EP2527807B1 - Sonde de température pour un thermomètre à contact - Google Patents

Sonde de température pour un thermomètre à contact Download PDF

Info

Publication number
EP2527807B1
EP2527807B1 EP12002929.3A EP12002929A EP2527807B1 EP 2527807 B1 EP2527807 B1 EP 2527807B1 EP 12002929 A EP12002929 A EP 12002929A EP 2527807 B1 EP2527807 B1 EP 2527807B1
Authority
EP
European Patent Office
Prior art keywords
circuit board
printed circuit
contact
connection
sensor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP12002929.3A
Other languages
German (de)
English (en)
Other versions
EP2527807A3 (fr
EP2527807A2 (fr
Inventor
Hans-Owe Mårtensson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Inor Process AB
Original Assignee
Inor Process AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Inor Process AB filed Critical Inor Process AB
Publication of EP2527807A2 publication Critical patent/EP2527807A2/fr
Publication of EP2527807A3 publication Critical patent/EP2527807A3/fr
Application granted granted Critical
Publication of EP2527807B1 publication Critical patent/EP2527807B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/08Protective devices, e.g. casings

Definitions

  • the invention relates to a temperature sensor for a contact thermometer of process measuring technology with a cladding tube, with at least one disposed in the process end of the cladding tube thermal sensor element and at least one electrical connection means, wherein the electrical connection means is connected to a first connection side with the thermal sensor element and in the Cladding tube extends at least up to the ausense matteren end of the cladding tube, so that the thermal sensor element via a second connection side of the electrical connection means is electrically contacted.
  • thermometers are thus seen in contrast to those thermometers which detect only the heat radiation emanating from a medium.
  • the cladding tube of the temperature sensor surrounds the thermal sensor element, wherein the thermal sensor element is usually arranged in the vicinity of a closed end of the cladding tube.
  • the thermal sensor element is often fixed in the cladding tube with a heat-conducting medium, such as a thermally conductive paste or a good heat-conducting adhesive.
  • the cladding tube is therefore closed at its process end and shields the thermal sensor element against the process.
  • a generic temperature sensor is also used as an insert in another protective tube, wherein the protective tube then protrudes into the process and permanently shields the process towards the environment.
  • the temperature sensor is then inserted with its cladding tube in the additional protective tube.
  • the other, end-side end of the cladding tube usually ends in a housing, where an evaluation or further processing of the measuring signal takes place.
  • the thermal sensor element is usually a temperature-dependent resistor or a thermocouple which is electrically contactable from outside the cladding tube via the electrical connection means.
  • the case may be a compact, modular Structure around a contact head act, in which an electrical connection between the outside world and the sensor element is made indirectly via the electrical connection means.
  • the contact head can also have a transmitter which has the task of converting a signal originating from the sensor element into a standardized signal, filtering the signal and linearizing it and providing it to higher-level process monitoring.
  • the electrical connection means usually implements at least two electrically conductive paths between the thermal sensor element and the terminals located outside the cladding tube.
  • the thermal sensor element as a temperature-dependent resistor of the thermal resistance is applied to a voltage or a current and determined according to the resulting current or the resulting voltage and closed on the resulting resistance value to the temperature.
  • changing line resistances can not be compensated, for which reason implementations in which the electrical connection means has three or even four electrical lines as reference resistors are often preferred.
  • Temperature sensors known from the prior art often have a mineral insulation of the electrical connection means in the cladding tube.
  • the electrical connection means are stored for example in a mineral or ceramic powder and the temperature sensor must be subjected to heat after installation of the thermal sensor element, so that the mineral or ceramic powder dries and solidifies.
  • Object of the present invention is to provide a temperature sensor, which has a simple and inexpensive construction, so that the temperature sensor is also used in mass applications, especially in those applications that are in a relatively low temperature range, for example up to 300 ° C.
  • the temperature sensor according to the invention in which the previously derived and indicated object is achieved, is initially and essentially characterized in that the electrical connection means by a printed circuit board - connecting circuit board with conductor tracks - is formed.
  • the term "interconnect board” will hereafter be used for the board or circuit board portion used to implement the electrical interconnect, the term “interconnect board” is used to more precisely specify the more general term “board” and therefore for clarity.
