EP2557571A1 - Hybride métallique/plastique électriquement conducteur comportant un matériau polymère, premier métal et particules métalliques d'un second métal intégré dans le premier métal et son procédé de production - Google Patents

Hybride métallique/plastique électriquement conducteur comportant un matériau polymère, premier métal et particules métalliques d'un second métal intégré dans le premier métal et son procédé de production Download PDF

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Publication number
EP2557571A1
EP2557571A1 EP11176866A EP11176866A EP2557571A1 EP 2557571 A1 EP2557571 A1 EP 2557571A1 EP 11176866 A EP11176866 A EP 11176866A EP 11176866 A EP11176866 A EP 11176866A EP 2557571 A1 EP2557571 A1 EP 2557571A1
Authority
EP
European Patent Office
Prior art keywords
metal
plastic hybrid
metal particles
aluminium
electrically conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP11176866A
Other languages
German (de)
English (en)
Other versions
EP2557571B1 (fr
Inventor
Helge Schmidt
Dominique Freckmann
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Germany GmbH
TE Connectivity Corp
Original Assignee
Tyco Electronics AMP GmbH
Tyco Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to EP11176866.9A priority Critical patent/EP2557571B1/fr
Application filed by Tyco Electronics AMP GmbH, Tyco Electronics Corp filed Critical Tyco Electronics AMP GmbH
Priority to BR112014002914-8A priority patent/BR112014002914B1/pt
Priority to CN201280038318.8A priority patent/CN103718254B/zh
Priority to JP2014524353A priority patent/JP2014527693A/ja
Priority to CA2844277A priority patent/CA2844277C/fr
Priority to PCT/EP2012/065328 priority patent/WO2013020946A1/fr
Priority to KR1020147006233A priority patent/KR101949319B1/ko
Publication of EP2557571A1 publication Critical patent/EP2557571A1/fr
Application granted granted Critical
Publication of EP2557571B1 publication Critical patent/EP2557571B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Definitions

