EP2274176B1 - Panneau en bois reconstitué comportant un revêtement laminé brillant et procédé de fabrication d'un tel panneau - Google Patents

Panneau en bois reconstitué comportant un revêtement laminé brillant et procédé de fabrication d'un tel panneau Download PDF

Info

Publication number
EP2274176B1
EP2274176B1 EP09742101.0A EP09742101A EP2274176B1 EP 2274176 B1 EP2274176 B1 EP 2274176B1 EP 09742101 A EP09742101 A EP 09742101A EP 2274176 B1 EP2274176 B1 EP 2274176B1
Authority
EP
European Patent Office
Prior art keywords
chip
chipboard
smoothing
wood
smoothed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP09742101.0A
Other languages
German (de)
English (en)
Other versions
EP2274176A1 (fr
Inventor
Andreas Arthold
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fritz Egger GmbH and Co OG
Original Assignee
Fritz Egger GmbH and Co OG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fritz Egger GmbH and Co OG filed Critical Fritz Egger GmbH and Co OG
Priority to PL09742101T priority Critical patent/PL2274176T3/pl
Publication of EP2274176A1 publication Critical patent/EP2274176A1/fr
Application granted granted Critical
Publication of EP2274176B1 publication Critical patent/EP2274176B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
    • B44C5/00—Processes for producing special ornamental bodies
    • B44C5/04—Ornamental plaques, e.g. decorative panels, decorative veneers
    • B44C5/0469—Ornamental plaques, e.g. decorative panels, decorative veneers comprising a decorative sheet and a core formed by one or more resin impregnated sheets of paper
    • B44C5/0492—Ornamental plaques, e.g. decorative panels, decorative veneers comprising a decorative sheet and a core formed by one or more resin impregnated sheets of paper containing wooden elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N7/00—After-treatment, e.g. reducing swelling or shrinkage, surfacing; Protecting the edges of boards against access of humidity
    • B27N7/005—Coating boards, e.g. with a finishing or decorating layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B44—DECORATIVE ARTS
    • B44F—SPECIAL DESIGNS OR PICTURES
    • B44F1/00—Designs or pictures characterised by special or unusual light effects
    • B44F1/02—Designs or pictures characterised by special or unusual light effects produced by reflected light, e.g. matt surfaces, lustrous surfaces

