EP2443694A1 - Filtre à cavité - Google Patents

Filtre à cavité

Info

Publication number
EP2443694A1
EP2443694A1 EP10722957A EP10722957A EP2443694A1 EP 2443694 A1 EP2443694 A1 EP 2443694A1 EP 10722957 A EP10722957 A EP 10722957A EP 10722957 A EP10722957 A EP 10722957A EP 2443694 A1 EP2443694 A1 EP 2443694A1
Authority
EP
European Patent Office
Prior art keywords
housing
circuit board
electrically conductive
printed circuit
cavity filter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP10722957A
Other languages
German (de)
English (en)
Other versions
EP2443694B1 (fr
Inventor
Thomas Kapfinger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kathrein Mobilcom Austria GmbH
Original Assignee
Kathrein Austria GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kathrein Austria GmbH filed Critical Kathrein Austria GmbH
Publication of EP2443694A1 publication Critical patent/EP2443694A1/fr
Application granted granted Critical
Publication of EP2443694B1 publication Critical patent/EP2443694B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/205—Comb or interdigital filters; Cascaded coaxial cavities
    • H01P1/2053—Comb or interdigital filters; Cascaded coaxial cavities the coaxial cavity resonators being disposed parall to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P7/00—Resonators of the waveguide type
    • H01P7/04—Coaxial resonators