  • the invention relates to an electrically conductive metal/plastic hybrid which comprises a matrix of a polymer material, a network embedded in the matrix and made of a metal, the metal having a first melting temperature, and metal particles within the network having a second melting temperature, the second melting temperature being higher than the first melting temperature. Further, the invention relates to a method of producing such a metal/plastic hybrid.
  • Metal/plastic hybrids of the afore-mentioned type are known from the prior art, but in order to achieve high electric conductivity, contain high percentages of the higher melting metal particles. As these higher melting metals are usually very dense, the entire metal/plastic hybrid is very dense too. Further, the metals used for the higher melting metal particles can be expensive, which increases the price for the metal/plastic hybrid. Additionally, these metals generally have a high heat capacity, which makes the resulting metal/plastic hybrid difficult to process, in particular in a molding process.
  • the object of the invention is to provide a metal/plastic hybrid which exhibits a lower density.
  • a further object of the invention is to provide a metal/plastic hybrid that is cheaper.
  • An even further object of the invention is to provide a metal/plastic hybrid that is easy to process, in particular in a molding process.
  • the object is achieved by using metal particles that contain aluminium as the higher melting metal particles.
  • the density of the resulting metal/plastic hybrid can be reduced considerably. Additionally, aluminium is usually cheaper than the metals often used for the metal particles, like for example copper, nickel, iron or silver. Furthermore, as aluminium has a low heat capacity, metal/plastic hybrids containing aluminium are easy to process and finer structures can be produced due to the lower volumetric heat capacity of the resulting metal/plastic hybrid. In particular, two-step processes can be conducted more easily, as negative effects of heat can be minimised. Especially if delicate and small structures are supposed to be created, the lower heat capacity can enable better results.
  • aluminium and compounds containing aluminium are less toxic than the materials generally employed in metal/plastic hybrids, a health and environmental benefit can result.
  • the metal particles contain primarily aluminium, that means, aluminium is the main component.
  • the metal particles consist only of aluminium and unavoidable impurities.
  • the percentage of impurities is preferably less than 3%, more preferably less than 1 % of the weight.
  • the metal particles containing aluminium can be coated with a second metal.
  • the coating of the metal particles takes place before the particles are mixed into the low melting metal.
  • Such a coating can help to make better contact between the metal particles and the low melting metal, e.g. by reducing or removing oxide layers, which might be present on the outside of the metal particles.
  • the coating can contain metals that can also be found in the low melting metal.
  • the coating of the metal particles contains only one element and the low melting metal is a mixture of this element and other elements.
  • the coating of the metal particles containing aluminium can be achieved with several methods. Preferentially, the metal particles are coated with a chemical method, for example by galvanizing. However, other methods of coating, for example Physical Vapour Deposition (PVD), Atomic Layer Deposition (ALD) or sputtering, can also be used.
  • PVD Physical Vapour Deposition
  • ALD Atomic Layer Deposition
  • sputtering can also be used.
  • the coating for the metal particles containing aluminium can be zinc.
  • Zinc is a common coating material for many metals, in particular for aluminium. Therefore, several processes for generating such a zinc coating are widely known and corresponding substances or devices are easily available. Furthermore, a pool of knowledge, e.g. process parameters for achieving certain thicknesses, is already available.
  • Such a coating can for example be achieved by wet chemical methods or by physical methods. As aluminium and zinc tend to form mixed crystals, an intimate connection between the two, and a good sticking of the zinc to the metal particle containing aluminium can be obtained.
  • tin is used as a coating material for the metal particles. Aluminium and tin do not mix in the solid phase, so diffusion of the coating metal into the aluminium particle can be avoided by using tin. Tin is often employed as a component of the low melting metal. Hence, using tin as a coating material can help to make a good contact between the particles and the low melting metal.
  • the tin coating can be applied by several methods, for example chemically or physically.
  • the metal particles containing aluminium can contain two or even more coating layers.
  • the metal particles containing aluminium can be coated with zinc in a first step, and with tin in a second step. Due to the intermixing of aluminium and zinc in the solid phase, the zinc will stick easily to the aluminium particles. As zinc and tin can form a eutectic system, further processing of such particles at temperatures as low as about 200°C can be made possible. Due to the low temperature, the production of the metal/plastic hybrid is further facilitated, in particular if tin is used as a component of the low melting metal. Furthermore, tin will not diffuse into the aluminium particles.
  • the metal particles are coated with tin in a first step and with zinc in a second step.
  • the metal/plastic hybrid is processed at a higher temperature, such a combination can be advantageous.
  • using zinc as the second layer helps to make good contact between the metal particle and the low melting metal.
  • solders e.g. tin
  • a coating material By using a material that is employed in solders, e.g. tin, as a coating material, it is facilitated that contact is made, for example by soldering, to this metal/plastic hybrid, as the additional solder for contacting will readily make contact with the coating material.
  • a coating layer of the metal particles contains the low melting metal. If enough of the low melting metal is applied onto the metal particles, the step of adding further low melting metal in another step can be avoided and the metal particles can be mixed with the polymer material directly.
  • copper can be used as a first or additional coating material for the metal particles containing aluminium.
  • a deposition by physical methods is preferred in this case.
  • the polymer material can be a thermoplastic and the first metal can melt in the range of 100°C to 400°C.
  • the addition of flux to the metal/plastic hybrid can help to make good contact between the metal particles containing aluminium and the low melting metal, as such a flux can remove oxide layers which might be present on the metal particles containing aluminium and can additionally improve the flowing properties of the low melting metal in the liquid phase.
  • Shaped bodies especially electric or electronic elements, comprising at least in part the metal/plastic hybrid according to the invention, can be used for a big range of applications.
  • they can be used in electric circuits, as electric or electromagnetic shieldings, as moldable plugs, housings, radio frequency (RF) connectors or antennas.
  • RF radio frequency
  • a metal/plastic hybrid 1 according to the invention is depicted in a sectional view.
  • Metal particles 2 according to the invention are formed as metal particles containing aluminium 3, which are embedded in a low melting metal 4.
  • the metal particles 2 can have a basically spherical shape. However, they can have any other shape, in particular, they might be filaments, cubes, flakes, rods, coins or the like.
  • the metal particles 2 together with the low melting metal 4 form an electrically conductive phase and can form an electrically conductive network within the metal/plastic hybrid 1, such that the entire metal/plastic hybrid 1 is electrically conductive.
  • metals are defined by being electrically conductive.
  • a metal can be elementary, an alloy, a compound or a mixture with metal.
  • the metal/plastic hybrid 1 can also comprise a polymer material 5 which can comprise one or more plastic materials, which can be plastically deformable at elevated temperatures, for instance thermoplastics or resins.
