EP2496419B1 - Ensemble tête d'impression à jet d'encre à connexion électrique côté arrière - Google Patents
Ensemble tête d'impression à jet d'encre à connexion électrique côté arrière Download PDFInfo
- Publication number
- EP2496419B1 EP2496419B1 EP09847677.3A EP09847677A EP2496419B1 EP 2496419 B1 EP2496419 B1 EP 2496419B1 EP 09847677 A EP09847677 A EP 09847677A EP 2496419 B1 EP2496419 B1 EP 2496419B1
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- European Patent Office
- Prior art keywords
- silicon
- printhead
- connector
- printhead assembly
- layer
- Prior art date
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- 229910052710 silicon Inorganic materials 0.000 claims description 61
- 239000010703 silicon Substances 0.000 claims description 61
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 19
- 239000004020 conductor Substances 0.000 claims description 16
- 230000000712 assembly Effects 0.000 claims description 15
- 238000000429 assembly Methods 0.000 claims description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 238000009792 diffusion process Methods 0.000 claims description 8
- 230000004888 barrier function Effects 0.000 claims description 6
- 238000004891 communication Methods 0.000 claims description 4
- 239000012530 fluid Substances 0.000 claims description 4
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 229920005570 flexible polymer Polymers 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 23
- 238000004519 manufacturing process Methods 0.000 description 19
- 239000000463 material Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 12
- 238000000465 moulding Methods 0.000 description 12
- 238000000151 deposition Methods 0.000 description 10
- 230000008021 deposition Effects 0.000 description 10
- 238000005530 etching Methods 0.000 description 10
- 229920002120 photoresistant polymer Polymers 0.000 description 10
- XBBRGUHRZBZMPP-UHFFFAOYSA-N 1,2,3-trichloro-4-(2,4,6-trichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC(Cl)=C1C1=CC=C(Cl)C(Cl)=C1Cl XBBRGUHRZBZMPP-UHFFFAOYSA-N 0.000 description 9
- 239000000377 silicon dioxide Substances 0.000 description 8
- 229910052681 coesite Inorganic materials 0.000 description 7
- 229910052906 cristobalite Inorganic materials 0.000 description 7
- 229910052814 silicon oxide Inorganic materials 0.000 description 7
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- 229910052905 tridymite Inorganic materials 0.000 description 7
- 239000002313 adhesive film Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 239000004205 dimethyl polysiloxane Substances 0.000 description 6
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 6
- 238000012423 maintenance Methods 0.000 description 6
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 6
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 6
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 5
- 239000010936 titanium Substances 0.000 description 5
- 229910052719 titanium Inorganic materials 0.000 description 5
- 229910017083 AlN Inorganic materials 0.000 description 4
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 4
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
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- PTXMVOUNAHFTFC-UHFFFAOYSA-N alumane;vanadium Chemical compound [AlH3].[V] PTXMVOUNAHFTFC-UHFFFAOYSA-N 0.000 description 2
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- 238000005334 plasma enhanced chemical vapour deposition Methods 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
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- 238000005538 encapsulation Methods 0.000 description 1
- 230000002706 hydrostatic effect Effects 0.000 description 1
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- 229910052751 metal Inorganic materials 0.000 description 1
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- 230000001590 oxidative effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000002952 polymeric resin Substances 0.000 description 1
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- 235000012239 silicon dioxide Nutrition 0.000 description 1
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14427—Structure of ink jet print heads with thermal bend detached actuators
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/145—Arrangement thereof
- B41J2/155—Arrangement thereof for line printing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
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- B41J2/1626—Manufacturing processes etching
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
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- B41J2/16—Production of nozzles
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- B41J2/1631—Manufacturing processes photolithography
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
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- B41J2/16—Production of nozzles
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- B41J2/1635—Manufacturing processes dividing the wafer into individual chips
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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- B41J2/1639—Manufacturing processes molding sacrificial molding
