EP2586582A1 - Système de commande de scie à fil et scie à fil - Google Patents

Système de commande de scie à fil et scie à fil Download PDF

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Publication number
EP2586582A1
EP2586582A1 EP11187049.9A EP11187049A EP2586582A1 EP 2586582 A1 EP2586582 A1 EP 2586582A1 EP 11187049 A EP11187049 A EP 11187049A EP 2586582 A1 EP2586582 A1 EP 2586582A1
Authority
EP
European Patent Office
Prior art keywords
wire
speed
saw
wire saw
camera
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP11187049.9A
Other languages
German (de)
English (en)
Other versions
EP2586582B1 (fr
Inventor
Jean-Marc Rosset
Philippe Nasch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Advanced Technologies Co Ltd
Original Assignee
Applied Materials Switzerland SARL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Switzerland SARL filed Critical Applied Materials Switzerland SARL
Priority to EP11187049.9A priority Critical patent/EP2586582B1/fr
Priority to CN201110459141.6A priority patent/CN103085185B/zh
Priority to CN 201120560605 priority patent/CN202685120U/zh
Priority to JP2012237407A priority patent/JP2013094959A/ja
Publication of EP2586582A1 publication Critical patent/EP2586582A1/fr
Application granted granted Critical
Publication of EP2586582B1 publication Critical patent/EP2586582B1/fr
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades

Definitions

  • a method for operating a wire saw includes the method for inspecting a wire as described herein.
  • the distance between the wires is from 110 ⁇ m to 310 ⁇ m.
  • the distance between the camera 20 and the wire 230 portions is dependent on a plurality of factors, e.g. of the employed type of camera, their technical specifications, the type and thickness of wire etc.
  • the distance is typically from 1 cm to 20 cm, more typically between 5 cm and 15 cm such as 10 cm +/- 2.5 cm.
  • up to 10 mm, in particular between 1 mm and 5 mm, of the web is within the field of view of the camera. Typically, this corresponds to an imaging of up to 30 wires, more typically of between 5 and 20 wires at one time.
  • the wire speed may be increased as a reaction.
  • increasing the wire speed is accompanied by reducing the table speed.
  • only the table speed is reduced without amending the wire speed at the same time.
  • the wire may be moved forward a first wire length, and the wire may subsequently be moved backward a second wire length.
  • the first wire length is slightly larger than the second wire length.
  • “Slightly” as understood in this context particularly refers to a difference of up to 10%, more typically up to 5% or only 1%.
  • the first wire length is larger than the second wire length, for instance, by between 5 m and 50 m, typically by between 5 m and 20 m, such as between 5 m and 10 m.
  • the wire saw is controlled such that the wire moves forwards and backwards in an alternating manner.
  • the wire length moving forwards is larger than the wire length moving backwards, such as by between 0.5% and 5%, more typically by between 0.5% and 3%.
  • each movement direction i.e., forwards and backwards
  • each movement direction is operated for a time interval of between 10 s and 5 min, more typically between 10 s and 1 min.
  • the time interval for the forward movement is larger than the time interval for the backward movement, such as by at least 0.5% or 1%.
  • the feature that the camera is operated in dependence of the wire speed does typically not exclude the possibility that the camera constantly takes pictures and that all of the pictures are analyzed. However, according to embodiments, only the analysis results of those pictures that were taken at a reduced wire speed or even zero speed of the wire can cause an amendment of at least one operation parameter of the wire saw.
  • the present disclosure is directed at a picture analysis system that takes pictures of a wire, typically a diamond wire or a steel wire, during the process of sawing.
  • the scales of the pictures as directed at herein are microscopic.
  • the wire is moved with a speed of up to 20 m/s in a back-and-forth movement, wherein typically each forward movement is followed by a backward movement (at least for as long as the wire is not used up or the process is altered for other reasons).

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
EP11187049.9A 2011-10-28 2011-10-28 Système de commande de scie à fil et scie à fil Not-in-force EP2586582B1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP11187049.9A EP2586582B1 (fr) 2011-10-28 2011-10-28 Système de commande de scie à fil et scie à fil
CN201110459141.6A CN103085185B (zh) 2011-10-28 2011-12-23 线锯控制系统和线锯
CN 201120560605 CN202685120U (zh) 2011-10-28 2011-12-23 线锯控制系统和线锯
JP2012237407A JP2013094959A (ja) 2011-10-28 2012-10-29 ワイヤソー制御システムおよびワイヤソー

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP11187049.9A EP2586582B1 (fr) 2011-10-28 2011-10-28 Système de commande de scie à fil et scie à fil

Publications (2)

Publication Number Publication Date
EP2586582A1 true EP2586582A1 (fr) 2013-05-01
EP2586582B1 EP2586582B1 (fr) 2017-03-01

Family

ID=47540787

Family Applications (1)

Application Number Title Priority Date Filing Date
EP11187049.9A Not-in-force EP2586582B1 (fr) 2011-10-28 2011-10-28 Système de commande de scie à fil et scie à fil

Country Status (3)

