JP2005109027A - Box body for element - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent the limitation of a usage environment and a service condition which improving the heat resistance and chemical resistance, and to reduce the manufacturing cost while improving water resistance. <P>SOLUTION: A rotation sensor has a housing 12, a case 14 buried in the housing 12, a hole IC 16 mounted in the case 14, and a metallic terminal 15 extended to the outside of the housing 12, through the inside of the case 14 from the hole IC 16 and the inside of the housing 12. The housing 12 and the case 14 are composed of a resin material, containing polyphenylene sulfide, glass fibers and an elastomer. In the sensor, the boundary between the housing 12 and the case 14 is fused. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to an element casing in which an electronic element is arranged. The device casing of the present invention is suitable for use as an electronic component.

  The conventional element housing includes, for example, a housing 92 having a predetermined shape and a case 94 embedded in the housing 92 as in the sensor shown in FIG. The case 94 has a bottomed cylindrical shape with an opening 94 a at the upper end, and the lower end of the case 94 protrudes outside the housing 92. In the case 94, a Hall IC 96 as an electronic element is provided, and the Hall IC 96 is covered with a covering member 97 made of epoxy resin or the like. In the opening 94 a of the case 94, a sealing member 98 that seals the Hall IC 96 and the covering member 97 is provided, and an O-ring 99 is provided on the outer periphery of the sealing member 98. A metal terminal 95 is connected to the Hall IC 96, and the metal terminal 95 extends outside the housing 92 through the covering member 97 and the sealing member 98 in the case 94 and the housing 92.

  In such a sensor, the O-ring 99 provided in the sealing member 98 in the case 94 can prevent water and oil from entering from the boundary between the housing 92 and the case 94, and the circuit of the Hall IC 96 is short-circuited. Can be prevented. For this reason, as a sensor with water resistance, it can be used even in an environment or under conditions where water, oil, or the like exists.

In this regard, if the invention described in Patent Document 1 is used, the housing of the sensor can be formed of a resin material made of 66 nylon and glass fiber, and the sensor case is made of 6 nylon, nitrile rubber, and glass fiber. It can shape | mold with the resin material which becomes. With such a sensor, since the boundary between the housing and the case can be sealed, water resistance can be exhibited without requiring a sealing member or an O-ring. Moreover, since a sealing member and an O-ring are not required, manufacturing cost can be reduced.
Japanese Patent Publication No. 5-40195

  However, in the above-described conventional device casing, since the housing and the case are made of polyamide-based resin such as 66 nylon or 6 nylon, it is difficult to say that they have excellent heat resistance and chemical resistance.

  That is, these polyamide-based resins can withstand heat that can be generated in a driving engine such as an automobile, but have sufficient heat resistance when heat exceeding an assumed temperature is generated. Is not good. Further, it is difficult to say that the various lubricants and the like that can be used in such a drive engine have sufficient chemical resistance. For this reason, in the element housing having such a polyamide resin housing and case, the use environment and use conditions are limited.

  The present invention has been made in view of the above-described conventional circumstances, and can be made difficult to be restricted by the use environment and use conditions while improving heat resistance and chemical resistance, and is manufactured while exhibiting water resistance. Providing a device casing capable of reducing costs is an issue to be solved.

  As a result of diligent research to solve the above-mentioned problems, the inventors have selected a good resin material as the housing of the element casing and its case, and have completed the present invention by solving the problems caused thereby. It was.

  That is, the technical means taken in the present invention to solve the above-described problems include a housing, a case embedded in the housing, and an electronic element provided in the case as described in claim 1. And an element housing having a metal terminal extending from the electronic element through the inside of the case and the inside of the housing to the outside of the housing, wherein the housing and the case are made of polyphenylene sulfide, glass fiber, and elastomer. And a boundary between the housing and the case is fused.

  According to the inventors' detection, a resin material containing polyphenylene sulfide, glass fiber, and elastomer has a higher melting point than that of polyamide-based resin. Moreover, such a resin material does not easily react with an alkaline solution or an acidic solution. For this reason, if the housing or the case is molded from a resin material containing polyphenylene sulfide, glass fiber, and elastomer, the heat resistance and chemical resistance of the element housing can be improved. In particular, since the elastomer has a thermal shock effect, the housing and the case formed of a resin material containing the elastomer are unlikely to crack even under a severe use environment. Accordingly, it is possible to obtain an element housing in which the use environment and use conditions are not easily restricted. In particular, in this element housing, after the case is molded using the resin material described above, the housing is molded by embedding the case with the same resin material. At that time, the housing and the case adhere to each other. In this state, it may occur that water or oil cannot be prevented from entering between the housing and the case. For this reason, only the boundary between the housing and the case is fused so that the space between the housing and the case is sealed. For this reason, entry of water, oil, etc. from the boundary between the housing and the case can be prevented, and water resistance can be exhibited. Moreover, since it is not necessary to provide a sealing member or an O-ring in the case, the manufacturing cost can be reduced.