Definitions

  • the invention relates to a method for producing a wood-based panel having a high-gloss laminate coating, in which at least one flat, broad surface of a chipboard is ground before the application of the laminate coating, and a chipboard provided with a high-gloss laminate coating.
  • laminate coating With regard to the laminate coating, in turn, different methods are known. These processes typically use multiple layers of paper impregnated with synthetic resin, usually melamine resin, melamine-urea resin or phenolic resin.
  • the paper layers can be freely designed in their color and printed with any desired decors such as wood decors or fantasy decors. At elevated pressure and temperature, these paper layers are then pressed either directly (Direct Pressure Laminate (DPL)) or only after their processing into a so-called laminate with the wood-based panel (High Pressure Laminate (HPL) or Continuous Pressure Laminate (CPL)).
  • DPL Direct Pressure Laminate
  • HPL High Pressure Laminate
  • CPL Continuous Pressure Laminate
  • an overlay paper which may additionally be provided with hard particles, for example with corundum particles, may optionally be provided.
  • hard particles for example with corundum particles
  • an overlay paper which may additionally be provided with hard particles, for example with corundum particles.
  • Laminates and coatings based on DPL technology are usually produced in cycles with single and multi-day presses or continuously with double belt presses.
  • Generic for the present invention is the DE 2006781 ,
  • Gloss is an optical property of light-reflecting surfaces. Physically, gloss is defined as the quotient of the directed and the diffusely reflected portion of the amount of light falling on a surface. It can be quantitatively determined with gloss meters; Details are given in the standards DIN 67530 and ISO 2813 respectively. For directly coated panels, the determination of the degree of gloss is specified in EN 14323 (current edition 2004-06-01). Then the degree of gloss is to be determined with a so-called reflectometer according to ISO 2813. The principle of the reflectometer is based on the measurement of the directed reflection. For this purpose, the intensity of the reflected light is measured in a narrow band of the reflection angle.
  • the measurement results are not related to the amount of light emitted, but instead on a black, polished glass standard with a defined refractive index (1.567).
  • the measurement value 100 gloss units (GE or gloss grade points) is set.
  • gloss levels of more than 100 GE may arise for certain material surfaces, for example in polished metals.
  • For a better differentiation of the measured values one measures depending on the gloss with different measuring angles.
  • the ISO 2813 standard for high-gloss surfaces ( ⁇ 70 GE), in addition to the conventional measurements with a 60 ° measuring geometry, measurements with a 20 ° measuring geometry must also be carried out.
  • the values given below refer exclusively to measurement results obtained with a 60 ° measuring geometry.
  • the DE 1 198 540 B discloses a method for smoothing, calibrating and optionally conditioning wood chipboards, in which, after grinding the surfaces, they are moistened with water on one or both sides and then again subjected to the action of heat and pressure. With the method, thickness differences in the order of a few tenths of a millimeter can be largely irreversibly compressed by a hot pressing with simultaneous plasticization by steam. As a device for the practice of this method, hot plate presses, belt presses, roller presses and roller presses are proposed.
  • the DE 1 198 540 B does not deal with the production of wood chip boards that have a high-gloss laminate coating.
  • the present invention has for its object to provide a method for coating chipboard, can be provided with the high-gloss laminate surfaces having chipboard cost.
  • the invention has for its object to provide a provided with a high-gloss laminate coating wood material panel that can be produced inexpensively.
  • Preferred and advantageous embodiments of the invention are specified in the subclaims.
  • the inventive method in which a chipboard having at least one flat broad surface is ground on this broad surface as the wood-based panel is characterized by the steps of cutting the smooth, flat, broad surface by compacting it by means of a cylindrical or plate-shaped smoothing body whose smoothing surface is tempered to at least 100 ° C or has a temperature of at least 100 ° C, and coating the smoothed broad surface by pressing a high-gloss laminate coating in the form of a direct coating.
  • a chipboard which has layers of different chip thickness distribution, with a middle layer in which the maximum of the chip thickness distribution in the range of 1.0 mm to 4.0 mm, and cover layers, in which the maximum the chip thickness distribution is in the range of 0.1 mm to 0.8 mm at a chip thickness, wherein the proportion of chips having a thickness of less than 0.6 mm in the chip material of the cover layers at least 75 wt .-%, in particular at least 80 wt. -%, and preferably at least 90 wt .-% is.
  • the wood-based panel according to the invention which is formed from such chipboard, is accordingly provided with a glossy laminate coating, which is applied as a direct coating on a chipless smoothed broad surface of the chipboard and a gloss level of at least 105, in particular at least 110 and preferably measured at least 115 gloss units according to ISO 2813 with a 60 ° measuring geometry.
  • a high-gloss laminate coating in the sense of the present invention is meant a laminate coating applied as a direct coating, based on at least one flat broad surface of the wood-based panel over its entire area or in an area fraction of at least 80%, preferably at least 90%, particularly preferably at least 95% of 1 m 2 large flat broad surface of the wood-based panel has a gloss level of at least 105 gloss units measured according to ISO 2813 with a 60 ° -Meßgeometrie.
  • wood-base panels with high-gloss laminate coatings can be produced cost-effectively if the relevant broad surface of the wood-based panel is smoothed after sanding and before coating (pressing on melamine resin-impregnated paper layers). In contrast to conventional grinding, smoothing takes place without chip removal. It is thereby effected by contact with a smooth, tempered surface that the after grinding out of the surface protruding wood fibers or chips plasticized and flattened.