Definitions

  • the invention relates to a cavity filter according to the preamble of claim 1.
  • a common antenna is often used for transmit and receive signals.
  • the transmit or receive signals each use different frequency ranges, and the antenna must be capable of transmitting and receiving in both frequency ranges.
  • a suitable frequency filtering is required, with the one hand, the transmission signals from the transmitter to the antenna and on the other hand, the received signals are forwarded from the antenna to the receiver.
  • high-frequency filters in a coaxial design are nowadays used inter alia.
  • Coaxial cavity high-frequency cavity filters comprise coaxial resonators in which an outer conductor housing Resonator cavities are formed in which inner conductors are arranged in the form of inner conductor tubes.
  • the inner conductor tubes each have a free end which lies adjacent to a housing cover, which is arranged on the upper side of the housing.
  • a high-frequency filter has become known, for example, from WO 2006/063640 Al.
  • the generic high-frequency filter can consist of a plurality of resonators which each comprise an outer conductor housing, a housing bottom and a preferably coaxial with the outer conductor arranged inner conductor, which usually ends at a distance below the housing can be placed on the housing - lid.
  • HF filters are made of a metal housing, usually an aluminum housing, for example formed as a milling or casting component, so that no intermodulation problems occur due to joints in the filter.
  • the housing lid is also usually made of a metal, i. made of a milling or casting, for example made of aluminum, wherein the housing cover to achieve a good electrical contact with the housing is also preferably silvered.
  • the housing cover is provided at its peripheral edge with a series of holes which are aligned with corresponding threaded holes in the housing walls of the cavity filter, so that by screwing the housing cover can be firmly attached to the actual housing to thereby a high-frequency-density assembly to ensure the lid.
  • a generic high frequency filter has become known, for example, from US 3,955,161 A. It describes a housing construction with several high-frequency chambers with inner conductors rising from the floor towards the cover. Both the high frequency filter housing and the high frequency filter housing closing high frequency filter cover are made of plastic. Both consist of a plastic casting. All surfaces of the HF housing and the HF lid are covered with an electrically conductive layer inside and outside.
  • the screw shafts are aligned with the arranged in the high-frequency filter inner conductors axially.
  • the effective distance between the leading end side of the screw shank and the opposite end face of the inner conductor can thus be increased or decreased, whereby a corresponding high-frequency filter can be tuned in a known manner.
  • a high-frequency filter has basically also become known from US Pat. No. 5,329,687 A.
  • This HF filter also comprises an HF housing and an HF cover, which in turn consist of a cast dielectric material, which was then coated with an electrically conductive layer.
  • tuning screws are used, which can be turned on and off at different heights via corresponding holes in the HF cover and thereby further or less far into a speak speaking axial recess in an underlying inner conductor of the RF housing.
  • the HF filter can be tuned in a known manner.
  • the object of the present invention is to provide an improved high-frequency filter, which conventionally comprises a housing and a cover closing the housing interior.
  • the printed circuit board material is provided with an electrically conductive layer, preferably a copper layer.
  • the Leiterplatinendeckel is like conventional cover also preferably fastened by screws to the housing walls of the cavity filter by screws and electrically-galvanically connected to the housing, which is why the electrically conductive layer preferably in the form of a copper layer plus a possible additional layer as finishing such.
  • the electrically conductive layer preferably in the form of a copper layer plus a possible additional layer as finishing such.
  • silver, gold or tin comes to rest with the housing inner side of the cavity filter.
  • a printed circuit board as a lid results in a material-related relatively soft conductive layer on the printed circuit board, preferably in the form of said copper layer, wherein by screwing the lid with a corresponding torque on the filter housing a 100% - HF-tight connection are guaranteed for the first time can. Above all, this results in a further cost savings, since it is not necessary to produce and use a lid molded separately from plastic, but printed circuit boards that are available on the market at very low cost are used directly as covers.
  • a sleeve member provided with an internal thread can be inserted into the printed circuit board in a corresponding bore and, for example, with a circumferential flange on the inside of the HF filter to the electrically conductive layer adjacent (namely soldered) inserted, in which one with an external thread Providing tuning element is far different screwed into the cavity filter to tune the filter accordingly or to set a corresponding resonant frequency.
  • the tuning jack which is inserted in a bore of the printed circuit board is soldered to the formed on the printed circuit board electrically conductive layer, thereby intermodulation problems are avoided.
  • the printed circuit board material is provided in the current process, for example with a structuring.
  • the structuring can be designed in this case that thereby, for example, DC lines (DC lines), a mitbeückbare with the circuit board electronics, RF coupling, etc. can be realized.
  • the electrically conductive ground plane which completely closes off the coaxial resonator (blocking pot / cup circuit) on the upper side of the housing is a fundamental component of the cavity filter.
  • Figure 1 a cross-sectional view through a cavity filter with a plurality of juxtaposed (coupled) resonators with attached lid;
  • FIG. 2 shows a plan view of the exemplary embodiment according to FIG. 1;
  • Figure 3 a cross-sectional view through the
  • FIG. 1 shown detail X, which relates to the tuning element
  • FIG. 5 an enlarged detail of the
  • the invention for a cavity filter will be described below with reference to an embodiment, which may for example also be designed as a duplexer, as a bandpass filter or as a band rejection filter, etc.
  • the high-frequency cavity filter 1 which is also sometimes referred to below as an RF cavity filter 1, comprises a housing 3 with a bottom 5 and a plurality of internal conductors 7 extending vertically from the bottom over a partial height of the housing 3.
  • the individual RF cavity filters shown in FIGS. 1 and 2 are each subdivided into chambers 101, which are separated by boundary walls 105 from a next adjacent individual RF cavity filter 101, the boundary walls 105 each extending from two of the side wall portions 6 inwardly projecting wall portions 105 'are formed.
  • the individual HF filters 1 being coupled together via these apertures or windows 107 (FIG. 3).
  • the cavity filter has, for example, an input connection in the form of a coupling-in region 9 and an output connection in the form of a decoupling region 11, which has a coupling-in disk 9 '(capacitive coupling) or a coil or a wire (in the case of an inductive coupling) comprises or may comprise, wherein the relevant coupling disc or the relevant coupling coil or the relevant coupling wire inside with the reference numerals 9 'and 11' for feeding or decoupling an electromagnetic wave are designated , Conventional coaxial connectors with corresponding cable connections can be connected to the input or output connection.
