EP2397919B1 - Manufacturing method for a hairspring assembly of a timepiece made of micro-machinable material or silicon - Google Patents
Manufacturing method for a hairspring assembly of a timepiece made of micro-machinable material or silicon Download PDFInfo
- Publication number
- EP2397919B1 EP2397919B1 EP10166685.7A EP10166685A EP2397919B1 EP 2397919 B1 EP2397919 B1 EP 2397919B1 EP 10166685 A EP10166685 A EP 10166685A EP 2397919 B1 EP2397919 B1 EP 2397919B1
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- component
- hairspring
- silicon
- junction
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- 239000010703 silicon Substances 0.000 title claims description 45
- 229910052710 silicon Inorganic materials 0.000 title claims description 45
- 239000000463 material Substances 0.000 title claims description 35
- 238000004519 manufacturing process Methods 0.000 title claims description 17
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 50
- 238000000034 method Methods 0.000 claims description 29
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- 241000861223 Issus Species 0.000 description 2
- 230000001186 cumulative effect Effects 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000005219 brazing Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
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- 238000000708 deep reactive-ion etching Methods 0.000 description 1
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- 238000005516 engineering process Methods 0.000 description 1
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Images
Classifications
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- G—PHYSICS
- G04—HOROLOGY
- G04B—MECHANICALLY-DRIVEN CLOCKS OR WATCHES; MECHANICAL PARTS OF CLOCKS OR WATCHES IN GENERAL; TIME PIECES USING THE POSITION OF THE SUN, MOON OR STARS
- G04B17/00—Mechanisms for stabilising frequency
- G04B17/04—Oscillators acting by spring tension
- G04B17/06—Oscillators with hairsprings, e.g. balance
- G04B17/066—Manufacture of the spiral spring
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- G—PHYSICS
- G04—HOROLOGY
- G04D—APPARATUS OR TOOLS SPECIALLY DESIGNED FOR MAKING OR MAINTAINING CLOCKS OR WATCHES
- G04D3/00—Watchmakers' or watch-repairers' machines or tools for working materials
- G04D3/0002—Watchmakers' or watch-repairers' machines or tools for working materials for mechanical working other than with a lathe
- G04D3/0035—Watchmakers' or watch-repairers' machines or tools for working materials for mechanical working other than with a lathe for components of the regulating mechanism
- G04D3/0041—Watchmakers' or watch-repairers' machines or tools for working materials for mechanical working other than with a lathe for components of the regulating mechanism for coil-springs
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49609—Spring making
Definitions
- the invention relates to a method for manufacturing a micro-mechanical assembly made of micro-machinable material or silicon comprising at least a first planar component made of micro-machinable material or silicon produced in a wafer of micro-machinable material or in silicon of given crystalline orientation, said first component extending on one side of a base plane.
- the invention relates more particularly to a method of manufacturing a spiral watch-timepiece assembly made of micro-machinable material or silicon comprising at least one planar spiral spring made of a micro-machinable material or silicon made of a material wafer. micro-machinable or silicon of given crystalline orientation, said coil spring extending from one side of a base plane.
- the invention also relates to a spiral assembly comprising a planar spiral spring and a terminal curve.
- the invention also relates to a timepiece comprising at least one attachment point which comprises fixing means.
- the invention also relates to a timepiece comprising at least one stud for hooking a hairspring, said peg comprising fixing means.
- the technical field is that of micro-mechanical components, and in particular that of timepieces made of micro-machinable material or silicon, or the like.
- the field is that of three-dimensional components such as certain components of regulating and especially the spirals.
- the invention will be described more particularly for the preferred application of a spiral made of silicon.
- Some watch spirals such as Breguet spirals have an external terminal curve of particular shape, bent, or in a particular curve such as Phillips curve, this terminal curve being fixed to a peak.
- This peak in the case of a flat hairspring, is in a plane other than that of the spring, and the projection of its position in the plane of the spring can be located anywhere in relation to this one, to the inside or outside the range of movement of the spring.
- the bolt In the case of a cylindrical hairspring, or other, the bolt can occupy any position in space.
- Silicon implementation techniques make it possible to produce planar components by deep-etching ion etching (DRIE) and to obtain complex geometries.
- DRIE deep-etching ion etching
- the manufacturing possibilities are limited to parallel multi-layer components, and it is possible to combine different manufacturing processes: assembly, multi-level engraving, wafer-bonding, or others. These manufacturing methods are generally limited to putting together flat subcomponents, which can be staged, assembled at different levels.
- the terminal curve must allow to make a correct junction between the spiral body and the peak.
- the present invention proposes to make the junction of a flat spiral spring micro-machinable material with a peak, a curve of strong curvature developing in space in a plane other than that of the spiral spring.
- the invention relates to a method for manufacturing a spiral watch assembly, this method being defined in independent claim 1. Variants of the invention are defined in the dependent claims 2 to 12. The invention also relates to a spiral watch assembly as defined in the independent claim 13. The invention also relates to a timepiece as defined in dependent claims 14 and 15.
- the invention makes it possible to attach a planar spiral spring made of silicon to a pin situated much higher than its plane, and whose projection in the plane of this spiral spring is situated outside the latter.
- the method according to the invention also advantageously makes it possible to assemble subcomponents which are derived from wafers of different crystalline orientations, which makes it possible to take advantage of the elastic properties according to the needs.
- the technical field is that of micro-mechanical components, and in particular that of timepieces made of micro-machinable material or silicon, or the like. More particularly, the field is that of three-dimensional components such as certain components of regulating members and in particular the watch spirals.
- the invention is described here more particularly for the preferred application of a spiral assembly 1 of micro-machinable material or silicon, having a terminal curve 4 junction with a peak 5 of a timepiece 10, this peak 5 being offset with respect to the plane of a spiral spring 2 plan, to perform the peeling of this spiral assembly 1.
- the invention relates to a method of manufacturing a micromechanical or watchmaking assembly of micro-machinable material or silicon and three-dimensional.
- three-dimensional it should be understood that this set develops in space not only according to a thickness, but that perpendiculars to surfaces which the component comprises cut it at several points, and that this set can not be obtained with a machining or a shaping of plane type allowing only contouring or machining pockets in a single direction perpendicular to a plane.
- a preliminary phase of study succeeds a sub-component manufacturing phase, then a phase of assembly of the completed component.
- each sub-component is manufactured in a wafer of crystalline orientation corresponding to that chosen for this subcomponent. It is understood that the concept of parallelepipedic prism, including rectangle, is used for the design phase alone, since for the manufacturing phase it is necessary to accommodate the format of the available wafers, which may in particular be disks.
- this assembly is assembled by assembling the sub-components in pairs according to the assembly mode determined for each junction zone.
- all elementary prisms are perpendicular to each other.
- the number of subcomponents is minimized.