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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- B41J2/164—Manufacturing processes thin film formation
- B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
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- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
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- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1645—Manufacturing processes thin film formation thin film formation by spincoating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
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- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1648—Production of print heads with thermal bend detached actuators
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
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- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14491—Electrical connection
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/18—Electrical connection established using vias
Claims (15)
- Ensemble tête d'impression à jet d'encre (60) comprenant :un collecteur d'alimentation en encre (124) ;un ou plusieurs circuits intégrés de tête d'impression (2), chaque circuit intégré de tête d'impression comprenant :un substrat au silicium (20) ;un côté avant ayant au moins une couche CMOS (113) comprenant une circuiterie de pilotage et une couche MEMS (26) comprenant une pluralité d'ensembles buse de jet d'encre (101), ladite couche CMOS étant positionnée entre ledit substrat au silicium et ladite couche MEMS ;un côté arrière (12) fixé audit collecteur d'alimentation en encre (124) ; etau moins un canal d'alimentation en encre (110) assurant une communication fluidique entre ledit côté arrière et lesdits ensembles buse de jet d'encre ; etau moins un film de connecteur (8) pour fournir de l'énergie à ladite circuiterie de pilotage,une extrémité de connexion dudit film de connecteur étant prise en sandwich entre au moins une partie dudit collecteur d'alimentation en encre et ledit ou lesdits circuits intégrés de tête d'impression ;et chaque circuit intégré de tête d'impression comprenant une pluralité de connecteurs à travers du silicium (14) assurant une connexion électrique entre ladite circuiterie de pilotage et ladite extrémité de connexion dudit film de connecteur (8), chaque connecteur à travers du silicium s'étendant de manière linéaire à partir d'un plot de contact (24) dans ladite couche MEMS (26), à travers ladite couche CMOS (113) et à travers la totalité de l'épaisseur du substrat au silicium, ledit plot de contact (24) étant connecté électriquement à ladite couche CMOS.
- Ensemble tête d'impression à jet d'encre selon la revendication 1, dans lequel ledit film de connecteur (8) comprend un film polymère souple ayant une pluralité de pistes conductrices.
- Ensemble tête d'impression à jet d'encre selon la revendication 1, dans lequel ledit film de connecteur (8) est un film de transport automatique sur bande, TAB.
- Ensemble tête d'impression à jet d'encre selon la revendication 1, dans lequel ledit côté arrière (12) a une partie renfoncée (6) pour recevoir ledit film de connecteur.
- Ensemble tête d'impression à jet d'encre selon la revendication 1, dans lequel ladite partie renfoncée (6) est définie le long d'une région de bord longitudinale de chaque circuit intégré de tête d'impression (2).
- Ensemble tête d'impression à jet d'encre selon la revendication 1, dans lequel chaque connecteur à travers du silicium (14) s'étend de manière linéaire à partir dudit côté avant vers ledit côté arrière.
- Ensemble tête d'impression à jet d'encre selon la revendication 6, dans lequel chaque connecteur à travers du silicium (14) est effilé vers ledit côté arrière.
- Ensemble tête d'impression à jet d'encre selon la revendication 6, dans lequel chaque connecteur à travers du silicium (14) est composé de cuivre.
- Ensemble tête d'impression à jet d'encre selon la revendication 1, comprenant un ou plusieurs poteaux conducteurs (30) s'étendant de manière linéaire entre ledit plot de contact (24) et ladite couche CMOS (113) .
- Ensemble tête d'impression à jet d'encre selon la revendication 1, dans lequel chaque connecteur à travers du silicium (14) est isolé électriquement vis-à-vis de ladite couche CMOS.
- Ensemble tête d'impression à jet d'encre selon la revendication 10, dans lequel chaque connecteur à travers du silicium (14) a des parois latérales externes comprenant un film d'isolation (42).
- Ensemble tête d'impression à jet d'encre selon la revendication 11, dans lequel lesdites parois latérales externes comprennent une couche de barrière de diffusion (43) entre ledit film d'isolation (42) et une âme conductrice dudit connecteur à travers du silicium (14).
- Ensemble tête d'impression à jet d'encre selon la revendication 1, dans lequel chaque connecteur à travers du silicium (14) est connecté à ladite extrémité de connexion dudit film (8) au moyen d'une soudure.
- Ensemble tête d'impression à jet d'encre selon la revendication 1, dans lequel une face côté avant dudit circuit intégré de tête d'impression est plane et dépourvue de quelconques connexions par fil.