  • the chipless smoothing of the ground, flat broad surface of the wood-based panel by means of a tempered smoothing body can be carried out both cyclically and continuously in the method according to the invention.
  • a smooth, tempered roller for smoothing wood boards of different lengths and to minimize the energy required for smoothing the smoothing of the ground wide surface of the wood-based panel is preferably continuous, for example, with a smooth, tempered roller.
  • a roller used as a smoothing element should be pressed onto the broad surface to be smoothed with a force in the range of 200 to 1000 N / cm plate width, preferably in the range of 450 to 750 N / cm plate width.
  • the non-cutting smoothing is carried out with one or more rollers arranged one behind the other.
  • the smoothing surface of the smoothing body is heated to a temperature in the range of 150 ° C to 240 ° C, preferably in the range of 180 ° C to 230 ° C.
  • the peripheral speed of the tempered roller can correspond to the feed rate of the wood-based panel to be smoothed.
  • the tempered roller can be used in particular at the same time as a transport roller for advancing the wood-based panel.
  • a relative movement between the plate-shaped or roller-shaped smoothing tool and the broad surface of the wood-based material board to be smoothed can also be carried out for smoothing the ground wood-based panel. As a result, the effect of the smoothing tool can be increased.
  • the tempering of the smoothing or the smoothing roll does not have to be done by supplying heat energy or the like. Rather, it is also within the scope of the invention, to cause the tempering of the smoothing surface of the smoothing or the smoothing roll by friction between the smoothing body and the broad surface to be smoothed.
  • the caused by appropriate friction temperature of the smoothing surface is at least 100 ° C, preferably at least 150 ° C.
  • a further advantageous embodiment of the method according to the invention is characterized in that the temperature of the smoothing surface of the smoothing body or the temperature of the smoothed broad surface of the wood-based panel is measured, that the measured temperature is compared with a predetermined target temperature, and that the relative speed between the smoothed Wide surface and the smoothing surface of the smoothing body and / or the force with which smoothing body is pressed against the flat surface to be smoothed, is controlled depending on the measured temperature.
  • the desired smoothing of the wood-based panel can be achieved particularly reliable and automated.
  • the rapid recooling required with conventional methods for producing high-gloss laminate coatings wood-based panels while maintaining the pressing pressure is not required in the inventive method.
  • the method according to the invention thus also offers cost advantages to that extent.
  • For the construction and control of a coating press required for carrying out the method according to the invention is easier and their throughput higher than the throughput of a coating press whose pressing tools are provided with a cooling device.
  • the pressed onto the wood-based panel high-gloss laminate coating is therefore not subject to forced cooling in the press.
  • the inventive method is particularly advantageous in the use of chipboard, since these are much cheaper to manufacture than MDF boards, on the other hand, are generally better suited for the direct coating with a high-gloss laminate material as chipboard. Strictly speaking, the method according to the invention only creates the prerequisite for being able to produce cost-effective chipboard with a high-gloss laminate coating pressed in by the direct coating method.
  • chipboard compared to the use of MDF boards is that grinding of the chipboard is possible immediately after pressing and a brief cooling (about 10 to 20 minutes).
  • MDF boards are stored for 2 to 5 days in a maturing warehouse before they can be sanded and then further processed. This circumstance is detrimental to the production logistics as well as to the manufacturing costs due to the need for corresponding storage capacities and the longer capital tie-up in the maturing warehouse.
  • multilayer particle boards were produced with an increased proportion of relatively fine cover shavings.
  • cover shavings By adding, for example, 5 to 7% more top layer chips compared to chipboard, which in cross-section about 60% coarser middle-layer chips and about 2 x 20% finer cover shavings have, otherwise the same binder dosage and the same plate thickness, was achieved that less large chips came to lie on the surface.
  • the surfaces of this chipboard having an increased proportion of cover shavings were particularly smooth and closed after smoothing. In the finished coated panels, a further increase in the gloss level of at least 3 gloss grades was achieved.
  • a chipboard is produced or used as a wood-based panel, the layers having different chip length distribution, with a middle layer, in which the maximum of the Spandorfnverannon between 8 mm and 15 mm, and outer layers, in which the maximum of span length distribution at a span length between 3 mm and 8 mm, wherein the proportion of chips with a length of less than 6 mm in the chip material of the outer layers is at least 75 wt .-%, in particular at least 80 wt .-% and preferably at least 90 wt .-%.
  • a chipboard is produced or used for carrying out the method according to the invention, in the chip material of the proportion of chips having a length of less than 8 mm at least 50 wt .-%, in particular at least 65 wt .-% and preferably at least 85 wt .-% is.
  • the binder content was not varied in the experiments, but this is necessarily higher with increasing proportion of relatively fine cover shavings, since the cover shavings have a higher binder content than the coarser middle-layer shavings. Nevertheless, it can be expected that an increase in the binder content in the cover layer by, for example, 3% based on the absolutely dry mass of chips (ie, span span) causes an increase in the gloss level by at least 3 points (gloss units).
