WO2015188859A1 - Système de scie à fil - Google Patents

Système de scie à fil Download PDF

Info

Publication number
WO2015188859A1
WO2015188859A1 PCT/EP2014/062140 EP2014062140W WO2015188859A1 WO 2015188859 A1 WO2015188859 A1 WO 2015188859A1 EP 2014062140 W EP2014062140 W EP 2014062140W WO 2015188859 A1 WO2015188859 A1 WO 2015188859A1
Authority
WO
WIPO (PCT)
Prior art keywords
wire
ingot
spool
cutting
embodiments described
Prior art date
Application number
PCT/EP2014/062140
Other languages
English (en)
Inventor
Andreas Schmid
John SPEYRER
Antoine Manens
Original Assignee
APPLIED MATERIALS SWITZERLAND SàRL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by APPLIED MATERIALS SWITZERLAND SàRL filed Critical APPLIED MATERIALS SWITZERLAND SàRL
Priority to PCT/EP2014/062140 priority Critical patent/WO2015188859A1/fr
Publication of WO2015188859A1 publication Critical patent/WO2015188859A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
    • B23D57/0061—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of devices for guiding or feeding saw wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work

Definitions

  • Fig. IB shows a schematic perspective view of a wire saw system according to embodiments described herein;
  • Fig. 4 shows a schematic view of a wire guide having grooves according to embodiments described herein;
  • Fig. 9 shows a schematic view of an excerpt of a wire guide and clamping assembly of a wire saw system, according to embodiments described herein;
  • Fig. 20 shows a schematic side view of an excerpt of a wire saw system including a wire monitoring system according to embodiments described herein;
  • the wire employed by the wire saw system as described herein may be suitable for cutting silicon, ceramic, compounds of the elements of groups III-V and II- VI, GGG (gadolinium gallium garnet), sapphire, etc. Further, the wire employed by the wire saw system as described herein may be suitable for cutting materials as described herein into slices of about 300 microns ( ⁇ ) or less, or for example of about 180 microns ( ⁇ ) or less, or of about 80 microns ( ⁇ ) or less in thickness.
  • the wire can be guided from the wire managements system over a plurality of pulleys 313 into the wire web compartment to form a wire web 111.
  • the wire saw system according to embodiments described herein can be used to cut ingots into wafers.
  • the wire that is used for sawing can be provided with an abrasive material.
  • the abrasive material can be provided as slurry. This may be done shortly before the wire touches the material to be cut. Accordingly, the abrasive is carried to the cutting position by the wire for cutting the material.
  • an external electrical control system is shown, i.e. an electrical control system which is located outside the housing 1111 of the wire saw system. It is apparent to a person skilled in the art that an electrical control system can also be provided at a different location in the housing of the wire saw system and corresponding control signals from and to the control system can be provided accordingly.
  • the deviation of the opening angle 460 from the nominal opening angle may be less than about 3°, particularly less than about 2°, and more particularly less than about 1°.
  • the deviation of the distance 470 from the nominal distance may be less than about 2 microns ( ⁇ ), particularly less than about 1 micron ( ⁇ ) and less than about 0.6 micron ( ⁇ ).
  • Fig. 12 illustrates a view of a connector 452 according to an embodiment.
  • a feature which can be combined with all other embodiments described herein and depicted in Fig. 12 is the outer surface 30 which includes outer surface sections 453, e.g. arc shaped sections.
  • the outer surface sections 453 may have gaps between them. Having 1, 2, 3, 4, 5, 6 or more outer surface sections 453 is contemplated.
  • the outer surface sections 300 as well as the outer surface 30 are disposed symmetrically about the axis 10, which is normal to the view provided by Fig. 12, and coincides with the center of symmetry.
  • Fig. 16 illustrates a wire guide assembly in a connected configuration, according to an embodiment, with schematically illustrated supports 127 and also illustrates an ingot 600.
  • the possible thermal expansion and contraction of the ingot 600 is represented by the arrows 135.
  • the expansion (contraction) of the wire guide and/or clamping assembly is illustrated with the lower arrow 335.
  • the wire guide 200 is contacted (directly or indirectly) by the connectors, for example the first shaft side connector 502 and/or the second shaft side connector 505.
  • the speed of the wire may be increased even more, such as by at least 20%, and/or the cutting speed may be reduced even more, such as by at least 20%.
  • a maximal bow angle such as at least 8° or at least 12 mm absolute bow length in the present example
  • the wire saw system may be halted and/or an operator may be alerted.
  • the at least one sensor arrangement 20 includes a plurality of sensors.