  • the inventive use of a printed circuit board as an electrical connection means in place of the known from the prior art realization of electrical connection means brings the advantage of a considerably simplified assembly with it, which is also automated, with printed circuit boards per se, even if they have to meet special temperature requirements , are relatively inexpensive to known implementations.
  • connection board must be made of such a material that is temperature resistant in the particular application.
  • all known printed circuit boards are suitable for realizing the temperature sensor according to the invention.
  • printed circuit boards based on phenolic or epoxy resin and printed circuit boards are also possible, which are based on the use of Teflon or ceramic.
  • the realization of the electrical connection means with a connection board is advantageous because printed circuit boards can be produced in virtually any form in a simple manner and electrical lines in any manner on such a circuit board - on one side, double-sided or in an intermediate layer of the circuit board - can be realized.
  • the thermal sensor element is arranged on the connection circuit board, in particular as a temperature-dependent resistor on the connection circuit board is realized and there electrically connected to conductor tracks, in particular soldered.
  • connection side of the electrical connection means is connected to a contact means formed on a printed circuit board-contact printed circuit board.
  • contact printed circuit board is again used to clarify the specification of the printed circuit board or the printed circuit board area on which the aforementioned contact means is provided, the term also serves for clarification.
  • This development of the invention is of considerable importance.
  • Contact means known from the prior art are usually realized by a very elaborately designed ceramic head, which usually has screw connections in order to be able to contact the sensor element externally via the electrical connection means. These ceramic heads can only be used for external contacting, but they can also be used for signal matching if they are designed as transmitters.
  • the temperature sensor according to the invention dispenses with such a complex structure and replaces it with a simple contact printed circuit board, on which a contact means is provided, wherein with the contact means preferably a screw, a plug connection or an insulation displacement connection to an external conductor can be produced, which also by the use of Standard contact means for mounting printed circuit boards is possible.
  • This embodiment of the invention overcomes the decades prevailing notion that all elements of a temperature sensor must meet maximum requirements.
  • connection circuit board and the contact circuit board are designed as separate circuit boards.
  • This has the advantage that different printed circuit board materials can be used for the connecting printed circuit board and the contact printed circuit board.
  • This configuration makes it possible to use a printed circuit board material with increased temperature stability for the connecting printed circuit board, that is to say the printed circuit board exposed at least partially to the medium temperature, for example a printed circuit board material suitable for temperatures greater than 300 ° C., in particular of polyimides.
  • the contact printed circuit board consists of a printed circuit board material which is long-term stable at lower temperatures, in particular at temperatures less than 300 ° C., in particular less than 250 ° C., preferably also less than 230 ° C.
  • the contact circuit board is provided at the end remote from the process of the temperature sensor and therefore only has to meet significantly lower requirements in terms of temperature stability.
  • the advantage is that significantly cheaper circuit board materials can be used than is the case for increased temperature requirements. This further makes it possible to reduce the cost of the temperature sensor according to the invention.
  • the connecting printed circuit board has at its edges extending parallel to the cladding tube, which effect a positioning of the connecting printed circuit board in the middle in the cladding tube.
  • the widths minimize the contact area between the connecting printed circuit board and the cladding tube, which simplifies the insertion of the connecting printed circuit board into the cladding tube.
  • an electrical arrangement is realized on the connecting circuit board, in particular an electrical arrangement for detecting a leakage of the cladding tube, which at Realizations in the art is possible only with considerable effort.
  • Such an electrical arrangement may in the simplest case, for example, consist only of opposing contact surfaces, wherein for leakage detection, the impedance between the contact surfaces is evaluated.
  • an electrical circuit in particular a transmitter electronics, is realized directly on the connection circuit board and / or the contact circuit board, preferably on the contact circuit board. Due to the circuit board construction, this is possible in a very simple and cost-effective manner, since no separate circuit carrier is required for the circuit. In addition, space is saved in the above-described implementation of such circuits over the at least in temperature sensors conventional implementations, which allows lean constructions.
