EP2527807B1 - Sonde de température pour un thermomètre à contact - Google Patents
Sonde de température pour un thermomètre à contact Download PDFInfo
- Publication number
- EP2527807B1 EP2527807B1 EP12002929.3A EP12002929A EP2527807B1 EP 2527807 B1 EP2527807 B1 EP 2527807B1 EP 12002929 A EP12002929 A EP 12002929A EP 2527807 B1 EP2527807 B1 EP 2527807B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- circuit board
- printed circuit
- contact
- connection
- sensor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 claims description 12
- 230000001419 dependent effect Effects 0.000 claims description 5
- 238000005516 engineering process Methods 0.000 claims description 3
- 238000005259 measurement Methods 0.000 claims 1
- 238000005253 cladding Methods 0.000 description 24
- 239000004020 conductor Substances 0.000 description 13
- 239000000463 material Substances 0.000 description 9
- 239000000919 ceramic Substances 0.000 description 7
- 229910052500 inorganic mineral Inorganic materials 0.000 description 6
- 239000011707 mineral Substances 0.000 description 6
- 238000010276 construction Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- KTXUOWUHFLBZPW-UHFFFAOYSA-N 1-chloro-3-(3-chlorophenyl)benzene Chemical compound ClC1=CC=CC(C=2C=C(Cl)C=CC=2)=C1 KTXUOWUHFLBZPW-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005352 clarification Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000007730 finishing process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/08—Protective devices, e.g. casings
Definitions
- the invention relates to a temperature sensor for a contact thermometer of process measuring technology with a cladding tube, with at least one disposed in the process end of the cladding tube thermal sensor element and at least one electrical connection means, wherein the electrical connection means is connected to a first connection side with the thermal sensor element and in the Cladding tube extends at least up to the ausense matteren end of the cladding tube, so that the thermal sensor element via a second connection side of the electrical connection means is electrically contacted.
- thermometers are thus seen in contrast to those thermometers which detect only the heat radiation emanating from a medium.
- the cladding tube of the temperature sensor surrounds the thermal sensor element, wherein the thermal sensor element is usually arranged in the vicinity of a closed end of the cladding tube.
- the thermal sensor element is often fixed in the cladding tube with a heat-conducting medium, such as a thermally conductive paste or a good heat-conducting adhesive.
- the cladding tube is therefore closed at its process end and shields the thermal sensor element against the process.
- a generic temperature sensor is also used as an insert in another protective tube, wherein the protective tube then protrudes into the process and permanently shields the process towards the environment.
- the temperature sensor is then inserted with its cladding tube in the additional protective tube.
- the other, end-side end of the cladding tube usually ends in a housing, where an evaluation or further processing of the measuring signal takes place.
- the thermal sensor element is usually a temperature-dependent resistor or a thermocouple which is electrically contactable from outside the cladding tube via the electrical connection means.
- the case may be a compact, modular Structure around a contact head act, in which an electrical connection between the outside world and the sensor element is made indirectly via the electrical connection means.
- the contact head can also have a transmitter which has the task of converting a signal originating from the sensor element into a standardized signal, filtering the signal and linearizing it and providing it to higher-level process monitoring.
- the electrical connection means usually implements at least two electrically conductive paths between the thermal sensor element and the terminals located outside the cladding tube.
- the thermal sensor element as a temperature-dependent resistor of the thermal resistance is applied to a voltage or a current and determined according to the resulting current or the resulting voltage and closed on the resulting resistance value to the temperature.
- changing line resistances can not be compensated, for which reason implementations in which the electrical connection means has three or even four electrical lines as reference resistors are often preferred.
- Temperature sensors known from the prior art often have a mineral insulation of the electrical connection means in the cladding tube.
- the electrical connection means are stored for example in a mineral or ceramic powder and the temperature sensor must be subjected to heat after installation of the thermal sensor element, so that the mineral or ceramic powder dries and solidifies.