- the thicknesses of the subcomponents are minimized.
- the manufacturing cost is minimized by choosing the minimum cumulative cost during a simulation in which both the number and the thicknesses of the subcomponents are varied. .
- the assembly at the junction zones can be achieved by any means compatible with the technology of the micro-machinable material or silicon.
- the wafer planes of some of these subcomponents are perpendicular to one another.
- the wafer plane of the second component is perpendicular to that of the first component.
- the second component has the shape of a curve, and comprises at least one curvature in the plane between the two faces closest to the wafer from which it comes, and whose center of curvature is located between these parallel faces.
- the smallest section of the second component has its smallest dimension which corresponds to the smallest dimension of the wafer from which it is derived.
- the smallest section of the second component has its largest dimension corresponding to the smallest dimension of the elementary prism from which it is derived.
- At least one of the junction areas comprises first stop means that comprise means for joining a component, and which are arranged to cooperate with first complementary stop means that comprise complementary junction means that comprises an adjacent subcomponent.
- these first stop means and / or these first complementary stop means are completed by second stop means, which are arranged to immobilize together the subcomponent and the adjacent subcomponent.
- these second stop means comprise at least one elastic element arranged to allow the assembly of the subcomponent and the adjacent subcomponent, and to prevent their disassembly.
- one of the subcomponents for example a flat spiral spring, comprises an eyelet into which is inserted the end of another sub-component.
- this end comprises a stop, not shown in the figures, constituting first stop means, which cooperate with first complementary stop means constituted by one of the faces of the eyelet, and it further comprises, not shown in the figures, an elastic blade eclipsable by compression in a corresponding housing of the terminal curve during its insertion into the eyelet, and recalled in the stop position behind the other face of the eyelet, with which it cooperates with a free end in return.
- all the components of this set are made of silicon.
- a spiral assembly 1 of a timepiece 10 of micro-machinable material or silicon comprises at least one such first component constituted by a spiral spring 2 plan of micro-machinable material or silicon, which is made in a wafer of micro-machinable material or silicon of given crystalline orientation, this spiral spring 2 extending from one side of a base plane P.
- This spiral spring plane 2 is arranged to cooperate on the side of its inner coil with a ferrule, or comprises at the end of its inner coil a ferrule.
- the spiral assembly 1 according to the invention associates with this spiral spring 2 means for its indirect hooking with a stud 5, belonging to a timepiece 10, and offset from it.
- the wafer planes of some of said subcomponents are perpendicular to each other. In a particular embodiment, they are all perpendicular two by two.
- the wafer plane of the terminal curve 4 is perpendicular to that of the planar spiral spring 2, that is to say to the basic plane P.
- the terminal curve 4 comprises at least one curvature in the plane between the two faces closest to the wafer from which it is derived, and whose center of curvature is located between these parallel faces.
- the smallest section of the terminal curve 4 has its smallest dimension which corresponds to the smallest dimension of the wafer from which it is derived.
- the smallest section of the terminal curve 4 has its largest dimension which corresponds to the smallest dimension of said elementary prism from which it is derived.
- the spiral assembly 1 comprises only the end curve 4 and the plane spiral spring 2.
- the stud 5, which is part of the timepiece 10 in which is incorporated the spiral assembly 1, comprises fastening means 6 for the attachment of the latter.
- the end curve 4 preferably comprises, at its second end 11 opposite the flat spiral spring 2, complementary fastening means 7 arranged for its assembly and attachment to the fixing means 6 of the stud 5, and which preferably comprise a profile. complementary arranged to cooperate by interlocking or gluing with a profile that comprises the fixing means 6 of the peak.
- the fixing means 6 of the stud 5 are a notch
- the complementary fastening means 7 are a tenon.
- Naturally first and second stop means similar to those described above can equip this particular junction.
- the implementation of the invention also makes it possible to arrange the inner end 12 of the hairspring 2, on the side of the shell.
- the spiral spring 2 can still be assembled, on the side of its inner turn, with a subcomponent constituting an inner curve type "Grossmann curve".
- the spiral spring 2 can be assembled, on the side of its inner coil, with a subcomponent constituting a ferrule with a thickness greater than that of the spiral spring 2.
- junction of the subcomponents can be made by interlocking, with or without clipping, gluing or welding or brazing, these assembly methods being cumulative.
- the assembled spiral assembly 1 can be made with a spiral spring 2 and a terminal curve 4 from the same wafer. But, as we have seen, it may be advantageous to favor, in certain configurations, particular crystalline orientations for certain subcomponents, so as to make the best use of their elastic properties in particular directions.
- all the components of this set are made of silicon.
- the invention thus relates to a spiral assembly 1 comprising a spiral spring plane 2 and a terminal curve 4. It is achieved by the implementation of the method according to the invention. Its end curve 4 and its planar spiral spring 2, each made of micro-machinable material or silicon, are assembled together at a junction zone 3 and are in oblique planes, one for each other. report to the other. In a preferred embodiment, all the components of this spiral assembly 1 are made of silicon.
- the invention also relates to a timepiece 10 comprising at least one attachment point 5 which comprises fastening means 6.
- this timepiece 10 comprises at least a set 1 made by the method described above, in any of its variants, and comprises at least one such first component 2 and at least one such second component 4, the second component 4 for the attachment of this set 1 at this point of attachment 5.
- this second component 4 comprises complementary fastening means 7 arranged for its assembly and its attachment to the fastening means 6 of the attachment point 5.
- the invention also relates to a timepiece 10 comprising at least one peg 5 for the attachment of a hairspring, this peg 5 comprising fastening means 6, this timepiece 10 comprising at least one spiral assembly 1 obtained by the method according to the invention, and comprising a planar spiral spring 2 and an end curve 4, each made of micro-machinable material or silicon, and whose end curve 4 comprises complementary fastening means 7 arranged for its assembly and its attachment to the fixing means 6 of the peak 5.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Micromachines (AREA)
- Springs (AREA)
Description
L'invention concerne un procédé de fabrication d'un ensemble de micro-mécanique en matériau micro-usinable ou en silicium comportant au moins un premier composant plan en matériau micro-usinable ou en silicium réalisé dans un wafer de matériau micro-usinable ou en silicium d'orientation cristalline donnée, ledit premier composant s'étendant d'un côté d'un plan de base.The invention relates to a method for manufacturing a micro-mechanical assembly made of micro-machinable material or silicon comprising at least a first planar component made of micro-machinable material or silicon produced in a wafer of micro-machinable material or in silicon of given crystalline orientation, said first component extending on one side of a base plane.