  • Fig. 1 a known from the prior art temperature sensor 1, which is intended for contact thermometers of process instrumentation.
  • the temperature sensor 1 has a cladding tube 2, in whose process-side end 3 a thermal sensor element is arranged, which in Fig. 1 not shown in the Fig. 4 and 6 is provided with reference numeral 4.
  • the temperature sensor 1 further has as electrical connection means 5 electrical lines, said electrical connection means 5 - as in the inventive variant in the Fig. 2 to 4 and 6 to recognize - is connected to a first connection side 6 with the thermal sensor element 4.
  • the electrical connection means 5 then runs in the cladding tube 2 as far as the end 7 of the cladding tube 2, so that the thermal sensor element 4 is in principle electrically contactable via a second connection side 8 of the electrical connection means 5 Fig. 1 can be seen, consists of the electrical connection means 5 in the prior art of a plurality of electrical conductors, in this case of three conductors, two of these conductors are connected to a terminal of the thermal sensor element and another conductor is connected to the second end of the thermal sensor element ,
  • the electrical connection means 5 in the form of the lines is provided with a mineral insulation located in the cladding tube 2, which is problematical in particular when establishing an electrical connection between the sensor element and the electrical connection means 5, requires a heat treatment and is expensive.
  • connection means 5 is formed by a printed circuit board with conductor tracks 9, wherein this, the connecting means 5 forming circuit board, hereinafter referred to as a connection circuit board 10.
  • the connection board 10 has on each side in each case two conductor tracks 9, which is a contact of the sensor element 4 via the second connection side 8 - that is, the connection side, which is located in the vicinity of the evaluation end 7 of the cladding tube 2 - electrically contacted.
  • the thermal sensor element 4 can be arranged and arranged directly on the connecting circuit board 10, wherein in the present case the thermal sensor element 4 is realized as a temperature-dependent resistor of the PT100 type.
  • the contact means 12 realized in screwing. Screw connections are also known in the art, to which reference is again made to the state of the art Fig. 1 ,
  • the contact means 12 is formed in connection with a rather elaborately designed ceramic head 13, wherein this ceramic head 13 for mounting often also has a fairly complicated prestressable spring mechanism; Although this construction is robust in many ways, it is also often too costly, difficult and expensive for the specific application.
  • the realization of the provided on the contact circuit board 11 contact means 12 is very simple and inexpensive, this is particularly because standard components can be used consistently.
  • the contact means 12 is implemented in a plug-in technique, so that an external conductor can be easily inserted into the contact means 12 and is held securely there by a clamping mechanism.
  • connection circuit board 10 and the contact circuit board 11 are designed as separate circuit boards and substantially perpendicular to each other are arranged.
  • the secure connection between the connection circuit board 10 and the contact circuit board 11 is realized in the illustrated embodiments in that the contact circuit board 11 has a recess 14 which serves to receive a corresponding portion of the connection circuit board 10.
  • the connecting circuit board 10 and the contact circuit board 11 in the region of their common junction on opposite conductor surfaces 15a, 15b, wherein the opposing conductor surfaces 15a, 15b electrically connected to each other, are soldered here, so that the connection between the connecting circuit board 10 and the Contact PCB 11 is additionally stabilized.
  • the opposing and by soldering electrically interconnected conductor surfaces 15a, 15b of the connecting circuit board 10 and the contact circuit board 11 are used in the illustrated temperature sensors 1 and the continuation of the electrical connection means 5 and the electrical traces 9 of the connection board 10 on the contact circuit board 11, so that on very simple way, an electrical connection to the contact means 12 is made.
  • the connecting circuit board 10 is made of standard printed circuit board material
  • the contact printed circuit boards 11 are made of temperature-resistant material, in this case made of high-strength, E-glass reinforced polyimides.
  • the illustrated and described temperature sensors 1 are particularly suitable for applications in a relatively low temperature measuring range, for example, up to 200 ° C.
  • Process thermometer - as shown for example in Fig. 6 - which are realized with a temperature sensor under the described use of printed circuit boards, have a significant cost advantage and are therefore particularly suitable for the automated Mass production and for mass applications, eg. B. also in the field of private households, for example in the context of heating technology such. B. at district heating transfer stations.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • General Induction Heating (AREA)