- Object of the present invention is to provide a temperature sensor, which has a simple and inexpensive construction, so that the temperature sensor is also used in mass applications, especially in those applications that are in a relatively low temperature range, for example up to 300 ° C.
- the temperature sensor according to the invention in which the previously derived and indicated object is achieved, is initially and essentially characterized in that the electrical connection means by a printed circuit board - connecting circuit board with conductor tracks - is formed.
- the term "interconnect board” will hereafter be used for the board or circuit board portion used to implement the electrical interconnect, the term “interconnect board” is used to more precisely specify the more general term “board” and therefore for clarity.
- the inventive use of a printed circuit board as an electrical connection means in place of the known from the prior art realization of electrical connection means brings the advantage of a considerably simplified assembly with it, which is also automated, with printed circuit boards per se, even if they have to meet special temperature requirements , are relatively inexpensive to known implementations.
- connection board must be made of such a material that is temperature resistant in the particular application.
- all known printed circuit boards are suitable for realizing the temperature sensor according to the invention.
- printed circuit boards based on phenolic or epoxy resin and printed circuit boards are also possible, which are based on the use of Teflon or ceramic.
- the realization of the electrical connection means with a connection board is advantageous because printed circuit boards can be produced in virtually any form in a simple manner and electrical lines in any manner on such a circuit board - on one side, double-sided or in an intermediate layer of the circuit board - can be realized.
- the thermal sensor element is arranged on the connection circuit board, in particular as a temperature-dependent resistor on the connection circuit board is realized and there electrically connected to conductor tracks, in particular soldered.
- connection side of the electrical connection means is connected to a contact means formed on a printed circuit board-contact printed circuit board.
- contact printed circuit board is again used to clarify the specification of the printed circuit board or the printed circuit board area on which the aforementioned contact means is provided, the term also serves for clarification.
- This development of the invention is of considerable importance.
- Contact means known from the prior art are usually realized by a very elaborately designed ceramic head, which usually has screw connections in order to be able to contact the sensor element externally via the electrical connection means. These ceramic heads can only be used for external contacting, but they can also be used for signal matching if they are designed as transmitters.
- the temperature sensor according to the invention dispenses with such a complex structure and replaces it with a simple contact printed circuit board, on which a contact means is provided, wherein with the contact means preferably a screw, a plug connection or an insulation displacement connection to an external conductor can be produced, which also by the use of Standard contact means for mounting printed circuit boards is possible.
- This embodiment of the invention overcomes the decades prevailing notion that all elements of a temperature sensor must meet maximum requirements.
- connection circuit board and the contact circuit board are designed as separate circuit boards.
- This has the advantage that different printed circuit board materials can be used for the connecting printed circuit board and the contact printed circuit board.
- This configuration makes it possible to use a printed circuit board material with increased temperature stability for the connecting printed circuit board, that is to say the printed circuit board exposed at least partially to the medium temperature, for example a printed circuit board material suitable for temperatures greater than 300 ° C., in particular of polyimides.
- the contact printed circuit board consists of a printed circuit board material which is long-term stable at lower temperatures, in particular at temperatures less than 300 ° C., in particular less than 250 ° C., preferably also less than 230 ° C.
- the contact circuit board is provided at the end remote from the process of the temperature sensor and therefore only has to meet significantly lower requirements in terms of temperature stability.
- the advantage is that significantly cheaper circuit board materials can be used than is the case for increased temperature requirements. This further makes it possible to reduce the cost of the temperature sensor according to the invention.
- the connecting printed circuit board has at its edges extending parallel to the cladding tube, which effect a positioning of the connecting printed circuit board in the middle in the cladding tube.
- the widths minimize the contact area between the connecting printed circuit board and the cladding tube, which simplifies the insertion of the connecting printed circuit board into the cladding tube.
- an electrical arrangement is realized on the connecting circuit board, in particular an electrical arrangement for detecting a leakage of the cladding tube, which at Realizations in the art is possible only with considerable effort.
- Such an electrical arrangement may in the simplest case, for example, consist only of opposing contact surfaces, wherein for leakage detection, the impedance between the contact surfaces is evaluated.
