EP2379998A1 - Device and method for producing a device - Google Patents

Device and method for producing a device

Info

Publication number
EP2379998A1
EP2379998A1 EP09749066A EP09749066A EP2379998A1 EP 2379998 A1 EP2379998 A1 EP 2379998A1 EP 09749066 A EP09749066 A EP 09749066A EP 09749066 A EP09749066 A EP 09749066A EP 2379998 A1 EP2379998 A1 EP 2379998A1
Authority
EP
European Patent Office
Prior art keywords
housing
component
carrier element
intermediate housing
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP09749066A
Other languages
German (de)
French (fr)
Inventor
Volker Dietrich
Martin Schuerer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of EP2379998A1 publication Critical patent/EP2379998A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14467—Joining articles or parts of a single article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00325—Processes for packaging MEMS devices for reducing stress inside of the package structure
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/141—Monolithic housings, e.g. molded or one-piece housings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/098—Arrangements not provided for in groups B81B2207/092 - B81B2207/097
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/01—Packaging MEMS
    • B81C2203/0154—Moulding a cap over the MEMS device

Definitions

  • the invention relates to a device according to the preamble of claim 1.
  • the document DE 10 2005 040 781 A1 discloses a sensor device which has a mold housing with a micromechanical sensor element and a carrier element, wherein the sensor element is arranged in a cavity of the mold housing and on the carrier element, the carrier element being completely is arranged in the mold housing and wherein the evaluation element is decoupled from the mold housing by a passivation gel.
  • Manufacture of a device according to the independent claims have the advantage over the prior art that the device is protected by the intermediate housing in the manufacture of the housing and thus damage to the device during the molding process is prevented.
  • This is necessary in particular in the case of the construction of the component as a sensor element and preferably as a pressure sensor element, since in this case the risk of damage to the component and preferably pressure-sensitive areas (membranes) of the pressure sensor element due to the injection pressure and / or the high temperatures during the molding process. is high at the same time.
  • Effective protection is achieved in that the intermediate housing is designed as a premold housing and thus when recording the component and in the manufacture of the housing is already cured.
  • the intermediate housing allows improved positioning of the device in the manufacturing process of the housing, since due to the rigid intermediate housing, a firm clamping of the device is made possible in an injection mold for the production of the housing.
  • the component is decoupled from the housing, so that no thermal stresses are transmitted from the housing to the component, but are absorbed by the intermediate housing. This is particularly advantageous in the production process of the housing, since damage to the component as a result of mechanical stress during hardening of the molding compound is thus prevented.
  • the advantage is that the shape of the intermediate housing influences the injection molding quality during the production of the housing.
  • a housing with fewer binding seams can be realized.
  • the housing is comparatively flexible form in the molding process, so that a variable adaptation of the housing in terms of the application of the device is made possible in a simple manner.
  • the component is completely enclosed by the intermediate housing and / or that the carrier element is partially enclosed by the intermediate housing, so that advantageously the component is completely protected from external influences by the intermediate housing and at the same time a electrical contacting of the device via the carrier element from outside the housing is made possible.
  • the intermediate housing and / or the housing is preferably formed as a socket in an outer region of the carrier element, so that the carrier element in this outer region comprises the plug contacts and thus a comparatively simple contact of the carrier element by a simple plug contact can be realized.
  • the carrier element comprises in particular a leadframe or a metallic insert part (ELT).
  • the intermediate housing comprises a first housing region and a second housing region, wherein the first and the second housing region are preferably adhesively bonded, welded and / or latched.
  • the first and second housing regions comprise two half-shells, which together form the intermediate housing.
  • the component and the carrier element is particularly advantageous to arrange in a simple manner in the intermediate housing.
  • a decoupling means is arranged between the component and the intermediate housing, between the carrier element and the intermediate housing and / or between the housing and the intermediate housing.
  • the decoupling agent comprises in particular an elastomer.
  • the housing is thus decoupled from the component so that mechanical influences on the housing, such as impacts and the like, are not or only insignificantly transferred to the component.
  • the decoupling means are also preferably used for passivation of the device.
  • the intermediate housing and / or the housing have an inlet channel.
  • the inlet channel advantageously serves to guide a measuring medium to the sensor element through the housing and through the intermediate housing.
  • the inlet channel is preferably sealed relative to the intermediate housing and / or relative to the housing.
  • the component comprises a pressure sensor, which is connected via the inlet channel with a pressure medium, so that advantageously an external pressure is passed to a pressure-sensitive region of the pressure sensor.
