EP2393965B1 - Die for continuous casting - Google Patents

Die for continuous casting Download PDF

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Publication number
EP2393965B1
EP2393965B1 EP10721642.6A EP10721642A EP2393965B1 EP 2393965 B1 EP2393965 B1 EP 2393965B1 EP 10721642 A EP10721642 A EP 10721642A EP 2393965 B1 EP2393965 B1 EP 2393965B1
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Prior art keywords
copper
mold
continuous casting
layer
die
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German (de)
French (fr)
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EP2393965A2 (en
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Egon Evertz
Ralf Evertz
Stefan Evertz
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Egon Evertz KG GmbH and Co
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Egon Evertz KG GmbH and Co
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D11/00—Continuous casting of metals, i.e. casting in indefinite lengths
    • B22D11/04—Continuous casting of metals, i.e. casting in indefinite lengths into open-ended moulds
    • B22D11/059—Mould materials or platings
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C25D15/02—Combined electrolytic and electrophoretic processes with charged materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/67—Electroplating to repair workpiece
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated

Definitions

  • the invention relates to a method for processing a copper mold or copper mold plate for continuous casting of metals or metal alloys, in which the worn by continuous casting inner surface is mechanically removed to the maximum depth of wear marks and then coated again.
  • Molds of the type mentioned consist of individual plates, which are assembled into a mold.
  • For cooling cooling channels are provided in the mold plates, which are flowed through by a cooling liquid, usually water.
  • Such an SiC particle-doped Ni coating of the inner mold walls was also successfully used in copper molds that were so worn by use on the inside that they were no longer useful for continuous casting.
  • the inner wall coating allows the restoration of a mold with the desired internal dimensions, which ensures optimal continuous casting.
  • the DE 10 2005 040 151 A1 relates to a method for electrodepositing metal layers from electrolyte solutions, the electrolyte solution containing hard particles embedded in the metal layer.
  • a suspension of hard particles, a small amount of liquid and a wetting agent is prepared and then added the suspension in the electrolyte solution and evenly distributed, in which then the electrodeposition is carried out.
  • metal layers are to be deposited which contain particularly uniformly distributed hard material particles.
  • the metal layer consists predominantly of nickel or copper, in which hard material particles of oxides, nitrides, borides or carbides, in particular of metals or semi-metals are embedded.
  • JP 7 001086 A discloses a method for repairing damage to mold inner walls wherein the wall portions not damaged by erosion are provided with a mask and thereafter the unmasked eroded wall surfaces are coated with copper by electroplating.
  • the U.S. 3,671,407 teaches a method for reducing the blistering and peeling of galvanic coatings on copper bodies exposed to an operating temperature in excess of 260 ° C, wherein prior to plating the surface of the copper body is removed to a depth at which the oxygen content is in the oxygen content Base metal comes close.
  • the thickness of the Abtrag should be at least 3.05 microns. From Table II it can be seen that where a base material with a very low mass oxygen content is present, even a metal removal of 4.57 microns sufficient to create sufficient resistance to bubble formation up to temperatures of 760 ° C.