- Circuit intégré de tête d'impression destiné à être utilisé dans l'ensemble tête d'impression selon la revendication 1, le circuit intégré de tête d'impression comprenant :un substrat au silicium (20) ;un côté avant ayant au moins une couche CMOS (113) comprenant une circuiterie de pilotage et une couche MEMS (26) comprenant une pluralité d'ensembles buse de jet d'encre (101), ladite couche CMOS étant positionnée entre ledit substrat au silicium et ladite couche MEMS ;un côté arrière (12) destiné à être fixé à un collecteur d'alimentation en encre, le côté arrière ayant une partie renfoncée (6) destinée à recevoir un film de connecteur ; etau moins un canal d'alimentation en encre (110) assurant une communication fluidique entre ledit côté arrière et lesdits ensembles buse de jet d'encre ; etune pluralité de connecteurs à travers du silicium (14) s'étendant chacun de manière linéaire à partir d'un plot de contact (24) dans ladite couche MEMS (26), à travers ladite couche CMOS (113) et à travers la totalité de l'épaisseur du substrat au silicium, ledit plot de contact (24) étant connecté électriquement à ladite couche CMOS.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/AU2009/000953 WO2011011807A1 (fr) | 2009-07-27 | 2009-07-27 | Ensemble tête d'impression à jet d'encre à connexion électrique côté arrière |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP2496419A1 EP2496419A1 (fr) | 2012-09-12 |
| EP2496419A4 EP2496419A4 (fr) | 2014-02-19 |
| EP2496419B1 true EP2496419B1 (fr) | 2018-05-30 |
Family
ID=43528619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP09847677.3A Active EP2496419B1 (fr) | 2009-07-27 | 2009-07-27 | Ensemble tête d'impression à jet d'encre à connexion électrique côté arrière |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP2496419B1 (fr) |
| JP (1) | JP5475116B2 (fr) |
| KR (1) | KR101444560B1 (fr) |
| CN (1) | CN102470671B (fr) |
| SG (1) | SG176568A1 (fr) |
| WO (1) | WO2011011807A1 (fr) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9289974B2 (en) | 2013-04-29 | 2016-03-22 | Hewlett-Packard Development Company L.P. | Printhead control systems and methods for controlling a printhead |
| JP5864037B2 (ja) * | 2013-08-02 | 2016-02-17 | 富士フイルム株式会社 | 画像処理装置、撮像装置、画像処理方法及びプログラム |
| JP6492891B2 (ja) * | 2015-03-31 | 2019-04-03 | ブラザー工業株式会社 | 液体吐出装置及び液体吐出装置ユニット |
| JP6911170B2 (ja) * | 2016-02-24 | 2021-07-28 | ヒューレット−パッカード デベロップメント カンパニー エル．ピー．Ｈｅｗｌｅｔｔ‐Ｐａｃｋａｒｄ Ｄｅｖｅｌｏｐｍｅｎｔ Ｃｏｍｐａｎｙ， Ｌ．Ｐ． | 集積回路を含む流体吐出デバイス |
| TWI789529B (zh) | 2018-07-30 | 2023-01-11 | 瑞士商西克帕控股有限公司 | 多晶片模組(mcm)組件 |
| US11390081B2 (en) | 2019-02-06 | 2022-07-19 | Hewlett-Packard Development Company, L.P. | Fluid ejection device with a carrier having a slot |
| AU2019428237B2 (en) | 2019-02-06 | 2023-06-01 | Hewlett-Packard Development Company, L.P. | Fluid ejection devices including electrical interconnect elements for fluid ejection dies |
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| JP3309341B2 (ja) * | 1992-08-05 | 2002-07-29 | 株式会社吉野工業所 | チューブ容器供給装置 |
| US6536882B1 (en) * | 2000-07-26 | 2003-03-25 | Eastman Kodak Company | Inkjet printhead having substrate feedthroughs for accommodating conductors |
| US6394580B1 (en) | 2001-03-20 | 2002-05-28 | Hewlett-Packard Company | Electrical interconnection for wide-array inkjet printhead assembly |
| US6727115B2 (en) | 2001-10-31 | 2004-04-27 | Hewlett-Packard Development Company, L.P. | Back-side through-hole interconnection of a die to a substrate |