  • Another object of the present invention is a method for producing a device, wherein in a first method step, the component is arranged together with the carrier element in the intermediate housing and wherein in a second method step, the intermediate housing for
  • Production of the housing is overmolded with a molding compound. Especially - A -
  • Partially the protection of the component during the second method step is achieved by the arrangement of the component and at least partially of the support element within the intermediate housing (as already detailed above), so that damage to the device by the injection pressure during spraying of the molding compound by increasing the Temperature during the MoId process and / or by thermal stresses during curing of the molding compound after the molding process is advantageously avoided and at the same time a variable and cost-effective design of the housing by the use of a molding process can be achieved. Furthermore, a decoupling of the component from the housing is achieved by the intermediate housing.
  • the component in the first method step, first the component is arranged together with the carrier element in the first housing region and then the second housing region is fastened on the first housing region, so that advantageously the component comparatively easily and inexpensively in as Premold- Housing trained intermediate housing is to be arranged.
  • a subsequent bonding, latching and / or welding of the first and second housing regions in particular by means of laser transmission welding or ultrasonic welding, a mechanically strong and tight connection between the first and the second housing portion for forming the intermediate housing is achieved.
  • the carrier element in a third method step, before the first method step, is produced by a punching process in a grid, wherein subsequently the baud element is arranged on the carrier element of the grid, and that in a fourth process step after the time first process step, the carrier element is separated from the grid.
  • the device is thus particularly inexpensive to produce in relatively large numbers.
  • FIGS. 1 a and 1 b show a first precursor structure for producing a device according to a first embodiment of the present invention and a device according to the first embodiment of the present invention and FIGS.
  • FIGS. 2 a and 2 b show a second precursor structure for producing a device according to a second embodiment of the present invention and a device according to the second embodiment of the present invention.
  • FIGS. 1 a and 1 b show a first precursor structure 1 'for producing a device 1 according to a first embodiment of the present invention and a device 1 according to the first embodiment of the present invention, wherein based on a first precursor structure illustrated in FIG 1 'a first and a third method step is illustrated schematically.
  • first of all a component 2, which comprises a sensor element is arranged on a carrier element 3.
  • the carrier element 3 comprises in particular a leadframe, which is produced in a stamping process.
  • the component 2 and at least partially the carrier element 3 are arranged in a first housing region 4 'of an intermediate housing 4, wherein subsequently a second housing region 4 "of the intermediate housing 4 is arranged on the first housing region 4' Housing area 4 ', 4 "are in particular welded together, glued and / or clipped, wherein particularly preferably the carrier element 3 is clamped by the first and the second housing area 4', 4" and electrically contactable via the carrier element 3 from outside the intermediate housing 4.
  • the carrier element 3, has an outer region 3 'which protrudes from the intermediate housing 4.
  • the first precursor structure 1' is filled with a molding compound to form the Encapsulated housing 5, wherein the intermediate housing.
  • a decoupling means 7 is further arranged, which is a Decoupling of the component 2 of the intermediate housing 4 causes.
  • the decoupling means 7 comprises a Passivitationsstoff, so that preferably the support member 3 is passivated in a direct contact between a measuring medium and a sensitive region of the device 2 by the decoupling agent and / or the sensitive area against a mechanical
  • FIG. 1 b shows the device 1 according to the first embodiment, wherein the housing 5 has the shape of a plug housing in the area of the outer area 3 ', so that the outer area 3' of the carrier element 3 forms plug contacts and the carrier element 3 by a simple Plug contact is contactable.
  • FIGS. 2 a and 2 b show a second precursor structure 1 "for producing a device 1 according to a second embodiment of the present invention and a device 1 according to the second embodiment of the present invention, wherein the second precursor structure 1" shown in FIG Essentially identical to the first precursor structure 1 'shown in Figure 1 a and wherein the apparatus 1 shown in Figure 2b according to the second embodiment is substantially identical to that shown in Figure 1 b
  • the intermediate housing 4 has an inlet channel 6, which protrudes from the housing 5 and a pressure medium leads to a pressure-sensitive region of the component 2.
  • the component 2 thus functions as a pressure sensor element for measuring a pressure in the pressure medium.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

The invention relates to a device, particularly a sensor device, having a structural element, a carrier element and a housing, wherein the structural element is arranged on the carrier element, and wherein the structural element and the carrier element are arranged at least partially within the housing, and wherein the device furthermore has an intermediate housing that is arranged substantially between the housing and the structural element, wherein the intermediate housing comprises a pre-mold housing.

Description

Beschreibung description
Titeltitle
Vorrichtung und Verfahren zur Herstellung einer VorrichtungApparatus and method for manufacturing a device
Stand der TechnikState of the art
Die Erfindung geht aus von einer Vorrichtung nach dem Oberbegriff des Anspruchs 1.The invention relates to a device according to the preamble of claim 1.
