EP2325121B1 - Transportsystem zur Aufnahme und zum Transport von flexiblen Substraten - Google Patents

Transportsystem zur Aufnahme und zum Transport von flexiblen Substraten Download PDF

Info

Publication number
EP2325121B1
EP2325121B1 EP20090014401 EP09014401A EP2325121B1 EP 2325121 B1 EP2325121 B1 EP 2325121B1 EP 20090014401 EP20090014401 EP 20090014401 EP 09014401 A EP09014401 A EP 09014401A EP 2325121 B1 EP2325121 B1 EP 2325121B1
Authority
EP
European Patent Office
Prior art keywords
transport
substrates
feed roller
film
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP20090014401
Other languages
German (de)
English (en)
French (fr)
Other versions
EP2325121A1 (de
Inventor
Paul Lindner
Thomas Glinsner
Gerald Kreindl
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EV Group E Thallner GmbH
Original Assignee
EV Group E Thallner GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EV Group E Thallner GmbH filed Critical EV Group E Thallner GmbH
Priority to EP20090014401 priority Critical patent/EP2325121B1/de
Priority to US12/944,867 priority patent/US8931624B2/en
Priority to CN201010582682.3A priority patent/CN102092558B/zh
Publication of EP2325121A1 publication Critical patent/EP2325121A1/de
Application granted granted Critical
Publication of EP2325121B1 publication Critical patent/EP2325121B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
    • B65H37/002—Web delivery apparatus, the web serving as support for articles, material or another web

