Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
  • H01B7/00—Insulated conductors or cables characterised by their form
  • H01B7/17—Protection against damage caused by external factors, e.g. sheaths or armouring
  • H01B7/28—Protection against damage caused by moisture, corrosion, chemical attack or weather
  • H01B7/2813—Protection against damage caused by electrical, chemical or water tree deterioration
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
  • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
  • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
  • H01B3/28—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances natural or synthetic rubbers

Definitions

• the invention relates to a coated insulating film with increased corona resistance in the electric field.
• Corona-stable PI films can be used for the conductor insulation. These films are very expensive and are only offered by one manufacturer. For the main insulation mica coated surface insulation materials are used. Again, this solution is expensive and difficult to handle. There is a risk in the winding that the mica particles peel off.
• As polymer films, ie as a carrier for the mica particles mainly (polyethylene terephthalate) PET, (polyethylene naphthalate) PEN and (polyimide) PI films are used.
• a disadvantage of the known solutions is that the herge ⁇ presented isolations are difficult to use and expensive. For example, in the winding around the conductor low bending radii of the mica coated films can not be realized because the mica otherwise peel off. Since the insulation films generally after the winding impregnated with resin for mechanical stability or, in the case of glimmering mer ambiencen materials already used as a resin-impregnated semi ⁇ imaging (so-called. Resin Rich materials) used ⁇ to, the danger of defect sites in the resin impregnation, the lower the corona resistance, and thus jeopardize the duration reliability of the insulation, at the Isola ⁇ functions after State of the art given.
• Object of the present invention is, therefore, an iso-regulation ⁇ for electrical machines, in particular transformers reindeer, to produce motors generators which exhibit improved corona stability with good insulation of the electrical equipment.
• the subject of the present invention is an electrical surface insulation with high corona stability ge ⁇ erosion in the electric field, a polymer film as a carrier, with one or both sides, partially or over the entire surface applied coating of a closely meshed and thus difficult to be converted into the gas phase inorganic or partially inorganic non-conductive material.
• the subject of the present invention is a process for producing the improved insulation by gas deposition or by wet-chemical processes.
• High corona resistance is present in this case, for example, with a local material removal of less than 250 ym, preferably less than 150 ym, preferably less than 100 ym, in particular be ⁇ preferred from less than 50 ym of mecanicnisolier fürs egg ⁇ ner electrode with a diameter of 6 mm at an E Field load of 6.5 V / ym for 240 hours, equated "Under" an electrode means that the electrode rests directly, but without pressure.
• crosslinking points refers to the ato ⁇ centered centers, the chemical bond between two or more finished molecular parts, also called monomer units produce.
• the inventive compact and smooth coating smaller bending radii can be achieved than is possible with ⁇ play, in the mica-coated films. Difficulties in defect-free impregnation of the mica-coated films can continue to occur in the coated films according to the invention, since the compact, smooth surface of the coating can be easily impregnated. This increases the reliability and durability of the insulation system in use. An improved Wettetz ⁇ ability of the film with the resin through the coating further promotes reliability.
• the coating material of a refractory inorganic material such as a ceramic material such as a titanate or of a partially inorganic material such as the so-called non-metallic hybrid polymers.
• the inorganic material is, for example, a nitride such as the trisilicon tetranitride S1 3 N 4 having a melting point of 1900 ° C.
• phosphates or oxides Kings ⁇ NEN are used here to advantage.
• Further materials may be: silicon carbide (SiC), barium titanate (BaTiO3), silicon nitride (SiN) or derivatives of these materials as well as all other ceramic compounds.
• the inorganic or partially inorganic non-conductive coatings can be applied to the polymer films by means of low-pressure PVD or low-pressure CVD or atmospheric-pressure plasma polymer coating methods.
• silanes and siloxanes can be applied as coatings to the polymer films by way of the sol-gel process, which form, for example, a SiO backbone framework, which is cross-linked and thus again the property that the coating is difficult to evaporate fulfilled.
• Prepo- mers for the sol-gel synthesis come silanes, siloxanes, or ⁇ ganisch modified silanes or mixtures thereof in question.