  Examples of the electronic element include various elements such as a semiconductor element such as a Hall IC, a magnet type element including a magnet, a coil, a yoke, and the like. Such an electronic element is preferably a detection element that detects a change in a magnetic field (magnetic force), an electric field (voltage, current, or resistance), light, temperature, or the like.

  Further, as a technical means that can be taken in the present invention as described in claim 2, a concave portion and a convex portion are provided around the outer periphery of the case in contact with the inside of the housing, and the concave portion and the convex portion are provided on the housing. It is preferable to continue alternately in the extending direction of the case protruding outward. The element housing of the present invention is obtained by dissolving a resin material for a housing containing polyphenylene sulfide, glass fiber, and elastomer, and pouring it around a case having an electronic element or the like inside, and performing molding. Can do. At that time, the concave portion and the convex portion provided around the outer periphery of the case come into contact with the housing, and only the convex portion is fused to the housing. According to the personal opinion of the inventors, it is considered that when molding is performed, thermal stress tends to concentrate on the convex portion of the case, and the heat of dissolution around the convex portion increases. For this reason, it is thought that only the convex part melt | dissolves and it fuse | melts to a housing. Further, since the case is engaged with the housing by the concave portion or the convex portion, it is possible to make it difficult to remove the case from the housing.

  Further, as a technical means that can be taken in the present invention as described in claim 3, it is preferable that the tip of the convex portion has an acute angle. If the tip of the convex portion has an acute angle, thermal stress tends to concentrate on the tip. For this reason, the convex part of the case can be reliably fused to the housing.

  Further, as a technical means that can be taken in the present invention as described in claim 4, the resin material includes 60 parts by mass of the first resin component containing polyphenylene sulfide, and the second resin component containing glass fiber and elastomer. It is preferably composed of 40 parts by mass. According to the results of the endurance test by the inventors, the insulation resistance value of the element casing can be maintained even under severe use conditions, and the above-described effects can be reliably exhibited.

  According to invention of Claims 1 thru | or 4, in a housing | casing for elements, it can make it difficult to receive the restriction | limiting of a use environment or use conditions, improving heat resistance and chemical resistance, and exhibiting water resistance. Manufacturing cost can be reduced.

   DESCRIPTION OF EXEMPLARY EMBODIMENTS The best mode for carrying out the present invention will be described below with reference to the drawings.

(Embodiment)
The sensor as the element casing of the embodiment can be manufactured by the primary and secondary molded body acquisition steps S10 and S20 shown in FIG. Here, a rotation sensor is manufactured.

  First, in primary molded object acquisition process S10, the resin material containing the 1st resin material component which has polyphenylene sulfide, and the 2nd resin component which has glass fiber and an elastomer is prepared. Here, the first resin component can include not only polyphenylene sulfide but also other resin materials and fiber materials, and the second resin component includes not only glass fibers and elastomers but also other resin materials and fiber materials. Can also be included. Such a resin material contains 60 parts by mass of the first resin component and 40 parts by mass of the second resin component. The case 14 shown in FIG. 2 can be molded by molding with a predetermined mold using the resin material thus prepared. The case 14 thus molded has a bottomed cylindrical shape having an opening 14a at the upper end. A plurality of concave portions 14 b and a plurality of convex portions 14 c are provided around the outer periphery of the case 14, and the concave portions 14 b and the convex portions 14 c are alternately continued in the extending direction of the case 14. At that time, the tip of the convex portion 14c has an acute angle. In the case 14 thus molded, a Hall IC 16 as an electronic element to which the metal terminal 15 is connected is inserted. An epoxy resin layer 17 or a silicone resin layer as a covering member is provided so as to cover the metal terminal 15 and the Hall IC 16 in the case 14. For this reason, the metal terminal 15 extends from the Hall IC 16 to the outside of the opening 14 a of the case 14 through the epoxy resin 17. In this way, the primary molded body 10 having the metal terminal 15, the Hall IC 16 and the epoxy resin layer 17 in the case 14 can be obtained.