| US6902872B2 (en) * | 2002-07-29 | 2005-06-07 | Hewlett-Packard Development Company, L.P. | Method of forming a through-substrate interconnect |
| US6755509B2 (en) | 2002-11-23 | 2004-06-29 | Silverbrook Research Pty Ltd | Thermal ink jet printhead with suspended beam heater |
| JP2005044927A (ja) * | 2003-07-25 | 2005-02-17 | Kyocera Corp | 圧電アクチュエータ及びその製造方法並びに液体吐出装置 |
| JP4456609B2 (ja) * | 2004-01-21 | 2010-04-28 | シルバーブルック リサーチ ピーティワイ リミテッド | 印字ヘッドアセンブリおよび印字ヘッドモジュール |
| US7524016B2 (en) * | 2004-01-21 | 2009-04-28 | Silverbrook Research Pty Ltd | Cartridge unit having negatively pressurized ink storage |
| US7441865B2 (en) | 2004-01-21 | 2008-10-28 | Silverbrook Research Pty Ltd | Printhead chip having longitudinal ink supply channels |
| GB2410467A (en) * | 2004-01-30 | 2005-08-03 | Hewlett Packard Development Co | A method of making an inkjet printhead |
| US7275805B2 (en) | 2004-05-27 | 2007-10-02 | Silverbrook Research Pty Ltd | Printhead comprising different printhead modules |
| US7690767B2 (en) * | 2004-07-22 | 2010-04-06 | Canon Kabushiki Kaisha | Ink jet recording head and ink jet recording apparatus |
| US7303930B2 (en) | 2005-10-11 | 2007-12-04 | Silverbrook Research Pty Ltd | Method of fabricating suspended beam in a MEMS process |
| US7438371B2 (en) | 2005-12-05 | 2008-10-21 | Silverbrook Research Pty Ltd | Method of modulating printhead peak power requirement using redundant nozzles |
| JP2007326340A (ja) * | 2006-06-09 | 2007-12-20 | Canon Inc | インクジェット記録ヘッドおよびその製造方法 |
| JP4819608B2 (ja) * | 2006-07-31 | 2011-11-24 | 富士フイルム株式会社 | 液体吐出ヘッド、液体吐出装置、及び画像形成装置 |
| US7984973B2 (en) | 2006-12-04 | 2011-07-26 | Silverbrook Research Pty Ltd | Thermal bend actuator comprising aluminium alloy |
| US7669967B2 (en) | 2007-03-12 | 2010-03-02 | Silverbrook Research Pty Ltd | Printhead having hydrophobic polymer coated on ink ejection face |
| US7794613B2 (en) | 2007-03-12 | 2010-09-14 | Silverbrook Research Pty Ltd | Method of fabricating printhead having hydrophobic ink ejection face |
| US7938974B2 (en) | 2007-03-12 | 2011-05-10 | Silverbrook Research Pty Ltd | Method of fabricating printhead using metal film for protecting hydrophobic ink ejection face |
| US7819503B2 (en) | 2007-06-15 | 2010-10-26 | Silverbrook Research Pty Ltd | Printhead integrated circuit comprising inkjet nozzle assemblies having connector posts |
| US8029097B2 (en) | 2008-11-26 | 2011-10-04 | Silverbrook Research Pty Ltd | Inkjet nozzle assembly having moving roof structure and sealing bridge |
-
2009
- 2009-07-27 EP EP09847677.3A patent/EP2496419B1/fr active Active
- 2009-07-27 JP JP2012514289A patent/JP5475116B2/ja active Active
- 2009-07-27 CN CN200980160208.7A patent/CN102470671B/zh active Active
- 2009-07-27 SG SG2011085248A patent/SG176568A1/en unknown
- 2009-07-27 WO PCT/AU2009/000953 patent/WO2011011807A1/fr active Application Filing
- 2009-07-27 KR KR1020127000846A patent/KR101444560B1/ko active IP Right Grant
Non-Patent Citations (1)
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| None * |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2496419A1 (fr) | 2012-09-12 |
| EP2496419A4 (fr) | 2014-02-19 |
| CN102470671A (zh) | 2012-05-23 |
| KR101444560B1 (ko) | 2014-10-07 |
| JP5475116B2 (ja) | 2014-04-16 |
| CN102470671B (zh) | 2014-11-26 |
| JP2012529384A (ja) | 2012-11-22 |
| SG176568A1 (en) | 2012-01-30 |
| KR20120031499A (ko) | 2012-04-03 |
| WO2011011807A1 (fr) | 2011-02-03 |
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