EP2393965B1 - Kokille zum stranggiessen - Google Patents

Kokille zum stranggiessen Download PDF

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Publication number
EP2393965B1
EP2393965B1 EP10721642.6A EP10721642A EP2393965B1 EP 2393965 B1 EP2393965 B1 EP 2393965B1 EP 10721642 A EP10721642 A EP 10721642A EP 2393965 B1 EP2393965 B1 EP 2393965B1
Authority
EP
European Patent Office
Prior art keywords
copper
mold
continuous casting
layer
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP10721642.6A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP2393965A2 (de
Inventor
Egon Evertz
Ralf Evertz
Stefan Evertz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Egon Evertz KG GmbH and Co
Original Assignee
Egon Evertz KG GmbH and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=41413318&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=EP2393965(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Egon Evertz KG GmbH and Co filed Critical Egon Evertz KG GmbH and Co
Priority to PL10721642T priority Critical patent/PL2393965T3/pl
Publication of EP2393965A2 publication Critical patent/EP2393965A2/de
Application granted granted Critical
Publication of EP2393965B1 publication Critical patent/EP2393965B1/de
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Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22DCASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D11/00Continuous casting of metals, i.e. casting in indefinite lengths
    • B22D11/04Continuous casting of metals, i.e. casting in indefinite lengths into open-ended moulds
    • B22D11/059Mould materials or platings
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C25D15/02Combined electrolytic and electrophoretic processes with charged materials
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10Electroplating with more than one layer of the same or of different metals
    • C25D5/12Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48After-treatment of electroplated surfaces
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60Electroplating characterised by the structure or texture of the layers
    • C25D5/605Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611Smooth layers
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/67Electroplating to repair workpiece
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00Electroplating characterised by the article coated

Definitions

  • the invention relates to a method for processing a copper mold or copper mold plate for continuous casting of metals or metal alloys, in which the worn by continuous casting inner surface is mechanically removed to the maximum depth of wear marks and then coated again.
  • Molds of the type mentioned consist of individual plates, which are assembled into a mold.
  • For cooling cooling channels are provided in the mold plates, which are flowed through by a cooling liquid, usually water.
  • Such an SiC particle-doped Ni coating of the inner mold walls was also successfully used in copper molds that were so worn by use on the inside that they were no longer useful for continuous casting.
  • the inner wall coating allows the restoration of a mold with the desired internal dimensions, which ensures optimal continuous casting.
  • the DE 10 2005 040 151 A1 relates to a method for electrodepositing metal layers from electrolyte solutions, the electrolyte solution containing hard particles embedded in the metal layer.
  • a suspension of hard particles, a small amount of liquid and a wetting agent is prepared and then added the suspension in the electrolyte solution and evenly distributed, in which then the electrodeposition is carried out.
  • metal layers are to be deposited which contain particularly uniformly distributed hard material particles.
  • the metal layer consists predominantly of nickel or copper, in which hard material particles of oxides, nitrides, borides or carbides, in particular of metals or semi-metals are embedded.
  • JP 7 001086 A discloses a method for repairing damage to mold inner walls wherein the wall portions not damaged by erosion are provided with a mask and thereafter the unmasked eroded wall surfaces are coated with copper by electroplating.
  • the U.S. 3,671,407 teaches a method for reducing the blistering and peeling of galvanic coatings on copper bodies exposed to an operating temperature in excess of 260 ° C, wherein prior to plating the surface of the copper body is removed to a depth at which the oxygen content is in the oxygen content Base metal comes close.
  • the thickness of the Abtrag should be at least 3.05 microns. From Table II it can be seen that where a base material with a very low mass oxygen content is present, even a metal removal of 4.57 microns sufficient to create sufficient resistance to bubble formation up to temperatures of 760 ° C.
  • Fig. 2 of this document shows recommended removal thicknesses of less than 50.8 microns at operating temperatures of 704 ° C.
  • the process described in claim 1 is proposed, in which the inner surface (s) worn down by continuous casting are mechanically removed to a maximum depth of abrasion marks and subsequently electrolytically coated with copper again, until the desired final dimension is reached.
  • This method can also be used in molds or mold plates, which are produced by casting and in which finally copper is applied electrolytically until the desired final size is reached.
  • molds or mold plates which have been produced by casting and subsequent forging, arise on the surface of fine-grained, harder and homogeneous structure, which lead to longer service life.
  • the advantage of such a mold is that on the one hand, copper is a cheaper raw material than nickel.
  • the mold, in particular the copper mold with copper a better bond can be achieved.
  • the wear resistance of such a mold is better than with a nickel coating.
  • the thickness of the coating depends on the desired final dimension of the mold inside dimension and is between 1 mm and 25 mm, preferably 3 mm to 15 mm.
  • the applied Cu layer has a greater hardness than the base body.
  • the mold inner side or the Kokillenplatteninnenseite can still be provided with a nickel coating, which is applied below the subsequent G manakible.
  • the applied layer is aftertreated by deep rolling, preferably with a hydraulic deep rolling tool.
  • a hydraulic deep rolling tool As far as the surface of the mold or the mold plate still has a surface roughness of more than 100 microns, it is expedient first to smooth the surface by machining erosion until about a roughness of 50 microns to 70 microns is reached.
  • a deep-rolling tool is pressed for final treatment with a pressure of 1.5 x 10 7 Pa to 6 x 10 7 Pa to the workpiece, the hydrostatically mounted ball of the deep rolling tool by a meandering guide on the mold or Kokillenplatten surface a final boundary layer solidification brought about, in which the compressive residual stress is increased in the boundary layer.
  • a rectangular sample measuring 25 mm ⁇ 30 mm ⁇ 105 mm made of copper was copper-plated on one side.
  • the applied copper layer had a thickness of about 10 mm.
  • the transition region from the base material to the layer has no malposition or binding error. While the Cu base material produced by casting and forging shows deformed grains with low precipitates, the Cu overlay is characterized by a very fine structure in which individual Cu grains could no longer be triggered by light microscopy. Hardness measurements of the main body have given hardnesses in the range of 74 to 78 HV 0.01, whereas the hardness of the electrodeposited copper layer was 80 HV 0.01.
  • Continuous casting are worn, electrolytically applied copper layers both in terms of their bonding to the base material as well as in terms of their structure, homogeneity, accuracy and hardness lead to optimal results. This applies both to pure Cu layers and to those Cu layers which are additionally provided with SiC particles.
  • a rectangular sample measuring 25 mm ⁇ 30 mm ⁇ 105 mm made of copper was copper-plated on one side.
  • the applied copper layer had a thickness of about 10 mm.
  • the transition region from the base material to the layer has no malposition or binding error.
  • the Cu base material produced by casting and forging shows deformed grains with low precipitations, the Cu support is characterized by a very fine structure in which individual Cu grains could no longer be triggered by light microscopy.
  • Hardness measurements of the main body have given hardnesses in the range of 74 to 78 HV 0.01, whereas the hardness of the electrodeposited copper layer was 80 HV 0.01.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Continuous Casting (AREA)
  • Electroplating Methods And Accessories (AREA)
EP10721642.6A 2009-09-29 2010-04-20 Kokille zum stranggiessen Active EP2393965B1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PL10721642T PL2393965T3 (pl) 2009-09-29 2010-04-20 Forma do odlewania ciągłego