Solche Vorrichtungen sind allgemein bekannt. Beispielsweise ist aus der Druckschrift DE 10 2005 040 781 A1 eine Sensorvorrichtung bekannt, welche ein Moldgehäuse mit einem mikromechanischen Sensorelement und einem Trägerelement aufweist, wobei das Sensorelement in einem Hohlraum des Moldgehäu- ses und auf dem Trägerelement angeordnet ist, wobei das Trägerelement voll- ständig in dem Moldgehäuse angeordnet ist und wobei das Auswerteelement von dem Moldgehäuse durch ein Passivierungsgel entkoppelt ist.Such devices are well known. For example, the document DE 10 2005 040 781 A1 discloses a sensor device which has a mold housing with a micromechanical sensor element and a carrier element, wherein the sensor element is arranged in a cavity of the mold housing and on the carrier element, the carrier element being completely is arranged in the mold housing and wherein the evaluation element is decoupled from the mold housing by a passivation gel.
Offenbarung der ErfindungDisclosure of the invention
Die erfindungsgemäße Vorrichtung und das erfindungsgemäße Verfahren zurThe inventive device and the inventive method for
Herstellung einer Vorrichtung gemäß den nebengeordneten Ansprüchen haben gegenüber dem Stand der Technik den Vorteil, dass das Bauelement durch das Zwischengehäuse bei der Herstellung des Gehäuses geschützt wird und somit eine Beschädigung des Bauelements während des Moldprozesses verhindert wird. Dies ist insbesondere bei der Ausbildung des Bauelements als Sensorelement und vorzugsweise als Drucksensorelement notwendig, da in diesem Fall die Gefahr von Beschädigungen des Bauelements und vorzugsweise von drucksensitiven Bereichen (Membranen) des Drucksensorelements durch den Spritzdruck und/oder die hohen Temperaturen während des Moldprozesses ver- gleichsweise hoch ist. Ein wirksamer Schutz wird dadurch erreicht, dass das Zwischengehäuse als Premold-Gehäuse ausgebildet ist und somit bei der Aufnahme des Bauelements und bei der Herstellung des Gehäuses bereits ausgehärtet ist. Femer ermöglicht das Zwischengehäuse eine verbesserte Positionierung der Vorrichtung im Herstellungsprozess des Gehäuses, da aufgrund des steifen Zwischengehäuses ein festes Einspannen der Vorrichtung in ein Spritzgußwerkzeug zur Herstellung des Gehäuses ermöglicht wird. Zudem wird das Bauelement von dem Gehäuses entkoppelt, so dass keine thermischen Spannungen von dem Gehäuse auf das Bauelement übertragen, sondern von dem Zwischengehäuse aufgenommen werden. Dies ist insbesondere im Herstellungsprozess des Gehäuses von Vorteil, da somit eine Beschädigung des Bauelements durch mecha- nische Spannung beim Aushärten der Moldmasse unterbunden wird. Ein weitererManufacture of a device according to the independent claims have the advantage over the prior art that the device is protected by the intermediate housing in the manufacture of the housing and thus damage to the device during the molding process is prevented. This is necessary in particular in the case of the construction of the component as a sensor element and preferably as a pressure sensor element, since in this case the risk of damage to the component and preferably pressure-sensitive areas (membranes) of the pressure sensor element due to the injection pressure and / or the high temperatures during the molding process. is high at the same time. Effective protection is achieved in that the intermediate housing is designed as a premold housing and thus when recording the component and in the manufacture of the housing is already cured. Furthermore, the intermediate housing allows improved positioning of the device in the manufacturing process of the housing, since due to the rigid intermediate housing, a firm clamping of the device is made possible in an injection mold for the production of the housing. In addition, the component is decoupled from the housing, so that no thermal stresses are transmitted from the housing to the component, but are absorbed by the intermediate housing. This is particularly advantageous in the production process of the housing, since damage to the component as a result of mechanical stress during hardening of the molding compound is thus prevented. Another
Vorteil ist, dass über die Formgebung des Zwischengehäuses Einfluss auf die Spritzgußqualität bei der Herstellung des Gehäuses genommen wird. Beispielsweise ist durch eine kugelförmige Ausbildung des Zwischengehäuses ein Gehäuse mit weniger Bindenähten realisierbar. Das Gehäuse ist im Moldprozess vergleichsweise flexibel auszubilden, so dass eine variable Adaption des Gehäuse im Hinblick auf die Anwendung der Vorrichtung in einfacher Weise ermöglicht wird.The advantage is that the shape of the intermediate housing influences the injection molding quality during the production of the housing. For example, by means of a spherical design of the intermediate housing, a housing with fewer binding seams can be realized. The housing is comparatively flexible form in the molding process, so that a variable adaptation of the housing in terms of the application of the device is made possible in a simple manner.
Vorteilhafte Ausgestaltungen und Weiterbildungen der Erfindung sind den Unter- ansprüchen, sowie der Beschreibung unter Bezugnahme auf die Zeichnungen entnehmbar.Advantageous embodiments and further developments of the invention are the dependent claims, as well as the description with reference to the drawings.