L'invention concerne plus particulièrement un procédé de fabrication d'un ensemble spiral de pièce d'horlogerie en matériau micro-usinable ou en silicium comportant au moins un ressort-spiral plan en matériau micro-usinable ou en silicium réalisé dans un wafer de matériau micro-usinable ou en silicium d'orientation cristalline donnée, ledit ressort-spiral s'étendant d'un côté d'un plan de base.The invention relates more particularly to a method of manufacturing a spiral watch-timepiece assembly made of micro-machinable material or silicon comprising at least one planar spiral spring made of a micro-machinable material or silicon made of a material wafer. micro-machinable or silicon of given crystalline orientation, said coil spring extending from one side of a base plane.
L'invention concerne encore un ensemble spiral comportant un ressort-spiral plan et une courbe terminale.The invention also relates to a spiral assembly comprising a planar spiral spring and a terminal curve.
L'invention concerne encore une pièce d'horlogerie comportant au moins un point d'accrochage lequel comporte des moyens de fixation.The invention also relates to a timepiece comprising at least one attachment point which comprises fixing means.
L'invention concerne encore une pièce d'horlogerie comportant au moins un piton pour l'accrochage d'un spiral, ledit piton comportant des moyens de fixation.The invention also relates to a timepiece comprising at least one stud for hooking a hairspring, said peg comprising fixing means.
Le domaine technique est celui des composants de micro-mécanique, et en particulier celui des pièces d'horlogerie réalisés en matériau micro-usinable ou en silicium, ou similaire.The technical field is that of micro-mechanical components, and in particular that of timepieces made of micro-machinable material or silicon, or the like.
Plus particulièrement le domaine est celui des composants tri-dimensionnels tels que certains composant d'organes réglants et notamment les spiraux. L'invention sera décrite plus particulièrement pour l'application préférée d'un spiral en silicium.More particularly, the field is that of three-dimensional components such as certain components of regulating and especially the spirals. The invention will be described more particularly for the preferred application of a spiral made of silicon.
Certains spiraux d'horlogerie, tels les spiraux Breguet comportent une courbe terminale externe de forme particulière, coudée, ou selon une courbe particulière telle que courbe Phillips, cette courbe terminale étant fixée à un piton. Ce piton, dans le cas d'un spiral plat, est dans un autre plan que celui du ressort, et la projection de sa position dans le plan du ressort peut se situer n'importe où par rapport à celui-ci, à l'intérieur ou l'extérieur de la plage de déplacement du ressort. Dans le cas d'un spiral cylindrique, ou autre, le piton peut occuper n'importe quelle position dans l'espace.Some watch spirals, such as Breguet spirals have an external terminal curve of particular shape, bent, or in a particular curve such as Phillips curve, this terminal curve being fixed to a peak. This peak, in the case of a flat hairspring, is in a plane other than that of the spring, and the projection of its position in the plane of the spring can be located anywhere in relation to this one, to the inside or outside the range of movement of the spring. In the case of a cylindrical hairspring, or other, the bolt can occupy any position in space.
L'utilisation du silicium a permet de faire de grandes avancées dans l'horlogerie, en particulier en utilisant des ressorts spiraux en silicium pour des hautes fréquences d'oscillation, notamment 10 Hz.The use of silicon has made great advances in watchmaking, in particular by using silicon spiral springs for high oscillation frequencies, especially 10 Hz.
Les techniques de mise en oeuvre du silicium permettent de réaliser des composants plans, par gravage DRIE (deep reactive ion etching), et d'y obtenir des géométries complexes. Pour des composants tridimensionnels, les possibilités de fabrication sont limitées à des composants multi-couches parallèles, et il est possible de combiner différents procédés de fabrication : assemblage, gravage multi-niveau, wafer-bonding, ou autres. Ces méthodes de fabrication sont en général limitées à mettre ensemble des sous-composants plans, qui peuvent être étagés, assemblés à différents niveaux.Silicon implementation techniques make it possible to produce planar components by deep-etching ion etching (DRIE) and to obtain complex geometries. For three-dimensional components, the manufacturing possibilities are limited to parallel multi-layer components, and it is possible to combine different manufacturing processes: assembly, multi-level engraving, wafer-bonding, or others. These manufacturing methods are generally limited to putting together flat subcomponents, which can be staged, assembled at different levels.
Ces techniques ne permettent pas la fabrication d'un spiral coudé, avec une courbe terminale externe montant en pente douce vers le niveau supérieur du pitonnage. Et a fortiori elles ne permettent pas la réalisation de composants à fortes courbures.These techniques do not allow the manufacture of a bent spiral, with an external terminal curve rising gently towards the upper level of pitonnage. And a fortiori they do not allow the realization of components with strong curvatures.
En effet, si le piton est situé beaucoup plus haut que le plan du spiral, la courbe terminale doit permettre d'effectuer une jonction correcte entre le corps de spiral et le piton.Indeed, if the peak is located much higher than the plane of the spiral, the terminal curve must allow to make a correct junction between the spiral body and the peak.
Il est donc nécessaire de pouvoir réaliser des pièces complexes en silicium, en trois dimensions, afin de résoudre de tels problèmes mécaniques.It is therefore necessary to be able to produce complex parts in silicon, in three dimensions, in order to solve such mechanical problems.
La demande de brevet
- on réalise au moins un premier composant plan constitué par un ressort spiral en matériau micro-usinable ou en silicium réalisé dans un wafer de matériau micro-usinable ou en silicium d'orientation cristalline donnée, ledit premier composant s'étendant d'un côté d'un plan de base;
- on réalise une courbe terminale;
- on effectue l'assemblage dudit ressort spiral et de ladite courbe terminale au niveau d'une zone de jonction par des moyens d'assemblage.
- at least one first planar component consisting of a spiral spring of micro-machinable material or of silicon made of a wafer of micro-machinable material or of silicon with a given crystalline orientation, said first component extending on one side of a basic plan;
- a terminal curve is made;
- the assembly of said spiral spring and said end curve is performed at a junction zone by assembly means.
La demande de brevet
La demande de brevet
La présente invention se propose de réaliser la jonction d'un ressort-spiral plat en matériau micro-usinable avec un piton, par une courbe de forte courbure se développant dans l'espace dans un autre plan que celui de ce ressort-spiral.The present invention proposes to make the junction of a flat spiral spring micro-machinable material with a peak, a curve of strong curvature developing in space in a plane other than that of the spiral spring.
A cet effet, l'invention concerne un procédé de fabrication d'un ensemble spiral d'horlogerie, ce procédé étant défini dans la revendication indépendante 1. Des variantes de l'invention sont définies dans les revendications dépendantes 2 à 12. L'invention concerne encore un ensemble spiral d'horlogerie tel que défini dans la revendication indépendante 13. L'invention concerne encore une pièce d'horlogerie telle que définie dans les revendications dépendantes 14 et 15. Ainsi, en utilisant des sous-composants réalisés chacun dans un wafer, et assemblés les uns aux autres perpendiculairement entre eux, il est possible d'intégrer des éléments courbes, ou des éléments de dimensions incompatibles avec les techniques traditionnelles, souvent limitée à des dimensions diagonales de wafers comprises entre 100 et 300 mm. To this end, the invention relates to a method for manufacturing a spiral watch assembly, this method being defined in
L'invention permet en particulier d'attacher un ressort-spiral plan en silicium à un piton situé beaucoup plus haut que son plan, et dont la projection dans le plan de ce ressort-spiral est située extérieurement à ce dernier.In particular, the invention makes it possible to attach a planar spiral spring made of silicon to a pin situated much higher than its plane, and whose projection in the plane of this spiral spring is situated outside the latter.