- an electrical circuit in particular a transmitter electronics, is realized directly on the connection circuit board and / or the contact circuit board, preferably on the contact circuit board. Due to the circuit board construction, this is possible in a very simple and cost-effective manner, since no separate circuit carrier is required for the circuit. In addition, space is saved in the above-described implementation of such circuits over the at least in temperature sensors conventional implementations, which allows lean constructions.
- Fig. 1 a known from the prior art temperature sensor 1, which is intended for contact thermometers of process instrumentation.
- the temperature sensor 1 has a cladding tube 2, in whose process-side end 3 a thermal sensor element is arranged, which in Fig. 1 not shown in the Fig. 4 and 6 is provided with reference numeral 4.
- the temperature sensor 1 further has as electrical connection means 5 electrical lines, said electrical connection means 5 - as in the inventive variant in the Fig. 2 to 4 and 6 to recognize - is connected to a first connection side 6 with the thermal sensor element 4.
- the electrical connection means 5 then runs in the cladding tube 2 as far as the end 7 of the cladding tube 2, so that the thermal sensor element 4 is in principle electrically contactable via a second connection side 8 of the electrical connection means 5 Fig. 1 can be seen, consists of the electrical connection means 5 in the prior art of a plurality of electrical conductors, in this case of three conductors, two of these conductors are connected to a terminal of the thermal sensor element and another conductor is connected to the second end of the thermal sensor element ,
- the electrical connection means 5 in the form of the lines is provided with a mineral insulation located in the cladding tube 2, which is problematical in particular when establishing an electrical connection between the sensor element and the electrical connection means 5, requires a heat treatment and is expensive.
- connection means 5 is formed by a printed circuit board with conductor tracks 9, wherein this, the connecting means 5 forming circuit board, hereinafter referred to as a connection circuit board 10.
- the connection board 10 has on each side in each case two conductor tracks 9, which is a contact of the sensor element 4 via the second connection side 8 - that is, the connection side, which is located in the vicinity of the evaluation end 7 of the cladding tube 2 - electrically contacted.
- the thermal sensor element 4 can be arranged and arranged directly on the connecting circuit board 10, wherein in the present case the thermal sensor element 4 is realized as a temperature-dependent resistor of the PT100 type.
- the contact means 12 realized in screwing. Screw connections are also known in the art, to which reference is again made to the state of the art Fig. 1 ,
- the contact means 12 is formed in connection with a rather elaborately designed ceramic head 13, wherein this ceramic head 13 for mounting often also has a fairly complicated prestressable spring mechanism; Although this construction is robust in many ways, it is also often too costly, difficult and expensive for the specific application.
- the realization of the provided on the contact circuit board 11 contact means 12 is very simple and inexpensive, this is particularly because standard components can be used consistently.
- the contact means 12 is implemented in a plug-in technique, so that an external conductor can be easily inserted into the contact means 12 and is held securely there by a clamping mechanism.
- connection circuit board 10 and the contact circuit board 11 are designed as separate circuit boards and substantially perpendicular to each other are arranged.
- the secure connection between the connection circuit board 10 and the contact circuit board 11 is realized in the illustrated embodiments in that the contact circuit board 11 has a recess 14 which serves to receive a corresponding portion of the connection circuit board 10.
- the connecting circuit board 10 and the contact circuit board 11 in the region of their common junction on opposite conductor surfaces 15a, 15b, wherein the opposing conductor surfaces 15a, 15b electrically connected to each other, are soldered here, so that the connection between the connecting circuit board 10 and the Contact PCB 11 is additionally stabilized.
- the opposing and by soldering electrically interconnected conductor surfaces 15a, 15b of the connecting circuit board 10 and the contact circuit board 11 are used in the illustrated temperature sensors 1 and the continuation of the electrical connection means 5 and the electrical traces 9 of the connection board 10 on the contact circuit board 11, so that on very simple way, an electrical connection to the contact means 12 is made.