Gemäß einer bevorzugten Weiterbildung ist vorgesehen, dass das Bauelement vollständig von dem Zwischengehäuse umschlossen ist und/oder dass das Trä- gerelement teilweise von dem Zwischengehäuse umschlossen ist, so dass in vorteilhafter Weise das Bauelement vollständig von dem Zwischengehäuse gegen äußere Einflüsse geschützt wird und gleichzeitig eine elektrische Kontaktierung des Bauelements über das Trägerelement von außerhalb des Gehäuses ermöglicht wird. Das Zwischengehäuse und/oder das Gehäuse ist in einem äußeren Bereich des Trägerelement vorzugsweise als Steckerbuchse ausgeformt, so dass das Trägerelement in diesem äußeren Bereich die Steckerkontakte umfasst und somit eine vergleichsweise einfache Kontakterung des Trägerelements durch einen einfachen Steckerkontakt realisierbar ist. Das Trägerelement umfasst insbesondere ein Leadframe bzw. ein metallisches Einlegeteil (ELT).According to a preferred embodiment, it is provided that the component is completely enclosed by the intermediate housing and / or that the carrier element is partially enclosed by the intermediate housing, so that advantageously the component is completely protected from external influences by the intermediate housing and at the same time a electrical contacting of the device via the carrier element from outside the housing is made possible. The intermediate housing and / or the housing is preferably formed as a socket in an outer region of the carrier element, so that the carrier element in this outer region comprises the plug contacts and thus a comparatively simple contact of the carrier element by a simple plug contact can be realized. The carrier element comprises in particular a leadframe or a metallic insert part (ELT).
Gemäß einer weiteren bevorzugten Weiterbildung ist vorgesehen, dass Gemäß einer weiteren bevorzugten Weiterbildung ist vorgesehen, dass das Zwischengehäuse einen ersten Gehäusebereich und einen zweiten Gehäusebereich umfasst, wobei der erste und der zweiten Gehäusebereich vorzugsweise miteinander verklebt, verschweißt und/oder verrastet vorgesehen sind. Besonders vor- teilhaft umfasst der erste und zweite Gehäusebereich zwei Halbschalen, welche zusammen das Zwischengehäuse bilden. Besonders vorteilhaft ist somit das Bauelement und das Trägerelement in einfacher Weise in dem Zwischengehäuse anzuordnen.According to a further preferred development, it is provided that According to a further preferred development, it is provided that the intermediate housing comprises a first housing region and a second housing region, wherein the first and the second housing region are preferably adhesively bonded, welded and / or latched. Particularly advantageously, the first and second housing regions comprise two half-shells, which together form the intermediate housing. Thus, the component and the carrier element is particularly advantageous to arrange in a simple manner in the intermediate housing.
Gemäß einer weiteren bevorzugten Weiterbildung ist vorgesehen, dass zwischen dem Bauelement und dem Zwischengehäuse, zwischen dem Trägerelement und dem Zwischengehäuse und/oder zwischen dem Gehäuse und dem Zwischengehäuse ein Entkopplungsmittel angeordnet ist. Das Entkopplungsmittel umfasst insbesondere ein Elastomer. Vorteilhaft wird somit das Gehäuses vom Bauele- ment entkoppelt, so dass mechanische Einflüsse auf das Gehäuse, wie Stöße und dergleichen, nicht oder nur unwesentlich auf das Bauelement übertragen werden. Die Entkopplungsmittel dienen vorzugsweise ebenfalls zur Passivierung des Bauelements.According to a further preferred development, it is provided that a decoupling means is arranged between the component and the intermediate housing, between the carrier element and the intermediate housing and / or between the housing and the intermediate housing. The decoupling agent comprises in particular an elastomer. Advantageously, the housing is thus decoupled from the component so that mechanical influences on the housing, such as impacts and the like, are not or only insignificantly transferred to the component. The decoupling means are also preferably used for passivation of the device.
Gemäß einer weiteren bevorzugten Weiterbildung ist vorgesehen, dass das Zwischengehäuse und/oder das Gehäuse einen Einlasskanal aufweisen. Im Fall, dass das Bauelement ein Sensorelement umfasst, dient der Einlasskanal vorteilhaft dazu, ein Messmedium zum Sensorelement durch das Gehäuse und durch das Zwischengehäuse zu leiten. Der Einlasskanal ist vorzugswiese gegenüber dem Zwischengehäuse und/oder gegenüber dem Gehäuse abgedichtet.According to a further preferred development, it is provided that the intermediate housing and / or the housing have an inlet channel. In the case where the component comprises a sensor element, the inlet channel advantageously serves to guide a measuring medium to the sensor element through the housing and through the intermediate housing. The inlet channel is preferably sealed relative to the intermediate housing and / or relative to the housing.
