EP2266140A1 - Substrat en verre portant une electrode - Google Patents
Substrat en verre portant une electrodeInfo
- Publication number
- EP2266140A1 EP2266140A1 EP09753741A EP09753741A EP2266140A1 EP 2266140 A1 EP2266140 A1 EP 2266140A1 EP 09753741 A EP09753741 A EP 09753741A EP 09753741 A EP09753741 A EP 09753741A EP 2266140 A1 EP2266140 A1 EP 2266140A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- electrode
- glass substrate
- zinc
- tin
- substrate according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000011521 glass Substances 0.000 title claims abstract description 66
- 239000000758 substrate Substances 0.000 title claims abstract description 61
- 239000011701 zinc Substances 0.000 claims abstract description 42
- 230000004888 barrier function Effects 0.000 claims abstract description 41
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 32
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 32
- 239000011248 coating agent Substances 0.000 claims abstract description 25
- 238000000576 coating method Methods 0.000 claims abstract description 25
- 238000010438 heat treatment Methods 0.000 claims description 57
- 229910052750 molybdenum Inorganic materials 0.000 claims description 30
- 239000011733 molybdenum Substances 0.000 claims description 30
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 29
- 239000011135 tin Substances 0.000 claims description 25
- 229910052718 tin Inorganic materials 0.000 claims description 23
- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 claims description 22
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 20
- 239000000203 mixture Substances 0.000 claims description 16
- 238000000151 deposition Methods 0.000 claims description 13
- 229910052782 aluminium Inorganic materials 0.000 claims description 12
- 230000008021 deposition Effects 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 8
- 150000003346 selenoethers Chemical class 0.000 claims description 7
- 238000004544 sputter deposition Methods 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 229910052738 indium Inorganic materials 0.000 claims description 6
- 229910052719 titanium Inorganic materials 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 5
- 230000003647 oxidation Effects 0.000 claims description 4
- 238000007254 oxidation reaction Methods 0.000 claims description 4
- 229910052758 niobium Inorganic materials 0.000 claims description 3
- 229910052715 tantalum Inorganic materials 0.000 claims description 3
- 229910052726 zirconium Inorganic materials 0.000 claims description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 claims 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 abstract description 10
- DVRDHUBQLOKMHZ-UHFFFAOYSA-N chalcopyrite Chemical compound [S-2].[S-2].[Fe+2].[Cu+2] DVRDHUBQLOKMHZ-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052951 chalcopyrite Inorganic materials 0.000 abstract description 6
- 239000011787 zinc oxide Substances 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 74
- 238000004519 manufacturing process Methods 0.000 description 14
- 150000002500 ions Chemical class 0.000 description 11
- 239000002346 layers by function Substances 0.000 description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 10
- 230000000694 effects Effects 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 230000005012 migration Effects 0.000 description 8
- 238000013508 migration Methods 0.000 description 8
- 229910052708 sodium Inorganic materials 0.000 description 8
- 239000011734 sodium Substances 0.000 description 8
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 7
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- 238000004458 analytical method Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000000463 material Substances 0.000 description 5
- 239000010936 titanium Substances 0.000 description 5
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 239000003513 alkali Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 230000007935 neutral effect Effects 0.000 description 4
- 230000001590 oxidative effect Effects 0.000 description 4
- 239000001301 oxygen Substances 0.000 description 4
- 239000011669 selenium Substances 0.000 description 4
- 239000005361 soda-lime glass Substances 0.000 description 4
- 239000011593 sulfur Substances 0.000 description 4
- 229910052717 sulfur Inorganic materials 0.000 description 4
- YJVLWFXZVBOFRZ-UHFFFAOYSA-N titanium zinc Chemical compound [Ti].[Zn] YJVLWFXZVBOFRZ-UHFFFAOYSA-N 0.000 description 4
- BNEMLSQAJOPTGK-UHFFFAOYSA-N zinc;dioxido(oxo)tin Chemical compound [Zn+2].[O-][Sn]([O-])=O BNEMLSQAJOPTGK-UHFFFAOYSA-N 0.000 description 4
- 229920000742 Cotton Polymers 0.000 description 3
- 229910052774 Proactinium Inorganic materials 0.000 description 3
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 3
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 229910001128 Sn alloy Inorganic materials 0.000 description 3
- 229910001069 Ti alloy Inorganic materials 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- 239000002585 base Substances 0.000 description 3
- BWFPGXWASODCHM-UHFFFAOYSA-N copper monosulfide Chemical compound [Cu]=S BWFPGXWASODCHM-UHFFFAOYSA-N 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 230000001617 migratory effect Effects 0.000 description 3
- 229910052711 selenium Inorganic materials 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- 229910001415 sodium ion Inorganic materials 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- -1 CuInSe 2 Chemical compound 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- VVTSZOCINPYFDP-UHFFFAOYSA-N [O].[Ar] Chemical compound [O].[Ar] VVTSZOCINPYFDP-UHFFFAOYSA-N 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 239000010955 niobium Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000007669 thermal treatment Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 229910000611 Zinc aluminium Inorganic materials 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229910000287 alkaline earth metal oxide Inorganic materials 0.000 description 1
- HXFVOUUOTHJFPX-UHFFFAOYSA-N alumane;zinc Chemical compound [AlH3].[Zn] HXFVOUUOTHJFPX-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- QNDQILQPPKQROV-UHFFFAOYSA-N dizinc Chemical compound [Zn]=[Zn] QNDQILQPPKQROV-UHFFFAOYSA-N 0.000 description 1