  • the binder fraction in the cover layers of the wood-based panel being at least 10% by weight, in particular at least 12% by weight, based on the absolutely dry composition of the cover shavings, and preferably in the range from 15 to 25% by weight. % lies.
  • the grinding of the wood-based panels, preferably chipboard is carried out in the inventive method usually in at least three stages.
  • the grains in the different stages are coordinated. It has been recognized that a very fine final finish, for example, with a grain size of 180, brings no additional improvement. Smoothing therefore offers the advantage that it is possible to dispense with the use of particularly high-quality ground plates. According to a preferred embodiment, it is therefore provided that the broad surface of the wood-based panel to be smoothed is ground in a number of stages before the chipless smoothing, wherein the final cut is carried out with a grain size of a maximum of 180, preferably a maximum of 120.
  • a further preferred embodiment of the method according to the invention is that the wood-based panel is moved along a grinding tool, wherein the flat surface to be smoothed before the chipless smoothing additionally by at least one cross-section relative to the direction of movement of the wood-based panel along the Grinding tool is ground.
  • the broad surface of the wood-based material board to be smoothed and / or the smoothing surface of the smoothing body are wetted before smoothing.
  • the desired smoothness of the wood-based panel can be further improved, with the result that the gloss level of the high-gloss laminate coating of the chipboard increases on average by a further three gloss units.
  • the reason for this increase in gloss level can be seen in the fact that the moisture applied by the wetting is evaporated when smoothing, which then causes an improved heat transfer and / or that the wetted surface of the chipboard is better plasticized or deformable in the short term, so that projecting fibers and / or chips can be embedded even better in the structure of the chipboard.
  • wood chips are first produced. From the so produced chips and / or other shredded wood residues wood chips are produced. The cutting takes place in the state of the respective moisture content of the wood, which, depending on the origin of the wood and the season can be between 60 and 150% based on the wood dry matter. Subsequently, the wood chips are dried to a humidity in the range of about 1.5 to 3% and fractionated by screening or other suitable classification method, for example by air classification, according to cover layer and middle layer material.
  • the maximum of the chip thickness distribution is in the range of 1.0 mm to 4.0 mm.
  • the maximum of the chip thickness distribution is in the range of 0.1 mm to 0.8 mm for a chip thickness.
  • the proportion of chips having a thickness of less than 0.6 mm in the chip material of the outer layers is at least 75 wt .-%, preferably at least 80 wt .-%.
  • the wood chips are cleaned of foreign matter such as metal particles and / or stone particles.
  • the wood chips are moved or guided along by electromagnets.
  • the separation of stone particles by means of a density sorter, for example by means of an air classifier or in a downpipe, in which the falling wood chips are deflected by means of a fan laterally, while the relatively heavy stone particles are not or less distracted and thus separated from the wood chips.
  • the wood shavings are subsequently glued separately after covering shavings and middle layer shavings with binder.
  • the binders used are preferably urea resin and / or phenolic resin. Hardeners, water repellents (paraffin) and optionally additives (e.g., fungicides and flame retardants) are added to the binder.
  • the wood chips are glued by means of a mixer or a spraying device. The wood chips receive a very fine binder coating.
  • the glued topcoat chips have a binder content in the range of 15 to 25 wt .-%, based on the absolutely dry Spanmasse.
  • a three-layered chip cake is produced consisting of a lower covering layer of fine chips, a middle layer of coarser chips and an upper covering layer of fine chips (cf. Fig. 2 ).
  • the hot pressing of the chip cake can be done in a single-storey or multi-daylight press (cycle press).
  • the continuously scattered chip cake is cut to length by means of cutting tools.
  • the hot pressing of the chip cake takes place in a continuous double-belt press (so-called "conti-roll press”).
  • the length distribution of the chip cake is in this case only after the pressing process.
  • the initially still relatively loose chip cake before the actual pressing in a press with low pressure precompressed pre-pressed.
  • pre-compaction is that the heat in the main press or the end section of the press reaches the central chips more quickly, so that a more uniform heating of all the chips and thus optimum setting of the binder is achieved.
  • the precompression is optionally carried out under the action of heat, wherein the contact surfaces of the press, for example, to a temperature of about 50 ° C are heated.
  • the chip cake is subjected to a temperature of more than 200 ° C. and a pressure of, for example, about 25 kg / cm 2 . Due to the high heat in the press, the binder is activated and binds off.
  • the endless chipboard is cut to length into individual plates of specified length.
  • trimming is done for example by means of mutually parallel circular saws.
  • a cooling of the individual chipboard is provided.
  • the cooling of the chipboard is preferably carried out in a so-called Sternwender in which the chipboard spaced from each other about an axis of rotation of the Sternwenders be moved, wherein the particle boards are carried by radially projecting from a rotating body of the Sternwenders handrails.
  • the for the cooling of the chipboard provided time period is in the range of about 10 to 30 minutes, preferably in the range of about 10 to 20 minutes.
  • the chipboard are ground, wherein at least one broad side of the respective chipboard is ground.
  • both broad sides of the respective chipboard are ground.
  • the grinding of the chipboard takes place by means of at least one cylindrical grinding machine and / or by means of at least one wide-belt sanding machine.