Gemäß einer weiteren bevorzugten Weiterbildung ist vorgesehen, dass das Bauelement einen Drucksensor umfasst, welche über den Einlasskanal mit einem Druckmedium verbunden ist, so dass in vorteilhafter weise ein Außendruck zu einem drucksensitiven Bereich des Drucksensor geleitet wird.According to a further preferred development, it is provided that the component comprises a pressure sensor, which is connected via the inlet channel with a pressure medium, so that advantageously an external pressure is passed to a pressure-sensitive region of the pressure sensor.
Ein weiterer Gegenstand der vorliegenden Erfindung ist ein Verfahren zur Herstellung einer Vorrichtung, wobei in einem ersten Verfahrensschritt das Bauelement zusammen mit dem Trägerelement in dem Zwischengehäuse angeordnet wird und wobei in einem zweiten Verfahrensschritt das Zwischengehäuse zurAnother object of the present invention is a method for producing a device, wherein in a first method step, the component is arranged together with the carrier element in the intermediate housing and wherein in a second method step, the intermediate housing for
Herstellung des Gehäuses mit einer Moldmasse umspritzt wird. Besonders vor- - A -Production of the housing is overmolded with a molding compound. Especially - A -
teilhaft wird durch die Anordnung des Bauelements und zumindest teilweise des Trägerelements innerhalb des Zwischengehäuses ein Schutz des Bauelements während des zweiten Verfahrensschrittes erzielt (wie oben bereits detailiert ausgeführt), so dass eine Beschädigung des Bauelements durch den Spritzdruck beim Spritzen der Moldmasse, durch eine Erhöhung der Temperatur während des MoId prozesses und/oder durch thermische Spannungen beim Aushärten der Moldmasse nach dem Moldprozess in vorteilhafter weise vermieden wird und gleichzeitig eine variable und kostengünstige Ausbildung des Gehäuse durch die Verwendung eines Moldprozesses erzielbar ist. Ferner wird durch das Zwischen- gehäuse eine Entkopplung des Bauelements vom Gehäuse erreicht.Partially the protection of the component during the second method step is achieved by the arrangement of the component and at least partially of the support element within the intermediate housing (as already detailed above), so that damage to the device by the injection pressure during spraying of the molding compound by increasing the Temperature during the MoId process and / or by thermal stresses during curing of the molding compound after the molding process is advantageously avoided and at the same time a variable and cost-effective design of the housing by the use of a molding process can be achieved. Furthermore, a decoupling of the component from the housing is achieved by the intermediate housing.
Gemäß einer bevorzugten Weiterbildung ist vorgesehen, dass im ersten Verfahrensschritt zunächst das Bauelement zusammen mit dem Trägerelement im ersten Gehäusebereich angeordnet wird und anschließend der zweite Gehäusebe- reich auf dem ersten Gehäusebereich befestigt wird, so dass vorteilhaft das Bauelement vergleichsweise einfach und kostengünstig im als Premold-Gehäuse ausgebildeten Zwischengehäuse anzuordnen ist. Durch ein anschließendes Verkleben, Verrasten und/oder Verschweißen der ersten und zweiten Gehäusebereiche, insbesondere mittels Laserdurchstrahlschweissen oder Ultraschall- schweissen, wird eine mechanisch feste und dichte Verbindung zwischen dem ersten und dem zweiten Gehäusebereich zur Bildung des Zwischengehäuses erzielt.According to a preferred embodiment, it is provided that in the first method step, first the component is arranged together with the carrier element in the first housing region and then the second housing region is fastened on the first housing region, so that advantageously the component comparatively easily and inexpensively in as Premold- Housing trained intermediate housing is to be arranged. By a subsequent bonding, latching and / or welding of the first and second housing regions, in particular by means of laser transmission welding or ultrasonic welding, a mechanically strong and tight connection between the first and the second housing portion for forming the intermediate housing is achieved.
Gemäß einer weiteren bevorzugten Weiterbildung ist vorgesehen, dass in einem dritten Verfahrensschritt zeitlich vor dem ersten Verfahrensschritt das Trägerelement durch ein Stanzverfahren in einem Gitter hergestellt wird, wobei anschließend das Baudelement auf dem Trägerelement des Gitters angeordnet wird, und dass in einem vierten Verfahrensschritt zeitlich nach dem ersten Verfahrensschritt das Trägerelement aus dem Gitter vereinzelt wird. Besonders vorteilhaft ist die Vorrichtung somit in vergleichsweise großen Stückzahlen besonders kostengünstig herstellbar.According to a further preferred development, it is provided that in a third method step, before the first method step, the carrier element is produced by a punching process in a grid, wherein subsequently the baud element is arranged on the carrier element of the grid, and that in a fourth process step after the time first process step, the carrier element is separated from the grid. Particularly advantageous, the device is thus particularly inexpensive to produce in relatively large numbers.