  Next, in the secondary molded body obtaining step S20 shown in FIG. 1, a mold 22 shown in FIG. 3 is prepared. The mold 22 includes an upper mold 22a and a lower mold 22b, and a cavity 22c imitating the outer shape of the rotation sensor is formed inside the upper mold 22a and the lower mold 22b. An injection groove 22d connected from the outside into the cavity 22c is provided on the bottom surface of the upper mold 22a. In such a mold 22, the primary molded body 10 described above is inserted into the cavity 22c. Then, as shown in FIG. 4, the resin material used for molding the case 14 is injected into the cavity 22 c from the injection groove 22 d of the mold 22. The mold 22 into which the resin material is injected is pressurized and molded. Thus, the resin material is fixed around the primary molded body 10, and the housing 12 is molded. At that time, as shown in FIG. 5, thermal stress concentrates on the tip of the convex portion 14c of the case 14, and the heat of dissolution increases around the convex portion 14c. For this reason, only the convex portion 14 c is melted and fused to the housing 12. Moreover, since the epoxy resin layer 17 shown in FIG. 4 has a role as a buffer material, the circuit of the Hall IC 16 is prevented from being short-circuited by pressurization. And the secondary molded object 20 is acquirable by removing the metal mold | die 22. FIG.

  The secondary molded body 20 obtained in this way becomes a rotation sensor shown in FIG. 6 after removing burrs and the like produced by molding and adjusting the outer shape.

  In the rotation sensor, a case 14 made of the same resin material is embedded in a housing 12 made of resin material containing polyphenylene sulfide, glass fiber, and elastomer. The lower end of the case 14 protrudes below the housing 12, and a hall IC 16 is provided in the case 14. A metal terminal 15 is connected to the Hall IC 16, and the metal terminal 15 extends outside the housing 12 through the epoxy resin layer 17 in the case 14 and the inside of the housing 12.

(Evaluation test)
Five rotation sensors obtained as described above were prepared as test samples (Nos. 1 to 5). Moreover, the rotation sensor by which the housing and the case were formed similarly to the above by the resin material containing the 1st resin material component which has polyphenylene sulfide, and the 2nd resin component which has glass fiber was obtained. Five rotation sensors thus obtained were prepared as comparative test products (Nos. 1 to 5). And the insulation resistance value of each implementation test product and each comparative test product was measured under the conditions shown below.

First, as shown in FIG. 7, in the rotation sensor as each test product and each comparative test product, the external connector 85 was connected to the metal terminal 15 and the bracket 82 was fixed to the housing 12. And normal temperature water was stored in the water tank 84, and the rotation sensor was immersed in it. In the evaluation test apparatus 80 having such a configuration, an insulation resistance value (Ω) generated between the external connector 85 (or the metal terminal 15) and the bracket 82 (or the housing 12) was measured. The results are shown in Table 1.
Next, the inside of a constant temperature chamber (not shown) was set to 150 (° C.), and the rotation sensors as the respective test products and the comparative test products were left in the chamber for 30 minutes. Then, the inside of the constant temperature chamber was set to −40 (° C.), and the rotation sensor was left in the chamber for 30 minutes. This cycle was repeated 3000 times.

  Next, the inside of the constant temperature chamber was set to 105 (° C.), and the rotation sensor was left in the chamber for 30 minutes. And normal temperature water was stored in the thermostat which is not illustrated, and the rotation sensor was immersed in it for 20 minutes. This cycle was repeated 300 times.

  Next, 100 (° C.) hot water was stored in the thermostatic bath, and the rotation sensor was immersed therein for 10 minutes. And 0 (degreeC) cold water was stored in the thermostat, and the rotation sensor was immersed in it for 10 minutes. This cycle was repeated 20 times.

  After the endurance test was performed by placing the rotation sensors as the respective test samples and comparative test products in the environment as described above, the rotation sensors were placed in the room temperature water in the water tank 84 shown in FIG. Soaked. Thus, the insulation resistance value (Ω) generated between the external connector 85 (or the metal terminal 15) and the bracket 82 (or the housing 12) was measured. The results are shown in Table 1.

  Further, in the rotation sensor of each test product, the boundary between the housing 12 and the case 14 was cut, and the boundary was photographed with an optical microscope (× 5 times). The optical micrograph is shown in FIG.

  Further, the tip of the convex portion 14c of the case 14 was photographed with an optical microscope (× 50 magnification). The optical micrograph is shown in FIG.

(Evaluation)
As can be seen from Table 1, in the rotation sensor of each test product, the insulation resistance value generated between the external connector 85 (or the metal terminal 15) and the bracket 82 (or the housing 12) does not change. In this respect, in the rotation sensor of each comparative test product, the insulation resistance value generated between them is small. That is, normal temperature water permeates inside the rotation sensor of each comparative test product, and normal temperature water does not permeate inside the rotation sensor of each test sample. For this reason, it can be seen that the boundary between the housing 12 and the case 14 shown in FIG.

