EP2617057A1 - Procédé pour grouper des led dans une unité de conditionnement et unité de conditionnement comportant une pluralité de led - Google Patents

Procédé pour grouper des led dans une unité de conditionnement et unité de conditionnement comportant une pluralité de led

Info

Publication number
EP2617057A1
EP2617057A1 EP11770384.3A EP11770384A EP2617057A1 EP 2617057 A1 EP2617057 A1 EP 2617057A1 EP 11770384 A EP11770384 A EP 11770384A EP 2617057 A1 EP2617057 A1 EP 2617057A1
Authority
EP
European Patent Office
Prior art keywords
leds
packaging unit
color
led
sequences
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP11770384.3A
Other languages
German (de)
English (en)
Inventor
Alexander Wilm
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of EP2617057A1 publication Critical patent/EP2617057A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F21Y2105/12—Planar light sources comprising a two-dimensional array of point-like light-generating elements characterised by the geometrical disposition of the light-generating elements, e.g. arranging light-generating elements in differing patterns or densities
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00—Combination of light sources
    • F21Y2113/10—Combination of light sources of different colours
    • F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages

Definitions

  • the invention relates to a method for assembling LEDs in a packaging unit and a packaging unit with a plurality of LEDs.
  • LEDs Due to their high efficiency, LEDs are increasingly being used in general lighting or indoor LED lamps
  • LED lamps used. It is often the case that several LED lamps are operated side by side, the individual LED lamps can each contain multiple LEDs.
  • LEDs are often grouped by the LED manufacturer before delivery (see above)
  • an object is a method for assembling LEDs in a packaging unit
  • an advantageous packaging unit is to be specified with a plurality of LEDs.
  • the color location of a plurality of LEDs is first determined.
  • the color location of an LED can be determined, for example, by measuring the light emitted by the LED during operation with a spectrophotometer.
  • the color locus is preferably determined in a normalized color space system.
  • the color location can be determined in a CIE color space system.
  • the color location of an LED can be determined, for example, by the coordinates (C x , C y ) in the CIE color space system
  • the LEDs are divided into a plurality of color loci, wherein each LED is divided into a color locus, which comprises the determined color locus of the respective LED.
  • the color space system used for example the CIE color space system, is subdivided into a plurality of different color loci, so that each LED can be divided into one of the color loci based on the determined color locus.
  • the LEDs are arranged in a packaging unit such that the packaging unit more
  • the packaging unit thus contains LEDs of different colors
  • Color loci which are arranged in a predetermined order in the packaging unit. This has the advantage that when removing a plurality of LEDs from the packaging unit in the order in which the LEDs are arranged in the packaging unit, the customer receives a uniform mixture of LEDs of different color locations. LED lamps, a variety of the so from the packaging unit
  • the resulting color locus is the color locus which the light emitted by the several LEDs contained in the luminaire has simultaneously.
  • the same color LEDs are assembled in the packaging unit.
  • the division of the LEDs in different Farbort Schemee means so
  • the LEDs have different colors such as red, green, blue or white, but that they have slight variations in the color impression of a single color.
  • the color loci become
  • the method can be used for LEDs of any color, especially for white light emitting LEDs.
  • the number of color loci in which the LEDs are divided is preferably between 3 and 8 inclusive. For example, if the LEDs are in four color loci
  • Each of the sequences arranged in the packaging unit contains four LEDs, each sequence containing exactly one LED from each of the four color loci in a predetermined order. If the packaging unit contains, for example, 1000 LEDs are in the
  • Packing unit 250 sequences of four LEDs arranged in the given order. If in this case four successive LEDs from the
  • the number of extracted LEDs corresponds to an integer multiple of the color loci, ie. H. If, for example, when dividing the LEDs into four color loci, eight, twelve, sixteen, etc., LEDs are removed from the packaging unit. If the number of LEDs removed from the packaging unit corresponds to an integer multiple of the number of color loci, a uniform mixture of LEDs of the different color loci is always taken, regardless of whether the first extracted LED is located at the beginning of a sequence.
  • the LEDs arranged in the packaging unit are provided for mounting in an LED lamp with a plurality of LEDs, it is advantageous if the division into color locus ranges is matched to the number of LEDs in the luminaire such that the number of LEDs in the luminaire is one integer multiple of the number of color loci. If, for example, an LED lamp contains twelve LEDs, it is advantageous if the LEDs are divided into three or four color loci, because in this case a removal of Twelve LEDs are always an integer number of sequences from the
  • Packaging unit is removed so that the lamp has an equal number of LEDs from each of the Farbort Schemee.
  • a good mix of LEDs of different color loci is achieved even if the number of LEDs taken out of the packaging unit one by one is large compared to the number of color loci.
  • the number of LEDs from different color locus ranges differs by a maximum of one for a plurality of units removed from the packaging unit, so that no significant difference between the resulting color units of the units occurs with a large number of LEDs per unit.