Ausführungsbeispiele der vorliegenden Erfindung sind in den Zeichnungen dargestellt und in der nachfolgenden Beschreibung näher erläutert.Embodiments of the present invention are illustrated in the drawings and explained in more detail in the following description.
Kurze Beschreibung der Zeichnungen Es zeigenBrief description of the drawings Show it
Figuren 1 a und 1 b eine erste Vorläuferstruktur zur Herstellung einer Vorrichtung gemäß einer ersten Ausführungsform der vorliegenden Erfindung und eine Vor- richtung gemäß der ersten Ausführungsform der vorliegenden Erfindung undFIGS. 1 a and 1 b show a first precursor structure for producing a device according to a first embodiment of the present invention and a device according to the first embodiment of the present invention and FIGS
Figuren 2a und 2b eine zweite Vorläuferstruktur zur Herstellung einer Vorrichtung gemäß einer zweiten Ausführungsform der vorliegenden Erfindung und eine Vorrichtung gemäß der zweiten Ausführungsform der vorliegenden Erfindung.FIGS. 2 a and 2 b show a second precursor structure for producing a device according to a second embodiment of the present invention and a device according to the second embodiment of the present invention.
Ausführungsformen der ErfindungEmbodiments of the invention
In den Figuren 1 a und 1 b sind eine erste Vorläuferstruktur 1 ' zur Herstellung einer Vorrichtung 1 gemäß einer ersten Ausführungsform der vorliegenden Erfindung und eine Vorrichtung 1 gemäß der ersten Ausführungsform der vorliegen- den Erfindung dargestellt, wobei anhand einer in Figur 1a illustrierten ersten Vorläuferstruktur 1 ' ein erste und ein dritter Verfahrensschritt schematisch veranschaulicht wird. Im dritten Verfahrensschritt wird zunächst ein Bauelement 2, welches ein Sensorelement umfasst, auf einem Trägerelement 3 angeordnet. Das Trägerelement 3 umfasst insbesondere ein Leadframe, welches in einem Stanzvorgang hergestellt wird. In einem nachfolgenden ersten Verfahrensschritt wird das Bauelement 2 und zumindest teilweise das Trägerelement 3 in einem ersten Gehäusebereich 4' eines Zwischengehäuses 4 angeordnet, wobei anschließend ein zweiter Gehäusebereich 4" des Zwischengehäuses 4 auf dem ersten Gehäusebereich 4' angeordnet wird. Der erste und der zweite Gehäuse- bereich 4', 4" werden insbesondere miteinander verschweißt, verklebt und/oder verclipst, wobei besonders bevorzugt das Trägerelement 3 von dem ersten und dem zweiten Gehäusebereich 4', 4" eingeklemmt wird. Das Bauelement 2 ist von dem Zwischengehäuse 4 vollständig umschlossen und über das Trägerelement 3 von außerhalb des Zwischengehäuses 4 elektrisch kontaktierbar. Das Träger- element 3 weist hingegen einen Außenbereich 3' auf, welcher aus dem Zwischengehäuse 4 herausragt. In einem zweiten Verfahren schritt wird die erste Vorläuferstruktur 1 ' mit einer Moldmasse zur Bildung des Gehäuses 5 umspritzt, wobei das Zwischengehäuse 4 von dem Gehäuse 5 im Wesentlichen vollständig umgeben ist und wobei das Bauelement 2 durch das Zwischengehäuse 4 von der Moldmasse vollständig isoliert und entkoppelt ist. Im Bereich des ersten Gehäusebereichs 4' ist ferner ein Entkopplungsmittel 7 angeordnet, welches eine Entkopplung des Bauelement 2 von dem Zwischengehäuse 4 bewirkt. Alternativ umfasst das Entkopplungsmittel 7 ein Passivierungsmittel, so dass vorzugsweise das Trägerelement 3 bei einem direkten Kontakt zwischen einem Messmedium und einem sensitiven Bereich des Bauelements 2 durch das Entkopplungsmittel passiviert wird und/oder der sensitive Bereich gegenüber einer mechanischenFIGS. 1 a and 1 b show a first precursor structure 1 'for producing a device 1 according to a first embodiment of the present invention and a device 1 according to the first embodiment of the present invention, wherein based on a first precursor structure illustrated in FIG 1 'a first and a third method step is illustrated schematically. In the third method step, first of all a component 2, which comprises a sensor element, is arranged on a carrier element 3. The carrier element 3 comprises in particular a leadframe, which is produced in a stamping process. In a subsequent first method step, the component 2 and at least partially the carrier element 3 are arranged in a first housing region 4 'of an intermediate housing 4, wherein subsequently a second housing region 4 "of the intermediate housing 4 is arranged on the first housing region 4' Housing area 4 ', 4 "are in particular welded together, glued and / or clipped, wherein particularly preferably the carrier element 3 is clamped by the first and the second housing area 4', 4" and electrically contactable via the carrier element 3 from outside the intermediate housing 4. The carrier element 3, on the other hand, has an outer region 3 'which protrudes from the intermediate housing 4. In a second process, the first precursor structure 1' is filled with a molding compound to form the Encapsulated housing 5, wherein the intermediate housing. 4 is completely completely surrounded by the housing 5 and wherein the component 2 is completely isolated and decoupled from the molding compound by the intermediate housing 4. In the region of the first housing portion 4 ', a decoupling means 7 is further arranged, which is a Decoupling of the component 2 of the intermediate housing 4 causes. Alternatively, the decoupling means 7 comprises a Passivierungsmittel, so that preferably the support member 3 is passivated in a direct contact between a measuring medium and a sensitive region of the device 2 by the decoupling agent and / or the sensitive area against a mechanical
Überbeanspruchung gedämpft wird.Overuse is damped.