Le procédé selon l'invention permet encore, avantageusement, d'assembler des sous-composants qui sont issus de wafers de différentes orientations cristallines, ce qui permet de tirer parti des propriétés d'élasticité selon les besoins.The method according to the invention also advantageously makes it possible to assemble subcomponents which are derived from wafers of different crystalline orientations, which makes it possible to take advantage of the elastic properties according to the needs.
D'autres caractéristiques et avantages de l'invention apparaîtront à la lecture de la description qui va suivre, en référence aux dessins annexés dans lesquels :
- la
figure 1 représente, de façon schématisée et en perspective, un ensemble spiral en silicium pour pièce d'horlogerie réalisé selon l'invention, dans une première variante de réalisation, et comportant une courbe terminale dans un plan perpendiculaire à celui du ressort, représentée dans une position de pitonnage avec un piton éloigné du plan du ressort, cette courbe terminale ayant la plus petite dimension de sa plus petite section qui correspond à la plus petite dimension d'un wafer dont elle est issue ; - la
figure 2 est une vue schématisée de face de l'ensemble spiral spiral de lafigure 1 , pitonné au même piton ; - la
figure 3 représente, de façon schématisée, partielle, et en perspective, de façon analogue à lafigure 1 , un ensemble spiral en silicium, pitonné à un piton d'une pièce d'horlogerie, dans une deuxième variante de réalisation, cette courbe terminale ayant la plus grande dimension de sa plus petite section qui correspond à la plus petite dimension d'un wafer dont elle est issue ; - la
figure 4 est une vue schématisée, partielle, et de face de l'ensemble spiral de lafigure 3 , pitonné au même piton d'une pièce d'horlogerie.
- the
figure 1 represents, schematically and in perspective, a spiral assembly made of silicon for a timepiece made according to the invention, in a first embodiment, and having a terminal curve in a plane perpendicular to that of the spring, shown in a pitoning position with a pin remote from the plane of the spring, this terminal curve having the smallest dimension of its smallest section which corresponds to the smallest dimension of a wafer from which it comes; - the
figure 2 is a schematic front view of the spiral spiral assembly of thefigure 1 , pitoned to the same piton; - the
figure 3 represents, schematically, partially, and in perspective, in a similar way to thefigure 1 , a spiral assembly made of silicon, pitoned at a peak of a timepiece, in a second variant embodiment, this end curve having the largest dimension of its smallest section which corresponds to the smallest dimension of a wafer from which it comes; - the
figure 4 is a schematic, partial, and front view of the spiral assembly of thefigure 3 , pitoned at the same piton of a timepiece.
Le domaine technique est celui des composants de micro-mécanique, et en particulier celui des pièces d'horlogerie réalisés en matériau micro-usinable ou en silicium, ou similaire. Plus particulièrement le domaine est celui des composants tri-dimensionnels tels que certains composants d'organes réglants et notamment les spiraux d'horlogerie. L'invention est décrite ici plus particulièrement pour l'application préférée d'un ensemble spiral 1 en matériau micro-usinable ou en silicium, comportant une courbe terminale 4 de jonction avec un piton 5 d'une pièce d'horlogerie 10, ce piton 5 étant déporté par rapport au plan d'un ressort-spiral 2 plan, pour effectuer le pitonnage de cet ensemble spiral 1.The technical field is that of micro-mechanical components, and in particular that of timepieces made of micro-machinable material or silicon, or the like. More particularly, the field is that of three-dimensional components such as certain components of regulating members and in particular the watch spirals. The invention is described here more particularly for the preferred application of a
L'invention concerne un procédé de fabrication d'un ensemble de micromécanique ou d'horlogerie en matériau micro-usinable ou en silicium et en trois dimensions. Par « en trois dimensions » il convient d'entendre que cet ensemble se développe dans l'espace non seulement selon une épaisseur, mais que des perpendiculaires à des surfaces que comporte le composant coupent celui-ci en plusieurs points, et que cet ensemble ne peut pas être obtenu avec un usinage ou un façonnage de type plan n'autorisant que du contournage ou des usinages de poches selon une unique direction perpendiculaire à un plan.The invention relates to a method of manufacturing a micromechanical or watchmaking assembly of micro-machinable material or silicon and three-dimensional. By "three-dimensional" it should be understood that this set develops in space not only according to a thickness, but that perpendiculars to surfaces which the component comprises cut it at several points, and that this set can not be obtained with a machining or a shaping of plane type allowing only contouring or machining pockets in a single direction perpendicular to a plane.
Selon ce procédé, à une phase préalable d'étude succèdent une phase de fabrication de sous-composants, puis une phase d'assemblage du composant terminé.According to this method, a preliminary phase of study succeeds a sub-component manufacturing phase, then a phase of assembly of the completed component.
Pour la phase d'étude, le procédé met en oeuvre un processus itératif de conception :
- on décompose le volume de l'ensemble en volumes élémentaires. Ces volumes élémentaires sont inscrits chacun dans un prisme élémentaire parallélépipédique, correspondant chacun à un wafer déterminé de par son épaisseur et son orientation cristalline. Certains de ces prismes élémentaires sont obliques par rapport à d'autres. Ces prismes élémentaires sont sécants au moins deux à deux au niveau d'une zone de jonction, il y a naturellement autant de zones de jonction que d'intersections entre les prismes;
- on dessine, correspondant à chaque prisme élémentaire, un sous-composant comportant, à chaque zone de jonction avec un prisme adjacent, des moyens de jonction qui sont agencés pour coopérer avec des moyens de jonction complémentaires que comporte un sous-composant adjacent dessiné dans ce prisme adjacent ;
- on vérifie par calcul la géométrie du composant constitué par assemblage aux différentes zones de jonction de ces sous-composants ;
- on choisit un mode d'assemblage pour chaque zone de jonction, on choisit pour chaque sous-composant une orientation cristalline particulière, et on vérifie par calcul l'obtention des propriétés mécaniques et de l'élasticité requises pour le composant final.