Definitions

  • the invention relates to a transport roller according to claim 1 and a transport system according to claim 8 for receiving and transporting at least one thin, flexible substrate and a corresponding method according to claim 9.
  • the WO 2008/120248 A1 relates to a device for transporting electronic circuits.
  • the EP 0 894 746 A1 relates to a magnetic transport system for the transport of magnetically polarized component.
  • the EP 1 698 999 A1 relates to an apparatus and method for inspecting RFID labels.
  • the US 2006/0194412 A1 relates to a method and an apparatus for an adhesive tape for receiving wafers.
  • the substrates When processing thin substrates with a thickness of less than 1 mm, for example wafers or in the production of silicon-based photovoltaic cells, the substrates, which are usually at least 20 cm in diameter (for example in wafer processing) and / or at least 10 cm diameter for non-circular, flat substrates (for example, in the Si-based Photovoltaic cell production), usually transported with vacuum grippers by robots between individual process modules. Again and again it comes when gripping, also because of the applied vacuum, damage or breakage of the substrates, with very thin substrates even bulges at the suction holes of the vacuum gripper.
  • the main obstacles for a commercial application are also the transport logistics or the transport and technology in the manufacturing environment and the lack of suitable methods and means to transport these thin substrates, for example, from substrate manufacturer to photovoltaic manufacturing.
  • the invention is based on the idea of receiving the substrates on a transport foil and transporting them between the individual process modules.
  • the present invention goes the opposite way, by also the carrier, in the present case a transport foil, as a flexible component.
  • a transport film designed as a transport belt has the additional advantage that the substrates are prefabricated on the transport foil, in particular wound on a transport roller, are transportable, preferably from the manufacturer of the transport foil or manufacturer of the substrates with prefabricated substrates to the processor. According to the invention a system is thus created, which makes it possible to attach thin and therefore flexible substrates on a flexible carrier system and thus make this overall system for handling, storage and transport wound up.
  • the transport foil is advantageously provided with a substrate, in particular a soft, preferably scratch-free material, in particular at least on the rear side of the transport foil, in order to protect the substrate front side in the wound state or to avoid damage such as scratches and the like.
  • the transport film has a slightly greater width than the substrates, in particular between 20 and 50 cm. But it is also conceivable that several substrates are arranged side by side on the transport foil. Advantageously, it is also possible to accommodate substrates on both sides of the transport foil.
  • the transport foil is made of plastic and / or fiber material, in particular glass fiber reinforced.
  • the transport foil in particular on a transport roller, wound or wound, so that a transport from the manufacturer to the processor in a space-saving manner is possible.
  • the transport foil has a thickness of ⁇ 1000 .mu.m, in particular ⁇ 500 .mu.m, preferably ⁇ 200 .mu.m.
  • the adhesive is advantageously solvable in a simple manner, in particular by UV irradiation, thermally, by solvents, stripping, unrolling.
  • the dissolution preferably takes place by reducing the contact surface in the case of adhesive adhesion methods.
  • the substrates are formed at least predominantly from at least one material of the group of semiconductors or compound semiconductors, in particular of glass, silicon, gallium arsenide (GaAs), indium phosphide (InP), ceramic, the substrates having a thickness 200 ⁇ m, in particular ⁇ 100 ⁇ m, preferably ⁇ 50 ⁇ m,
  • a material for the transport film according to the invention comes in a particularly advantageous embodiment at least partially, in particular predominantly, stainless steel in question, preferably in the form of a hybrid film, preferably formed by a metal core with plastic coating.
  • the film is designed so that electrostatic charging is prevented or can be removed in an orderly manner.
  • This is achieved in that the film has a conductivity of> 10e-15 S / m, preferably> 10e-12 S / m, even more ideally> 10e-9S / m.
  • the conductive foil in conjunction with suitable devices in the manufacturing equipment and transport systems allows an orderly discharge of the charges.
  • Conductive plastic is achieved here by doping the plastic with conductive additives.
  • As a material for the transport film could also woven plastic such as GoreTex® as well as woven plastic with a suitable coating or any woven fiber with a suitable coating can be used.
  • FIG. 1 shows a transport foil 4 in the form of a conveyor belt which is driven by at least one drive roller 1 in a rotational direction by frictional contact with the transport foil 4. In this way, adhered to the transport film, flexible substrates 3 along a transport path T can be transported.
  • FIG. 1 two process modules 5 shown schematically in which defined process steps are performed on the substrates 3, for example, lithography, exposure, developing, sputtering, heating, cooling, deposition, etching, implanting, embossing, bonding, etc.
  • the substrates are suitable deflection / Guide rollers 2 and brought by the movement of the transport foil 4 by means of the drive roller 1 in position.
  • the conveyor belt or the transport foil 4 can also be guided through closed process module spaces, in particular under or overpressure, by moving the conveyor belt or the transport foil 4 in via a fluidic seal into a corresponding process module space 5 on one side and on the other side ,
  • the transport foil 4 with the substrates 3 fixed thereon is shown in a plan view, with square substrates 3 being shown in the present case, but likewise round substrates, for example wafers, can be processed.
  • the diameter or the transverse extent of the substrates is advantageously smaller than the width of the conveyor belt 4 and, advantageously, the substrates 3 are fixed at a distance along the transport path T on the transport foil 4, so that a detection of the position of the individual substrates 3 is made possible and the substrates 3 can be correspondingly precisely moved to the processing positions in the process modules.
  • position marks for positioning the substrates can be applied to the film. These contrast in contrast to the material of the transport foil.
  • index holes can be incorporated in the transport foil. These can be used in a preferred embodiment in conjunction with specially designed rollers for an improved drive, in which there is positive contact between the drive roller and the film.
  • the transport foil 4 is placed on a in FIG. 3 shown transport roller 6 are supplied wound, wherein advantageously the substrates 3 are already delivered pre-wound on the transport roller 6.
  • the processed substrates 3 are removed for further processing of the transport foil 4, for example, when using a UV-soluble adhesive as a connecting means between the transport foil 4 and the substrates 3 by UV light irradiation at the end of the transport path T.
  • the peeling or discharging of the processed substrates 3 is in an exemplary embodiment in FIG FIG. 4 shown.
  • the transport foil 4 is deflected by a deflection roller 10 in the direction of the side facing away from the substrates 3 side of the transport foil 4, in particular with a deflection angle of at least 45 °, preferably at least 90 °.
  • the guide roller 10 has a radius R 10 smaller than the radius R 6 of the transport roller 6, in particular with a ratio of ⁇ 1 ⁇ 2, preferably ⁇ 1 ⁇ 4.
  • the flexible substrates are advantageously transferred to a linear transport device 11 with transport rollers 12.
  • the application of the flexible substrates 3 on the transport foil 4 takes place in the reverse direction, as in FIG. 3 represented, wherein a, in particular with the guide roller 10 identical deflection roller 10 'is arranged such that the transport film in extension of a linear transport 11' extends and the flexible substrates 3 receives for further transport to a transport roller 6.
  • the linear transport device 11 ' is by transport rollers 12 'driven.
  • the transport foil 4 can be advantageously as in FIG FIG. 5 be constructed shown.
  • the film consists in this embodiment of a base film 9, preferably made of plastic, on which a net 8 is applied, which consists in particular of plastic and / or fabric fiber.
  • a net 8 is applied, which consists in particular of plastic and / or fabric fiber.
  • a preferably formed as a flexible plastic film film 7 is fixed, which in turn fixes the flexible substrates 3, in particular by adhesion forces.
  • FIG. 6 is the state of the transport film 4 immediately before unloading according to FIG. 4 shown.
  • a negative pressure in particular a vacuum
  • the flexible plastic film 7 is applied in the area of the network 8, so that the flexible plastic film 7 at least partially bulges in the direction of the base film 9.