In Figur 1 b ist die Vorrichtung 1 gemäß der ersten Ausführungsform dargestellt, wobei das Gehäuse 5 im Bereich des Außenbereichs 3' die Form eines Stecker- gehäuses aufweist, so dass der Außenbereich 3' des Trägerelements 3 Steckerkontakte bildet und das Trägerelement 3 durch einen einfachen Steckerkontakt kontaktierbar ist.FIG. 1 b shows the device 1 according to the first embodiment, wherein the housing 5 has the shape of a plug housing in the area of the outer area 3 ', so that the outer area 3' of the carrier element 3 forms plug contacts and the carrier element 3 by a simple Plug contact is contactable.
In den Figuren 2a und 2b ist eine zweite Vorläuferstruktur 1 " zur Herstellung ei- ner Vorrichtung 1 gemäß einer zweiten Ausführungsform der vorliegenden Erfindung und eine Vorrichtung 1 gemäß der zweiten Ausführungsform der vorliegenden Erfindung dargestellt, wobei die in Figur 2a dargestellte zweite Vorläuferstruktur 1 " im Wesentlichen identisch der in Figur 1 a dargestellten ersten Vorläuferstruktur 1 ' ist und wobei die in Figur 2b dargestellte Vorrichtung 1 gemäß der zweiten Ausführungsform im Wesentlichen identisch der in Figur 1 b dargestelltenFIGS. 2 a and 2 b show a second precursor structure 1 "for producing a device 1 according to a second embodiment of the present invention and a device 1 according to the second embodiment of the present invention, wherein the second precursor structure 1" shown in FIG Essentially identical to the first precursor structure 1 'shown in Figure 1 a and wherein the apparatus 1 shown in Figure 2b according to the second embodiment is substantially identical to that shown in Figure 1 b
Vorrichtung 1 gemäß der ersten Ausführungsform ist, wobei das Zwischengehäuse 4 einen Einlasskanal 6 aufweist, welche aus dem Gehäuse 5 herausragt und ein Druckmedium zu einem drucksensitiven Bereich des Bauelements 2 führt. Das Bauelement 2 fungiert somit als Drucksensorelement zur Messung ei- nes Drucks im Druckmedium. Device 1 according to the first embodiment, wherein the intermediate housing 4 has an inlet channel 6, which protrudes from the housing 5 and a pressure medium leads to a pressure-sensitive region of the component 2. The component 2 thus functions as a pressure sensor element for measuring a pressure in the pressure medium.

Claims

Ansprüche claims
1 . Vorrichtung (1 ), insbesondere Sensorvorrichtung, mit einem Bauelement (2), einem Trägerelement (3) und einem Gehäuse (5), wobei das Bauelement (2) auf dem Trägerelement (3) angeordnet ist, wobei das Bauelement (2) und das Trägerelement (3) zumindest teilweise innerhalb des Gehäuse (5) angeordnet sind und wobei das Gehäuse (5) ein Moldgehäuse umfasst, dadurch gekennzeichnet, dass die Vorrichtung (1 ) ein Zwischengehäuse (4) aufweist, welches im Wesentlichen zwischen dem Gehäuse (5) und dem Bauelement (2) angeordnet ist, wobei das Zwischengehäuse (4) ein Premold-Gehäuse (5) umfasst.1 . Device (1), in particular sensor device, with a component (2), a carrier element (3) and a housing (5), wherein the component (2) is arranged on the carrier element (3), wherein the component (2) and the Carrier element (3) are at least partially disposed within the housing (5) and wherein the housing (5) comprises a mold housing, characterized in that the device (1) has an intermediate housing (4) substantially between the housing (5) and the component (2), wherein the intermediate housing (4) comprises a premold housing (5).