- we break down the volume of the set into elementary volumes. These elementary volumes are each inscribed in a parallelepipedic elemental prism, each corresponding to a wafer determined by its thickness and its crystalline orientation. Some of these elementary prisms are oblique to others. These elementary prisms are intersecting at least two by two at a junction zone, there are naturally as many junction zones as there are intersections between the prisms;
- a subcomponent is provided corresponding to each elemental prism, comprising, at each junction zone with an adjacent prism, junction means which are arranged to cooperate with complementary junction means comprising an adjacent subcomponent drawn in this section. adjacent prism;
- the geometry of the component constituted by assembly is checked by calculation at the different junction zones of these subcomponents;
- an assembly mode is chosen for each junction zone, a particular crystalline orientation is chosen for each subcomponent, and the mechanical properties and elasticity required for the final component are computationally checked.
Lors de la phase de fabrication de sous-composants, on fabrique chaque sous-composant dans un wafer d'orientation cristalline correspondante à celle choisie pour ce sous-composant. On comprend que la notion de prisme parallélépipédique, notamment rectangle, est utilisée pour la seule phase de conception, puisque pour la phase de fabrication il faut s'accommoder du format des wafers disponibles, qui peuvent notamment être des disques.During the sub-component manufacturing phase, each sub-component is manufactured in a wafer of crystalline orientation corresponding to that chosen for this subcomponent. It is understood that the concept of parallelepipedic prism, including rectangle, is used for the design phase alone, since for the manufacturing phase it is necessary to accommodate the format of the available wafers, which may in particular be disks.
Lors de la phase d'assemblage de l'ensemble terminé, on assemble cet ensemble par assemblage des sous-composants deux à deux selon le mode d'assemblage déterminé pour chaque zone de jonction.During the assembly phase of the completed assembly, this assembly is assembled by assembling the sub-components in pairs according to the assembly mode determined for each junction zone.
Dans un mode préféré de mise en oeuvre du procédé, pour faciliter la mise en oeuvre, tous les prismes élémentaires sont perpendiculaires les uns aux autres.In a preferred embodiment of the method, to facilitate implementation, all elementary prisms are perpendicular to each other.
Dans un mode particulier de réalisation, lors du processus itératif de conception, on minimise le nombre des sous-composants.In a particular embodiment, during the iterative design process, the number of subcomponents is minimized.
Dans un autre mode particulier de réalisation, lors du processus itératif de conception, on minimise les épaisseurs des sous-composants.In another particular embodiment, during the iterative design process, the thicknesses of the subcomponents are minimized.
Dans un autre mode encore de réalisation, lors du processus itératif de conception, on minimise le coût de fabrication en choisissant le coût cumulé minimum lors d'une simulation lors de laquelle on fait varier à la fois le nombre et les épaisseurs des sous-composants.In yet another embodiment, during the iterative design process, the manufacturing cost is minimized by choosing the minimum cumulative cost during a simulation in which both the number and the thicknesses of the subcomponents are varied. .
L'assemblage au niveau des zones de jonction peut être réalisé par tous moyens compatibles avec la technologie du matériau micro-usinable ou du silicium.The assembly at the junction zones can be achieved by any means compatible with the technology of the micro-machinable material or silicon.
L'invention concerne, ainsi, un procédé de fabrication d'un ensemble de micro-mécanique en matériau micro-usinable ou en silicium comportant au moins un premier composant plan en matériau micro-usinable ou en silicium réalisé dans un wafer de matériau micro-usinable ou en silicium d'orientation cristalline donnée, ce premier composant s'étendant d'un côté d'un plan de base, caractérisé en ce que :
- on décompose cet ensemble en sous-composants réalisables chacun dans un wafer de matériau micro-usinable ou en silicium d'orientation cristalline donnée, chaque dit wafer s'étendant parallèlement à un plan de wafer ;
- on définit des zones de jonction où ces sous-composants sont assemblés deux à deux, et où, de part et d'autre de cette zone de jonction, les normales aux plans des wafers dont sont issus chacun de ces sous-composants sont obliques l'une part rapport à l'autre ;
- on réalise au moins un de ces sous-composants pour former un deuxième composant joignant ce au moins un premier composant plan à un point situé, en projection sur ledit plan de base, en-dehors de ce premier composant ;
- on effectue l'assemblage de ces sous-composants au niveau de ces zones de jonction par des moyens d'assemblage.
- this set is subdivided into sub-components, each of which can be produced in a wafer of micro-machinable material or in silicon of given crystalline orientation, each said wafer extending parallel to a wafer plane;
- junction zones are defined where these subcomponents are assembled in pairs, and where, on either side of this junction zone, the normals at the wafer planes from which each of these subcomponents are derived are oblique. one part to another;
- performing at least one of these subcomponents to form a second component joining this at least one first planar component to a point located, in projection on said base plane, outside this first component;
- these sub-components are assembled at these junction zones by assembly means.
Dans une exécution de l'invention, les plans de wafer de certains de ces sous-composants sont perpendiculaires les uns aux autres.In one embodiment of the invention, the wafer planes of some of these subcomponents are perpendicular to one another.
En particulier, le plan de wafer du deuxième composant est perpendiculaire à celui du premier composant.In particular, the wafer plane of the second component is perpendicular to that of the first component.
De façon avantageuse, permettant la résolution de nombreux problèmes de jonction ou d'accrochage dans l'espace, le deuxième composant a la forme d'une courbe, et comporte au moins une courbure dans le plan situé entre les deux faces les plus proches du wafer dont elle est issue, et dont le centre de courbure est situé entre ces faces parallèles.Advantageously, allowing the resolution of many junction or latching problems in space, the second component has the shape of a curve, and comprises at least one curvature in the plane between the two faces closest to the wafer from which it comes, and whose center of curvature is located between these parallel faces.
Dans une première variante de réalisation, la plus petite section du deuxième composant a sa plus petite dimension qui correspond à la plus petite dimension du wafer dont elle est issue.In a first embodiment, the smallest section of the second component has its smallest dimension which corresponds to the smallest dimension of the wafer from which it is derived.
Dans une deuxième variante de réalisation, la plus petite section du deuxième composant a sa plus grande dimension qui correspond à la plus petite dimension du prisme élémentaire dont elle est issue.In a second variant embodiment, the smallest section of the second component has its largest dimension corresponding to the smallest dimension of the elementary prism from which it is derived.
Parmi les différents modes d'assemblage possibles, il est plus particulièrement préféré d'utiliser au moins un des modes d'assemblage suivants, qui peuvent naturellement être différenciés selon la localisation et les contraintes de la zone de jonction :
- un mode d'assemblage est réalisé par collage entre des moyens de jonction d'un composant et des moyens de jonction complémentaires que comporte un sous-composant adjacent, ces moyens de jonction et moyens de jonction complémentaires étant conçus avec un jeu d'assemblage adapté à ce collage ;
- un mode d'assemblage est réalisé par pincement entre des moyens de jonction d'un composant et des moyens de jonction complémentaires que comporte un sous-composant adjacent. Au moins les moyens de jonction ou bien les moyens de jonction complémentaires comportent au moins un élément élastique agencé pour immobiliser, respectivement, les moyens de jonction complémentaires ou les moyens de jonction. Naturellement, les moyens de jonction et les moyens de jonction complémentaire peuvent comporter chacun un tel élément élastique.