  • Sequence is taken from the packaging unit, it is ensured that different extracted sequences each have the same composition of LEDs of different color loci, even if the number of LEDs taken not equal or not equal to an integer
  • a packaging unit preferably contains between
  • the packaging unit used is preferably a roll on which the sequences of LEDs are arranged one after the other become.
  • the LEDs are preferably fixed on the reel so that they can be easily removed from the reel.
  • the roller may have an adhesive tape to which the LEDs are glued.
  • the packaging unit contains according to at least one
  • Each of the LEDs may be associated with a color locus that includes the color location of the radiation emitted by the respective LED during operation.
  • the LEDs are in the packaging unit in several
  • the packaging unit is preferably a roll on which the sequences of LEDs are arranged one after the other.
  • the beginning of the sequences advantageously has one each
  • the packaging unit preferably contains between 500 and 20000 total LEDs inclusive, more preferably between 1000 and 10000 LEDs inclusive.
  • Figure 1 is a schematic representation of the division of
  • Figure 2 is a schematic representation of the arrangement
  • FIG. 3 is a schematic representation of an LED lamp
  • the color location of a plurality of LEDs is first determined.
  • the color location of an LED can be represented in particular by the coordinates C x , C y in the normalized CIE color space.
  • the measurement of the color location of the plurality of LEDs can be
  • a color location (C x i, C y i) and for the second LED a color location (C X 2, C X 2) determined.
  • the color loci (C xn , C yn ), for n 1 to N, for a plurality of N LEDs, which are to be assembled in a packaging unit, determined.
  • the LEDs are divided into several different color loci A, B, C, D.
  • the color loci A, B, C, D are subregions of the color space, in particular the CIE color space, wherein the color loci A, B, C, D are advantageously selected such that they are evenly arranged around a nominal color location (C xS , C yS ) are and together cover the occurring during the production of the LEDs scattering of the actually determined color locations around this setpoint around.
  • the color loci A, B, C, D preferably do not overlap each other, so that each LED can be assigned to exactly one color locus A, B, C, D.
  • each of the plurality of LEDs is classified into one of the color loci A, B, C, D, which includes the determined color locus of the respective LED.
  • a first LED having the color coordinates (C x i, C y i) is assigned to the color locus A and a second LED having the color locus coordinates (C X 2, C y 2) is assigned to the color locus region D.
  • the LEDs are subsequently arranged in a packaging unit 4 such that the
  • Packaging unit 4 contains several consecutive sequences 1, 2, 3 of a plurality of LEDs 5, each sequence 1, 2, 3 each exactly one LED 5 from each of the
  • Sequences 1, 2, 3 are arranged in each case in the same order.
  • the packaging unit 4 may in particular be a roller on which the sequences of LEDs 1, 2, 3 are arranged one after the other.
  • Figure 2 are for
  • Packaging 4 serving role, for example, between 500 and 20,000 LEDs 5 include.
  • the sequences 1, 2, 3 each contain exactly four LEDs, since the LEDs 5 in the exemplary embodiment have been divided into four color loci.
  • the sequences 1, 2, 3 each contain exactly one LED from each of the color loci A, B, C, D, the LEDs 5 in each of the sequences 1, 2, 3 being assigned to the color loci A, B, C, D are arranged in the same order.
  • This arrangement of the LEDs 5 in the packaging unit 4 has the advantage that when removing a plurality of LEDs 5 it is ensured that the color locations of the individual LEDs 5 are arranged uniformly around the setpoint value. This is the case in particular if the number of LEDs 5 removed is equal to the number of LEDs 5 in one of the sequences 1, 2, 3 or an integer multiple thereof. If in the embodiment in which the LEDs 5 in four
  • m * 4 LEDs are taken 5, where m is an integer, the number of LEDs thus removed from the packaging unit 4 has the same number of LEDs from each of the color loci A, B, C, D. This is independent of whether the first extracted LED 5 is arranged at the beginning of one of the sequences 1, 2, 3 or not. It is possible that the packaging unit 4 has markings 6, each marking the beginning of a new sequence 1, 2, 3. This is particularly advantageous if a number of LEDs from the packaging unit 4 is to be taken for different LED components, which does not equal the number of LEDs 5 in the sequences 1, 2, 3 or an integral multiple thereof.
  • the number of LEDs 5 is taken from a beginning of a sequence, it is ensured that the components equipped with the LEDs 5 each have the same number of LEDs 5 from the color loci A, B, C, D, wherein the number of LEDs 5 from the different Farbort Schemeen in a single LED component differ by a maximum of one.
  • the removed LEDs 5 each have two LEDs 5 from the color loci A, B, C and an LED 5 from the color locus D. on. The color place of the whole
  • Such LEDs 5 populated LED components will therefore advantageously differ only slightly or not at all from each other.
  • an LED lamp 7 is shown schematically, which is equipped, for example, with twelve taken from the packaging unit 4 of Figure 2 LEDs 5. The LEDs are in the order of theirs when fitting the LED lamp 7
  • the LED lamp 7 advantageously has the same number of LEDs 5 of the color locus areas A, B, C, D. In this way, it is advantageously achieved that the color location of the light emitted by the totality of the LEDs 5 of the LED lamp 7 is comparatively close to
  • the individual LEDs 5 of the LED array 7 may have slightly different color locations.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Packaging Frangible Articles (AREA)
  • Packages (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