  Further, in the optical micrographs shown in FIGS. 8 and 9, it can be seen that the housing 12 and the case 14 are fixed in the rotation sensor of each test product, and the tip of the convex portion 14 c of the case 14 is fused to the housing 12. You can see that she is wearing it. For this reason, the boundary between the housing 12 and the case 14 is fused, and the boundary exhibits a good sealed state.

  The inventors consider that the thermal conductivity of the elastomer is smaller than that of polyphenylene sulfide, and thus the thermal conductivity of the entire resin material is considered to be reduced. For this reason, in the second molded body acquisition step S20 of FIG. 1 described above, the housing 12 can easily store the melting heat of the resin material itself. Thus, thermal stress concentrates on the tip of the convex portion 14c of the case 14, and the heat of dissolution is increased around the convex portion 14c. For this reason, it is considered that the bonding of polyphenylene sulfide contained in the resin material of the case 14 is slightly relaxed, and the tip of the convex portion 14 c of the case 14 is fused to the housing 12. In particular, since the tip of the convex portion 14c of the case 14 has an acute angle, the tendency is remarkable. Further, the case 14 is engaged with the housing 12 by the concave portion 14b of the case 14 and the convex portion 14c thereof, and the case 14 can be hardly detached from the housing 12.

  Thus, in the rotation sensor of the embodiment, the boundary between the housing 12 and the case 14 is fused, and the space between the housing 12 and the case 14 is sealed. For this reason, infiltration of water, oil, or the like from the boundary between the housing 12 and the case 14 can be prevented, and water resistance can be exhibited. Moreover, since it is not necessary to provide a sealing member or an O-ring in the case 14, the manufacturing cost can be reduced.

  The resin material used for molding the housing 12 and the case 14 has a high melting point. In particular, even if the durability test as described above is performed, the housing 12 and the case 14 are unlikely to crack due to the thermal shock effect of the elastomer. And such a resin material does not react easily with an alkaline solution or an acidic solution. For this reason, the heat resistance and chemical resistance of the rotation sensor can be improved, and the use environment and use conditions of the rotation sensor are not easily limited.

  Therefore, if it is a rotation sensor of embodiment, it can make it difficult to receive the restriction | limiting of a use environment and use conditions, improving heat resistance and chemical resistance, and can reduce manufacturing cost, exhibiting water resistance. .

  In the device casing of the above-described embodiment, another electronic device that detects a change in magnetic force or the like can be used instead of the Hall IC 16. Thus, by changing the electronic element, the element casing can be not only a rotation sensor but also a vehicle height sensor, another element casing, or the like.

It is process drawing which concerns on embodiment and shows the manufacturing method of a rotation sensor. It is a longitudinal cross-sectional view of a primary molded object in connection with embodiment. It is detail drawing of a secondary molded object acquisition process in connection with embodiment. It is a longitudinal cross-sectional view of a secondary molded object according to the embodiment. It is an enlarged vertical sectional view of the boundary between the housing and the case according to the embodiment. It is a longitudinal cross-sectional view of a rotation sensor according to the embodiment. It is a longitudinal cross-sectional view of the evaluation test apparatus of a rotation sensor according to the embodiment. It is an optical micrograph of a housing and a case according to the embodiment. It is an optical micrograph of the convex part of the case according to the embodiment. It is a longitudinal cross-sectional view of the conventional sensor.

Explanation of symbols

12 ... Housing 14 ... Case 16 ... Hall IC (electronic element)
15 ... Metal terminal 14b ... Concave part 14c ... Convex part

Claims (4)

A housing, a case embedded in the housing, an electronic element provided in the case, and a metal terminal extending from the electronic element to the outside of the housing through the case and the housing In the element housing,
The housing for an element, wherein the housing and the case are made of a resin material containing polyphenylene sulfide, glass fiber, and elastomer, and a boundary between the housing and the case is fused.   A concave portion and a convex portion are provided around the outer periphery of the case in contact with the inside of the housing, and the concave portion and the convex portion are alternately and continuously extended in the extending direction of the case protruding to the outside of the housing. The device casing according to claim 1, wherein   The device casing according to claim 2, wherein a tip of the convex portion has an acute angle.   The said resin material consists of 60 mass parts of 1st resin components containing the said polyphenylene sulfide, and 40 mass parts of 2nd resin components containing the said glass fiber and the said elastomer. Housing for the element.