  • the at least one sensor arrangement 20 includes at least one of a plurality of inductive sensors, a plurality of capacitive sensors and a plurality of contact sensors.
  • a wire saw system including a wire bow monitoring system according to embodiments described herein.
  • a method for monitoring a wire bow in a wire saw system as described herein includes conducting at least one of an inductive measurement, a capacitive measurement and a contact measurement of a wire; detecting a bow of the wire,
  • the acquired measurement data can then be used for adjusting cutting process parameters. For example, when the wire has experienced a certain degree of wear resulting in a decrease of the diameter, measurement data of the wire diameter can be employed for calculation of mechanical properties of the used wire having a reduced diameter compared to a new wire. Thus, cutting process parameters can be adjusted according to the changing mechanical properties of the wire due to wear. A critical wire diameter below which breakage of the wire is likely to occur may be detected such that the used wire can be replaced by a new wire before damage occurs due to breakage of the wire.
  • the bearing box sleeves can be made of steel or other materials described herein and can be glued into the mineral casting.
  • the mineral casting frame body i.e. wherein the hybrid structure is formed, this can be conducted at high precision regarding concentricity, parallelism and/or perpendicularity.
  • the one or more heat shields can be made of water cooled/heated plates, e.g. stainless steel plates, which cover the inside of the process chamber (cutting head) or can be cast into the frame body.
  • conduits can be cast in the frame body.
  • the cutting head 1100 or the frame body 1122 can be equipped with temperature sensors:
  • the temperature sensors may, for example, be provided at various positions of the cutting head or the frame body, respectively.
  • the temperature sensor can measure the temperature at the various positions and can be connected via a controller to the temperature control shields.
  • Fig. 28 showing the frame body under a different viewing angle when compared to Fig. 27, temperature control shields 220A and 220B are shown.
  • one or more of the temperature sensor(s) can be adapted to control and stabilize the temperature of the frame body. Accordingly, overall temperature variations of the structural frame can be compensated for or reduced.
  • the temperature control and stabilization is done by varying the flow and temperature of the water to and from the temperature control shields, e.g. heat shields.
  • Embodiments of the ingot feeding system including at least one sensor for measuring force acting on the kinematic mechanism structure provide for measuring the force acting on the kinematic mechanism structure. Accordingly, information about the force transmitted to the ingot via the wire web during the cutting process can be obtained.
  • the acting on the kinematic mechanism structure, particularly on the arms can are illustrated by Fl, F2, F3 and F4 in Fig 31.
  • monitoring force acting on the ingot includes measuring the force based on a signal generated by at least one sensor or by at least one actuator.
  • the method for feeding an ingot during cutting may include monitoring a wire bow based on a signal generated by the wire bow monitoring system according to embodiments described herein.
  • Fig. 34 shows a schematic perspective view of a wire management system of a wire saw system according to embodiments described herein;
  • a plurality of pulleys are used in a wire saw system described herein.
  • the pulleys may rotate with rotation speeds of more than 1500 rpm around their respective axes.
  • the pulleys are adapted for wire saw devices by being capable of rotation speeds of 2000 rpm and more, or even 3000 rpm or more, e.g., 2000 rpm to 4000 rpm.
  • the wire saw device needs to be stopped as fast as possible.
  • the inertia of the pulleys that is the moment of inertia of the pulleys, results in the rotation of the pulleys not being able to stop immediately. This further pulley rotation may result in a harmful tension on the wire such that wire breakage may occur.
  • Fig. 37 shows an excerpt of the wire management system with a spool 250 being mounted to the spool reception arrangement 210.
  • the bearing 216 of the spool reception arrangement 210 can be seen in Fig. 37.
  • the first spool flange 260 and the second spool flange 270 of the spool 250 are also shown in Fig. 37.
  • the wire management system may include a sensor arrangement 220 adapted for measuring the operation condition of at least one of the flanges of the spool.
  • the parameters obtained by the sensors can be used to check whether the spool is in a correct operation condition.
  • the correct operation condition may depend on the shape of the spool, the distance of the flange to the spool reception, or the distance of the flanges to one another.