- the connecting circuit board 10 is made of standard printed circuit board material
- the contact printed circuit boards 11 are made of temperature-resistant material, in this case made of high-strength, E-glass reinforced polyimides.
- the illustrated and described temperature sensors 1 are particularly suitable for applications in a relatively low temperature measuring range, for example, up to 200 ° C.
- Process thermometer - as shown for example in Fig. 6 - which are realized with a temperature sensor under the described use of printed circuit boards, have a significant cost advantage and are therefore particularly suitable for the automated Mass production and for mass applications, eg. B. also in the field of private households, for example in the context of heating technology such. B. at district heating transfer stations.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- General Induction Heating (AREA)
Claims (4)
- Sonde thermique (1) pour un thermomètre à contact relevant de la technique de mesure de processus, avec un tube de gainage (2) avec au moins un élément capteur thermique (4) placé dans l'extrémité (3) côté processus du tube de gainage et avec au moins un moyen de liaison (5) électrique, par un premier côté (6) de connexion, le moyen de liaison (5) électrique étant assemblé avec l'élément capteur thermique (4) et s'écoulant dans le tube de gainage (2) au moins jusqu'à l'extrémité (7) côté évaluation du tube de gainage (2), de sorte que l'élément capteur thermique (2) puisse être électriquement contacté par l'intermédiaire d'un deuxième côté (8) de connexion du moyen de liaison (5) électrique, le moyen de liaison (5) électrique étant formé par une carte de circuits imprimés (10) de liaison avec des pistes conductives (9),
caractérisée en ce que
le deuxième côté (8) de connexion du moyen de liaison (5) électrique est relié avec un moyen de contact (12) conçu sur une carte de circuits imprimés (11) de contact, en ce que la carte de circuits imprimés (10) de liaison et la carte de circuits imprimés (11) de contact sont réalisées en tant que cartes de circuits imprimés séparées, en ce que dans la zone de leur point de liaison commun, la carte de circuits imprimés (10) de liaison et la carte de circuits imprimés (11) de contact comportent des surfaces de conducteurs (15a, 15b) mutuellement opposées et les surfaces de conducteurs (15a, 15b) opposées sont électriquement reliées l'une à l'autre et en ce que les surfaces de conducteurs (15a, 15b) mutuellement opposées et électriquement reliées l'une à l'autre de la carte de circuits imprimés (10) de liaison et de la carte de circuits imprimés (11) de contact servent à poursuivre le moyen de liaison (5) électrique de la carte de circuits imprimés (10) de liaison sur la carte de circuits imprimés (11) de contact. - Sonde thermique (1) selon la revendication 1, caractérisée en ce que l'élément capteur thermique (4) est placé sur la carte de circuits imprimés (10) de liaison, l'élément capteur thermique (4) étant notamment une résistance dépendant de la température ou un thermocouple.
- Sonde thermique (1) selon la revendication 1 ou la revendication 2, caractérisée en ce que la carte de circuits imprimés (10) de liaison et la carte de circuits imprimés (11) de contact sont placées à la perpendiculaire l'une de l'autre et en ce que la carte de circuits imprimés (11) de contact comporte un évidement (14) destiné à recevoir la carte de circuits imprimés (10) de liaison.
- Sonde thermique (1) selon l'une quelconque des revendications 1 à 3, caractérisée en ce que sur ses arêtes s'écoulant à la parallèle du tube de gainage (2), la carte de circuits imprimés (10) de liaison comporte des zones élargies qui provoquent un positionnement de la carte de circuits imprimés (10) de liaison au centre dans le tube de gainage (2).