  • Fig. 2 of this document shows recommended removal thicknesses of less than 50.8 microns at operating temperatures of 704 ° C.
  • the process described in claim 1 is proposed, in which the inner surface (s) worn down by continuous casting are mechanically removed to a maximum depth of abrasion marks and subsequently electrolytically coated with copper again, until the desired final dimension is reached.
  • This method can also be used in molds or mold plates, which are produced by casting and in which finally copper is applied electrolytically until the desired final size is reached.
  • molds or mold plates which have been produced by casting and subsequent forging, arise on the surface of fine-grained, harder and homogeneous structure, which lead to longer service life.
  • the advantage of such a mold is that on the one hand, copper is a cheaper raw material than nickel.
  • the mold, in particular the copper mold with copper a better bond can be achieved.
  • the wear resistance of such a mold is better than with a nickel coating.
  • the thickness of the coating depends on the desired final dimension of the mold inside dimension and is between 1 mm and 25 mm, preferably 3 mm to 15 mm.
  • the applied Cu layer has a greater hardness than the base body.
  • the mold inner side or the Kokillenplatteninnenseite can still be provided with a nickel coating, which is applied below the subsequent G manakible.
  • the applied layer is aftertreated by deep rolling, preferably with a hydraulic deep rolling tool.
  • a hydraulic deep rolling tool As far as the surface of the mold or the mold plate still has a surface roughness of more than 100 microns, it is expedient first to smooth the surface by machining erosion until about a roughness of 50 microns to 70 microns is reached.
  • a deep-rolling tool is pressed for final treatment with a pressure of 1.5 x 10 7 Pa to 6 x 10 7 Pa to the workpiece, the hydrostatically mounted ball of the deep rolling tool by a meandering guide on the mold or Kokillenplatten surface a final boundary layer solidification brought about, in which the compressive residual stress is increased in the boundary layer.
  • a rectangular sample measuring 25 mm ⁇ 30 mm ⁇ 105 mm made of copper was copper-plated on one side.
  • the applied copper layer had a thickness of about 10 mm.
  • the transition region from the base material to the layer has no malposition or binding error. While the Cu base material produced by casting and forging shows deformed grains with low precipitates, the Cu overlay is characterized by a very fine structure in which individual Cu grains could no longer be triggered by light microscopy. Hardness measurements of the main body have given hardnesses in the range of 74 to 78 HV 0.01, whereas the hardness of the electrodeposited copper layer was 80 HV 0.01.
  • Continuous casting are worn, electrolytically applied copper layers both in terms of their bonding to the base material as well as in terms of their structure, homogeneity, accuracy and hardness lead to optimal results. This applies both to pure Cu layers and to those Cu layers which are additionally provided with SiC particles.
  • a rectangular sample measuring 25 mm ⁇ 30 mm ⁇ 105 mm made of copper was copper-plated on one side.
  • the applied copper layer had a thickness of about 10 mm.
  • the transition region from the base material to the layer has no malposition or binding error.
  • the Cu base material produced by casting and forging shows deformed grains with low precipitations, the Cu support is characterized by a very fine structure in which individual Cu grains could no longer be triggered by light microscopy.
  • Hardness measurements of the main body have given hardnesses in the range of 74 to 78 HV 0.01, whereas the hardness of the electrodeposited copper layer was 80 HV 0.01.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Continuous Casting (AREA)
  • Electroplating Methods And Accessories (AREA)