  • the parameters may also be used to cause an alert in the case that the parameters indicate that the spool is not in a correct operation condition.
  • the parameters may be used to calculate further operational parameters of the wire saw system, such as parameters for operating the pulley moving device, the wire guides of the wire saw, the feeding of the workpiece to be sawed and the like. For instance, the distances of the flanges may be automatically monitored and controlled and the flange distance changes due to wire weight and wire pressure may be detected so as to adjust the stroke of the pulley moving device accordingly.
  • the sensor By providing a sensor of the sensor arrangement on a moving unit, the sensor may be moved to and removed from the spool flange during operation.
  • the retractable arm carrying a sensor of the sensor arrangement may be moved to the spool flange during a slow-down phase during the operation of the wire saw. For instance, the velocity of rotation of the spool may be decreased and the sawing process is shortly suspended or postponed so that the measurement of the operating condition of the flange may be measured by moving a sensor in front of the respective spool flange. After the measurement, the moving unit may be removed or retracted from the spool flange so as not to disturb the winding and unwinding process.
  • the sensor arrangement 220 includes at least one sensor adapted for measuring the operation condition of the supply spool and at least one sensor for measuring the operation condition of the take-up spool.
  • An active adjusting action may be induced by a control device, e.g. the electrical control system 1300 of the wire saw system as described herein, which controls one or more actuators included in the tension modifier according to a measured wire tension.
  • a control device e.g. the electrical control system 1300 of the wire saw system as described herein, which controls one or more actuators included in the tension modifier according to a measured wire tension.
  • a tension modifier is provided which is configured for converting a first wire tension into a second wire tension.
  • the first wire tension may be higher than the second wire tension.
  • the first wire tension may be lower than the second wire tension.
  • the first wire tension may be, for example, the wire tension of the wire entering the tension modifier.
  • the first wire tension may be the wire tension of the wire exiting the tension modifier.
  • the tension modifier may be designed for adjusting the wire tension.
  • the wire tension may be regulated in order to compensate fluctuations of the wire tension which may occur during the sawing process, such as fluctuations due to the conversion of the wire tension. Adjusting the wire tension may include increasing or decreasing the wire tension of the wire.
  • the second guide roller 325 may be pivotable around both the axis of rotation 26 of the second guide roller 325 and the axis of rotation 45 of the first guide roller 315.
  • an actuator (not shown) may be provided for pivoting the second guide roller 325 around the axis of rotation 45 of the first guide roller 315, as indicated by the double-headed arrow 49.
  • the maximum angle of the second guide roller pivoting around the axis of rotation of the first guide roller may be +/-35 0 .
  • the wire management system may include a first sensing device 28 being arranged in the wire spool zone 390 between the tension modifier 333 and the take-up spool 138. Additionally or alternatively, a second sensing device 29 can be arranged between the pulley 133 and the tension modifier 333. The second sensing device 29 may be adapted for measuring the wire tension of the wire 11 before or upon entering the tension modifier 333. The first sensing device 28 may be adapted for measuring the wire tension of the wire 11 upon or after exiting the tension modifier 333.
  • the second guide roller 325 is pivotable around the axis of rotation 45 of the first guide roller 315.
  • the first guide roller 315 and the second guide roller 325 are connected through a connection arm 35.
  • the diameter increases constantly in a longitudinal direction of the conically shaped body from the first end 302 to the second end 303.
  • the operation of the camera may be synchronized with the movement of the wire.
  • the camera may be synchronized with the back-and-forth of the wire or with different wire speeds for specific time intervals in one direction.
  • the wire may be moved with a first speed.
  • the first speed may be the maximum speed of the wire saw.
  • the wire's speed can be reduced to a lower speed value to take a picture of the wire.
  • the lower speed may be between (including) zero and (excluding) the maximum speed.
  • the method 2000 for cutting semiconductor material may include the method for monitoring a wire bow in a wire saw system according to embodiments as describe herein.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