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
EP20090014401 2009-11-18 2009-11-18 Transportsystem zur Aufnahme und zum Transport von flexiblen Substraten Active EP2325121B1 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP20090014401 EP2325121B1 (de) 2009-11-18 2009-11-18 Transportsystem zur Aufnahme und zum Transport von flexiblen Substraten
US12/944,867 US8931624B2 (en) 2009-11-18 2010-11-12 Transport system for accommodating and transporting flexible substrates
CN201010582682.3A CN102092558B (zh) 2009-11-18 2010-11-18 用于承载和传送柔韧衬底的传送系统

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP20090014401 EP2325121B1 (de) 2009-11-18 2009-11-18 Transportsystem zur Aufnahme und zum Transport von flexiblen Substraten

Publications (2)

Publication Number Publication Date
EP2325121A1 EP2325121A1 (de) 2011-05-25
EP2325121B1 true EP2325121B1 (de) 2013-06-05

Family

ID=41467137

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20090014401 Active EP2325121B1 (de) 2009-11-18 2009-11-18 Transportsystem zur Aufnahme und zum Transport von flexiblen Substraten

Country Status (3)

Country Link
US (1) US8931624B2 (zh)
EP (1) EP2325121B1 (zh)
CN (1) CN102092558B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102350216B1 (ko) 2011-08-12 2022-01-11 에베 그룹 에. 탈너 게엠베하 기판의 접합을 위한 장치 및 방법
DE102012104658A1 (de) * 2012-04-18 2013-10-24 Huhtamaki Ronsberg, Zweigniederlassung Der Huhtamaki Deutschland Gmbh & Co. Kg Verfahren zum, insbesondere farbigen, Bedrucken eines dünnen Flächenkörpers sowie bedruckter Flächenkörper
JP2013224188A (ja) * 2012-04-20 2013-10-31 Nippon Electric Glass Co Ltd ベルトコンベア
SG11201603148VA (en) * 2014-12-18 2016-07-28 Ev Group E Thallner Gmbh Method for bonding substrates
CN115363356B (zh) * 2022-10-25 2023-01-13 合肥科之谷互联网科技服务有限公司 一种基于知识产权数据的存储管理系统

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2858237A (en) * 1956-04-02 1958-10-28 Dow Chemical Co Method for treating silicone rubber materials and treated articles thereby obtained
US3608711A (en) * 1969-10-06 1971-09-28 Teledyne Inc Package for electronic devices and the like
US3745846A (en) * 1971-10-14 1973-07-17 Vitek Research Corp Conveyor belt construction
US3867027A (en) * 1971-12-29 1975-02-18 Xerox Corp Transport arrangement for thin sheet material
US4770290A (en) * 1985-08-26 1988-09-13 The B. F. Goodrich Company Conveyor belt
US4922304A (en) * 1988-03-11 1990-05-01 Imagitek Reproduction machine fuser belt
DE19652545B4 (de) * 1996-12-17 2006-03-23 Voith Sulzer Papiermaschinen Gmbh Preßwalze zum Behandeln bahnförmigen Gutes
US5865298A (en) * 1997-07-28 1999-02-02 Eastman Kodak Company Magnetic transport system
DE19959563A1 (de) * 1999-12-10 2001-06-13 Stahlecker Fritz Luftdurchlässiges Transportband zum Transportieren eines zu verdichtenden Faserverbandes
US6451154B1 (en) * 2000-02-18 2002-09-17 Moore North America, Inc. RFID manufacturing concepts
EP1395505B1 (de) * 2001-05-23 2007-03-07 ContiTech Transportbandsysteme GmbH Fördergurt mit kunststoffbeschichtung
US6889427B2 (en) * 2002-02-15 2005-05-10 Freescale Semiconductor, Inc. Process for disengaging semiconductor die from an adhesive film
US20060194412A1 (en) * 2004-04-07 2006-08-31 Takehito Nakayama Method and device for sticking tape
JP4519413B2 (ja) * 2003-04-09 2010-08-04 リンテック株式会社 テープの貼付方法および貼付装置
GB0320099D0 (en) * 2003-08-27 2003-10-01 Spoors Simon Conveyor belt
US7176799B1 (en) * 2003-12-04 2007-02-13 George Schmitt & Company Assembling pressure sensitive labels with RFID tags
JP4652790B2 (ja) * 2004-12-07 2011-03-16 株式会社サトー Ｒｆｉｄラベル検品装置及び検品方法
WO2008120248A1 (en) * 2007-03-30 2008-10-09 Baccini Spa Device to transport support elements for electronic circuits, in particular photovoltaic cells, along a working line
US7948384B1 (en) * 2007-08-14 2011-05-24 Mpt, Inc. Placard having embedded RFID device for tracking objects