Description

Die Erfindung betrifft ein Verfahren zur Aufarbeitung einer Kupfer-Kokille oder Kupfer-Kokillenplatte zum Stranggießen von Metallen oder Metall-Legierungen, bei dem die durch Stranggießen verschlissene Innenfläche bis zur maximalen Tiefe der Verschleißriefen mechanisch abgetragen und anschließend wieder beschichtet wird.The invention relates to a method for processing a copper mold or copper mold plate for continuous casting of metals or metal alloys, in which the worn by continuous casting inner surface is mechanically removed to the maximum depth of wear marks and then coated again.

Kokillen der genannten Art bestehen aus einzelnen Platten, die zu einer Kokille zusammengebaut werden. Zur Kühlung sind in den Kokillenplatten Kühlkanäle vorgesehen, die von einer Kühlflüssigkeit, zumeist Wasser, durchströmt werden.Molds of the type mentioned consist of individual plates, which are assembled into a mold. For cooling cooling channels are provided in the mold plates, which are flowed through by a cooling liquid, usually water.

Bereits in der DE 30 38 289 A1 wird beschrieben, dass die Kokilleninnenwände häufig galvanisch behandelt werden, um die Kokilleninnenwand gegenüber den zu Beginn des Stranggießens in den kokillenbewegten Anfahrsträngen sowie später gegenüber dem flüssigen bzw. fest werdendem Stahl widerstandsfähig zu erhalten. Zunächst ist zur Oberflächenbehandlung eine Hartverchromung vorgeschlagen worden, allerdings waren die Standzeiten derartiger Kokillen verhältnismäßig gering, weshalb eine Metallschicht aus Nickel zusammen mit in einer temperierten Lösung eines oder mehrerer Nickelsalze suspendierten Hartstoffpartikeln auf die Kokilleninnenwand zur Abscheidung vorgeschlagen wird. Als Hartstoffpartikel soll insbesondere Siliziumkarbid mit (SiC) verwendet werden. Seinerzeit konnte überraschend festgestellt werden, dass mit SiC-Partikeln dotierte Nickelschichten eine Verschleißminderung bewirken. Es war überraschend, dass insbesondere beim Stahlguss das in der Kokille bewegte flüssige Metall weder die SiC-Partikel chemisch angreift noch beim Aushärten des Stahls ein mechanisches Herausbrechen der Partikel eintritt.Already in the DE 30 38 289 A1 It is described that the mold inner walls are often treated galvanically in order to obtain the mold inner wall in relation to the beginning of the continuous casting in the kokillenbewegten Anfahrsträngen and later against the liquid or solidifying steel resistant. First, a hard chrome plating has been proposed for surface treatment, however, the service life of such molds were relatively low, which is why a metal layer of nickel together with suspended in a temperate solution of one or more nickel salts hard particles is proposed on the mold inner wall for deposition. In particular, silicon carbide with (SiC) should be used as hard material particles. At that time, it was surprisingly found that nickel layers doped with SiC particles cause a reduction in wear. It was surprising that, in particular during steel casting, the liquid metal moved in the mold neither chemically attacks the SiC particles nor does it mechanically break out of the particles when the steel is hardened.

Eine solche mit SiC-Partikeln dotierte Ni-Beschichtung der Kokilleninnenwände wurde mit Erfolg auch bei Kupfer-Kokillen verwendet, die durch Gebrauch auf der Innenseite so stark verschlissen waren, dass sie für den Strangguss nicht mehr brauchbar waren. Die Innenwandbeschichtung ermöglicht die Wiederherstellung einer Kokille mit den gewünschten Innenmaßen, welche einen optimalen Strangguss gewährleisten.Such an SiC particle-doped Ni coating of the inner mold walls was also successfully used in copper molds that were so worn by use on the inside that they were no longer useful for continuous casting. The inner wall coating allows the restoration of a mold with the desired internal dimensions, which ensures optimal continuous casting.

Das Dokument DATABASE WPI Week 198051 - Thomson Scientific, London, GB; AN 1980-91089C & JP 55 141364 A (MITSUBISHI METAL CORP) 5. November 1980 offenbart eine rohrförmige Gießform mit einem Hauptkörper aus einer feuerfesten Cu-Legierung und einer Außen-Oberfläche, die vollständig mit reinem Kupfer beschichtet ist. Die Dicke der Kupferschicht ist 6 mm oder mehr. Die Innenfläche der Gießform ist mit einer harten Cu-Legierung beschichtet, um die Festigkeit dieser Oberfläche zu erhöhen.Document DATABASE WPI Week 198051 - Thomson Scientific, London, UK; AT 1980-91089C & JP 55 141364 A (MITSUBISHI METAL CORP.) November 5, 1980 discloses a tubular mold having a main body made of a refractory Cu alloy and an outer surface completely coated with pure copper. The thickness of the copper layer is 6 mm or more. The inner surface of the mold is coated with a hard Cu alloy to increase the strength of this surface.

