut, sur une dimension verticale (V). Selon l'invention, le corps de refroidissement est conçu de sorte que, lorsqu'on le considère dans une coupe verticale à travers le premier segment (2) et le second segment (4), il ne présente, hors du second segment (4), aucune partie qui se trouve au-dessus d'un niveau (TV) fixé par la moitié de la dimension verticale (V), de préférence le quart de la dimension verticale (V). Cette conception permet de réaliser des surfaces du corps de refroidissement comparativement importantes, par lesquelles peut s'effectuer dans une première ligne une évacuation de chaleur par rayonnement. Le fait que dans une zone située latéralement autour du second segment (4) ne se trouve aucune autre partie du corps de refroidissement, permet d'obtenir une évacuation de chaleur (Ä) des parties de surfaces du second segment (4) pratiquement sans entraves. En particulier, cette évacuation de chaleur latérale n'est pas entravée par des nervures de refroidissement ou autres parties. L'émission de chaleur vers le haut par le premier segment (2) peut également s'effectuer sans entrave. L'invention concerne également un agencement de module de lampe, au moins une DEL (2) étant montée sur un corps de refroidissement de ce type, ainsi qu'une lampe correspondante.
EP11760493.4A 2010-09-27 2011-09-26 Corps de refroidissement et agencement de module de lampe pour lampe Not-in-force EP2622258B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102010041470A DE102010041470A1 (de) 2010-09-27 2010-09-27 Kühlkörper und Leuchtmodulanordnung für eine Leuchte
PCT/EP2011/066638 WO2012041797A1 (fr) 2010-09-27 2011-09-26 Corps de refroidissement et agencement de module de lampe pour lampe

Publications (2)

Publication Number Publication Date
EP2622258A1 true EP2622258A1 (fr) 2013-08-07
EP2622258B1 EP2622258B1 (fr) 2015-11-18

Family

ID=44674807

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11760493.4A Not-in-force EP2622258B1 (fr) 2010-09-27 2011-09-26 Corps de refroidissement et agencement de module de lampe pour lampe

Country Status (4)

Country Link
EP (1) EP2622258B1 (fr)
CN (1) CN103119352B (fr)
DE (1) DE102010041470A1 (fr)
WO (1) WO2012041797A1 (fr)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202005012652U1 (de) * 2005-08-11 2005-11-10 Kotzolt, Michael Leistungs-LED-Modell
DE202008002873U1 (de) * 2008-02-29 2008-05-15 Martin, Andreas, Dipl.-Ing. Lichtmodul für Raum- und Flächenausleuchtung
CN101619842B (zh) * 2008-07-04 2011-03-23 富准精密工业(深圳)有限公司 发光二极管灯具及其光引擎
TWI385343B (zh) * 2008-07-24 2013-02-11 Advanced Optoelectronic Tech 一種光源及其被動散熱裝置
JP5304198B2 (ja) * 2008-11-24 2013-10-02 東芝ライテック株式会社 照明器具
CN201513770U (zh) * 2009-08-28 2010-06-23 扬州新世代光电照明有限公司 一种散热型led光源模组
CN201555119U (zh) * 2009-10-15 2010-08-18 苏州中泽光电科技有限公司 组合式led吊顶灯

Also Published As

Publication number Publication date
CN103119352B (zh) 2017-03-01
WO2012041797A1 (fr) 2012-04-05
CN103119352A (zh) 2013-05-22
DE102010041470A1 (de) 2012-03-29
EP2622258B1 (fr) 2015-11-18

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