  • the cylindrical grinding machine has a cylinder rotating about its longitudinal central axis, on the lateral surface of which sandpaper is attached.
  • the wide-belt sanding machine has an endless sanding belt which runs over several rollers, wherein between at least two of the rollers a pressure plate is arranged which presses the endless sanding belt against the wide surface of the chipboard to be ground.
  • the grinding of the chipboard takes place by means of at least one wide-belt sanding machine.
  • the grinding of the respective broad side of the chipboard takes place in several stages, starting with a relatively coarse grain, for example a 40 grain.
  • abrasive papers or abrasive belts with a finer grain size are used for the subsequent grinding operations.
  • the final touch is made with a grain size of a maximum of 180, preferably a maximum of 120.
  • the grinding process which takes place in the direction of movement (transport direction) of the wood material board along the wide-belt sander or cylindrical grinding
  • at least one transverse to the direction of the endless abrasive belt or transverse to the direction of movement of the wood-based panel acting grinding is provided. Due to the cross-section, the grinding result can be significantly improved. In particular, can be reduced by the transverse grinding, the resulting amount of grinding dust for a given number of grinding operations.
  • the intermediate storage which serves to mature the wood-based panel, takes 2 to 4 days.
  • the ground, flat broad sides of the chipboard are then smoothed by compacting by means of at least one smoothing device without cutting.
  • the smoothing device comprises at least one cylindrical or plate-shaped smoothing body whose smoothing surface is tempered. For this purpose, the smoothing element is pressed against the broad side of the chipboard to be smoothed.
  • Rollers of metal are preferably used for smoothing, the polished shell surfaces are tempered to at least 150 ° C, for example to about 200 ° C and with a force in the range of 450 to 750 N / cm plate width from the top and bottom against the wood-based panel be pressed.
  • significantly smoother and more closed plate surfaces were obtained than those of only ground plates.
  • the non-cutting smoothing preferably takes place with a plurality of rollers arranged one behind the other in the feed direction of the wood-based panel.
  • the thus smoothed broad surfaces of the wood-based panels are then provided with a high-gloss laminate coating, which is pressed as a direct coating on the respective smoothed broad surface.
  • the direct coating of the wood-based panels takes place cyclically.
  • the high-gloss laminate coating may have a wood decor, stone decor, fantasy decor or a patternless, plain decor (Unidekor).
  • a high-gloss laminate coating according to the DPL technology wood-based panels, especially chipboard had a gloss of at least 105 gloss units (gloss grades), each measured according to ISO 2813 with a 60 ° -Meßgeometrie.
  • high-gloss laminate-coated chipboards were obtained which had a gloss level of more than 110, in particular more than 115 gloss units.
  • Fig. 2 a section of a wood-based panel according to the invention is sketched, in which it is a chipboard with the properties described above Spanuren- and / or Spandickenverannon is.
  • the transition from the middle layer 1 to the cover layers 2, 3 of the chipboard is marked by dashed lines.
  • the ground and then non-cutting smoothed broad surfaces of the chipboard are provided with high-gloss laminate coatings 4, 5.
  • a chipboard having the above-mentioned chip length and / or chip thickness distribution characteristics is first selected or manufactured. At least one or both flat broad surfaces of the wood-based panel are then ground in one or more stages. The ground wide surface is freed from grinding dust and wetted before the subsequent chipless smoothing.
  • wetting for example, water can be used. However, it may also be advantageous to use a solution or emulsion as a wetting agent. For this purpose, the wide surface to be smoothed and / or the smoothing surface of the smoothing body can be wetted accordingly.
  • the invention provides, if appropriate, to add to the wetting agent one or more additives which can further improve the smoothness effect, or also to achieve an improved bonding of the subsequently applied laminate coating to the surface of the wood-based panel. In this way, also a saving of impregnating resin can be achieved.
  • the wetting can be done very simply by spraying, preferably by producing a fine spray before the smoothing device, in particular smoothing roll. Even very small amounts of moisture or wetting agent are sufficient to achieve an improvement in the smoothness effect.
  • the amount of wetting agent applied is in the range of 2 to 20 g / m 2 , preferably in the range of 2 to 10 g / m 2 .
  • the ground wide surface of the wood-based panel is smoothed by compacting the same chipless.
  • a smoothing roll is used, the smoothing surface has a temperature of at least 100 ° C.
  • the tempering of the smoothing roll or of the smoothing element takes place, for example, by activation of heating elements integrated in the smoothing element or results from the friction between the smoothing surface of the smoothing element and the broad surface to be smoothed.
  • the temperature of the smoothing surface of the smoothing body and / or the temperature of the smoothed broad surface of the wood-based panel are measured and compared with a predefinable desired temperature value in order to control the smoothing process. For example, if the temperature is too low on the smoothing element or on the smoothing roller, the relative speed between the wood-based panel and the smoothing surface of the smoothing body (preferably smoothing roller) and / or the contact force of the smoothing member are increased to the surface to be smoothed.
  • the measurement of the temperature of the smoothing surface of the smoothing body or the smoothed broad surface of the wood-based panel is preferably carried out by means of non-contact temperature sensors.
  • the smoothed broad surface of the wood-based panel is coated with a high-gloss laminate coating.
  • the so coated wood-based panel is finally treated further without forced cooling, for example, divided into smaller plate formats and stored in a warehouse (see. Fig. 2 ).