Die DE 10 2005 040 151 A1 betrifft ein Verfahren zum galvanischen Abscheiden von Metallschichten aus Elektrolytlösungen, wobei die Elektrolytlösung Hartstoffpartikel enthält, die in die Metallschicht eingebettet werden. Zunächst wird eine Suspension aus Hartstoffpartikel, einer geringen Menge Flüssigkeit und einem Benetzungsmittel hergestellt und anschließend die Suspension in die Elektrolytlösung gegeben und gleichmäßig verteilt, in der dann die galvanische Abscheidung durchgeführt wird. Mit Hilfe dieses Verfahrens sollen Metallschichten abgeschieden werden, die besonders gleichmäßig verteilt Hartstoffpartikel enthalten. Die Metallschicht besteht vorwiegend aus Nickel oder Kupfer, worin Hartstoffpartikel aus Oxiden, Nitriden, Boriden oder Carbiden, insbesondere von Metallen oder Halbmetallen eingebettet sind.The DE 10 2005 040 151 A1 relates to a method for electrodepositing metal layers from electrolyte solutions, the electrolyte solution containing hard particles embedded in the metal layer. First, a suspension of hard particles, a small amount of liquid and a wetting agent is prepared and then added the suspension in the electrolyte solution and evenly distributed, in which then the electrodeposition is carried out. With the help of this method, metal layers are to be deposited which contain particularly uniformly distributed hard material particles. The metal layer consists predominantly of nickel or copper, in which hard material particles of oxides, nitrides, borides or carbides, in particular of metals or semi-metals are embedded.

Das Abstract der JP 7 001086 A offenbart ein Verfahren zur Reparatur von Beschädigungen an Kokilleninnenwänden, wobei die nicht durch Erosion beschädigten Wandpartien mit einer Maske versehen werden und hiernach die nicht maskierten erodierten Wandflächen mittels eines Elektroplattierens mit Kupfer beschichtet werden.The abstract of JP 7 001086 A discloses a method for repairing damage to mold inner walls wherein the wall portions not damaged by erosion are provided with a mask and thereafter the unmasked eroded wall surfaces are coated with copper by electroplating.

Das Dokument DATABASE WPI Week 198130 - Thomson Scientific, London, GB; AN 1981-54166D & JP 56 068555 A (SATHOSEN KK) 9. Juni 1981 beschreibt eine Gießform aus Kupfer oder einer Kupferlegierung mit einer 10-200 µm dicken Legierungsbeschichtung, die aus Cu und/oder Ni und Phosphorgehalten zwischen 2 bis 14 Gew% und/oder Borgehalten zwischen 1 und 7 Gew% besteht.Document DATABASE WPI Week 198130 - Thomson Scientific, London, UK; AT 1981-54166D & JP 56 068555 A (SATHOSEN KK) June 9, 1981 describes a casting mold made of copper or a copper alloy with a 10-200 μm thick alloy coating consisting of Cu and / or Ni and phosphorus contents between 2 to 14% by weight and / or boron contents between 1 and 7% by weight. consists.

Die US-3,671 407 behandelt ein Verfahren zur Verringerung der Blasenbildung und des Abschälens von galvanischen Überzügen auf Kupfergrundkörpern, die einer Betriebstemperatur von mehr als 260°C ausgesetzt sind, wobei vor dem Plattieren die Oberfläche des Kupfergrundkörpers bis zu einer Tiefe abgetragen wird, bei der der Sauerstoffgehalt dem Sauerstoffgehalt im Grundmetall nahe kommt. Für eine Betriebstemperatur von mehr als 593°C soll die Dicke des Abtrages mindestens 3,05 µm betragen. Aus Tabelle II lässt sich ersehen, dass dort, wo ein Grundmaterial mit einem sehr geringen Massensauerstoffgehalt vorliegt, bereits ein Metallabtrag von 4,57 µm ausreicht, um einen hinreichenden Widerstand gegen die Blasenbildung bis zu Temperaturen von 760°C zu schaffen. Fig. 2 dieses Dokumentes lässt empfohlene Abtragdicken von weniger als 50,8 µm bei Betriebstemperaturen von 704°C erkennen.The U.S. 3,671,407 teaches a method for reducing the blistering and peeling of galvanic coatings on copper bodies exposed to an operating temperature in excess of 260 ° C, wherein prior to plating the surface of the copper body is removed to a depth at which the oxygen content is in the oxygen content Base metal comes close. For an operating temperature of more than 593 ° C, the thickness of the Abtrag should be at least 3.05 microns. From Table II it can be seen that where a base material with a very low mass oxygen content is present, even a metal removal of 4.57 microns sufficient to create sufficient resistance to bubble formation up to temperatures of 760 ° C. Fig. 2 of this document shows recommended removal thicknesses of less than 50.8 microns at operating temperatures of 704 ° C.