  • the metal particles 2 contain aluminium, in particular aluminium can be the main or the only component. However, other elements may also be present in the metal particles.
  • aluminium as one of the components of the metal particles 2, the density of the metal particles 2 can be lowered.
  • a further advantage of aluminium is, that it is usually cheaper than other metals employed for producing metal/plastic hybrids, like for example copper, nickel, iron or silver.
  • aluminium has a low heat capacity, which can help to facilitate the production of parts that comprise such a metal/plastic hybrid 1.
  • using a metal/plastic hybrid 1 according to the invention can help to make manufacturing this part easier, with less effort and time, thus saving money and additionally saving energy, as less energy is required to heat the metal/plastic hybrid 1 according to the invention.
  • very fine structures can be produced with the metal/plastic hybrid according to the invention due to its low heat capacity.
  • processes in which a second part can be affected negatively by heat or temperature, or in which using a lower temperature or less heat is advantageous can be carried out more efficiently, with less discard, faster and with less energy.
  • the metal/plastic hybrid 1 might also contain flux.
  • Flux can help to remove oxide layers which can be on the aluminium particles and which can make it difficult or impossible to establish a connection between the metal particles 2 and the low melting metal 4.
  • such a flux can give a higher viscosity of the low melting metal 4, which further improves the interconnection between the metal particles 2 and the low melting metal 4.
  • the sizes of the metal particles 2 can in a preferential embodiment be smaller than 200 ⁇ m. In case very fine structures are supposed to be manufactured, the size of the metal particles 2 can be lowered further. However, if for example a higher volume to surface ratio is desired, the size of the particles containing aluminium 3 can be increased. For more efficient packing and therefore a higher loading of metal particles and/or easier processing, also mixtures of various particle sizes, e.g. fine and coarse, can be used.
  • the metal particles containing aluminium 3 are not covered by a coating layer 6 around the particle in their final state in the metal/plastic hybrid 1, it can be advantageous to coat the metal particles containing aluminium 3 during the process of manufacturing.
  • the metal particles containing aluminium 3, which might exhibit oxide layers on the outside can be coated with tin.
  • Such a coating can for instance be achieved with wet chemical methods like galvanization or by physical methods like Physical Vapour Deposition (PVD).
  • PVD Physical Vapour Deposition
  • the coating layer 6 of tin can intermix with the tin in the low melting metal 4.
  • Such a coating step can help to make a better contact between the metal particles comprising aluminium 3 and the low melting metal 4.
  • one of the coating layers 6 contains the low melting metal 4, preferably in large quantities.
  • the addition of low melting metal 4 or the intermixing of the metal particles 2 with the low melting metal 4 can be avoided, as the coating layer 6 provides enough low melting metal 4.
  • these coated particles can be blended with or into the polymer material, skipping one step in the manufacturing process.
  • the metal/plastic hybrid 1 according to the invention comprises metal particles which contain aluminium 3 with an additional coating layer 6 located on the interface between the metal particles containing aluminium 3 and the low melting metal 4. Furthermore, a polymer material 5, for example a thermoplastic material or a resin, can be seen.
  • the preferred size range of the metal particles containing aluminium 3 is below 200 ⁇ m.
  • the ratio of the coating material to the material of the metal particle containing aluminium 3 can be varied.
  • aluminium is the main component of the metal particles, further reducing the density of the metal particles.
  • aluminium is the only component in the metal particles 2.
  • Such simple particles can easily be manufactured or be purchased readily, which reduces manufacturing time and costs.
  • the metal particles containing aluminium 3 have a coating layer 6 containing zinc.
  • a zinc coating can be achieved by several methods, for example by wet chemical methods like galvanization or by physical methods. Such methods are already known and widely used so that a wide knowledge of these processes exists and substances for this process are easily available. As aluminium and zinc can easily intermix by forming mixed crystals, a tight and intimate contact between the aluminium in the metal particle and the coating layer 6 is generated.
  • tin is a component of the low melting metal, which makes using zinc as a coating layer 6 even more advantageous, as zinc and tin can form a eutectic system with a melting point as low as about 200°C.
  • a low melting point helps to minimize the energy used for the production process of the metal/plastic hybrid 1. Furthermore, manufacturing time and effort is also decreased by such a low melting point.
  • tin is used as a coating layer 6 for the metal particles containing aluminium 3.
  • aluminium and tin do not intermix in the solid phase, a diffusion of the tin into the aluminium of the metal particle containing aluminium 3 over time is avoided.
  • constant properties of the metal/plastic hybrid 1 during the lifetime of a part manufactured from this metal/plastic hybrid 1 can be expected.
  • tin is used as a component of the low melting metal 4 in many cases, an easy contacting of the metal particles containing the aluminium 3 to the low melting metal can be facilitated.
  • the coating of the metal particles containing aluminium 3 with tin can be accomplished with a variety of methods such as chemical methods or physical methods.
  • the metal particles containing aluminium 3 can be coated with more than one coating layer 6.
  • the first coating layer might be zinc, which forms mixed crystals with the aluminium and thus a good contact to the other components is established.
  • a second layer might be made from tin, which can form a eutectic system with zinc, having a low melting point and giving a good connection of the zinc to the tin layer.
  • tin is often used as a component of the low melting metal 4
  • tin is often used as a component of the low melting metal 4
  • tin is often used as a component of the low melting metal 4
  • tin is often used as a component of the low melting metal 4
  • tin is often used as a component of the low melting metal 4
  • tin is often used as a component of the low melting metal 4
  • tin is often used as a component of the low melting metal 4
  • tin is often used as a component of the low melting metal 4
  • tin is also provided by using
  • Copper can also be used as a coating layer 6. If copper is used as a coating material, a physical coating process like Physical Vapour Deposition (PVD) might be preferred, as applying copper by chemical methods like wet chemical methods could be difficult.
  • PVD Physical Vapour Deposition
  • Parts or shaped bodies manufactured from or comprising at least partially a metal/plastic hybrid 1 according to the invention could be used in a variety of applications. Due to the electric conductivity of such a metal/plastic hybrid 1 it can easily be used in electric circuits, in particular if electric circuits or electric parts are supposed to be manufactured by methods that include plastic forming, especially at elevated temperatures, of these electric circuits or parts. Further, this method is very advantageous in 2-step-processes like a 2K or 2-shot molding process, as the metal/plastic hybrid 1 according to the invention has a low heat capacity, which allows for faster and more efficient processing with less energy and more precision. Parts made from this metal/plastic hybrid 1 could also be used as shieldings for electric or electromagnetic fields. Another exemplary application of a part made from such a metal/plastic hybrid 1 could be a plug molded onto a conductive element of an electric circuit, a radio frequency (RF) connector, an antenna or a casing.
  • RF radio frequency

