EP2379998A1 - Dispositif et procédé de fabrication du dispositif - Google Patents

Dispositif et procédé de fabrication du dispositif

Info

Publication number
EP2379998A1
EP2379998A1 EP09749066A EP09749066A EP2379998A1 EP 2379998 A1 EP2379998 A1 EP 2379998A1 EP 09749066 A EP09749066 A EP 09749066A EP 09749066 A EP09749066 A EP 09749066A EP 2379998 A1 EP2379998 A1 EP 2379998A1
Authority
EP
European Patent Office
Prior art keywords
housing
component
carrier element
intermediate housing
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09749066A
Other languages
German (de)
English (en)
Inventor
Volker Dietrich
Martin Schuerer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP2379998A1 publication Critical patent/EP2379998A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14467—Joining articles or parts of a single article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00325—Processes for packaging MEMS devices for reducing stress inside of the package structure
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/141—Monolithic housings, e.g. molded or one-piece housings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/098—Arrangements not provided for in groups B81B2207/092 - B81B2207/097
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0154—Moulding a cap over the MEMS device

Definitions

  • the invention relates to a device according to the preamble of claim 1.
  • the document DE 10 2005 040 781 A1 discloses a sensor device which has a mold housing with a micromechanical sensor element and a carrier element, wherein the sensor element is arranged in a cavity of the mold housing and on the carrier element, the carrier element being completely is arranged in the mold housing and wherein the evaluation element is decoupled from the mold housing by a passivation gel.
  • Manufacture of a device according to the independent claims have the advantage over the prior art that the device is protected by the intermediate housing in the manufacture of the housing and thus damage to the device during the molding process is prevented.
  • This is necessary in particular in the case of the construction of the component as a sensor element and preferably as a pressure sensor element, since in this case the risk of damage to the component and preferably pressure-sensitive areas (membranes) of the pressure sensor element due to the injection pressure and / or the high temperatures during the molding process. is high at the same time.
  • Effective protection is achieved in that the intermediate housing is designed as a premold housing and thus when recording the component and in the manufacture of the housing is already cured.
  • the intermediate housing allows improved positioning of the device in the manufacturing process of the housing, since due to the rigid intermediate housing, a firm clamping of the device is made possible in an injection mold for the production of the housing.
  • the component is decoupled from the housing, so that no thermal stresses are transmitted from the housing to the component, but are absorbed by the intermediate housing. This is particularly advantageous in the production process of the housing, since damage to the component as a result of mechanical stress during hardening of the molding compound is thus prevented.
  • the advantage is that the shape of the intermediate housing influences the injection molding quality during the production of the housing.
  • a housing with fewer binding seams can be realized.
  • the housing is comparatively flexible form in the molding process, so that a variable adaptation of the housing in terms of the application of the device is made possible in a simple manner.
  • the component is completely enclosed by the intermediate housing and / or that the carrier element is partially enclosed by the intermediate housing, so that advantageously the component is completely protected from external influences by the intermediate housing and at the same time a electrical contacting of the device via the carrier element from outside the housing is made possible.
  • the intermediate housing and / or the housing is preferably formed as a socket in an outer region of the carrier element, so that the carrier element in this outer region comprises the plug contacts and thus a comparatively simple contact of the carrier element by a simple plug contact can be realized.
  • the carrier element comprises in particular a leadframe or a metallic insert part (ELT).
  • the intermediate housing comprises a first housing region and a second housing region, wherein the first and the second housing region are preferably adhesively bonded, welded and / or latched.
  • the first and second housing regions comprise two half-shells, which together form the intermediate housing.
  • the component and the carrier element is particularly advantageous to arrange in a simple manner in the intermediate housing.
  • a decoupling means is arranged between the component and the intermediate housing, between the carrier element and the intermediate housing and / or between the housing and the intermediate housing.
  • the decoupling agent comprises in particular an elastomer.
  • the housing is thus decoupled from the component so that mechanical influences on the housing, such as impacts and the like, are not or only insignificantly transferred to the component.
  • the decoupling means are also preferably used for passivation of the device.
  • the intermediate housing and / or the housing have an inlet channel.
  • the inlet channel advantageously serves to guide a measuring medium to the sensor element through the housing and through the intermediate housing.