Es ist Aufgabe der vorliegenden Erfindung ein Verfahren der eingangs genannten Art anzugeben, das preiswert durchführbar ist und eine gleichgute Verschleißbeständigkeit der Kokille oder Kokillenplatte gewährleistet.It is an object of the present invention to provide a method of the type mentioned, which is inexpensive to carry out and ensures the same good wear resistance of the mold or mold plate.

Zur Reparatur von verschlissenen Kokillen oder Kokillenplatten wird das im Anspruch 1 beschriebene Verfahren vorgeschlagen, bei dem die durch Stranggießen verschlissene(n) Innenfläche(n) bis zu einer maximalen Tiefe der Verschleißriefen mechanisch abgetragen und anschließend wieder mit Kupfer elektrolytisch beschichtet wird (werden), bis das gewünschte Endmaß erreicht ist. Dieses Verfahren kann auch bei Kokillen oder Kokillenplatten verwendet werden, die durch Gießen hergestellt und bei denen abschließend bis zum Erreichen des gewünschten Endmaßes Kupfer elektrolytisch aufgetragen wird. Im Unterschied zu solche Kokillen oder Kokillenplatten, die durch Gießen und anschließendes Schmieden hergestellt worden sind, ergeben sich an der Oberfläche feinkörnige, härtere und homogene Gefüge, die zu längeren Standzeiten führen.For repairing worn molds or mold plates, the process described in claim 1 is proposed, in which the inner surface (s) worn down by continuous casting are mechanically removed to a maximum depth of abrasion marks and subsequently electrolytically coated with copper again, until the desired final dimension is reached. This method can also be used in molds or mold plates, which are produced by casting and in which finally copper is applied electrolytically until the desired final size is reached. In contrast to such molds or mold plates, which have been produced by casting and subsequent forging, arise on the surface of fine-grained, harder and homogeneous structure, which lead to longer service life.

Der Vorteil einer solchen Kokille besteht darin, dass Kupfer einerseits ein preiswerterer Rohstoff als Nickel ist. Andererseits kann durch die Beschichtung der Kokille, insbesondere der Kupferkokille mit Kupfer ein besserer Haftverbund erzielt werden. Überraschenderweise ist die Verschleißbeständigkeit einer solchen Kokille besser als bei einer Nickelbeschichtung. Die Dicke der Beschichtung richtet sich nach dem gewünschten Endmaß der Kokillen-Innenabmessung und liegt zwischen 1 mm und 25 mm, vorzugsweise 3 mm bis 15 mm. Vorzugsweise besitzt die aufgetragene Cu-Schicht eine größere Härte als der Basiskörper.The advantage of such a mold is that on the one hand, copper is a cheaper raw material than nickel. On the other hand, by coating the mold, in particular the copper mold with copper, a better bond can be achieved. Surprisingly, the wear resistance of such a mold is better than with a nickel coating. The thickness of the coating depends on the desired final dimension of the mold inside dimension and is between 1 mm and 25 mm, preferably 3 mm to 15 mm. Preferably, the applied Cu layer has a greater hardness than the base body.

Falls es im Hinblick auf die Stranggießprozess sinnvoll oder erforderlich erscheint, kann die Kokilleninnenseite bzw. die Kokillenplatteninnenseite noch mit einer NickelBeschichtung versehen werden, die unterhalb der späteren Gießspiegelhöhe aufgetragen wird.If it seems sensible or necessary with regard to the continuous casting process, the mold inner side or the Kokillenplatteninnenseite can still be provided with a nickel coating, which is applied below the subsequent Gießspiegelhöhe.