L'invention porte sur un système de scie à fil pour couper un matériau semi-conducteur et sur un procédé pour couper un matériau semi-conducteur en une pluralité de tranches. Le système de scie à fil (1000) a un fil (11) formant un film de fil (111) pour couper un matériau semi-conducteur. De plus, le système de scie à fil (1000) comprend une tête de coupe (1100) pour couper un lingot (600) de matériau semi-conducteur ; un système de gestion de fil (1200) configuré pour délivrer le fil (11) vers le film de fil (111) et pour recevoir le fil (11) à partir du film de fil (111) ; un système de commande électrique (1300) pour commander le système de scie à fil (1000) ; et un système de refroidissement (1500) configuré pour refroidir un agent de refroidissement du système d'agent de refroidissement (1400), le système d'agent de refroidissement (1400) étant configuré pour refroidir des parties du système de scie à fil.
PCT/EP2014/062140 2014-06-11 2014-06-11 Système de scie à fil WO2015188859A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/EP2014/062140 WO2015188859A1 (fr) 2014-06-11 2014-06-11 Système de scie à fil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2014/062140 WO2015188859A1 (fr) 2014-06-11 2014-06-11 Système de scie à fil

Publications (1)

Publication Number Publication Date
WO2015188859A1 true WO2015188859A1 (fr) 2015-12-17

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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106914661A (zh) * 2017-04-20 2017-07-04 广西科技大学鹿山学院 便携式电热线切割机
CN107310058A (zh) * 2017-08-25 2017-11-03 盘梓华 一种环形金刚石线排锯
WO2018012313A1 (fr) * 2016-07-13 2018-01-18 信越半導体株式会社 Dispositif de scie à fil et procédé de découpe de pièce de fabrication
DE102018221922A1 (de) 2018-12-17 2020-06-18 Siltronic Ag Verfahren zur Herstellung von Halbleiterscheiben mittels einer Drahtsäge, Drahtsäge und Halbleiterscheibe aus einkristallinem Silizium
CN112549331A (zh) * 2019-09-10 2021-03-26 苏州阿特斯阳光电力科技有限公司 方硅锭及其制备方法、硅片及其制备方法
EP3858569A1 (fr) * 2020-01-28 2021-08-04 Siltronic AG Procédé de séparation d'une pluralité de disques à partir de pièces au moyen d'une scie à fil lors d'une séquence de processus de séparation
WO2023116608A1 (fr) * 2021-12-23 2023-06-29 青岛高测科技股份有限公司 Machine à trancher à double station
TWI815767B (zh) * 2022-11-08 2023-09-11 大陸商西安奕斯偉材料科技股份有限公司 對轉軸的線槽中的污染顆粒進行檢查的系統和方法
DE102016224640B4 (de) 2016-12-09 2024-03-28 Siltronic Ag Verfahren zum Zersägen eines Werkstückes mit einer Drahtsäge
CN115023328B (zh) * 2020-01-28 2024-05-28 硅电子股份公司 用于在一系列分离工艺期间通过线锯从工件分离多个晶片的方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2586554A1 (fr) * 2011-10-27 2013-05-01 Applied Materials Switzerland Sàrl Dispositif de scie à fil avec deux grilles de fils indépendantes et son procédé de fonctionnement
EP2586582A1 (fr) * 2011-10-28 2013-05-01 Applied Materials Switzerland Sàrl Système de commande de scie à fil et scie à fil
EP2647458A1 (fr) * 2012-04-04 2013-10-09 Applied Materials Switzerland Sàrl Fil pour scie à fil à semi-conducteur et scie à fil
EP2708342A1 (fr) * 2012-09-14 2014-03-19 Applied Materials Switzerland Sàrl Système de surveillance de cintrage de fils pour une scie à fil