  • the thus constructed housing 3 with the housing bottom 5 and the inner conductor 7 is formed from a milling or casting, namely of metal or of a metal alloy. Preferably aluminum is used for this purpose. Since the inner conductor is connected to the housing bottom integrally or screwed, this intermodulation problems are avoided.
  • a housing cover 17 is placed and screwed with a plurality of screws 19 with the housing 3 fixed.
  • the housing cover 17 consists of a printed circuit board 21, that is generally of a plate material 121, which compared to the used Metal for the housing, to the bottom and to the inner conductor circumferentially arranged housing walls 6 at least slightly nachgebbar and / or at least slightly deformable.
  • the copper layer 25 provided on the plate material 121 is compared is softer, more flexible and / or elastic, that is easier to deform with the conventional made of metal housing cover 17.
  • the thickness of the printed circuit board 21 or the plate material 121 may be significantly smaller than the thickness of the wall or the bottom or the inner conductor of the RF cavity filter.
  • the thickness of the printed circuit board may, as usual, be less than 5 mm, in particular less than 4 mm, less than 3 mm and less than 2 mm, for example by 1 mm (and below).
  • the minimum thickness is added 1.0 mm, 0.8 mm, 0.5 mm, 0.1 mm or slightly above it.
  • the total thickness of printed circuit board and of a conductive ground layer 25, which will be discussed below may be, for example, 1.5 mm. This thickness D is shown for example in FIG.
  • the electrically conductive layer of the printed circuit board preferably in the form of copper
  • the thickness of the electrically conductive layer can be, for example, 1 ⁇ m to 300 ⁇ m, in particular 2 ⁇ m to 200 ⁇ m, 3 ⁇ m to 2 ⁇ m or 10 ⁇ m to 50 ⁇ m, above all, as mentioned, 30 ⁇ m to 40 ⁇ m.
  • the thickness of the copper layer or the electrically conductive layer 25, 26 has, for example, a thickness which is less than 20%, in particular less than 10%, 8%, 6%, 4%, 2%, 1% or even less than 0.5% or 0.1% of the thickness of the associated printed circuit board 21.
  • the thickness can also be chosen such that the copper layer is more than 0.1%, in particular more than 0.5%, 1%, 2%, 4%, 6%, 8%, 10% or more than 15% of the thickness of the printed circuit board 21. In other words, thickness ranges of 1% to 5% of the thickness of the printed circuit board 21 are particularly favorable.
  • an electrically conductive layer 25 preferably in the form of a copper layer 25 'and optionally an additional layer 26 (see Figures 4 and 5) as a finishing layer, said optional layer 26 of a noble metal such as silver or gold or tin.
  • a tuning sleeve 31 may be used, which is electrically conductive on its outer circumference or preferably made of metal and according to the embodiment shown has a circumferential stop ring 33, so that a tuning so formed Sleeve 31 can be inserted from below into the respective bore 29 until the stop ring 33 abuts the electrically conductive layer 25.
  • the circumferential outer edge 33 ' is preferably soldered to the adjacent electrically conductive layer 25, preferably in the form of the copper layer 25', wherein the soldering thus formed, ie the solder ring thus formed by the reference numeral 35 in Figure 3 and Figure 4 is marked.
  • the inner conductor is in contrast even provided with a larger diameter and with an axial, extending from its upper end down over a partial length inner recess 7b ( Figure 1), so that here the tuning stub 37 ', if necessary, to achieve a different vote the cavity film ters can also dip into this inner recess 7b.
  • the tuning element 37 with the tuning sleeve 31 and their arrangement in the cover forming the printed circuit board 21 is shown as an enlarged detail X in Figure 4 separately.
  • a multiplicity of fastening bores 41 are introduced on the printed circuit board 21 offset from one another on the outer circumference, which are aligned with corresponding bores 43 which are parallel to the axial orientation of the inner conductor and thus perpendicular to the Level of the printed circuit board 21 are incorporated into the housing wall material 6.
  • These holes 43 may be provided with a corresponding internal thread suitable for the screws 19 used or otherwise be dimensioned so that corresponding fastening screws 19 can notch when screwing into the holes 43 in the housing wall material 6 of the housing 3.
  • the electrically conductive layer 25, that is, the ground surface formed, preferably in the form of a copper layer 25 'plus a possibly possible additional layer 26, which serves as a finishing and consists for example of silver, gold or tin, which completely closes the coaxial resonator, that is to say, for example, the blocking pot or the cup circle on the upper side of the housing 3, is a fundamental component of the blocking pot or of the cup circuit, that is to say of the coaxial resonator, or of the cavity filter in general.
  • corresponding structures explained above may alternatively or additionally also be provided on the lower or inner side 21a of the ground plane by forming certain conductor tracks to form thinner conductive portions (eg, removed by etching) be formed. If necessary, additional metal surfaces may be formed at these locations on the top or outside 21b of the printed circuit board 21. In addition, metallizations in holes (through-holes) and outer edges (edge metallization) are possible.
  • the printed circuit board 21 or the printed circuit board material 121 may consist of all suitable and customary materials, ie dielectric materials.
  • Suitable printed circuit board materials are printed circuit boards, such as those offered under the trade name "FR1", “FR2", “FR3”, “FR4" or, for example, "FR5".
  • FR is known for flame retardant, so flame retardant.
  • Circuit board materials can therefore consist of the following materials or comprise these materials, including in any combination namely phenol resin, paper, epoxy resin, glass fiber, glass fiber fabric, ceramic, PTFE (polytetrafluoroethylene - Teflon).
  • the amount of elastic modulus (modulus of elasticity) is greater, the more resistance a material opposes to its deformation.
  • a component made of a material with a high modulus of elasticity eg steel
  • a component made of a material with a low modulus of elasticity eg rubber
  • the actual "softness" of the copper foil (Cu foil) provided in the context of the invention is explained by the fact that, due to the distribution of the different material thicknesses - although the modulus of elasticity of the copper foil is considerably higher than that of the material (AlMg3) - Softness "is achieved as in the prior art.
  • the thickness of the copper on the glass fiber epoxy circuit board layer is, for example, only 0.35 ⁇ m, whereas when using a resonator cover according to the prior art, for example consisting of AlMg3, its total thickness is about 1.5 mm.
  • An additional effect is achieved by the combination of copper and glass fiber epoxy, if the relatively high bending strength (rigidity) of the glass fiber epoxy material results in a higher contact pressure of the underlying copper layer with the filter housing compared to a pure cover made of AlMg3.