Nach einer weiteren Ausgestaltung der Erfindung wird die aufgetragene Schicht durch Festwalzen nachbehandelt, vorzugsweise mit einem hydraulischen Festwalzwerkzeug. Soweit die Oberfläche der Kokille oder der Kokillenplatte noch eine Rautiefe von mehr als 100 µm besitzt, ist es zweckmäßig, zunächst die Oberfläche durch zerspanende Abtragung zu glätten, bis etwa ein Rauigkeitsmaß von 50 µm bis 70 µm erreicht ist. Ein Festwalzwerkzeug wird zur abschließenden Behandlung mit einem Druck von 1,5 x 107 Pa bis 6 x 107 Pa an das Werkstück gepresst, wobei die hydrostatisch gelagerter Kugel des Festwalzwerkzeuges durch eine meanderförmige Führung über die Kokillen- oder Kokillenplatten-Oberfläche eine abschließende Randschichtverfestigung herbeiführt, bei der die Druckeigenspannung in der Randschicht erhöht wird.According to a further embodiment of the invention, the applied layer is aftertreated by deep rolling, preferably with a hydraulic deep rolling tool. As far as the surface of the mold or the mold plate still has a surface roughness of more than 100 microns, it is expedient first to smooth the surface by machining erosion until about a roughness of 50 microns to 70 microns is reached. A deep-rolling tool is pressed for final treatment with a pressure of 1.5 x 10 7 Pa to 6 x 10 7 Pa to the workpiece, the hydrostatically mounted ball of the deep rolling tool by a meandering guide on the mold or Kokillenplatten surface a final boundary layer solidification brought about, in which the compressive residual stress is increased in the boundary layer.

Insgesamt ist es überraschend, dass sowohl bei neuen, bisher unbenutzten Kokillenplatten als auch bei solchen Kokillen oder Kokillenplatten, die bereits durch Stranggießen verschlissen sind, elektrolytisch aufgetragene Kupferschichten sowohl hinsichtlich ihrer Bindung an den Grundwerkstoff als auch hinsichtlich ihrer Struktur, Homogenität, Fehlerfreiheit sowie Härte zu optimalen Ergebnissen führen. Dies gilt sowohl für reine Cu-Schichten als auch für solche Cu-Schichten, die zusätzlich mit SiC-Partikeln versehen sind.Overall, it is surprising that both with new, previously unused Kokillenplatten as well as those molds or mold plates that are already worn by continuous casting, electrolytically applied copper layers both in terms of their binding to the base material and in terms of their structure, homogeneity, accuracy and hardness optimal results. This applies both to pure Cu layers and to those Cu layers which are additionally provided with SiC particles.

In einem konkreten Ausführungsbeispiel wurde eine Rechteckprobe mit den Maßen 25 mm x 30 mm x 105 mm aus Kupfer einseitig elektrolytisch verkupfert. Die aufgetragene Kupferschicht hatte eine Dicke von ca. 10 mm. Der Übergangsbereich vom Grundwerkstoff zur Schicht weist keine Fehlstellung oder Bindefehler auf. Während das durch Gießen und Schmieden hergestellte Cu-Grundmaterial verformte Körner mit geringen Ausscheidungen zeigt, zeichnet sich die Cu-Auflage durch eine sehr feine Struktur, bei der einzelne Cu-Körner lichtmikroskopisch nicht mehr auszulösen waren. Härtemessungen des Grundkörpers haben Härten im Bereich von 74 bis 78 HV 0,01 ergeben, wohingegen die Härte der galvanisch aufgebrachten Kupferschicht bei 80 HV 0,01 lag.In a specific embodiment, a rectangular sample measuring 25 mm × 30 mm × 105 mm made of copper was copper-plated on one side. The applied copper layer had a thickness of about 10 mm. The transition region from the base material to the layer has no malposition or binding error. While the Cu base material produced by casting and forging shows deformed grains with low precipitates, the Cu overlay is characterized by a very fine structure in which individual Cu grains could no longer be triggered by light microscopy. Hardness measurements of the main body have given hardnesses in the range of 74 to 78 HV 0.01, whereas the hardness of the electrodeposited copper layer was 80 HV 0.01.