Claims (4)

  1. Sonde thermique (1) pour un thermomètre à contact relevant de la technique de mesure de processus, avec un tube de gainage (2) avec au moins un élément capteur thermique (4) placé dans l'extrémité (3) côté processus du tube de gainage et avec au moins un moyen de liaison (5) électrique, par un premier côté (6) de connexion, le moyen de liaison (5) électrique étant assemblé avec l'élément capteur thermique (4) et s'écoulant dans le tube de gainage (2) au moins jusqu'à l'extrémité (7) côté évaluation du tube de gainage (2), de sorte que l'élément capteur thermique (2) puisse être électriquement contacté par l'intermédiaire d'un deuxième côté (8) de connexion du moyen de liaison (5) électrique, le moyen de liaison (5) électrique étant formé par une carte de circuits imprimés (10) de liaison avec des pistes conductives (9),
    caractérisée en ce que
    le deuxième côté (8) de connexion du moyen de liaison (5) électrique est relié avec un moyen de contact (12) conçu sur une carte de circuits imprimés (11) de contact, en ce que la carte de circuits imprimés (10) de liaison et la carte de circuits imprimés (11) de contact sont réalisées en tant que cartes de circuits imprimés séparées, en ce que dans la zone de leur point de liaison commun, la carte de circuits imprimés (10) de liaison et la carte de circuits imprimés (11) de contact comportent des surfaces de conducteurs (15a, 15b) mutuellement opposées et les surfaces de conducteurs (15a, 15b) opposées sont électriquement reliées l'une à l'autre et en ce que les surfaces de conducteurs (15a, 15b) mutuellement opposées et électriquement reliées l'une à l'autre de la carte de circuits imprimés (10) de liaison et de la carte de circuits imprimés (11) de contact servent à poursuivre le moyen de liaison (5) électrique de la carte de circuits imprimés (10) de liaison sur la carte de circuits imprimés (11) de contact.
  2. Sonde thermique (1) selon la revendication 1, caractérisée en ce que l'élément capteur thermique (4) est placé sur la carte de circuits imprimés (10) de liaison, l'élément capteur thermique (4) étant notamment une résistance dépendant de la température ou un thermocouple.
  3. Sonde thermique (1) selon la revendication 1 ou la revendication 2, caractérisée en ce que la carte de circuits imprimés (10) de liaison et la carte de circuits imprimés (11) de contact sont placées à la perpendiculaire l'une de l'autre et en ce que la carte de circuits imprimés (11) de contact comporte un évidement (14) destiné à recevoir la carte de circuits imprimés (10) de liaison.
  4. Sonde thermique (1) selon l'une quelconque des revendications 1 à 3, caractérisée en ce que sur ses arêtes s'écoulant à la parallèle du tube de gainage (2), la carte de circuits imprimés (10) de liaison comporte des zones élargies qui provoquent un positionnement de la carte de circuits imprimés (10) de liaison au centre dans le tube de gainage (2).
EP12002929.3A 2011-05-27 2012-04-26 Sonde de température pour un thermomètre à contact Active EP2527807B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE201110103331 DE102011103331B3 (de) 2011-05-27 2011-05-27 Temperaturfühler für ein Kontaktthermometer

