EP2482304A1 - Plasma Reaction Method and Plasma Reaction Device - Google Patents

Plasma Reaction Method and Plasma Reaction Device Download PDF

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Publication number
EP2482304A1
EP2482304A1 EP12150890A EP12150890A EP2482304A1 EP 2482304 A1 EP2482304 A1 EP 2482304A1 EP 12150890 A EP12150890 A EP 12150890A EP 12150890 A EP12150890 A EP 12150890A EP 2482304 A1 EP2482304 A1 EP 2482304A1
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EP
European Patent Office
Prior art keywords
conductive coil
closed space
plasma reaction
energy
magnetic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP12150890A
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German (de)
English (en)
French (fr)
Inventor
Ping-Li Lai
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Individual
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Individual
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Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of EP2482304A1 publication Critical patent/EP2482304A1/en
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/327—Arrangements for generating the plasma

Definitions

  • the present invention relates generally to a plasma reaction method and a plasma reaction device.
  • the plasma reaction method includes steps of: installing at least one conductive coil set in a closed space; filling a reaction fluid into the closed space; and applying an electric field and/or a magnetic field to the conductive coil set to carry out plasma reaction.
  • the plasma reaction method and device in the closed space, the transformation between electric energy and electric energy, electric energy and magnetic energy, magnetic energy and magnetic energy and electrons of the materials can be more efficiently performed.
  • a solenoid is formed of a uniformly spiraled elongated conductive wire. According to Ampere's Circuit Law, when the solenoid is powered on, a uniform magnetic field is created in the solenoid. It is known that a solenoid with a soft iron core (magnetic iron material) positioned therein has a magnetic flux much greater than the magnetic flux of a hollow solenoid. However, an eddy current will be produced in the soft iron core (magnetic iron material) to generate heat and cause loss of magnetic energy or interference.
  • the soft iron core (magnetic iron material) can be replaced with thinner multilayer laminated silicon steel sheets to lower the saturation of magnetic path and reduce eddy current. Accordingly, the problems of heat and loss of energy due to the eddy current can be properly solved. However, the eddy current still can be hardly thoroughly eliminated so that the problems of heat and the resultant loss of energy still exist. This is because air is a medium with very high magnetic resistance. Therefore, the magnetic flux inside the solenoid can be hardly increased.
  • Plasma is a material in a plasma state, which is mainly composed of high-energy electrons, high-energy ions and high-energy neutral atoms. Plasma has a very high electrical conductivity. Plasma was discovered by Sir William Crookes in 1879. Plasma is a gas mass with high potential energy and high kinetic energy. Plasma carries such a total charge that it is neutral. The outer layer of electrons are struck out by the high kinetic energy of the electric and/or magnetic field to escape from the confinement of the atomic nucleus and become free electrons with high potential energy and high kinetic energy.
  • Plasma is widely applied in various fields. For example, plasma is used to manufacture displays. Also, ion deposition technique and coating control technique are used to improve the textures and structures of coatings and expedite chemical reaction processes so as to facilitate formation of compound coatings.
  • the plasma reaction is generally performed "between two electrode plates".
  • plasma is alternatively produced by means of a solenoid.
  • the produced plasma is "additionally taken out and transferred" for other specified usages rather than kept in the original site in which the plasma is produced.
  • all of the above ion deposition technique, coating control technique, display technique, etc. pertain to such sort of techniques.
  • air is a medium with very high magnetic resistance. Therefore, the magnetic flux inside the solenoid can be hardly increased.
  • the soft iron core (magnetic iron material) can be replaced with thinner multilayer laminated silicon steel sheets to lower the saturation of magnetic path and reduce eddy current. In this case, the problems of heat and the resultant loss of energy due to the eddy current can be properly solved. However, this will lead to increase of volume and weight of the device. Moreover, the eddy current still can be hardly thoroughly eliminated. As a result, the transformation between electric energy and electric energy, electric energy and magnetic energy, magnetic energy and magnetic energy and electrons of the materials can be hardly efficiently performed.
  • a reaction fluid (“fluid” means gas or liquid) is filled in the closed space.
  • An electric field and/or a magnetic field is applied to the conductive coil set, whereby the conductive coil and the reaction fluid in the closed space interact on each other to carry out plasma reaction in the closed space.