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE201110103331 DE102011103331B3 (de) | 2011-05-27 | 2011-05-27 | Temperaturfühler für ein Kontaktthermometer |
Publications (3)
Publication Number | Publication Date |
---|---|
EP2527807A2 EP2527807A2 (fr) | 2012-11-28 |
EP2527807A3 EP2527807A3 (fr) | 2014-09-24 |
EP2527807B1 true EP2527807B1 (fr) | 2017-03-29 |
Family
ID=46172652
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP12002929.3A Active EP2527807B1 (fr) | 2011-05-27 | 2012-04-26 | Sonde de température pour un thermomètre à contact |
Country Status (6)
Country | Link |
---|---|
US (1) | US8911148B2 (fr) |
EP (1) | EP2527807B1 (fr) |
JP (1) | JP5858865B2 (fr) |
KR (1) | KR101619284B1 (fr) |
CN (1) | CN102798482B (fr) |
DE (1) | DE102011103331B3 (fr) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9188490B2 (en) | 2013-03-12 | 2015-11-17 | Rosemount Inc. | Thermowell insert |
DE102013013710B4 (de) * | 2013-08-20 | 2023-11-09 | Endress + Hauser Wetzer Gmbh + Co Kg | Verfahren zur Überprüfung eines Thermometers |
JP5661978B1 (ja) * | 2014-04-22 | 2015-01-28 | 株式会社岡崎製作所 | シース型測温センサのターミナルヘッド |
US9885610B2 (en) | 2014-12-22 | 2018-02-06 | Rosemount Inc. | Thermowell system with vibration detection |
US9891111B2 (en) * | 2015-06-30 | 2018-02-13 | Rosemount Inc. | Thermowell with infrared sensor |
US10295491B2 (en) * | 2016-05-11 | 2019-05-21 | Daily Instruments | Mineral insulated sheathed assembly with insulation resistance indicator |
US10288490B2 (en) | 2016-05-11 | 2019-05-14 | Daily Thermetrics Corp. | Mineral insulated sheathed assembly with grounded and ungrounded temperature sensors |
US10247615B2 (en) * | 2017-05-08 | 2019-04-02 | DunAn Sensing, LLC | Sensor assemblies and methods of making same |
US11408779B2 (en) | 2019-06-03 | 2022-08-09 | Daily Thermetrics Corporation | Temperature sensor and methods of use |
USD1020493S1 (en) * | 2022-07-31 | 2024-04-02 | CPA Pool Products, Inc. | Flotational thermometer |
USD1020494S1 (en) * | 2022-07-31 | 2024-04-02 | CPA Pool Products, Inc. | Skimmer lid thermometer |
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DE3134166A1 (de) * | 1981-08-28 | 1983-03-10 | Robert Bosch Gmbh, 7000 Stuttgart | Temperaturfuehler |
GB2209093B (en) * | 1987-08-27 | 1992-04-08 | Stc Plc | Temperature probe |
US5301557A (en) | 1989-06-09 | 1994-04-12 | Micro Motion, Inc. | Stability coriolis mass flow meter |
DE3923535C1 (fr) | 1989-07-15 | 1990-10-31 | Heraeus Sensor Gmbh, 6450 Hanau, De | |
US6835898B2 (en) * | 1993-11-16 | 2004-12-28 | Formfactor, Inc. | Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
US5449234A (en) * | 1993-11-29 | 1995-09-12 | Caterpillar Inc. | Air temperature sensor |
US5498079A (en) * | 1994-12-23 | 1996-03-12 | Rosemount Inc. | Temperature transmitter |
JPH08292108A (ja) * | 1995-02-23 | 1996-11-05 | Nippondenso Co Ltd | サーミスタ式温度センサ |
DE19621001A1 (de) * | 1996-05-24 | 1997-11-27 | Heraeus Sensor Nite Gmbh | Sensoranordnung zur Temperaturmessung und Verfahren zur Herstellung der Anordnung |
JPH10253652A (ja) * | 1997-03-14 | 1998-09-25 | Denso Corp | センサ装置及びその製造方法並びにその製造に用いられるリードフレーム |
US6297723B1 (en) * | 1998-01-08 | 2001-10-02 | Matsushita Electric Industrial Co., Ltd. | Temperature sensor and method of manufacturing the same |