- an assembly method is achieved by gluing between junction means of a component and complementary junction means that comprises an adjacent subcomponent, these joining means and complementary junction means being designed with a suitable assembly set to this collage;
- an assembly mode is achieved by clamping between junction means of a component and complementary junction means that comprises an adjacent subcomponent. At least the joining means or the complementary joining means comprise at least one elastic element arranged to immobilize, respectively, the complementary joining means or the joining means. Naturally, the connecting means and the complementary joining means may each comprise such an elastic element.
Pour faciliter l'assemblage, et en particulier pour assurer une parfaite reproductibilité d'un composant assemblé à l'autre, avantageusement au moins une des zones de jonction comporte des premiers moyens d'arrêt que comportent des moyens de jonction d'un composant, et qui sont agencés pour coopérer avec des premiers moyens d'arrêt complémentaire que comportent des moyens de jonction complémentaires que comporte un sous-composant adjacent.To facilitate assembly, and in particular to ensure perfect reproducibility of a component assembled to the other, advantageously at least one of the junction areas comprises first stop means that comprise means for joining a component, and which are arranged to cooperate with first complementary stop means that comprise complementary junction means that comprises an adjacent subcomponent.
Dans une variante particulière de réalisation, ces premiers moyens d'arrêt ou/et ces premiers moyens d'arrêt complémentaire sont complétés par des seconds moyens d'arrêt, qui sont agencés pour immobiliser ensemble le sous-composant et le sous-composant adjacent.In a particular variant embodiment, these first stop means and / or these first complementary stop means are completed by second stop means, which are arranged to immobilize together the subcomponent and the adjacent subcomponent.
Grâce à l'élasticité du matériau micro-usinable, notamment quand il est constitué par du silicium, il est en particulier avantageux que ces seconds moyens d'arrêt comportent au moins un élément élastique agencé pour autoriser l'assemblage du sous-composant et du sous-composant adjacent, et pour interdire leur démontage. Par exemple, avec une zone de jonction de type à oeil telle que visible sur les figures, l'un des sous-composants, par exemple un ressort-spiral plat, comporte un oeillet dans lequel est introduite l'extrémité d'un autre sous-composant, par exemple une courbe terminale : cette extrémité comporte une butée, non représentée sur les figures, constituant des premiers moyens d'arrêt, qui coopèrent avec des premiers moyens d'arrêt complémentaire constitués par une des faces de l'oeillet, et elle comporte encore, non représentée sur les figures, une lame élastique éclipsable par compression dans un logement correspondant de la courbe terminale pendant son introduction dans l'oeillet, et rappelée en position d'arrêt derrière l'autre face de l'oeillet, avec laquelle elle coopère par une extrémité libre en retour. Ainsi, à la fois la précision et la sécurité de montage sont assurées.Due to the elasticity of the micro-machinable material, especially when it is constituted by silicon, it is particularly advantageous that these second stop means comprise at least one elastic element arranged to allow the assembly of the subcomponent and the adjacent subcomponent, and to prevent their disassembly. For example, with a junction zone of eye type as visible in the figures, one of the subcomponents, for example a flat spiral spring, comprises an eyelet into which is inserted the end of another sub-component. -composing, for example a terminal curve: this end comprises a stop, not shown in the figures, constituting first stop means, which cooperate with first complementary stop means constituted by one of the faces of the eyelet, and it further comprises, not shown in the figures, an elastic blade eclipsable by compression in a corresponding housing of the terminal curve during its insertion into the eyelet, and recalled in the stop position behind the other face of the eyelet, with which it cooperates with a free end in return. Thus, both accuracy and assembly safety are assured.
De façon préférée, tous les constituants de cet ensemble sont réalisés en silicium.Preferably, all the components of this set are made of silicon.
Plus particulièrement, l'invention a été développée pour la mise au point d'un procédé de fabrication d'un ensemble spiral 1 de pièce d'horlogerie 10 en matériau micro-usinable ou en silicium. Un tel ensemble spiral 1 comporte au moins un tel premier composant constitué par un ressort-spiral 2 plan en matériau micro-usinable ou en silicium, qui est réalisé dans un wafer de matériau micro-usinable ou en silicium d'orientation cristalline donnée, ce ressort-spiral 2 s'étendant d'un côté d'un plan de base P. Ce ressort-spiral plan 2 est agencé pour coopérer du côté de sa spire interne avec une virole, ou bien comporte à l'extrémité de sa spire interne une virole. L'ensemble spiral 1 selon l'invention associe à ce ressort-spiral 2 des moyens permettant son accrochage indirect avec un piton 5, appartenant à une pièce d'horlogerie 10, et déporté par rapport à lui.More particularly, the invention has been developed for the development of a method of manufacturing a
Selon l'invention :
- on décompose
cet ensemble spiral 1 en sous-composants réalisables chacun dans un wafer de silicium d'orientation cristalline donnée, chaque wafer s'étendant parallèlement à un plan de wafer qui lui est propre; - on définit des zones de jonction 3 où ces sous-composants sont assemblés deux à deux, et où, de part et d'autre de la zone de jonction d'assemblage entre deux sous-composants particuliers, les normales aux plans des wafers dont sont issus chacun de ces sous-composants sont obliques l'une part rapport à l'autre ;
- on réalise au moins un de ces sous-composants pour former un tel deuxième composant constitué par une courbe terminale joignant ce au moins un ressort-spiral plan à un piton, piton qui est situé, en projection sur le plan de base, en-dehors du ressort-spiral, à l'extérieur de son emprise;
- on effectue l'assemblage de ces sous-composants au niveau de ces zones de jonction 3 par des moyens d'assemblage.
- this
spiral assembly 1 is subdivided into subcomponents which can each be produced in a silicon wafer of given crystalline orientation, each wafer extending parallel to a wafer plane of its own; -
junction zones 3 are defined in which these subcomponents are assembled in pairs, and where, on either side of the junction joining zone between two particular subcomponents, the normal to the plane of the wafers of which are each of these subcomponents are oblique to each other; - at least one of these subcomponents is formed to form such a second component constituted by an end curve joining this at least one spiral spring plane to a piton, which is located, in projection on the base plane, outside spiral spring, outside its right-of-way;
- these sub-components are assembled at these
junction zones 3 by means of assembly.
De façon particulière pour une exécution simplifiée, les plans de wafer de certains desdits sous-composants sont perpendiculaires les uns aux autres. Dans une réalisation particulière, ils sont tous perpendiculaires deux à deux.In particular for a simplified embodiment, the wafer planes of some of said subcomponents are perpendicular to each other. In a particular embodiment, they are all perpendicular two by two.