L'invention concerne un procédé pour grouper des LED (5) dans une unité de conditionnement (4). Selon ce procédé, la localisation chromatique d'une pluralité de LED (5) est déterminée et les LED (5) sont classées en plusieurs zones de localisation chromatique (A, B, C, D) différentes, chaque LED (5) étant classée dans une zone de localisation chromatique (A, B, C, D) présentant la localisation chromatique déterminée de la LED concernée (5). Les LED (5) sont agencées dans l'unité de conditionnement (4) de sorte que l'unité de conditionnement (4) contienne plusieurs séquences successives (1, 2, 3) de plusieurs LEDs (5), chaque séquence (1, 2, 3) comportant exactement une LED (5) provenant de chaque localisation chromatique (A, B, C, D), et les LEDs de localisations chromatiques (A, B, C, D) différentes à l'intérieur des séquences (1, 2, 3) étant disposées dans un ordre identique. En outre, l'invention concerne une unité de conditionnement (4) comportant une pluralité de LED (5) groupées de telle sorte.
EP11770384.3A 2010-09-16 2011-08-22 Procédé pour grouper des led dans une unité de conditionnement et unité de conditionnement comportant une pluralité de led Withdrawn EP2617057A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102010045576 2010-09-16
DE102010049857A DE102010049857A1 (de) 2010-09-16 2010-10-27 Verfahren zur Zusammenstellung von LEDs in einer Verpackungseinheit und Verpackungseinheit mit einer Vielzahl von LEDs
PCT/EP2011/064380 WO2012034827A1 (fr) 2010-09-16 2011-08-22 Procédé pour grouper des led dans une unité de conditionnement et unité de conditionnement comportant une pluralité de led

Publications (1)

Publication Number Publication Date
EP2617057A1 true EP2617057A1 (fr) 2013-07-24

Family

ID=44802029

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11770384.3A Withdrawn EP2617057A1 (fr) 2010-09-16 2011-08-22 Procédé pour grouper des led dans une unité de conditionnement et unité de conditionnement comportant une pluralité de led

Country Status (7)

Country Link
US (2) US9171884B2 (fr)
EP (1) EP2617057A1 (fr)
JP (1) JP5963750B2 (fr)
KR (1) KR101486832B1 (fr)
CN (1) CN103098208B (fr)
DE (1) DE102010049857A1 (fr)
WO (1) WO2012034827A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011103752A1 (de) 2011-05-31 2012-12-06 Osram Opto Semiconductors Gmbh Verfahren zur Anordnung einer Vielzahl von LEDs in Verpackungseinheiten und Verpackungseinheit mit einer Vielzahl von LEDs
US9273834B2 (en) 2013-02-25 2016-03-01 Osram Gmbh Method for mounting light radiation sources and light source therefor
CN103886814B (zh) * 2014-03-13 2016-04-13 长春希达电子技术有限公司 一种集成式led显示屏制作方法
DE102016221533B4 (de) 2016-11-03 2018-09-20 Mühlbauer Gmbh & Co. Kg Verfahren und Vorrichtung zum Transfer elektronischer Komponenten von einem Trägersubstrat auf ein Zwischenträgersubstrat

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59217399A (ja) * 1983-05-26 1984-12-07 株式会社東芝 半導体部品のテ−ピング用テ−プ
US20060250085A1 (en) * 2005-05-09 2006-11-09 Sony Corporation Display apparatus and method of manufacturing display apparatus
US7259030B2 (en) * 2004-03-29 2007-08-21 Articulated Technologies, Llc Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
US20080123355A1 (en) * 2006-07-06 2008-05-29 Dong-Sing Wuu Flexible light emitting module
US20080180948A1 (en) * 2007-01-02 2008-07-31 Samsung Electro-Mechanics Co., Ltd. White light emitting device and light source module for liquid crystal display backlight using the same
US20080225143A1 (en) * 2006-04-13 2008-09-18 Daktronics, Inc. Pixel interleaving configurations for use in high definition electronic sign displays
US20080285268A1 (en) * 2004-11-09 2008-11-20 Takashi Oku Backlight Device
WO2009064363A1 (fr) * 2007-11-15 2009-05-22 Cree, Inc. Appareil et procédés de sélection d'émetteurs de lumière
US20090246895A1 (en) * 2008-03-28 2009-10-01 Cree, Inc. Apparatus and methods for combining light emitters