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE202009013126U DE202009013126U1 (de) 2009-09-29 2009-09-29 Kokille zum Stranggießen
PCT/DE2010/000441 WO2011038704A2 (de) 2009-09-29 2010-04-20 Kokille zum stranggiessen

Publications (2)

Publication Number Publication Date
EP2393965A2 EP2393965A2 (de) 2011-12-14
EP2393965B1 true EP2393965B1 (de) 2016-06-08

Family

ID=41413318

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10721642.6A Active EP2393965B1 (de) 2009-09-29 2010-04-20 Kokille zum stranggiessen

Country Status (9)

Country Link
US (1) US8813825B2 (xx)
EP (1) EP2393965B1 (xx)
CN (1) CN102421944B (xx)
BR (1) BRPI1015535A2 (xx)
DE (1) DE202009013126U1 (xx)
HK (1) HK1164382A1 (xx)
PL (1) PL2393965T3 (xx)
WO (1) WO2011038704A2 (xx)
ZA (1) ZA201107472B (xx)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011114556A1 (de) 2011-09-30 2013-04-04 Egon Evertz Kg (Gmbh & Co.) Kupfer-Kokille oder Kupfer-Kokillenplatte zum Stranggießen von Metallen oder Metalllegierungen
US8932518B2 (en) 2012-02-29 2015-01-13 General Electric Company Mold and facecoat compositions
CN102776550B (zh) * 2012-08-01 2014-11-05 西峡龙成特种材料有限公司 结晶器铜板上下镀层一次电镀成型电解槽
US9192983B2 (en) 2013-11-26 2015-11-24 General Electric Company Silicon carbide-containing mold and facecoat compositions and methods for casting titanium and titanium aluminide alloys
US9511417B2 (en) 2013-11-26 2016-12-06 General Electric Company Silicon carbide-containing mold and facecoat compositions and methods for casting titanium and titanium aluminide alloys
DE102018129966A1 (de) * 2018-11-27 2020-05-28 apt Extrusions GmbH & Co. KG Verfahren zur Herstellung eines in einem Strangpressprozess umformbaren Erzeugnisses durch Stranggießen
CN109355684A (zh) * 2018-11-28 2019-02-19 德阳深捷科技有限公司 一种应用于连铸结晶器的增材制造结构及增材制造方法和装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3671407A (en) * 1970-09-11 1972-06-20 United States Steel Corp Method for preventing high-temperature blistering of copper coatings electro-deposited on copper substrates
EP0282759A1 (en) 1987-03-18 1988-09-21 DANIELI & C. OFFICINE MECCANICHE S.p.A. Method for the rehabilitation of a crystallizer of a continuous casting ingot mould
EP0492264A1 (de) 1990-12-24 1992-07-01 Sms Schloemann-Siemag Aktiengesellschaft Stahlstranggiesskokille
WO2003099490A1 (de) 2002-05-27 2003-12-04 Concast Ag Verfahren zur galvanischen beschichtung einer stranggiesskokille