Dans une réalisation préférée, le plan de wafer de la courbe terminale 4 est perpendiculaire à celui du ressort-spiral plan 2, c'est-à-dire au plan de base P.In a preferred embodiment, the wafer plane of the
Deux variantes de réalisation sont représentées sur les figures, qui diffèrent par la position relative du piton 5 et du ressort-spiral 2 : sur les
Dans ces deux variantes de réalisation, de façon préférée et tel que visible sur les figures, la courbe terminale 4 comporte au moins une courbure dans le plan situé entre les deux faces les plus proches du wafer dont elle est issue, et dont le centre de courbure est situé entre ces faces parallèles.In these two embodiments, preferably and as shown in the figures, the
Dans une première variante de réalisation, tel que visible sur les
Dans une deuxième variante de réalisation, tel que visible sur les
De façon préférée et tel que visible sur les figures, l'ensemble spiral 1 ne comporte que la courbe terminale 4 et le ressort-spiral plan 2.In a preferred manner and as visible in the figures, the
Le piton 5, qui fait partie de la pièce d'horlogerie 10 à laquelle est incorporé l'ensemble spiral 1, comporte des moyens de fixation 6 pour l'accrochage de ce dernier. La courbe terminale 4 comporte de préférence, à sa deuxième extrémité 11 opposée au ressort-spiral plat 2, des moyens de fixation complémentaire 7 agencés pour son assemblage et sa fixation aux moyens de fixation 6 du piton 5, et qui comportent de préférence un profil complémentaire agencé pour coopérer par emboîtement ou par collage avec un profil que comportent les moyens de fixation 6 du piton. Par exemple les moyens de fixation 6 du piton 5 sont une encoche, et les moyens de fixation complémentaire 7 sont un tenon. Naturellement des premiers et seconds moyens d'arrêt similaires à ceux décrits ci-dessus peuvent équiper cette jonction particulière.The
Concernant un tel spiral, la mise en oeuvre de l'invention permet également d'aménager l'extrémité intérieure 12 du ressort-spiral 2, du côté de la virole. Notamment, par le même procédé le ressort-spiral 2 peut encore être assemblé, du côté de sa spire interne, avec un sous-composant constituant une courbe intérieure de type « courbe Grossmann ».Regarding such a hairspring, the implementation of the invention also makes it possible to arrange the
De la même façon, le ressort-spiral 2 peut être assemblé, du côté de sa spire interne, avec un sous-composant constituant une virole d'épaisseur supérieure à celle du ressort-spiral 2.In the same way, the
La jonction des sous-composants peut être réalisée par emboîtement, avec ou sans clipage, par collage ou soudage ou brasage, ces modes d'assemblage étant cumulables.The junction of the subcomponents can be made by interlocking, with or without clipping, gluing or welding or brazing, these assembly methods being cumulative.
L'ensemble spiral 1 assemblé peut être réalisé avec un ressort-spiral 2 et une courbe terminale 4 issus du même wafer. Mais, comme on l'a vu, il peut s'avérer intéressant de privilégier, dans certaines configurations, des orientations cristallines particulières pour certains sous-composants, de façon à exploiter au mieux leurs propriétés d'élasticité dans des directions particulières.The assembled
De façon préférée, tous les constituants de cet ensemble sont réalisés en silicium.Preferably, all the components of this set are made of silicon.
L'invention concerne ainsi un ensemble spiral 1 comportant un ressort-spiral plan 2 et une courbe terminale 4. Il est réalisé par la mise en oeuvre du procédé selon l'invention. Sa courbe terminale 4 et son ressort-spiral plan 2, chacun en matériau micro-usinable ou en silicium, sont assemblés l'un à l'autre au niveau d'une zone de jonction 3 et sont dans des plans obliques l'un par rapport à l'autre. Dans un mode de réalisation préféré, tous les composants de cet ensemble spiral 1 sont en silicium.The invention thus relates to a
L'invention concerne encore une pièce d'horlogerie 10 comportant au moins un point d'accrochage 5 lequel comporte des moyens de fixation 6. Selon l'invention cette pièce d'horlogerie 10 comporte au moins un ensemble 1 réalisé par le procédé décrit ci-dessus, dans l'une quelconque de ses variantes, et comporte au moins un tel premier composant 2 et au moins un tel deuxième composant 4, ce deuxième composant 4 pour l'accrochage de cet ensemble 1 à ce point d'accrochage 5. Et ce deuxième composant 4 comporte des moyens de fixation complémentaire 7 agencés pour son assemblage et sa fixation aux moyens de fixation 6 du point d'accrochage 5.The invention also relates to a
L'invention concerne encore une pièce d'horlogerie 10 comportant au moins un piton 5 pour l'accrochage d'un spiral, ce piton 5 comportant des moyens de fixation 6, cette pièce d'horlogerie 10 comportant au moins un ensemble spiral 1 obtenu par le procédé selon l'invention, et comportant un ressort-spiral plan 2 et une courbe terminale 4, chacun en matériau micro-usinable ou en silicium, et dont la courbe terminale 4 comporte des moyens de fixation complémentaire 7 agencés pour son assemblage et sa fixation aux moyens de fixation 6 du piton 5.The invention also relates to a
Claims (15)
- Method of fabricating a timepiece balance spring assembly (1) in micro-machinable material or in silicon and in three dimensions, including the following steps:- there is made at least a first flat component formed by a hairspring (2) in micro-machinable material or in silicon made in a wafer of micro-machinable material or in silicon with a given crystalline orientation, said first component extending on one side from a base plane (P);- there is made at least one sub-component of said balance spring assembly (1), called the second component (4), which is flat, inscribed in an elementary parallelepiped prism, secant with said hairspring (2) in a junction area, said second component (4) being made in a wafer of micromachinable material or in silicon, said second component (4) forming a terminal curve of said balance spring assembly (1) and directly joining said at least one flat hairspring (2) at a point in space, the projection of which onto said base plane (P) is located external to said hairspring (2), said terminal curve (4) being in an orthogonal plane to that of said at least one hairspring (2);- said hairspring (2) and said terminal curve (4) are assembled at said junction areas by assembling means.
- Method according to the preceding claim, characterized in that said terminal curve (4) includes at least one curvature in the plane located between the two parallel faces closest to said wafer from which it originates, and whose centre of curvature is located between said parallel faces.
- Method according to any of the preceding claims, characterized in that said terminal curve (4) joins said at least one flat hairspring to a stud (5) located, in projection onto said base plane (P), outside said hairspring (2).
- Method according to any of the preceding claims, characterized in that said terminal curve (4) has a profile of the Phillips curve type.
- Method according to any of the preceding claims, characterized in that said balance spring assembly (1) includes only said terminal curve (4) and said flat hairspring (2).