DE19913195C2 (de) * | 1999-03-24 | 2001-02-15 | Techem Service Ag | Meßeinsatz für Widerstandsthermometer |
US6341892B1 (en) * | 2000-02-03 | 2002-01-29 | George Schmermund | Resistance thermometer probe |
DE10031124C2 (de) * | 2000-06-30 | 2002-05-16 | Heraeus Electro Nite Int | Sensor zur Temperaturerfassung eines Fluids |
US6588931B2 (en) * | 2000-12-07 | 2003-07-08 | Delphi Technologies, Inc. | Temperature sensor with flexible circuit substrate |
DE10127871C1 (de) * | 2001-03-29 | 2003-03-13 | Epiq Sensor Nite N V | Gehäuse für einen Temperatur- oder Gassensor |
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US7084342B2 (en) * | 2003-06-17 | 2006-08-01 | Watlow Electric Manufacturing Co. | Semi-compensated pins for cold junction compensation |
JP2006038824A (ja) * | 2004-06-25 | 2006-02-09 | Nippon Seiki Co Ltd | 半導体センサ装置 |
EP1645857A1 (fr) * | 2004-10-06 | 2006-04-12 | Whirlpool Corporation | Capteur pour des appareils électroménagers |
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JP2006258520A (ja) * | 2005-03-16 | 2006-09-28 | Ishizuka Electronics Corp | 電子体温計用プローブ |
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US7665890B2 (en) * | 2006-06-22 | 2010-02-23 | Watlow Electric Manufacturing Company | Temperature sensor assembly and method of manufacturing thereof |
DE102006062115B4 (de) * | 2006-12-22 | 2010-08-19 | Sitronic Ges. für elektrotechnische Ausrüstung GmbH & Co. KG | Sensoranordnung zur Temperaturmessung |
FR2942026B1 (fr) | 2009-02-06 | 2013-04-26 | Cotherm Sa | Capteur thermosensible pour ballon de stockage d'eau chaude |
US20100202492A1 (en) * | 2009-02-12 | 2010-08-12 | Robert Larimer | Pouring and temperature determining device |
MX2012014622A (es) | 2010-07-09 | 2013-02-21 | Micro Motion Inc | Medidor de vibracion que incluye cubierta mejorada de medidor. |
IT1401027B1 (it) | 2010-07-29 | 2013-07-12 | Thermowatt Spa | Termostato elettronico ed elettromeccanico perfezionato |
US8305186B1 (en) * | 2010-08-24 | 2012-11-06 | Minco Products, Inc. | Resistive temperature detector assembly |
IT1401780B1 (it) | 2010-09-22 | 2013-08-28 | Thermowatt Spa | Termostato elettronico con sicurezza attivata da resistori. |
US20120193086A1 (en) * | 2011-01-28 | 2012-08-02 | Tasseron Sensors, Inc. | Thermal probe |
-
2011
- 2011-05-27 DE DE201110103331 patent/DE102011103331B3/de not_active Withdrawn - After Issue
-
2012
- 2012-04-26 EP EP12002929.3A patent/EP2527807B1/fr active Active
- 2012-05-24 KR KR1020120055589A patent/KR101619284B1/ko active IP Right Grant
- 2012-05-24 US US13/479,809 patent/US8911148B2/en active Active
- 2012-05-25 JP JP2012119209A patent/JP5858865B2/ja not_active Expired - Fee Related
- 2012-05-28 CN CN201210168035.7A patent/CN102798482B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US8911148B2 (en) | 2014-12-16 |
CN102798482A (zh) | 2012-11-28 |
DE102011103331B3 (de) | 2012-11-29 |
KR20120132400A (ko) | 2012-12-05 |
US20120300808A1 (en) | 2012-11-29 |
EP2527807A3 (fr) | 2014-09-24 |
JP2012247422A (ja) | 2012-12-13 |
JP5858865B2 (ja) | 2016-02-10 |
KR101619284B1 (ko) | 2016-05-10 |
CN102798482B (zh) | 2016-12-21 |
EP2527807A2 (fr) | 2012-11-28 |
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