Stranggießen verschlissen sind, elektrolytisch aufgetragene Kupferschichten sowohl hinsichtlich ihrer Bindung an den Grundwerkstoff als auch hinsichtlich ihrer Struktur, Homogenität, Fehlerfreiheit sowie Härte zu optimalen Ergebnissen führen. Dies gilt sowohl für reine Cu-Schichten als auch für solche Cu-Schichten, die zusätzlich mit SiC-Partikeln versehen sind.Continuous casting are worn, electrolytically applied copper layers both in terms of their bonding to the base material as well as in terms of their structure, homogeneity, accuracy and hardness lead to optimal results. This applies both to pure Cu layers and to those Cu layers which are additionally provided with SiC particles.

In einem konkreten Ausführungsbeispiel wurde eine Rechteckprobe mit den Maßen 25 mm x 30 mm x 105 mm aus Kupfer einseitig elektrolytisch verkupfert. Die aufgetragene Kupferschicht hatte eine Dicke von ca. 10 mm. Der Übergangsbereich vom Grundwerkstoff zur Schicht weist keine Fehlstellung oder Bindefehler auf. Während das durch Gießen und Schmieden hergestellte Cu-Grundmaterial verformte Körner mit geringen Ausscheidungen zeigt, zeichnet sich die Cu-Auflage durch eine sehr feine Struktur, bei der einzelne Cu-Körner lichtmikroskopisch nicht mehr auszulösen waren. Härtemessungen des Grundkörpers haben Härten im Bereich von 74 bis 78 HV 0,01 ergeben, wohingegen die Härte der galvanisch aufgebrachten Kupferschicht bei 80 HV 0,01 lag.In a specific embodiment, a rectangular sample measuring 25 mm × 30 mm × 105 mm made of copper was copper-plated on one side. The applied copper layer had a thickness of about 10 mm. The transition region from the base material to the layer has no malposition or binding error. While the Cu base material produced by casting and forging shows deformed grains with low precipitations, the Cu support is characterized by a very fine structure in which individual Cu grains could no longer be triggered by light microscopy. Hardness measurements of the main body have given hardnesses in the range of 74 to 78 HV 0.01, whereas the hardness of the electrodeposited copper layer was 80 HV 0.01.

Claims (3)

  1. Method for reconditioning a copper mould or a copper mould plate for continuous casting, in which process material is removed mechanically from the inner surface worn by continuous casting down to the maximum depth of the wear grooves, and the inner surface is then recoated again,
    characterized in that
    the coating material used is pure copper which is applied electrolytically in a thickness of 1 mm to 25 mm.
  2. Method according to claim 1, characterized in that parts of the Cu-mould or Cu-mould plate are provided with an additional Ni-outer layer.
  3. Method according to one of the claims 1 or 2, characterized in that the applied layer is aftertreated by roller compression.
EP10721642.6A 2009-09-29 2010-04-20 Die for continuous casting Active EP2393965B1 (en)

Priority Applications (1)

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PL10721642T PL2393965T3 (en) 2009-09-29 2010-04-20 Die for continuous casting

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DE202009013126U DE202009013126U1 (en) 2009-09-29 2009-09-29 Mold for continuous casting
PCT/DE2010/000441 WO2011038704A2 (en) 2009-09-29 2010-04-20 Die for continuous casting

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CN102776550B (en) * 2012-08-01 2014-11-05 西峡龙成特种材料有限公司 Electrolytic bath for primary electroplating molding for upper plating layer and lower plating layer of crystallizer copper plate
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WO2011038704A3 (en) 2011-08-18
EP2393965A2 (en) 2011-12-14
PL2393965T3 (en) 2017-05-31
CN102421944A (en) 2012-04-18
BRPI1015535A2 (en) 2016-04-26
CN102421944B (en) 2014-12-17
DE202009013126U1 (en) 2009-12-10
HK1164382A1 (en) 2012-09-21
ZA201107472B (en) 2012-09-26
WO2011038704A2 (en) 2011-04-07
US20120067541A1 (en) 2012-03-22
US8813825B2 (en) 2014-08-26

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