  • the inlet channel is preferably sealed relative to the intermediate housing and / or relative to the housing.
  • the component comprises a pressure sensor, which is connected via the inlet channel with a pressure medium, so that advantageously an external pressure is passed to a pressure-sensitive region of the pressure sensor.
  • Another object of the present invention is a method for producing a device, wherein in a first method step, the component is arranged together with the carrier element in the intermediate housing and wherein in a second method step, the intermediate housing for
  • Production of the housing is overmolded with a molding compound. Especially - A -
  • Partially the protection of the component during the second method step is achieved by the arrangement of the component and at least partially of the support element within the intermediate housing (as already detailed above), so that damage to the device by the injection pressure during spraying of the molding compound by increasing the Temperature during the MoId process and / or by thermal stresses during curing of the molding compound after the molding process is advantageously avoided and at the same time a variable and cost-effective design of the housing by the use of a molding process can be achieved. Furthermore, a decoupling of the component from the housing is achieved by the intermediate housing.
  • the component in the first method step, first the component is arranged together with the carrier element in the first housing region and then the second housing region is fastened on the first housing region, so that advantageously the component comparatively easily and inexpensively in as Premold- Housing trained intermediate housing is to be arranged.
  • a subsequent bonding, latching and / or welding of the first and second housing regions in particular by means of laser transmission welding or ultrasonic welding, a mechanically strong and tight connection between the first and the second housing portion for forming the intermediate housing is achieved.
  • the carrier element in a third method step, before the first method step, is produced by a punching process in a grid, wherein subsequently the baud element is arranged on the carrier element of the grid, and that in a fourth process step after the time first process step, the carrier element is separated from the grid.
  • the device is thus particularly inexpensive to produce in relatively large numbers.
  • FIGS. 1 a and 1 b show a first precursor structure for producing a device according to a first embodiment of the present invention and a device according to the first embodiment of the present invention and FIGS.
  • FIGS. 2 a and 2 b show a second precursor structure for producing a device according to a second embodiment of the present invention and a device according to the second embodiment of the present invention.
  • FIGS. 1 a and 1 b show a first precursor structure 1 'for producing a device 1 according to a first embodiment of the present invention and a device 1 according to the first embodiment of the present invention, wherein based on a first precursor structure illustrated in FIG 1 'a first and a third method step is illustrated schematically.
  • first of all a component 2, which comprises a sensor element is arranged on a carrier element 3.
  • the carrier element 3 comprises in particular a leadframe, which is produced in a stamping process.
  • the component 2 and at least partially the carrier element 3 are arranged in a first housing region 4 'of an intermediate housing 4, wherein subsequently a second housing region 4 "of the intermediate housing 4 is arranged on the first housing region 4' Housing area 4 ', 4 "are in particular welded together, glued and / or clipped, wherein particularly preferably the carrier element 3 is clamped by the first and the second housing area 4', 4" and electrically contactable via the carrier element 3 from outside the intermediate housing 4.
  • the carrier element 3, has an outer region 3 'which protrudes from the intermediate housing 4.
  • the first precursor structure 1' is filled with a molding compound to form the Encapsulated housing 5, wherein the intermediate housing.
  • a decoupling means 7 is further arranged, which is a Decoupling of the component 2 of the intermediate housing 4 causes.
  • the decoupling means 7 comprises a Passivitationsstoff, so that preferably the support member 3 is passivated in a direct contact between a measuring medium and a sensitive region of the device 2 by the decoupling agent and / or the sensitive area against a mechanical
  • FIG. 1 b shows the device 1 according to the first embodiment, wherein the housing 5 has the shape of a plug housing in the area of the outer area 3 ', so that the outer area 3' of the carrier element 3 forms plug contacts and the carrier element 3 by a simple Plug contact is contactable.
  • FIGS. 2 a and 2 b show a second precursor structure 1 "for producing a device 1 according to a second embodiment of the present invention and a device 1 according to the second embodiment of the present invention, wherein the second precursor structure 1" shown in FIG Essentially identical to the first precursor structure 1 'shown in Figure 1 a and wherein the apparatus 1 shown in Figure 2b according to the second embodiment is substantially identical to that shown in Figure 1 b
  • the intermediate housing 4 has an inlet channel 6, which protrudes from the housing 5 and a pressure medium leads to a pressure-sensitive region of the component 2.
  • the component 2 thus functions as a pressure sensor element for measuring a pressure in the pressure medium.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