  • the multiple conductive coil sets are symmetrically arranged.
  • It is still a further object of the present invention to provide a plasma reaction device including a closed space and at least one conductive coil set installed in the closed space.
  • a reaction fluid is filled in the closed space.
  • An electric field and/or a magnetic field is applied to the conductive coil set, whereby the conductive coil and the reaction fluid in the closed space interact on each other to carry out plasma reaction in the closed space.
  • the plasma reaction device includes one or multiple conductive coil sets.
  • the multiple conductive coil sets are symmetrically arranged.
  • the conductive coil set or at least one of the conductive coil sets has at least one terminal extending out of the closed space. Accordingly, the electric field and/or magnetic field can be applied to the conductive coil by way of conduction.
  • the conductive coil set or at least one of the conductive coil sets has at least one terminal sealedly enclosed in the closed space without contacting the exterior of the closed space, whereby the magnetic field can be applied to the conductive coil by way of induction.
  • the present invention relates to a plasma reaction method in which at least one conductive coil set 22 is installed in a closed space 21.
  • a reaction fluid 23 ("fluid" means gas or liquid) is filled in the closed space 21.
  • An electric field and/or a magnetic field is applied to the conductive coil set 22, whereby the surface particles of the conductive coil 22 in the closed space 21 are ionized by the magnetic field or electric field into high-energy electrons, high-energy ions and high-energy neutral atoms.
  • the conductive coil 22 and the reaction fluid 23 in the closed space 21 interact on each other to carry out plasma reaction in the closed space 21. Therefore, in the closed space 21, the transformation between electric energy and electric energy, electric energy and magnetic energy, magnetic energy and magnetic energy and electrons of the materials can be more efficiently performed.
  • one or multiple means two or more
  • the multiple conductive coil sets 22 are symmetrically arranged.
  • the conductive coil set 22 or at least one of the conductive coil sets 22 has at least one terminal 221 (or 222) extending out of the closed space 21. Accordingly, the terminal 221 can be connected to an external power supply to power on the conductive coil 22 sealedly enclosed in the closed space 21. In this case, the electric field and/or magnetic field can be applied to the conductive coil 22 by way of conduction.
  • the conductive coil set 22 or at least one of the conductive coil sets 22 has at least one terminal 222 (or 221) sealedly enclosed in the closed space 21 without contacting the exterior of the closed space 21.
  • the magnetic field can be applied to the conductive coil 22 by way of induction.
  • the present invention also relates to a plasma reaction device 20 including a closed space 21 and at least one conductive coil set 22 installed in the closed space 21.
  • a reaction fluid 23 is filled in the closed space 21.
  • An electric field and/or a magnetic field is applied to the conductive coil set 22, whereby the surface particles of the conductive coil 22 in the closed space 21 are ionized by the magnetic field or electric field into high-energy electrons, high-energy ions and high-energy neutral atoms.
  • the conductive coil 22 and the reaction fluid 23 in the closed space 21 interact on each other to carry out plasma reaction in the closed space 21. Therefore, in the closed space 21, the transformation between electric energy and electric energy, electric energy and magnetic energy, magnetic energy and magnetic energy and electrons of the materials can be more efficiently performed.
  • Figs. 1 to 10 Please further refer to Figs. 1 to 10 .
  • one or multiple conductive coil sets 22 are arranged in the closed space 21. As shown in Figs. 4 and 5 , the multiple conductive coil sets 22 are symmetrically arranged.
  • the conductive coil set 22 or at least one of the conductive coil sets 22 has at least one terminal 221 (or 222) extending out of the closed space 21.
  • the electric field and/or magnetic field can be applied to the conductive coil 22 by way of conduction.
  • the conductive coil set 22 or at least one of the conductive coil sets 22 has at least one terminal 222 (or 221) sealedly enclosed in the closed space 21 without contacting the exterior of the closed space 21.
  • the magnetic field can be applied to the conductive coil 22 by way of induction.
  • the conductive coil 22 only needs to be partially exposed to contact the reaction fluid 23 for plasma reaction.
  • the exposed parts of the conductive coil 22 are not in contact with each other so as to avoid short-circuit.
  • the conductive coil 22 can be, but not limited to, a bare conductive wire (as shown in Figs. 1 to 7 ), a stranded wire (not shown) or a conductive plate (with a bare face and an insulation face as shown in Figs. 8 and 10 ).
  • the plasma reaction method and plasma reaction device of the present invention have the following advantages:

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Or Chemical Processes And Apparatus (AREA)
  • Plasma Technology (AREA)
  • Soft Magnetic Materials (AREA)
EP12150890A 2011-01-26 2012-01-12 Plasma Reaction Method and Plasma Reaction Device Withdrawn EP2482304A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW100102842A TW201233253A (en) 2011-01-26 2011-01-26 Plasma reaction method and apparatus

Publications (1)

Publication Number Publication Date
EP2482304A1 true EP2482304A1 (en) 2012-08-01

Family

ID=45445961

Family Applications (1)

Application Number Title Priority Date Filing Date
EP12150890A Withdrawn EP2482304A1 (en) 2011-01-26 2012-01-12 Plasma Reaction Method and Plasma Reaction Device

Country Status (5)

Country Link
US (1) US20120189783A1 (zh)
EP (1) EP2482304A1 (zh)
JP (1) JP2012152732A (zh)
CN (1) CN102625562A (zh)
TW (1) TW201233253A (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018084596A (ja) 2016-11-21 2018-05-31 マクセル株式会社 情報表示装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998056027A1 (en) * 1997-06-05 1998-12-10 Applied Materials, Inc. Rf plasma etch reactor with internal inductive coil antenna and electrically conductive chamber walls
US6158384A (en) * 1997-06-05 2000-12-12 Applied Materials, Inc. Plasma reactor with multiple small internal inductive antennas
EP1146013A1 (en) * 1998-12-28 2001-10-17 Osaka Gas Company Limited Amorphous nano-scale carbon tube and production method therefor
EP1834925A1 (en) * 2005-01-05 2007-09-19 Dialight Japan Co., Ltd. Apparatus for manufacturing carbon film by plasma cvd, method for manufacturing the same, and carbon film
US20080078506A1 (en) * 2006-09-29 2008-04-03 Zyvex Corporation RF Coil Plasma Generation

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5773175A (en) * 1980-10-23 1982-05-07 Kobe Steel Ltd Chemical vapor deposition device
JPH0111721Y2 (zh) * 1986-11-04 1989-04-06
JPH1092596A (ja) * 1996-09-13 1998-04-10 Toshiba Corp 薄膜形成装置及び薄膜形成方法
JP4122467B2 (ja) * 1998-02-17 2008-07-23 株式会社東芝 高周波放電装置及び高周波処理装置
JP4509337B2 (ja) * 2000-09-04 2010-07-21 株式会社Ｉｈｉ 薄膜形成方法及び薄膜形成装置
JP4867124B2 (ja) * 2000-05-17 2012-02-01 株式会社Ｉｈｉ プラズマｃｖｄ装置及び方法
JP2002008982A (ja) * 2000-06-19 2002-01-11 Tokuyama Corp プラズマｃｖｄ装置
JP2006188382A (ja) * 2005-01-05 2006-07-20 Dialight Japan Co Ltd カーボンナノチューブの製造方法
GB0713821D0 (en) * 2007-07-17 2007-08-29 P2I Ltd A plasma deposition apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998056027A1 (en) * 1997-06-05 1998-12-10 Applied Materials, Inc. Rf plasma etch reactor with internal inductive coil antenna and electrically conductive chamber walls
US6158384A (en) * 1997-06-05 2000-12-12 Applied Materials, Inc. Plasma reactor with multiple small internal inductive antennas
EP1146013A1 (en) * 1998-12-28 2001-10-17 Osaka Gas Company Limited Amorphous nano-scale carbon tube and production method therefor
EP1834925A1 (en) * 2005-01-05 2007-09-19 Dialight Japan Co., Ltd. Apparatus for manufacturing carbon film by plasma cvd, method for manufacturing the same, and carbon film
US20080078506A1 (en) * 2006-09-29 2008-04-03 Zyvex Corporation RF Coil Plasma Generation

Also Published As

Publication number Publication date
CN102625562A (zh) 2012-08-01
US20120189783A1 (en) 2012-07-26
JP2012152732A (ja) 2012-08-16
TW201233253A (en) 2012-08-01

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