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2586554A1 (fr) * 2011-10-27 2013-05-01 Applied Materials Switzerland Sàrl Dispositif de scie à fil avec deux grilles de fils indépendantes et son procédé de fonctionnement
EP2586582A1 (fr) * 2011-10-28 2013-05-01 Applied Materials Switzerland Sàrl Système de commande de scie à fil et scie à fil
EP2647458A1 (fr) * 2012-04-04 2013-10-09 Applied Materials Switzerland Sàrl Fil pour scie à fil à semi-conducteur et scie à fil
EP2708342A1 (fr) * 2012-09-14 2014-03-19 Applied Materials Switzerland Sàrl Système de surveillance de cintrage de fils pour une scie à fil

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018012313A1 (fr) * 2016-07-13 2018-01-18 信越半導体株式会社 Dispositif de scie à fil et procédé de découpe de pièce de fabrication
DE102016224640B4 (de) 2016-12-09 2024-03-28 Siltronic Ag Verfahren zum Zersägen eines Werkstückes mit einer Drahtsäge
CN106914661A (zh) * 2017-04-20 2017-07-04 广西科技大学鹿山学院 便携式电热线切割机
CN107310058A (zh) * 2017-08-25 2017-11-03 盘梓华 一种环形金刚石线排锯
EP4300542A2 (fr) 2018-12-17 2024-01-03 Siltronic AG Procédé de fabrication de tranches de semi-conducteur au moyen d'une scie à fil, scie à fil et tranche de semi-conducteur en silicium monocristallin
DE102018221922A1 (de) 2018-12-17 2020-06-18 Siltronic Ag Verfahren zur Herstellung von Halbleiterscheiben mittels einer Drahtsäge, Drahtsäge und Halbleiterscheibe aus einkristallinem Silizium
WO2020126787A2 (fr) 2018-12-17 2020-06-25 Siltronic Ag Procédé de fabrication de tranches de semi-conducteur au moyen d'une scie à fil, scie à fil et tranche de semi-conducteur en silicium monocristallin
CN112549331A (zh) * 2019-09-10 2021-03-26 苏州阿特斯阳光电力科技有限公司 方硅锭及其制备方法、硅片及其制备方法
CN112549331B (zh) * 2019-09-10 2024-03-15 苏州阿特斯阳光电力科技有限公司 方硅锭及其制备方法、硅片及其制备方法
EP3858569A1 (fr) * 2020-01-28 2021-08-04 Siltronic AG Procédé de séparation d'une pluralité de disques à partir de pièces au moyen d'une scie à fil lors d'une séquence de processus de séparation
CN115023328A (zh) * 2020-01-28 2022-09-06 硅电子股份公司 用于在一系列分离工艺期间通过线锯从工件分离多个晶片的方法
WO2021151695A1 (fr) * 2020-01-28 2021-08-05 Siltronic Ag Procédé de séparation de plusieurs tranches de pièces au moyen d'un appareil de sciage à fil hélicoïdal pendant une séquence de processus de séparation
CN115023328B (zh) * 2020-01-28 2024-05-28 硅电子股份公司 用于在一系列分离工艺期间通过线锯从工件分离多个晶片的方法
WO2023116608A1 (fr) * 2021-12-23 2023-06-29 青岛高测科技股份有限公司 Machine à trancher à double station
TWI815767B (zh) * 2022-11-08 2023-09-11 大陸商西安奕斯偉材料科技股份有限公司 對轉軸的線槽中的污染顆粒進行檢查的系統和方法

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