L'invention concerne un dispositif, en particulier un dispositif capteur, comprenant un composant, un élément de support et un boîtier. Le composant est implanté sur l'élément de support, et le composant et l'élément de support sont au moins partiellement disposés dans le boîtier. Par ailleurs, le dispositif comprend un boîtier intermédiaire qui est disposé essentiellement entre le boîtier et le composant. Le boîtier intermédiaire comprend un boîtier prémoulé.
EP09749066A 2008-12-16 2009-10-30 Dispositif et procédé de fabrication du dispositif Withdrawn EP2379998A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008054743A DE102008054743A1 (de) 2008-12-16 2008-12-16 Vorrichtung und Verfahren zur Herstellung einer Vorrichtung
PCT/EP2009/064394 WO2010072455A1 (fr) 2008-12-16 2009-10-30 Dispositif et procédé de fabrication du dispositif

Publications (1)

Publication Number Publication Date
EP2379998A1 true EP2379998A1 (fr) 2011-10-26

Family

ID=41611306

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09749066A Withdrawn EP2379998A1 (fr) 2008-12-16 2009-10-30 Dispositif et procédé de fabrication du dispositif

Country Status (6)

Country Link
US (1) US8621925B2 (fr)
EP (1) EP2379998A1 (fr)
JP (1) JP2012512405A (fr)
CN (1) CN102257374B (fr)
DE (1) DE102008054743A1 (fr)
WO (1) WO2010072455A1 (fr)

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US8914183B2 (en) * 2010-09-20 2014-12-16 Joshua Forwerck Enhanced electronic assembly
DE102011102768B4 (de) * 2011-05-28 2019-10-17 Audi Ag Druckspeichereinrichtung für eine Kraftstoffversorgungseinrichtung
JP5949672B2 (ja) 2013-06-10 2016-07-13 日立金属株式会社 検出装置、及び検出装置の製造方法
DE102014200936A1 (de) * 2014-01-20 2015-07-23 Leoni Bordnetz-Systeme Gmbh Elektronikbaugruppe
US9260071B2 (en) 2014-03-11 2016-02-16 Trw Automotive U.S. Llc Apparatus for snap mounting a crash sensor
US9470595B2 (en) * 2014-08-29 2016-10-18 Trw Automotive U.S. Llc Apparatus for dry side mounting a crash pressure sensor
DE102014013356A1 (de) * 2014-09-08 2016-03-10 Wabco Gmbh Träger für ein Sensorelement, Bauteilgruppe und Drehzahlsensor
FR3040213B1 (fr) * 2015-08-18 2017-09-15 Continental Automotive France Procede de fabrication d'un capteur de mesure pour vehicule automobile
DE102015225159A1 (de) * 2015-12-14 2017-06-14 Continental Automotive Gmbh Magnetfeldsensor mit einem Steckersockel
JP6160940B2 (ja) * 2016-06-07 2017-07-12 日立金属株式会社 検出装置、及び検出装置の製造方法
KR102637239B1 (ko) * 2017-02-27 2024-02-19 현대모비스 주식회사 차량용 압력감지장치
JP7035680B2 (ja) * 2018-03-22 2022-03-15 日立金属株式会社 樹脂成形体付きケーブル
EP3797962A1 (fr) * 2019-09-30 2021-03-31 Siemens Aktiengesellschaft Boîtier d'un module électronique et sa fabrication

Citations (1)

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EP1376090A1 (fr) * 2001-03-29 2004-01-02 Hitachi, Ltd. Capteur de pression a semi-conducteur

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EP1376090A1 (fr) * 2001-03-29 2004-01-02 Hitachi, Ltd. Capteur de pression a semi-conducteur

Also Published As

Publication number Publication date
CN102257374A (zh) 2011-11-23
JP2012512405A (ja) 2012-05-31
WO2010072455A1 (fr) 2010-07-01
DE102008054743A1 (de) 2010-06-17
US20110290016A1 (en) 2011-12-01
US8621925B2 (en) 2014-01-07
CN102257374B (zh) 2014-12-24

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