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Control Of Motors That Do Not Use Commutators (AREA)

Abstract

L'invention concerne un filtre à cavité HF présentant notamment les caractéristiques suivantes : le couvercle de boîtier (17) est constitué par une plaquette à circuit imprimé (21); au moins un trou supplémentaire (29) est percé dans la plaquette à circuit imprimé (21), trou dans lequel est inséré un manchon d'accord qui, sur la périphérie externe, est brasé avec une couche électro-conductrice (25), sur la plaquette à circuit imprimé (21); l'élément d'accord (37) peut être vissé à différentes profondeurs dans le manchon d'accord (31); sur la plaquette à circuit imprimé (21) est configurée au moins une structure électro-conductrice; et la structure diélectriquement conductrice comprend au moins une piste conductrice et/ou au moins un composant SMT et/ou au moins un dispositif de surcouplage HF.
EP10722957A 2009-06-18 2010-06-03 Filtre à cavité Active EP2443694B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE200910025408 DE102009025408B4 (de) 2009-06-18 2009-06-18 Hohlraumfilter
PCT/EP2010/003366 WO2010145758A1 (fr) 2009-06-18 2010-06-03 Filtre à cavité

Publications (2)

Publication Number Publication Date
EP2443694A1 true EP2443694A1 (fr) 2012-04-25
EP2443694B1 EP2443694B1 (fr) 2013-04-03

Family

ID=42709083

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10722957A Active EP2443694B1 (fr) 2009-06-18 2010-06-03 Filtre à cavité

Country Status (5)

Country Link
US (1) US8872605B2 (fr)
EP (1) EP2443694B1 (fr)
DE (1) DE102009025408B4 (fr)
ES (1) ES2411514T3 (fr)
WO (1) WO2010145758A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10090573B2 (en) 2014-05-27 2018-10-02 Kathrein-Werke Kg High-frequency shielded housing, in particular high-frequency shielded filter housing