2. Vorrichtung (1 ) nach Anspruch 1 , dadurch gekennzeichnet, dass das Bauelement (2) vollständig von dem Zwischengehäuse (4) umschlossen ist und/oder dass das Trägerelement (3) teilweise von dem Zwischengehäuse (4) umschlossen ist.2. Device (1) according to claim 1, characterized in that the component (2) is completely enclosed by the intermediate housing (4) and / or that the carrier element (3) is partially enclosed by the intermediate housing (4).
3. Vorrichtung (1 ) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Zwischengehäuse (4) einen ersten Gehäusebereich (41) und einen zweiten Gehäusebreich (4") umfasst, wobei der erste und der zweiten Gehäusebereich(4', 4") vorzugsweise miteinander verklebt, verschweißt und/oder verrastet vorgesehen sind.3. Device (1) according to one of the preceding claims, characterized in that the intermediate housing (4) comprises a first housing region (4 1 ) and a second housing region (4 "), wherein the first and the second housing region (4 ', 4 ") are preferably glued together, welded and / or provided latched.
4. Vorrichtung (1 ) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass zwischen dem Bauelement (2) und dem Zwischenge- häuse (4), zwischen dem Trägerelement (3) und dem Zwischengehäuse (4) und/oder zwischen dem Gehäuse (5) und dem Zwischengehäuse (4) ein Entkopplungsmittel (7) angeordnet ist.4. Device (1) according to one of the preceding claims, characterized in that between the component (2) and the intermediate housing (4), between the support element (3) and the intermediate housing (4) and / or between the housing ( 5) and the intermediate housing (4) a decoupling means (7) is arranged.
5. Vorrichtung (1 ) nach einem der vorhergehenden Ansprüche, dadurch ge- kennzeichnet, dass das Zwischengehäuse (4) und/oder das Gehäuse (5) einen Einlasskanal (6) aufweisen. 5. Device (1) according to one of the preceding claims, character- ized in that the intermediate housing (4) and / or the housing (5) have an inlet channel (6).
6. Vorrichtung (1 ) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass das Bauelement (2) einen Drucksensor umfasst, welche über den Einlasskanal mit einem Druckmedium verbunden ist.6. Device (1) according to one of the preceding claims, characterized in that the component (2) comprises a pressure sensor, which is connected via the inlet channel with a pressure medium.
7. Verfahren zur Herstellung einer Vorrichtung (1 ) nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, dass in einem ersten Verfahrensschritt das Bauelement (2) zusammen mit dem Trägerelement (3) in dem Zwischengehäuse (4) angeordnet wird und dass in einem zweiten Ver- fahrensschritt das Zwischengehäuse (4) zur Herstellung des Gehäuses (5) mit einer Moldmasse umspritzt wird.7. A method for producing a device (1) according to any one of the preceding claims, characterized in that in a first method step, the component (2) together with the carrier element (3) in the intermediate housing (4) is arranged and that in a second Ver - Moving step, the intermediate housing (4) for producing the housing (5) is encapsulated with a molding compound.
8. Verfahren nach Anspruch 7, dadurch gekennzeichnet, dass im ersten Verfahrensschritt zunächst das Bauelement (2) zusammen mit dem Trägerele- ment (3) im ersten Gehäusebereich (4') angeordnet wird und anschließend der zweite Gehäusebereich (4") auf dem ersten Gehäusebereich (4') befestigt wird.8. The method according to claim 7, characterized in that in the first method step, first the component (2) together with the Trägerele- element (3) in the first housing portion (4 ') is arranged and then the second housing portion (4 ") on the first Housing portion (4 ') is attached.
9. Verfahren nach einem der Ansprüche 7 oder 8, dadurch gekennzeichnet, dass in einem dritten Verfahrensschritt zeitlich vor dem ersten Verfahrensschritt das Trägerelement (3) durch ein Stanzverfahren in einem Gitter hergestellt wird, wobei anschließend das Bauelement (2) auf dem Trägerelement (3) des Gitters angeordnet wird, und dass in einem vierten Verfahrensschritt zeitlich nach dem ersten Verfahrensschritt das Trägerelement (3) aus dem Gitter vereinzelt wird. 9. The method according to any one of claims 7 or 8, characterized in that in a third process step, before the first process step, the carrier element (3) is produced by a punching process in a grid, wherein subsequently the component (2) on the carrier element (3 ) of the grid is arranged, and that in a fourth method step after the first method step, the carrier element (3) is separated from the grid.
EP09749066A 2008-12-16 2009-10-30 Device and method for producing a device Withdrawn EP2379998A1 (en)

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WO2010072455A1 (en) 2010-07-01
JP2012512405A (en) 2012-05-31
CN102257374B (en) 2014-12-24
US8621925B2 (en) 2014-01-07
DE102008054743A1 (en) 2010-06-17
CN102257374A (en) 2011-11-23

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