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Manufacturing & Machinery (AREA)
  • Forests & Forestry (AREA)
  • Dry Formation Of Fiberboard And The Like (AREA)

Claims (19)

  1. Procédé de fabrication d'un panneau en matériau dérivé du bois présentant un revêtement stratifié hautement brillant, dans lequel un panneau de particules qui présente au moins une surface large plane est poli sur cette surface large en tant que panneau en matériau dérivé du bois, caractérisé par les étapes opératoires suivantes :
    lissage sans enlèvement de copeaux de la surface large plane polie par compactage de celle-ci au moyen d'un corps de lissage en forme de rouleau ou de plaque dont la surface de lissage est tempérée à au moins 100°C ou présente une température d'au moins 100°C, et revêtement de la surface large lissée par engagement par pression d'un revêtement stratifié hautement brillant sous la forme d'un revêtement direct, dans lequel un panneau de particules qui présente des couches de répartition d'épaisseur de particules différente est utilisé en tant que panneau en matériau dérivé du bois, avec une couche centrale dans laquelle le maximum de la répartition d'épaisseur de particules se situe dans la plage de 1,0 mm à 4,0 mm et des couches de recouvrement dans lesquelles le maximum de la répartition d'épaisseur de particules se situe à une épaisseur de particules dans la plage de 0,1 mm à 0,8 mm, dans lequel la proportion des particules avec une épaisseur inférieure à 0,6 mm dans le matériau de particules des couches de recouvrement se monte à au moins 75 % en poids, notamment au moins 80 % en poids et de préférence au moins 90 % en poids.
  2. Procédé selon la revendication 1, caractérisé en ce que le revêtement stratifié hautement brillant engagé par pression sur le panneau de particules n'est soumis à aucun refroidissement forcé.
  3. Procédé selon la revendication 1 ou 2, caractérisé en ce qu'un panneau de particules qui présente des couches de répartition de longueur de particules différente est utilisé, avec une couche centrale dans laquelle le maximum de la répartition de longueur de particules se situe entre 8 mm et 15 mm et des couches de recouvrement dans lesquelles le maximum de la répartition de longueur de particules se situe à une longueur de particules comprise entre 3 mm et 8 mm, dans lequel la proportion des particules avec une longueur inférieure à 6 mm dans le matériau de particules des couches de recouvrement se monte à au moins 75 % en poids, notamment au moins 80 % en poids et de préférence au moins 90 % en poids.
  4. Procédé selon l'une quelconque des revendications 1 à 3, caractérisé en ce que la proportion de liant dans les couches de recouvrement du panneau de particules par rapport à la masse absolument sèche des particules de couche de recouvrement se situe à au moins 10 % en poids, notamment au moins 12 % en poids et de préférence dans la plage de 15 à 25 % en poids.
  5. Procédé selon l'une quelconque des revendications 1 à 4, caractérisé en ce qu'un panneau de particules dans le matériau de particules duquel la proportion de particules avec une épaisseur inférieure à 0,6 mm se monte à au moins 50 % en poids, notamment au moins 65 % en poids et de préférence au moins 80 % en poids est utilisé.
  6. Procédé selon l'une quelconque des revendications 1 à 5, caractérisé en ce qu'un panneau de particules dans le matériau de particules duquel la proportion de particules avec une longueur inférieure à 8 mm se monte à au moins 50 % en poids, notamment au moins 65 % en poids et de préférence au moins 85 % en poids est utilisé.
  7. Procédé selon l'une quelconque des revendications 1 à 6, caractérisé en ce qu'un rouleau avec une force dans la plage de 200 à 1000 N/cm de largeur de panneau, de préférence dans la plage de 450 à 750 N/cm de largeur de panneau est pressé sur la surface large à lisser en tant que corps de lissage.
  8. Procédé selon l'une quelconque des revendications 1 à 7, caractérisé en ce que la surface large à lisser du panneau en matériau dérivé du bois est polie en plusieurs étapes avant le lissage sans enlèvement de copeaux, dans lequel le dernier polissage est effectué avec une granulométrie de 180 maximum, de préférence de 120 maximum.
  9. Procédé selon l'une quelconque des revendications 1 à 8, caractérisé en ce que le panneau de particules est déplacé le long d'un outil de polissage, dans lequel la surface large à lisser est polie avant le lissage sans enlèvement de copeaux en plus par au moins un polissage transversal par rapport au sens de déplacement du panneau de particules le long de l'outil de polissage.
  10. Procédé selon l'une quelconque des revendications 1 à 9, caractérisé en ce que la surface de lissage du corps de lissage est tempérée à une température dans la plage de 150°C à 240°C, de préférence dans la plage de 180°C à 230°C.
  11. Procédé selon l'une quelconque des revendications 1 à 10, caractérisé en ce que le lissage sans enlèvement de copeaux de la surface large plane polie est effectué par compactage de celle-ci au moyen de rouleaux tempérés à au moins 150°C, de préférence à au moins 180°C, dans lequel les rouleaux sont pressés du haut et du bas contre le panneau de particules.
  12. Procédé selon l'une quelconque des revendications 1 à 11, caractérisé en ce que la surface de lissage du corps de lissage présente une température d'au moins 100°C, de préférence d'au moins 150°C par frottement entre le corps de lissage et la surface large à lisser.
  13. Procédé selon l'une quelconque des revendications 1 à 12, caractérisé en ce que la température de la surface de lissage du corps de lissage ou la température de la surface large lissée du panneau de particules est mesurée, que la température mesurée est comparée à une température de consigne pouvant être prédéfinie et que la vitesse relative entre la surface large à lisser et la surface lisse du corps de lissage et/ou la force avec laquelle le corps de lissage est pressé contre la surface large à lisser est commandée en fonction de la température mesurée.
  14. Procédé selon l'une quelconque des revendications 1 à 13, caractérisé en ce que la surface large à lisser du panneau de particules et/ou la surface de lissage du corps de lissage est mouillée avec de l'eau, une solution et/ou une émulsion avant le lissage.
  15. Panneau en matériau dérivé du bois formé d'un panneau de particules qui est pourvu d'un revêtement stratifié brillant (4, 5), caractérisée en ce que le panneau de particules présente des couches de répartition d'épaisseur de particules différente, avec une couche centrale (1) dans laquelle le maximum de la répartition d'épaisseur de particules se situe dans la plage de 1,0 mm à 4,0 mm et des couches de recouvrement (2, 3) dans lesquelles le maximum de la répartition d'épaisseur de particules se situe à une épaisseur de particules dans la plage de 0,1 mm à 0,8 mm, dans laquelle la proportion des particules avec une épaisseur inférieure à 0,6 mm dans le matériau de particules des couches de recouvrement (2, 3) se monte à au moins 75 % en poids, notamment au moins 80 % en poids et de préférence au moins 90 % en poids, et que le revêtement stratifié (4, 5) est appliqué en tant que revêtement direct sur une surface large lissée sans enlèvement de copeaux du panneau de particules, dans laquelle le revêtement stratifié (4, 5) présente un degré de brillance d'au moins 105, notamment d'au moins 110 et de préférence d'au moins 115 unités de brillance, mesuré selon ISO 2813 avec une géométrie de mesure à 60°.
  16. Panneau en matériau dérivé du bois selon la revendication 15, caractérisée en ce que les couches du panneau de particules présentent une répartition de longueur de particules différente, dans laquelle le maximum de la répartition de longueur de particules se situe entre 8 mm et 15 mm dans la couche centrale (1) et le maximum de la répartition de longueur de particules se situe à une longueur de particules comprise entre 3 mm et 8 mm dans les couches de recouvrement (2, 3), et dans laquelle la proportion des particules avec une longueur inférieure à 6 mm dans le matériau de particules des couches de recouvrement (2, 3) se monte à au moins 75 % en poids, notamment au moins 80 % en poids et de préférence au moins 90 % en poids.
  17. Panneau en matériau dérivé du bois selon la revendication 15 ou 16, caractérisée en ce que la proportion de liant dans les couches de recouvrement (2, 3) du panneau en matériau dérivé du bois par rapport à la masse absolument sèche des particules de couche de recouvrement se situe à au moins 10 % en poids, notamment au moins 12 % en poids et de préférence dans la plage de 15 à 25 % en poids.
  18. Panneau en matériau dérivé du bois selon l'une quelconque des revendications 15 à 17, caractérisée en ce que la proportion de particules avec une épaisseur inférieure à 0,6 mm dans le matériau de particules du panneau de particules se monte à au moins 50 % en poids, notamment au moins 65 % en poids et de préférence au moins 80 % en poids.
  19. Panneau en matériau dérivé du bois selon l'une quelconque des revendications 15 à 18, caractérisée en ce que la proportion de particules avec une longueur inférieure à 8 mm dans le matériau de particules du panneau de particules se monte à au moins 50 % en poids, notamment au moins 65 % en poids et de préférence au moins 85 % en poids.
EP09742101.0A 2008-05-06 2009-05-06 Panneau en bois reconstitué comportant un revêtement laminé brillant et procédé de fabrication d'un tel panneau Active EP2274176B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PL09742101T PL2274176T3 (pl) 2008-05-06 2009-05-06 Płyta z tworzywa drzewnego z powłoką laminatową o wysokim połysku i sposób wytwarzania takiej płyty z tworzywa drzewnego