• the properties of the sol-gel layers can be adapted.
• layers can be realized which are based on interpenetrating networks of such sol-gel condensates and the organic polymers.
• Suitable polymer films more may be enumerated, for example, is suitable standard materials such as polyethylene ⁇ (PE), polypropylene (PP), polyvinyl chloride (PVC), polyether terephthalate (PET) or polyethylene naphthalate (PEN), as well as other thermoset and high temperature stable Fo ⁇
• PE polyethylene ⁇
• PVC polypropylene
• PVC polyvinyl chloride
• PET polyether terephthalate
• PEN polyethylene naphthalate
• PI polyimide
• PEEK polyetheretherketone
• PEI polyetherimide
• PES polyethersulfone
• LCP liquid crystal polymer
• the thickness of the layer may vary, for example, it may be less than 500 ⁇ , in particular less than 100 ⁇ and more preferably between 5 nm and 150 ⁇ . It will be evident ⁇ Lich that applied Schich ⁇ th are significantly thicker by wet chemical methods than those applied by vacuum deposition in layers. The wet-chemically generated
• PVD or CVD coatings of around 50 nm can produce a significant improvement in the corona resistance of the films against partial electrical discharge.
• One possibility is the coating by means of wet-chemical materials, which are applied in the sol-gel process. Even in this case, significant improvements can already be achieved by thin layers in the range of a few ym. Both the gas phase deposition and the sol-gel coating can be easily automated, thus providing highly scalable coating processes.
• Expensive erosion stable PI-foil or mica coated films of PET or PEN for the partial or Hauptleiterisolie ⁇ tion can be replaced by these low-cost coated films.
• the handling of the films, for example, in a winding process is much easier than for a mica particle-coated film, since due to the compact coating flaking of the mica particles can not auftre ⁇ th. This also allows smaller bending radii to be realized.
• the resin impregnation of the coated films is also more reliable than the impregnation of the mica particles.
• a risk of life-reducing defects due to defective impregnation of the mica tape does not occur in the coated film. Due to the compact and smooth coating, depending on the version, in general even an improved resin wetting compared to the uncoated foil is achieved.
• the figure shows the scheme of construction of an exemplary embodiment of the film according to the invention.
• the coating 2 and 3 are made of finely crosslinked and difficult to be converted into the gas phase inorganic or partially inorganic non-conductive material.
• This coating which is also referred to as the "electrical barrier layer” has a higher rigidity and brittleness than the polymer film, which usually also reduces the elongation at break of the polymer film elasticizing layer 4 or 5 is coated.
• ⁇ are all suitable elastic polymeric Be Anlagenungssys- systems such as PU, epoxy resin, silicones and / or acrylates, etc.
• These elasticizing compensating layer has, in a part before ⁇ exemplary embodiment, layer thicknesses in the range of 0.1 100 bi It is applied wet-chemically by means of printing, doctoring, dipping or other inline-capable processes advantageously in the roll-to-roll process.
• This invention discloses for the first time a coating of standard PET films with inorganic or partially inorganic layers such as SiOx, Al 2 O 3, Si 3 N 4, etc., which can be applied by low pressure PVD, low pressure CVD, or atmospheric pressure plasma polymer coating processes , which simultaneously leads to increased corona stability of the film and an at least constant mechanical Festig ⁇ speed (even under thermal aging) as for the uncoated film.
• inorganic or partially inorganic layers such as SiOx, Al 2 O 3, Si 3 N 4, etc.
• the resistance to erosion in the electric field is significantly improved in the case of the polymer film under permanent partial discharge loading.
• all non-metallic, non-conductive layers with high crosslinking density and inorganic proportions are suitable.

Landscapes

• Physics & Mathematics (AREA)
• Spectroscopy & Molecular Physics (AREA)
• Organic Insulating Materials (AREA)
• Insulated Conductors (AREA)
• Laminated Bodies (AREA)
• Application Of Or Painting With Fluid Materials (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=43533343

Family Applications (1)

Country Status (5)

Families Citing this family (2)

Family Cites Families (13)

• 2009
  • 2009-11-10 DE DE102009052432A patent/DE102009052432A1/de not_active Ceased
• 2010
  • 2010-10-29 EP EP10784270A patent/EP2483893A1/de not_active Withdrawn
  • 2010-10-29 WO PCT/EP2010/066492 patent/WO2011057905A1/de active Application Filing
  • 2010-10-29 CN CN2010800511172A patent/CN102696076A/zh active Pending
• 2011
  • 2011-10-29 US US13/509,198 patent/US20120225319A1/en not_active Abandoned

Non-Patent Citations (1)

Also Published As

Similar Documents

Legal Events