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Laminated Bodies (AREA)
EP11176866.9A 2011-08-08 2011-08-08 Hybride métallique/plastique électriquement conducteur comportant un matériau polymère, premier métal et particules métalliques d'un second métal intégré dans le premier métal et son procédé de production Active EP2557571B1 (fr)

Priority Applications (7)

Application Number Priority Date Filing Date Title
EP11176866.9A EP2557571B1 (fr) 2011-08-08 2011-08-08 Hybride métallique/plastique électriquement conducteur comportant un matériau polymère, premier métal et particules métalliques d'un second métal intégré dans le premier métal et son procédé de production
CN201280038318.8A CN103718254B (zh) 2011-08-08 2012-08-06 包括聚合物材料、第一金属和嵌入于第一金属的第二金属的金属微粒的导电金属/塑料杂合物及其制造方法
JP2014524353A JP2014527693A (ja) 2011-08-08 2012-08-06 ポリマー材料、第１金属、及び第１金属に埋め込まれた第２金属粒子を含む導電性金属／プラスチック混成物、及びその製造方法
CA2844277A CA2844277C (fr) 2011-08-08 2012-08-06 Hybride metal/plastique electriquement conducteur comprenant un materiau polymere, un premier metal et des particules metalliques d'un deuxieme metal incorporees dans le premier metal, et procede pour le produire
BR112014002914-8A BR112014002914B1 (pt) 2011-08-08 2012-08-06 Híbrido metálico/plástico eletricamente condutor, seu método de produção, e elemento elétrico ou eletrônico
PCT/EP2012/065328 WO2013020946A1 (fr) 2011-08-08 2012-08-06 Hybride métal/plastique électriquement conducteur comprenant un matériau polymère, un premier métal et des particules métalliques d'un deuxième métal incorporées dans le premier métal, et procédé pour le produire
KR1020147006233A KR101949319B1 (ko) 2011-08-08 2012-08-06 폴리머 재료, 제 1 금속 및 제 1 금속 내에 매립되는 제 2 금속의 금속 입자들을 포함하는 전기 전도성 금속/플라스틱 하이브리드 및 그 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP11176866.9A EP2557571B1 (fr) 2011-08-08 2011-08-08 Hybride métallique/plastique électriquement conducteur comportant un matériau polymère, premier métal et particules métalliques d'un second métal intégré dans le premier métal et son procédé de production