- Method according to any of claims 1 to 4, characterized in that said flat hairspring (2) is arranged to cooperate on the inner coil side thereof with a sub-component formed by a collet.
- Method according to any of the preceding claims, characterized in that the smallest dimension of the smallest section of said terminal curve (4) corresponds to the smallest dimension of the wafer from which it originates.
- Method according to any of claims 1 to 6, characterized in that the largest dimension of the smallest section of said terminal curve (4) corresponds to the smallest section of said elementary prism from which it originates.
- Method according to any of the preceding claims, characterized in that assembly of said sub-components is achieved by clamping between the junction means of one component and complementary junction means comprised in an adjacent sub-component, at least said junction means or said complementary junction means including at least one elastic element arranged for immobilising, respectively, at least said complementary junction means or said junction means.
- Method according to any of the preceding claims, characterized in that at least one said junction area includes first stop means which are comprised in the junction means of one component and arranged for cooperating with complementary first stop means comprised in complementary junction means comprised in an adjacent sub-component.
- Method according to the preceding claim, characterized in that said first stop means and/or said complementary first stop means are completed by second stop means arranged for immobilising together said sub-component and said adjacent sub-component.
- Method according to the preceding claim, characterized in that said second stop means include at least one elastic element arranged to allow the assembly of said sub-component and said adjacent sub-component and to prevent the disassembly thereof.
- Timepiece balance spring assembly (1) made of micro-machinable material or of silicon and in three dimensions comprising at least a first flat component formed by a hairspring (2) in micro-machinable material or in silicon made in a wafer of micro-machinable material or in silicon with a given crystalline orientation, said first component extending on one side from a base plane (P), characterized in that said balance spring assembly includes at least one second component (4), which is flat, inscribed in an elementary parallelepiped prism, formed from a wafer of micro-machinable material or in silicon, said second component (4) forming a terminal curve (4) of said balance spring assembly (1) and directly joining said at least one hairspring (2) at a point in space, the projection of which onto said base plane (P) is located external to said hairspring (2), said terminal curve (4) being in an orthogonal plane to that of said at least one hairspring (2), said terminal curve (4) of said second component being secant with said hairspring (2) in a junction area, and assembled thereto in said junction area by assembling means.
- Timepiece (10) including at least one point of attachment (5) which includes securing means (6), characterized in that the timepiece includes at least one balance spring assembly (1) according to the preceding claim, arranged such that the projection of said point of attachment (5) onto said base plane (P) and said hairspring (2) are external to one another, the projection of said point of attachment (5) onto said base plane (P) being located outside said hairspring (2), and further characterized in that said terminal curve (4) is assembled and secured to said point of attachment (5) by the cooperation between complementary securing means (7) comprised in said terminal curve (4) and said securing means (6) of said point of attachment (5).
- Timepiece (10) according to the preceding claim, including at least one stud (5) for attaching a balance spring, said stud (5) comprising securing means (6), characterized in that said timepiece includes at least one balance spring assembly (1) according to claim 13, and in that said terminal curve (4) includes complementary securing means (7) arranged for the assembly and securing thereof to said securing means (6) of said stud (5).
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
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EP10166685.7A EP2397919B1 (en) | 2010-06-21 | 2010-06-21 | Manufacturing method for a hairspring assembly of a timepiece made of micro-machinable material or silicon |
PCT/EP2011/057459 WO2011160885A1 (en) | 2010-06-21 | 2011-05-10 | Method for manufacturing a timepiece hairspring assembly made of micromachinable material or of silicon |
JP2011134572A JP5823180B2 (en) | 2010-06-21 | 2011-06-16 | Method for manufacturing watch balance spring / spring assembly with micro-machinable material or silicon |
CN201110211398XA CN102289184B (en) | 2010-06-21 | 2011-06-20 | Manufacturing method for a hairspring assembly of a timepiece made of micro-machinable material or silicon |
US13/164,124 US8757868B2 (en) | 2010-06-21 | 2011-06-20 | Method of fabricating a timepiece balance spring assembly in micro-machinable material or silicon |
HK12102210.6A HK1161759A1 (en) | 2010-06-21 | 2012-03-05 | Method of fabricating a timepiece balance spring assembly in micro- machinable material or silicon |
Applications Claiming Priority (1)
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EP10166685.7A EP2397919B1 (en) | 2010-06-21 | 2010-06-21 | Manufacturing method for a hairspring assembly of a timepiece made of micro-machinable material or silicon |
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EP2397919A1 EP2397919A1 (en) | 2011-12-21 |
EP2397919B1 true EP2397919B1 (en) | 2017-11-08 |
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EP10166685.7A Active EP2397919B1 (en) | 2010-06-21 | 2010-06-21 | Manufacturing method for a hairspring assembly of a timepiece made of micro-machinable material or silicon |
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US (1) | US8757868B2 (en) |
EP (1) | EP2397919B1 (en) |
JP (1) | JP5823180B2 (en) |
CN (1) | CN102289184B (en) |
HK (1) | HK1161759A1 (en) |
WO (1) | WO2011160885A1 (en) |
Cited By (1)
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TWI796444B (en) * | 2018-03-20 | 2023-03-21 | 瑞士商百達翡麗日內瓦股份有限公司 | Method for manufacturing timepiece thermocompensated hairsprings of precise stiffness |
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EP2570871B1 (en) * | 2011-09-14 | 2014-03-19 | Montres Breguet SA | Hairspring with two spiral springs |
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2010
- 2010-06-21 EP EP10166685.7A patent/EP2397919B1/en active Active
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- 2011-05-10 WO PCT/EP2011/057459 patent/WO2011160885A1/en active Application Filing
- 2011-06-16 JP JP2011134572A patent/JP5823180B2/en not_active Expired - Fee Related
- 2011-06-20 CN CN201110211398XA patent/CN102289184B/en not_active Expired - Fee Related
- 2011-06-20 US US13/164,124 patent/US8757868B2/en not_active Expired - Fee Related
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2012
- 2012-03-05 HK HK12102210.6A patent/HK1161759A1/en not_active IP Right Cessation
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TWI796444B (en) * | 2018-03-20 | 2023-03-21 | 瑞士商百達翡麗日內瓦股份有限公司 | Method for manufacturing timepiece thermocompensated hairsprings of precise stiffness |
Also Published As
Publication number | Publication date |
---|---|
EP2397919A1 (en) | 2011-12-21 |
WO2011160885A1 (en) | 2011-12-29 |
US8757868B2 (en) | 2014-06-24 |
CN102289184A (en) | 2011-12-21 |
US20110310710A1 (en) | 2011-12-22 |
JP5823180B2 (en) | 2015-11-25 |
JP2012002813A (en) | 2012-01-05 |
HK1161759A1 (en) | 2012-08-03 |
CN102289184B (en) | 2013-07-17 |
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