Publications (3)

Publication Number Publication Date
EP2527807A2 EP2527807A2 (fr) 2012-11-28
EP2527807A3 EP2527807A3 (fr) 2014-09-24
EP2527807B1 true EP2527807B1 (fr) 2017-03-29

Family

ID=46172652

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12002929.3A Active EP2527807B1 (fr) 2011-05-27 2012-04-26 Sonde de température pour un thermomètre à contact

Country Status (6)

Country Link
US (1) US8911148B2 (fr)
EP (1) EP2527807B1 (fr)
JP (1) JP5858865B2 (fr)
KR (1) KR101619284B1 (fr)
CN (1) CN102798482B (fr)
DE (1) DE102011103331B3 (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9188490B2 (en) 2013-03-12 2015-11-17 Rosemount Inc. Thermowell insert
DE102013013710B4 (de) * 2013-08-20 2023-11-09 Endress + Hauser Wetzer Gmbh + Co Kg Verfahren zur Überprüfung eines Thermometers
JP5661978B1 (ja) * 2014-04-22 2015-01-28 株式会社岡崎製作所 シース型測温センサのターミナルヘッド
US9885610B2 (en) 2014-12-22 2018-02-06 Rosemount Inc. Thermowell system with vibration detection
US9891111B2 (en) * 2015-06-30 2018-02-13 Rosemount Inc. Thermowell with infrared sensor
US10295491B2 (en) * 2016-05-11 2019-05-21 Daily Instruments Mineral insulated sheathed assembly with insulation resistance indicator
US10288490B2 (en) 2016-05-11 2019-05-14 Daily Thermetrics Corp. Mineral insulated sheathed assembly with grounded and ungrounded temperature sensors
US10247615B2 (en) * 2017-05-08 2019-04-02 DunAn Sensing, LLC Sensor assemblies and methods of making same
US11408779B2 (en) 2019-06-03 2022-08-09 Daily Thermetrics Corporation Temperature sensor and methods of use
USD1020493S1 (en) * 2022-07-31 2024-04-02 CPA Pool Products, Inc. Flotational thermometer
USD1020494S1 (en) * 2022-07-31 2024-04-02 CPA Pool Products, Inc. Skimmer lid thermometer