Also Published As

Publication number Publication date
US20110114450A1 (en) 2011-05-19
CN102092558B (zh) 2014-08-20
US8931624B2 (en) 2015-01-13
CN102092558A (zh) 2011-06-15
EP2325121A1 (de) 2011-05-25

Similar Documents

Publication Publication Date Title
EP2422357B1 (de) Vorrichtung und verfahren zum trennen eines substrats von einem trägersubstrat
EP2325121B1 (de) Transportsystem zur Aufnahme und zum Transport von flexiblen Substraten
AT502233B1 (de) Vorrichtung zum lösen eines trägers von einer halbleiterscheibe
EP2381464B1 (de) Vorrichtung und Verfahren zum Ablösen eines Produktsubstrats von einem Trägersubstrat
DE112011101899T5 (de) Verarbeitung von Substraten unter Verwendung eines temporären Trägers
DE112013000980B4 (de) Verfahren zum temporären Verbinden eines Produktsubstrats mit einem Trägersubstrat sowie ein entsprechender Verbund
DE102008055155A1 (de) Trennverfahren für ein Schichtsystem umfassend einen Wafer
WO2008003502A1 (de) Vorrichtung und verfahren zum vereinzeln und transportieren von substraten
WO2000014789A1 (de) Verfahren zum aufbringen eines schaltungschips auf einen träger
EP1951490B1 (de) Vorrichtung und verfahren zur vereinzelung von scheibenförmigen substraten unter nutzung von adhäsionskräften
EP2422364B1 (de) Vorrichtung zur ausrichtung und vorfixierung eines wafers
DE112014003660B4 (de) Verfahren zum Bonden von Substraten
DE102009041969B4 (de) Greifer für die Aufnahme, den Transport und die positionierte Ablage von streifenförmigen Elementen
EP1935599B1 (de) Vorrichtung und Verfahren zum Vereinzeln und Transportieren von Substraten
EP3216049B1 (de) Verfahren und vorrichtung zum beschichten eines produktsubstrats
DE102021211425A1 (de) Anlage zur Handhabung von Gegenständen
EP2596525B1 (de) Handhabungsvorrichtung zur handhabung eines wafers
WO2021164855A1 (de) Verfahren und vorrichtung zur übertragung von bauteilen
AT411197B (de) Verfahren zum montieren, haltern oder abmontieren eines wafers sowie einrichtung zur durchführung des verfahrens
EP4420157A1 (de) Verfahren und vorrichtung zum transferieren und bereitstellen von bauteilen
DE102005042769A1 (de) Verfahren und Vorrichtung zur Formkorrektur eines dünngeschliffenen Wafers
EP4406890A1 (de) Vorrichtung, anordnung und verfahren zum automatisierten ablösen eines wärmeleitpads von einer trägerfolie
DE102006048799A1 (de) Verfahren und Einrichtung zum Ablösen eines dünnen Wafer oder bereits vereinzelter Bauelemente eines dünnen Wafers von einem Träger
DE102015114964A1 (de) Substratträger, Substrathaltevorrichtung, Substrattransportvorrichtung und Prozessiervorrichtung
DE20109403U1 (de) Vorrichtung zum Lösen eines Trägers von einer Halbleiterscheibe

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

AX Request for extension of the european patent

Extension state: AL BA RS

17P Request for examination filed

Effective date: 20111108

17Q First examination report despatched

Effective date: 20120113

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

Free format text: NOT ENGLISH

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 615563

Country of ref document: AT

Kind code of ref document: T

Effective date: 20130615

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

Free format text: LANGUAGE OF EP DOCUMENT: GERMAN

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 502009007275

Country of ref document: DE

Effective date: 20130801

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130916

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130905

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130605

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130605

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130605

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130605

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130906

REG Reference to a national code

Ref country code: NL

Ref legal event code: VDEP

Effective date: 20130605

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG4D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130605

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130905

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130605

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130605

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130605

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130605

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20131007

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20131005

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130605

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130605

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130605

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130605

26N No opposition filed

Effective date: 20140306

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130605

BERE Be: lapsed

Owner name: EV GROUP E. THALLNER GMBH

Effective date: 20131130

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 502009007275

Country of ref document: DE

Effective date: 20140306

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

GBPC Gb: european patent ceased through non-payment of renewal fee

Effective date: 20131118

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130605

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20131130

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20131130

REG Reference to a national code

Ref country code: IE

Ref legal event code: MM4A

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20131130

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20131118

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: GB

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20131118

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130605

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130605

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130605

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20131118

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20091118

Ref country code: MK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130605

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130605

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 7

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 8

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 9

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20231124

Year of fee payment: 15

Ref country code: DE

Payment date: 20231120

Year of fee payment: 15

Ref country code: AT

Payment date: 20231117

Year of fee payment: 15