Publications (2)

Publication Number Publication Date
EP2557571A1 true EP2557571A1 (fr) 2013-02-13
EP2557571B1 EP2557571B1 (fr) 2014-07-02

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EP11176866.9A Active EP2557571B1 (fr) 2011-08-08 2011-08-08 Hybride métallique/plastique électriquement conducteur comportant un matériau polymère, premier métal et particules métalliques d'un second métal intégré dans le premier métal et son procédé de production

Country Status (7)

Country Link
EP (1) EP2557571B1 (fr)
JP (1) JP2014527693A (fr)
KR (1) KR101949319B1 (fr)
CN (1) CN103718254B (fr)
BR (1) BR112014002914B1 (fr)
CA (1) CA2844277C (fr)
WO (1) WO2013020946A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105274557A (zh) * 2015-11-12 2016-01-27 厦门理工学院 一种电极及其制备方法
CN113453822B (zh) * 2019-03-18 2023-09-26 惠普发展公司，有限责任合伙企业 三维金属对象成型
WO2020190274A1 (fr) * 2019-03-18 2020-09-24 Hewlett-Packard Development Company, L.P. Commande de déformation d'objet de corps cru
EP3911464A4 (fr) 2019-03-18 2022-11-02 Hewlett-Packard Development Company, L.P. Formation d'objet tridimensionnel

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998008362A1 (fr) * 1996-08-16 1998-02-26 Craig Hugh P Compositions d'impression et leur application sur des surfaces dielectriques utilisees dans la fabrication de cartes de circuits imprimes
US20070012900A1 (en) * 2005-07-12 2007-01-18 Sulzer Metco (Canada) Inc. Enhanced performance conductive filler and conductive polymers made therefrom

Family Cites Families (4)

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Publication number Priority date Publication date Assignee Title
TW340132B (en) * 1994-10-20 1998-09-11 Ibm Structure for use as an electrical interconnection means and process for preparing the same
TW396471B (en) * 1997-06-04 2000-07-01 Ibm Electrodeposition of low temperature, high conductivity, powder materials for electrically conductive paste formulations
WO2009110095A1 (fr) * 2008-03-07 2009-09-11 富士通株式会社 Matériau conducteur, pâte conductrice, carte de circuit imprimé et dispositif à semi-conducteur
KR101138519B1 (ko) * 2009-09-30 2012-04-25 삼성전기주식회사 도전성 페이스트 및 이를 이용한 인쇄회로기판의 제조방법

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998008362A1 (fr) * 1996-08-16 1998-02-26 Craig Hugh P Compositions d'impression et leur application sur des surfaces dielectriques utilisees dans la fabrication de cartes de circuits imprimes
US20070012900A1 (en) * 2005-07-12 2007-01-18 Sulzer Metco (Canada) Inc. Enhanced performance conductive filler and conductive polymers made therefrom

Also Published As

Publication number Publication date
JP2014527693A (ja) 2014-10-16
WO2013020946A1 (fr) 2013-02-14
CA2844277A1 (fr) 2013-02-14
CA2844277C (fr) 2019-07-09
CN103718254A (zh) 2014-04-09
BR112014002914B1 (pt) 2020-08-04
KR20140102175A (ko) 2014-08-21
BR112014002914A2 (pt) 2017-03-01
CN103718254B (zh) 2017-03-29
KR101949319B1 (ko) 2019-02-18
EP2557571B1 (fr) 2014-07-02

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