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102008022403A DE102008022403B3 (de) 2008-05-06 2008-05-06 Holzwerkstoffplatte mit einer hochglänzenden Laminatbeschichtung und Verfahren zur Herstellung einer solchen Holzwerkstoffplatte
PCT/EP2009/055498 WO2009135883A1 (fr) 2008-05-06 2009-05-06 Panneau en bois reconstitué comportant un revêtement laminé brillant et procédé de fabrication d'un tel panneau

Publications (2)

Publication Number Publication Date
EP2274176A1 EP2274176A1 (fr) 2011-01-19
EP2274176B1 true EP2274176B1 (fr) 2013-07-10

Family

ID=41066185

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09742101.0A Active EP2274176B1 (fr) 2008-05-06 2009-05-06 Panneau en bois reconstitué comportant un revêtement laminé brillant et procédé de fabrication d'un tel panneau

Country Status (5)

Country Link
EP (1) EP2274176B1 (fr)
DE (1) DE102008022403B3 (fr)
PL (1) PL2274176T3 (fr)
RU (1) RU2444443C1 (fr)
WO (1) WO2009135883A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
UA123960C2 (uk) * 2014-11-06 2021-06-30 Флурінг Текнолоджис Лтд. Плита з деревного матеріалу, зокрема у вигляді деревно-пластикового композитного матеріалу, та її застосування
EP3050687B1 (fr) * 2015-01-29 2017-04-12 Flooring Technologies Ltd. Procédé de fabrication et de revêtement simultané de décor d'une plaque en bois dotée de décor, en particulier d'un matériau composite bois/matière synthétique
EP3166732A1 (fr) * 2015-03-05 2017-05-17 Kastamonu Entegre Agaç Sanayi Ve Ticaret Anonim Sirketi Système d'application de polissage pour surfaces de panneau à base de bois revêtues de mélamine
CN114603660B (zh) * 2022-04-22 2022-12-20 东部全球家具采购中心(海安)有限公司 一种木质家具加工用压胶装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE490530C (de) * 1927-04-06 1930-01-30 Robert Arnot Dr Verfahren zur Herstellung von hochglaenzenden UEberzuegen
DE1198540B (de) 1962-02-14 1965-08-12 Max Himmelheber Dipl Ing Verfahren und Vorrichtung zur Glaettung, Kalibrierung und gegebenenfalls Konditionierung von Holzspanplatten
DE1260759B (de) * 1964-08-18 1968-02-08 Boettcher & Gessner Holzhobel- oder Schleifmaschine
DE2006781B1 (de) * 1970-02-14 1971-02-11 Siempelkamp S A Vaud (Schweiz) Verfahren zum Verguten von Tragerplat ten
RU2103164C1 (ru) * 1995-07-26 1998-01-27 Воронежская государственная лесотехническая академия Способ изготовления древесностружечных плит
DE19949625B4 (de) * 1999-05-01 2016-02-04 Dieffenbacher GmbH Maschinen- und Anlagenbau Verfahren und Anlage zur kontinuierlichen und diskontinuierlichen Herstellung von Holzwerkstoffplatten
AUPQ603900A0 (en) * 2000-03-03 2000-03-30 Wesfi Manufacturing Pty Ltd Impact resistant substrate particleboard and composite material using same
DE10102382A1 (de) * 2001-01-19 2002-08-01 Ott Patrick Oliver Verfahren zum Vorbehandeln von Oberflächen von Holz- und/oder Holzfaserverbundrohlingen zum anschließenden Pulver- oder Folienbeschichten
US20030165669A1 (en) * 2002-03-04 2003-09-04 Nowak David H. Precure consolidator
RU2252867C1 (ru) * 2004-01-30 2005-05-27 Воронежская государственная лесотехническая академия Способ изготовления древесно-стружечных плит
DE102004032058B4 (de) * 2004-07-01 2009-12-03 Fritz Egger Gmbh & Co. Verfahren zum Herstellen einer Platte mit einer ein Dekor aufweisenden Oberfläche und Platte mit einer dekorativen Oberfläche
DE102005021156A1 (de) * 2005-05-09 2006-11-16 Kaindl Flooring Gmbh Mehrschichtplatte
DE102006007976B4 (de) * 2006-02-21 2007-11-08 Flooring Technologies Ltd. Verfahren zur Veredelung einer Bauplatte