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010056048A1 (de) * 2010-12-23 2012-06-28 Kathrein-Werke Kg Abstimmbares Hochfrequenzfilter
GB201212159D0 (en) * 2012-07-09 2012-08-22 Radio Design Electronic apparatus housing and method of use thereof
KR102010269B1 (ko) * 2012-08-23 2019-08-13 주식회사 케이엠더블유 캐비티 구조를 가진 무선 주파수 필터
DE102012022411A1 (de) * 2012-11-15 2014-05-15 Kathrein-Austria Gmbh Hochfrequenzfilter mit Frequenzstabilisierung
CN104969411B (zh) * 2013-10-10 2017-09-12 华为技术有限公司 滤波器及应用其的通信模块
US11021188B2 (en) * 2017-06-30 2021-06-01 Texas Instruments Incorporated Systems with radio frequency resonators, tuning elements, and spectrum analyzers to provide values of resonance parameters
CN111010888B (zh) * 2018-08-08 2022-08-12 大富科技(安徽)股份有限公司 一种谐振器及腔体滤波器
CN111697294B (zh) * 2019-03-14 2022-10-14 康普公司意大利有限责任公司 带阻滤波器、用于带阻滤波器的传输线、以及复用器
CN110429368B (zh) * 2019-08-29 2024-05-14 重庆思睿创瓷电科技有限公司 用于滤波器的银浆印刷装置
CN115064852B (zh) * 2022-07-18 2023-10-31 苏州立讯技术有限公司 一种滤波器及滤波器制造方法

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US3955161A (en) * 1974-08-05 1976-05-04 General Dynamics Corporation Molded waveguide filter with integral tuning posts
US4100504A (en) * 1977-06-20 1978-07-11 Harris Corporation Band rejection filter having integrated impedance inverter-tune cavity configuration
US5329687A (en) * 1992-10-30 1994-07-19 Teledyne Industries, Inc. Method of forming a filter with integrally formed resonators
FI106584B (fi) * 1997-02-07 2001-02-28 Filtronic Lk Oy Korkeataajuussuodatin
SE516862C2 (sv) 2000-07-14 2002-03-12 Allgon Ab Avstämningsskruvanordning samt metod och resonator
US6919782B2 (en) * 2001-04-04 2005-07-19 Adc Telecommunications, Inc. Filter structure including circuit board
US6559740B1 (en) * 2001-12-18 2003-05-06 Delta Microwave, Inc. Tunable, cross-coupled, bandpass filter
KR100769657B1 (ko) * 2003-08-23 2007-10-23 주식회사 케이엠더블유 무선 주파수 대역 가변 필터
DE102004060695B3 (de) 2004-12-16 2006-09-28 Kathrein-Austria Ges.M.B.H. Hochfrequenzfilter sowie Verfahren zum Abstimmen eines Hochfrequenzfilters
DE102006030634A1 (de) * 2006-07-03 2008-01-10 Work Microwave Elektronische Bauelemente Gmbh Oszillator-Anordnung
DE102006033704B3 (de) 2006-07-20 2008-01-03 Kathrein-Werke Kg Hochfrequenzfilter in koaxialer Bauweise, insbesondere nach Art einer Hochfrequenzweiche (z.B. einer Duplex-Weiche) oder eines Bandpassfilters oder Bandsperrfilters

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* Cited by examiner, † Cited by third party
Title
See references of WO2010145758A1 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10090573B2 (en) 2014-05-27 2018-10-02 Kathrein-Werke Kg High-frequency shielded housing, in particular high-frequency shielded filter housing

Also Published As

Publication number Publication date
DE102009025408A1 (de) 2010-12-23
DE102009025408B4 (de) 2011-09-01
US8872605B2 (en) 2014-10-28
EP2443694B1 (fr) 2013-04-03
WO2010145758A1 (fr) 2010-12-23
ES2411514T3 (es) 2013-07-05
US20120105176A1 (en) 2012-05-03

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