Country Link
EP (1) EP2586582B1 (fr)
JP (1) JP2013094959A (fr)
CN (2) CN103085185B (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015188859A1 (fr) * 2014-06-11 2015-12-17 APPLIED MATERIALS SWITZERLAND SàRL Système de scie à fil
FR3040318A1 (fr) * 2015-08-28 2017-03-03 Commissariat Energie Atomique Procede et dispositif de controle d'un fil de decoupe a abrasifs lies
FR3088838A1 (fr) 2018-11-28 2020-05-29 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procédé de mesure d’au moins un paramètre d’usure d’un fil de coupe, son application à un procédé de coupe ou de fabrication des fils et dispositif associé
US20220040882A1 (en) * 2018-12-17 2022-02-10 Siltronic Ag Method for producing semiconductor wafers using a wire saw, wire saw, and semiconductor wafers made of monocrystalline silicon
FR3115485A1 (fr) * 2020-10-26 2022-04-29 Commissariat à l'Energie Atomique et aux Energies Alternatives Procédé de découpe en tranches d’un bloc

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2586582B1 (fr) * 2011-10-28 2017-03-01 Toyo Advanced Technologies Co., Ltd. Système de commande de scie à fil et scie à fil
EP2815834A1 (fr) * 2013-06-21 2014-12-24 Applied Materials Switzerland Sàrl Système de surveillance de fil destiné à une scie à fil et procédé de surveillance d'une scie à fil
CN104108138B (zh) * 2014-07-09 2015-09-30 华侨大学 一种绳锯线弓角度的控制方法及控制装置
WO2018042864A1 (fr) * 2016-08-31 2018-03-08 住友電気工業株式会社 Procédé de production de substrat semi-conducteur
CN106891451A (zh) * 2017-02-22 2017-06-27 平凉中电科新能源技术有限公司 一种金刚线多线切割机断线检测方法
KR102063751B1 (ko) * 2017-05-24 2020-01-08 김판용 다이아몬드 와이어컷팅 머신
CN107263750B (zh) * 2017-08-07 2020-01-10 苏州赛万玉山智能科技有限公司 太阳能硅片的切割方法及三维结构太阳能硅片
CN110039671B (zh) * 2019-04-24 2021-01-22 宇晶机器（长沙）有限公司 一种鲁棒多线切割机走线速度控制系统
CN110000941B (zh) * 2019-04-28 2021-01-22 宇晶机器（长沙）有限公司 一种多线切割机工作台进给速度控制系统及其控制方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011070386A1 (fr) * 2009-12-11 2011-06-16 Applied Materials, Inc. Dispositif de contrôle du fil d'un appareil de sciage au fil hélicoïdal et son procédé d'utilisation

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3827675B2 (ja) * 2004-02-26 2006-09-27 株式会社ノリタケスーパーアブレーシブ 切断装置
JP4017627B2 (ja) * 2004-10-20 2007-12-05 株式会社ノリタケスーパーアブレーシブ 切断装置
US7503831B2 (en) * 2006-04-26 2009-03-17 Siemens Medical Solutions Usa, Inc. System and method for cutting soluble scintillator material
CN101596749B (zh) * 2009-06-26 2011-11-02 江苏中博钻石科技有限公司 钎焊钻石线锯的制作方法
JP5373502B2 (ja) * 2009-08-04 2013-12-18 三菱電機株式会社 マルチワイヤソーのワイヤ断線予防装置
JP2011143504A (ja) * 2010-01-14 2011-07-28 Mitsubishi Electric Corp ワイヤソー装置
EP2586582B1 (fr) * 2011-10-28 2017-03-01 Toyo Advanced Technologies Co., Ltd. Système de commande de scie à fil et scie à fil

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011070386A1 (fr) * 2009-12-11 2011-06-16 Applied Materials, Inc. Dispositif de contrôle du fil d'un appareil de sciage au fil hélicoïdal et son procédé d'utilisation

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015188859A1 (fr) * 2014-06-11 2015-12-17 APPLIED MATERIALS SWITZERLAND SàRL Système de scie à fil
FR3040318A1 (fr) * 2015-08-28 2017-03-03 Commissariat Energie Atomique Procede et dispositif de controle d'un fil de decoupe a abrasifs lies
WO2017036888A1 (fr) * 2015-08-28 2017-03-09 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procédé et dispositif de contrôle d'un fil de découpe à abrasifs liés
FR3088838A1 (fr) 2018-11-28 2020-05-29 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procédé de mesure d’au moins un paramètre d’usure d’un fil de coupe, son application à un procédé de coupe ou de fabrication des fils et dispositif associé
EP3659734A1 (fr) 2018-11-28 2020-06-03 Commissariat à l'Energie Atomique et aux Energies Alternatives Procédé de mesure d'au moins un paramètre d'usure d'un fil de coupe, son application à un procédé de coupe ou de fabrication des fils et dispositif associé
US20220040882A1 (en) * 2018-12-17 2022-02-10 Siltronic Ag Method for producing semiconductor wafers using a wire saw, wire saw, and semiconductor wafers made of monocrystalline silicon
FR3115485A1 (fr) * 2020-10-26 2022-04-29 Commissariat à l'Energie Atomique et aux Energies Alternatives Procédé de découpe en tranches d’un bloc

Also Published As

Publication number Publication date
CN202685120U (zh) 2013-01-23
CN103085185B (zh) 2016-07-06
CN103085185A (zh) 2013-05-08
JP2013094959A (ja) 2013-05-20
EP2586582B1 (fr) 2017-03-01

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