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5978584A (ja) 1982-10-28 1984-05-07 Toshiba Corp 発光ダイオ−ドシ−トとその製造装置
JPS6159899A (ja) * 1984-08-31 1986-03-27 株式会社東芝 部品テ−ピング用テ−プ
JP3368890B2 (ja) * 2000-02-03 2003-01-20 日亜化学工業株式会社 画像表示装置およびその制御方法
DE10317811A1 (de) * 2003-04-16 2004-11-04 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Transportgurt
US6860620B2 (en) * 2003-05-09 2005-03-01 Agilent Technologies, Inc. Light unit having light emitting diodes
KR20070016541A (ko) * 2005-08-04 2007-02-08 삼성전자주식회사 광 발생 유닛 및 이를 갖는 표시 장치
US8038320B2 (en) * 2006-06-30 2011-10-18 The Sloan Company, Inc. Packaging for lighting modules
US7736017B2 (en) * 2006-12-21 2010-06-15 Osram Opto Semiconductors Gmbh Illumination device and display with illumination device
CN101539276B (zh) * 2008-03-21 2011-07-27 富准精密工业(深圳)有限公司 发光二极管组合
DE102008025398B4 (de) 2008-05-28 2018-04-26 Osram Gmbh Schutzumhüllung für ein LED-Band
US8240875B2 (en) * 2008-06-25 2012-08-14 Cree, Inc. Solid state linear array modules for general illumination
DE102008033391A1 (de) * 2008-07-16 2010-01-21 Osram Opto Semiconductors Gmbh Leuchtvorrichtung und Verfahren zur Gruppierung von Strahlung emittierenden Halbleiterchips
CN105135238A (zh) 2008-11-19 2015-12-09 罗姆股份有限公司 Led照明装置
JP2010129953A (ja) * 2008-12-01 2010-06-10 Rohm Co Ltd Ｌｅｄランプおよびその製造方法
DE102008064073A1 (de) 2008-12-19 2010-06-24 Osram Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung einer Mehrzahl von LED-Beleuchtungsvorrichtungen und LED-Beleuchtungsvorrichtung
US7967652B2 (en) * 2009-02-19 2011-06-28 Cree, Inc. Methods for combining light emitting devices in a package and packages including combined light emitting devices
KR101149677B1 (ko) * 2010-01-20 2012-07-11 주식회사 엘지실트론 플렉서블 소자 제조방법 및 이에 의하여 제조된 플렉서블 소자, 태양전지, ｌｅｄ

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59217399A (ja) * 1983-05-26 1984-12-07 株式会社東芝 半導体部品のテ−ピング用テ−プ
US7259030B2 (en) * 2004-03-29 2007-08-21 Articulated Technologies, Llc Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
US20080285268A1 (en) * 2004-11-09 2008-11-20 Takashi Oku Backlight Device
US20060250085A1 (en) * 2005-05-09 2006-11-09 Sony Corporation Display apparatus and method of manufacturing display apparatus
US20080225143A1 (en) * 2006-04-13 2008-09-18 Daktronics, Inc. Pixel interleaving configurations for use in high definition electronic sign displays
US20080123355A1 (en) * 2006-07-06 2008-05-29 Dong-Sing Wuu Flexible light emitting module
US20080180948A1 (en) * 2007-01-02 2008-07-31 Samsung Electro-Mechanics Co., Ltd. White light emitting device and light source module for liquid crystal display backlight using the same
WO2009064363A1 (fr) * 2007-11-15 2009-05-22 Cree, Inc. Appareil et procédés de sélection d'émetteurs de lumière
US20090246895A1 (en) * 2008-03-28 2009-10-01 Cree, Inc. Apparatus and methods for combining light emitters

Also Published As

Publication number Publication date
WO2012034827A1 (fr) 2012-03-22
US9171884B2 (en) 2015-10-27
US20130234176A1 (en) 2013-09-12
US20150380462A1 (en) 2015-12-31
DE102010049857A1 (de) 2012-03-22
JP2013544712A (ja) 2013-12-19
KR101486832B1 (ko) 2015-01-28
CN103098208A (zh) 2013-05-08
CN103098208B (zh) 2017-03-29
KR20130051503A (ko) 2013-05-20
JP5963750B2 (ja) 2016-08-03

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