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5377840A (en) * 1976-12-21 1978-07-10 Mishima Kosan Co Ltd Preparation of mold for slab
JPS55141364A (en) 1979-04-23 1980-11-05 Mitsubishi Metal Corp Composite tubular mold
JPS5668555A (en) 1979-11-12 1981-06-09 Sumitomo Metal Ind Ltd Mold for continuous casting
DE3038289A1 (de) 1980-10-10 1982-05-27 Egon 5650 Solingen Evertz Verfahren zum abscheiden von metallschichten auf den waenden von kokillen
DE3211199A1 (de) * 1982-03-26 1983-09-29 Egon 5650 Solingen Evertz Verfahren zum vernickeln von kokillenwaenden
EP0108744B1 (de) * 1982-11-04 1988-08-17 VOEST-ALPINE Aktiengesellschaft Durchlaufkokille für eine Stranggiessanlage
JPS62154570A (ja) * 1985-12-27 1987-07-09 Furukawa Battery Co Ltd:The 蓄電池用電極板の製造法
JPH0659523B2 (ja) * 1988-09-09 1994-08-10 ノムラテクノリサーチ株式会社 連続鋳造用鋳型の製造方法
JPH071086A (ja) 1993-06-15 1995-01-06 Daido Steel Co Ltd 銅製鋳造モールドの補修方法
FR2747400B1 (fr) * 1996-04-12 1998-05-22 Usinor Sacilor Procede de conditionnement de la surface externe en cuivre ou alliage de cuivre d'un element d'une lingotiere de coulee continue des metaux, du type comportant une etape de nickelage et une etape de denickelage
FR2750903B1 (fr) * 1996-07-11 1998-09-18 Usinor Sacilor Element d'une lingotiere pour la coulee continue des metaux, comprenant une paroi refroidie en cuivre ou en alliage de cuivre comportant sur sa surface externe un revetement metallique et procede pour son revetement
JPH10305351A (ja) * 1997-05-08 1998-11-17 Nkk Corp 連続鋳造用鋳型の補修方法
DE102005040151B4 (de) 2005-08-25 2008-10-09 Galvotech Dier Gmbh Verfahren zur galvanischen Abscheidung von Metallschichten und mit dem Verfahren hergestellte Kokillenplatte

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3671407A (en) * 1970-09-11 1972-06-20 United States Steel Corp Method for preventing high-temperature blistering of copper coatings electro-deposited on copper substrates
EP0282759A1 (en) 1987-03-18 1988-09-21 DANIELI & C. OFFICINE MECCANICHE S.p.A. Method for the rehabilitation of a crystallizer of a continuous casting ingot mould
EP0492264A1 (de) 1990-12-24 1992-07-01 Sms Schloemann-Siemag Aktiengesellschaft Stahlstranggiesskokille
WO2003099490A1 (de) 2002-05-27 2003-12-04 Concast Ag Verfahren zur galvanischen beschichtung einer stranggiesskokille

Also Published As

Publication number Publication date
US8813825B2 (en) 2014-08-26
PL2393965T3 (pl) 2017-05-31
WO2011038704A2 (de) 2011-04-07
US20120067541A1 (en) 2012-03-22
DE202009013126U1 (de) 2009-12-10
ZA201107472B (en) 2012-09-26
CN102421944A (zh) 2012-04-18
BRPI1015535A2 (pt) 2016-04-26
CN102421944B (zh) 2014-12-17
HK1164382A1 (en) 2012-09-21
WO2011038704A3 (de) 2011-08-18
EP2393965A2 (de) 2011-12-14

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