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3134166A1 (de) * 1981-08-28 1983-03-10 Robert Bosch Gmbh, 7000 Stuttgart Temperaturfuehler
GB2209093B (en) * 1987-08-27 1992-04-08 Stc Plc Temperature probe
US5301557A (en) 1989-06-09 1994-04-12 Micro Motion, Inc. Stability coriolis mass flow meter
DE3923535C1 (fr) 1989-07-15 1990-10-31 Heraeus Sensor Gmbh, 6450 Hanau, De
US6835898B2 (en) * 1993-11-16 2004-12-28 Formfactor, Inc. Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
US5449234A (en) * 1993-11-29 1995-09-12 Caterpillar Inc. Air temperature sensor
US5498079A (en) * 1994-12-23 1996-03-12 Rosemount Inc. Temperature transmitter
JPH08292108A (ja) * 1995-02-23 1996-11-05 Nippondenso Co Ltd サーミスタ式温度センサ
DE19621001A1 (de) * 1996-05-24 1997-11-27 Heraeus Sensor Nite Gmbh Sensoranordnung zur Temperaturmessung und Verfahren zur Herstellung der Anordnung
JPH10253652A (ja) * 1997-03-14 1998-09-25 Denso Corp センサ装置及びその製造方法並びにその製造に用いられるリードフレーム
US6297723B1 (en) * 1998-01-08 2001-10-02 Matsushita Electric Industrial Co., Ltd. Temperature sensor and method of manufacturing the same
DE19913195C2 (de) * 1999-03-24 2001-02-15 Techem Service Ag Meßeinsatz für Widerstandsthermometer
US6341892B1 (en) * 2000-02-03 2002-01-29 George Schmermund Resistance thermometer probe
DE10031124C2 (de) * 2000-06-30 2002-05-16 Heraeus Electro Nite Int Sensor zur Temperaturerfassung eines Fluids
US6588931B2 (en) * 2000-12-07 2003-07-08 Delphi Technologies, Inc. Temperature sensor with flexible circuit substrate
DE10127871C1 (de) * 2001-03-29 2003-03-13 Epiq Sensor Nite N V Gehäuse für einen Temperatur- oder Gassensor
US7223014B2 (en) * 2003-03-28 2007-05-29 Intempco Controls Ltd. Remotely programmable integrated sensor transmitter
US7084342B2 (en) * 2003-06-17 2006-08-01 Watlow Electric Manufacturing Co. Semi-compensated pins for cold junction compensation
JP2006038824A (ja) * 2004-06-25 2006-02-09 Nippon Seiki Co Ltd 半導体センサ装置
EP1645857A1 (fr) * 2004-10-06 2006-04-12 Whirlpool Corporation Capteur pour des appareils électroménagers
US7000478B1 (en) * 2005-01-31 2006-02-21 Texas Instruments Incorporated Combined pressure and temperature transducer
JP2006258520A (ja) * 2005-03-16 2006-09-28 Ishizuka Electronics Corp 電子体温計用プローブ
CA2654084A1 (fr) * 2006-06-03 2007-12-13 Precision Linear Systems, Inc. Ensembles de detection et de transmission de temperature, unites de capteurs de temperature programmables, et procedes de fabrication et d'utilisation
US7665890B2 (en) * 2006-06-22 2010-02-23 Watlow Electric Manufacturing Company Temperature sensor assembly and method of manufacturing thereof
DE102006062115B4 (de) * 2006-12-22 2010-08-19 Sitronic Ges. für elektrotechnische Ausrüstung GmbH & Co. KG Sensoranordnung zur Temperaturmessung
FR2942026B1 (fr) 2009-02-06 2013-04-26 Cotherm Sa Capteur thermosensible pour ballon de stockage d'eau chaude
US20100202492A1 (en) * 2009-02-12 2010-08-12 Robert Larimer Pouring and temperature determining device
MX2012014622A (es) 2010-07-09 2013-02-21 Micro Motion Inc Medidor de vibracion que incluye cubierta mejorada de medidor.
IT1401027B1 (it) 2010-07-29 2013-07-12 Thermowatt Spa Termostato elettronico ed elettromeccanico perfezionato
US8305186B1 (en) * 2010-08-24 2012-11-06 Minco Products, Inc. Resistive temperature detector assembly
IT1401780B1 (it) 2010-09-22 2013-08-28 Thermowatt Spa Termostato elettronico con sicurezza attivata da resistori.
US20120193086A1 (en) * 2011-01-28 2012-08-02 Tasseron Sensors, Inc. Thermal probe

Also Published As

Publication number Publication date
US8911148B2 (en) 2014-12-16
CN102798482A (zh) 2012-11-28
DE102011103331B3 (de) 2012-11-29
KR20120132400A (ko) 2012-12-05
US20120300808A1 (en) 2012-11-29
EP2527807A3 (fr) 2014-09-24
JP2012247422A (ja) 2012-12-13
JP5858865B2 (ja) 2016-02-10
KR101619284B1 (ko) 2016-05-10
CN102798482B (zh) 2016-12-21
EP2527807A2 (fr) 2012-11-28