Also Published As

Publication number Publication date
RU2444443C1 (ru) 2012-03-10
EP2274176A1 (fr) 2011-01-19
PL2274176T3 (pl) 2014-03-31
WO2009135883A1 (fr) 2009-11-12
DE102008022403B3 (de) 2009-11-19

Similar Documents

Publication Publication Date Title
EP1068083B1 (fr) Procede de realisation de recouvrements stratifie, et recouvrement stratifie
EP2619016B1 (fr) Procédé de fabrication de panneaux et panneau fabriqué selon ledit procédé
EP3322596B1 (fr) Procede de fabrication d'un lamine comprenant une plaque de support et du papier decoratif
DE4434876A1 (de) Verfahren und Anlage zur kontinuierlichen Herstellung einer Mehrschichtplatte
EP2274176B1 (fr) Panneau en bois reconstitué comportant un revêtement laminé brillant et procédé de fabrication d'un tel panneau
EP2688722B1 (fr) Procédé façonnage des bords de panneaux en matériau dérivé du bois
EP1761370B1 (fr) Panneau contreplaqué
EP3126144B1 (fr) Matériau stratifié et procédé pour le fabriquer
EP3216574B1 (fr) Procede de fabrication d'un osb
EP1691991B1 (fr) Stratifie decoratif et procede de fabrication associe
EP3088204B1 (fr) Procédé de fabrication d'un panneau mural ou de sol décoré
DE10024543A1 (de) Verfahren und Anlage zur kontinuierlichen Herstellung einer Mehrschichtplatte
DE19746383A1 (de) Verfahren und Vorrichtung zur Herstellung von Faserplatten sowie nach dem Verfahren hergestellte Faserplatten
EP3725481A1 (fr) Matériau sous forme de plaque et son procédé de fabrication
WO2007009443A2 (fr) Plaque decorative en materiau derive du bois et procede de fabrication de ladite plaque
EP3470191B1 (fr) Procédé et dispositif destinés à la fabrication d'une plaque en matériau dérivé du bois
DE10049050A1 (de) Verfahren zur Herstellung einer Mehrschichtplatte und eine nach diesem Verfahren hergestellte Mehrschichtplatte
DE2513764C3 (de) Verfahren zum Herstellen einer mindestens einseitig beschichteten Holzwerkstoff-Platte, wie Spanplatte o.dgl
EP2186635B1 (fr) Méthode pour revêtir des plaques de matière dérivée du bois avec une couche d'usure et plaques ainsi obtenues
EP2078599B1 (fr) Plaque de serrage
EP4050325B1 (fr) Procédé de détermination de la pénétration de résine dans le bois utlisant la spectroscopie dans l'infrarouge proche
DE102011118009A1 (de) Verfahren zur Herstellung von OSB-Platten und Wafer-Platten aus Palmen
EP3181315B1 (fr) Procede de fabrication d'un panneau osb presentant une surface lisse
EP2786849B1 (fr) Procédé de fabrication d'un panneau de fibres multicouche, et panneau de fibres multicouche
WO2021023784A1 (fr) Procédé de production d'une plaque de matériau

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20101012

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA RS

RIN1 Information on inventor provided before grant (corrected)

Inventor name: ARTHOLD, ANDREAS

DAX Request for extension of the european patent (deleted)
17Q First examination report despatched

Effective date: 20120221

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO SE SI SK TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

Free format text: NOT ENGLISH

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 620730

Country of ref document: AT

Kind code of ref document: T

Effective date: 20130715

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

Free format text: LANGUAGE OF EP DOCUMENT: GERMAN

REG Reference to a national code

Ref country code: CH

Ref legal event code: NV

Representative=s name: TROESCH SCHEIDEGGER WERNER AG, CH

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 502009007542

Country of ref document: DE

Effective date: 20130905

REG Reference to a national code

Ref country code: RO

Ref legal event code: EPE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

REG Reference to a national code

Ref country code: NL

Ref legal event code: VDEP

Effective date: 20130710

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG4D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20131111

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130918

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20131110

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20131010

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20131011

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

Ref country code: ES

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20131021

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20140411

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 502009007542

Country of ref document: DE

Effective date: 20140411

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140506

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

REG Reference to a national code

Ref country code: IE

Ref legal event code: MM4A

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20140506

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 8

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20140531

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20090506

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 9

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 10

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20130710

P01 Opt-out of the competence of the unified patent court (upc) registered

Effective date: 20230517

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: RO

Payment date: 20230427

Year of fee payment: 15

Ref country code: IT

Payment date: 20230525

Year of fee payment: 15

Ref country code: FR

Payment date: 20230523

Year of fee payment: 15

Ref country code: DE

Payment date: 20230523

Year of fee payment: 15

Ref country code: CH

Payment date: 20230602

Year of fee payment: 15

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: PL

Payment date: 20230504

Year of fee payment: 15

Ref country code: AT

Payment date: 20230525

Year of fee payment: 15

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20230523

Year of fee payment: 15

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: TR

Payment date: 20240325

Year of fee payment: 16