Similar Documents

Publication Publication Date Title
EP2527807B1 (fr) Sonde de température pour un thermomètre à contact
DE102014011593B4 (de) Widerstand, insbesondere niederohmiger Strommesswiderstand
DE102010052478B4 (de) Elektrischer Streckenverbinder für Thermoelemente und Verfahren zu dessen Herstellung
DE102011111081B4 (de) Batteriesensor
EP3463969B1 (fr) Fiche, en particulier avec un câble de recharge d'un véhicule électrique ou hybride
DE19621001A1 (de) Sensoranordnung zur Temperaturmessung und Verfahren zur Herstellung der Anordnung
DE19742236C2 (de) Elektrischer Sensor, insbesondere Temperatur-Sensor, mit Leiterplatte
EP2679963A2 (fr) Dispositif de mesure pour la détermination d'une grandeur de processus
EP1568978B1 (fr) Capteur de température
EP3295523B1 (fr) Construction de connecteur pour cartes de circuit imprimé
EP2867623B1 (fr) Dispositif capteur
DE102013219092B4 (de) Anordnung eines Temperatursensors mit einer elektrisch isolierenden Umhüllung
DE102011121902B9 (de) Widerstand zur Messung eines elektrischen Stroms
EP3625805B1 (fr) Résistance de puissance
DE19715080C1 (de) Thermometeranordnung mit einem Thermoelement
DE202011111000U1 (de) Kapazitiver Näherungssensor
DE102021107218A1 (de) Vorrichtung zur Temperaturmessung und Vorrichtung zur Stromermittlung
DE3338497A1 (de) Kombinierte ph-einstabmesskette mit integriertem temperaturmessfuehler
DE102009048940B3 (de) Heizkostenverteiler
EP1982153B1 (fr) Thermometre a resistance
DE102013219094B4 (de) Anordnung eines Temperatursensors mit einer elektrisch und thermisch isolierenden Umhüllung
DE19905384A1 (de) Sensor und Verfahren zu dessen Herstellung
DE19826212C1 (de) Anschlußeinrichtung für Thermoelemente
DE102019103074A1 (de) Anschlusseinheit zum Anschluss eines Thermoelementes
DE102011103828B4 (de) Massenproduktion kleiner Temepratursensoren mit Flip-Chips

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

PUAL Search report despatched

Free format text: ORIGINAL CODE: 0009013

AK Designated contracting states

Kind code of ref document: A3

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

RIC1 Information provided on ipc code assigned before grant

Ipc: G01K 1/14 20060101AFI20140818BHEP

Ipc: G01K 1/08 20060101ALI20140818BHEP

17P Request for examination filed

Effective date: 20150324

RBV Designated contracting states (corrected)

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

INTG Intention to grant announced

Effective date: 20161006

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

Free format text: NOT ENGLISH

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 880220

Country of ref document: AT

Kind code of ref document: T

Effective date: 20170415

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

Free format text: LANGUAGE OF EP DOCUMENT: GERMAN

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 6

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 502012009875

Country of ref document: DE

REG Reference to a national code

Ref country code: SE

Ref legal event code: TRGR

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170630

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170629

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170329

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170329

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170329

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20170329

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170629

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170329

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170329

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170329

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170329

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170329

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170329

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170329

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170329

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170329

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170731

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170329

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170729

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170329

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 502012009875

Country of ref document: DE

REG Reference to a national code

Ref country code: IE

Ref legal event code: MM4A

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170329

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170329

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170426

26N No opposition filed

Effective date: 20180103

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20170430

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 7

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170426

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170430

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170329

REG Reference to a national code

Ref country code: AT

Ref legal event code: MM01

Ref document number: 880220

Country of ref document: AT

Kind code of ref document: T

Effective date: 20170426

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170426

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170329

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20120426

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170329

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170329

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170329

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170329

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20220622

Year of fee payment: 11

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20230420

Year of fee payment: 12

Ref country code: CH

Payment date: 20230502

Year of fee payment: 12

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: SE

Payment date: 20230420

Year of fee payment: 12

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20230419

Year of fee payment: 12

REG Reference to a national code

Ref country code: DE

Ref legal event code: R119

Ref document number: 502012009875

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20231103