- ZBFOLPMOGPIUGP-UHFFFAOYSA-N dizinc;oxygen(2-);titanium(4+) Chemical compound [O-2].[O-2].[O-2].[O-2].[Ti+4].[Zn+2].[Zn+2] ZBFOLPMOGPIUGP-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- BVSHTEBQPBBCFT-UHFFFAOYSA-N gallium(iii) sulfide Chemical compound [S-2].[S-2].[S-2].[Ga+3].[Ga+3] BVSHTEBQPBBCFT-UHFFFAOYSA-N 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- SIXIBASSFIFHDK-UHFFFAOYSA-N indium(3+);trisulfide Chemical compound [S-2].[S-2].[S-2].[In+3].[In+3] SIXIBASSFIFHDK-UHFFFAOYSA-N 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 230000000155 isotopic effect Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 150000002751 molybdenum Chemical class 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- KYKLWYKWCAYAJY-UHFFFAOYSA-N oxotin;zinc Chemical compound [Zn].[Sn]=O KYKLWYKWCAYAJY-UHFFFAOYSA-N 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 230000001131 transforming effect Effects 0.000 description 1
- 238000011282 treatment Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022466—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022466—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers
- H01L31/022483—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers composed of zinc oxide [ZnO]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/0256—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by the material
- H01L31/0264—Inorganic materials
- H01L31/032—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312
- H01L31/0322—Inorganic materials including, apart from doping materials or other impurities, only compounds not provided for in groups H01L31/0272 - H01L31/0312 comprising only AIBIIICVI chalcopyrite compounds, e.g. Cu In Se2, Cu Ga Se2, Cu In Ga Se2
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/0248—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies
- H01L31/036—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes
- H01L31/0392—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate
- H01L31/03923—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by their semiconductor bodies characterised by their crystalline structure or particular orientation of the crystalline planes including thin films deposited on metallic or insulating substrates ; characterised by specific substrate materials or substrate features or by the presence of intermediate layers, e.g. barrier layers, on the substrate including AIBIIICVI compound materials, e.g. CIS, CIGS
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1884—Manufacture of transparent electrodes, e.g. TCO, ITO
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/541—CuInSe2 material PV cells
Definitions
- the present invention relates to a glass substrate carrying at least one electrode, for an electronic device such as a photovoltaic cell, in the form of a thin layer, and to the electronic device comprising such a substrate carrying at least one electrode.
- the electrode of an electronic device is for distributing or collecting an electric current. For this device to work properly, it is fundamental that the electrode has as low a resistance as possible, taking into account other requirements of construction or operation of the device, to minimize electrical losses. Electronic devices that use a glass substrate carrying at least one electrode are varied.
- Intelligent glazing such as electrochromic glazings, devices using lighting based on LEDs (light-emitting diodes) or OLEDs (organic light-emitting diodes) in which the current is supplied via electrodes deposited on the electroluminescent glasses, can notably be mentioned. glass, etc.
- the invention will be described with particular reference to photovoltaic cells, also called solar cells, for transforming sunlight into electricity. These electronic devices have taken a particular step in recent years following the search for alternative energy to fossil energy.
- chalcopyrite-based cells such as solar cells called CIS (based on selenide and / or copper and indium sulphide, such as CuInSe 2 , CuInS 2 ) or CIGS (based on selenide and / or copper, indium and gallium sulphide), or on solar cells based on selenide and / or copper sulphide, indium and aluminum, or solar cells called CZTS (based on selenide and / or copper sulphide, zinc and tin, such as Cu 2 ZnSnS 4 or Cu 2 ZnSnSe 4 ).
- CIS based on selenide and / or copper and indium sulphide, such as CuInSe 2 , CuInS 2
- CIGS based on selenide and / or copper, indium and gallium sulphide
- CZTS based on selenide and / or copper sulphide, zinc and tin, such as Cu 2 ZnSnS 4 or Cu 2 Zn
- the substrate carrying the electrode may be subjected to a heat treatment at a high temperature, for example at a temperature greater than 500 ° C., or more than 550 ° C. (for example 550-600 ° C.) for approximately 5 to 30 minutes in one or more stages in an atmosphere generally based on selenium or sulfur, or on the basis of selenium and then sulfur, to react Cu and In layers. , deposited on the electrode, with Se and / or S.
- an alkaline ion diffusion occurs, such as sodium ions, towards the surface of the substrate.
- These ions pollute, uncontrollably, the electrode deposited on the substrate.
- This pollution at least from a certain level, can undesirably reduce the conductivity of the electrode. It also has an adverse effect on the interfaces by reducing the adhesion between the layers, and in particular the adhesion between the electrode and the functional layer, for example based on chalcopyrite. It can also have a detrimental effect on the functional element of the solar cell, for example the layer based on chalcopyrite. Indeed, at low concentration sodium has a positive effect on the functional element, but the effect quickly becomes negative if the concentration increases beyond a certain level.
- CIS or CIGS having a Mo electrode deposited on a glass substrate.
- This document proposes to deposit between the substrate and the electrode a barrier layer of SiO 2 or SiO x to prevent the diffusion of alkali ions from the glass.
- the invention relates to a glass substrate carrying at least one electrode, for an electronic device, in the form of a thin layer, characterized in that a barrier coating comprising at least one layer based on a mixed zinc oxide and at least one other element, containing at least 10% by weight of zinc, is disposed between the substrate and the electrode
- barrier coating is meant a coating which obstructs migrating species from the glass substrate, such as oxygen and alkali ions, by curbing their migration.
- zinc mixed oxide and another element containing at least 10% zinc and at least 10% of another element used in the present description mean that there is at least 10% by weight zinc and at least 10% by weight of the other element in the mixed oxide with respect to the total weight of zinc and the other element in the mixed oxide. It is the same for the different percentages of zinc and the other element in the mixed oxide given below, as well as for other values than 10%, which are taken here by way of illustration.
- the said barrier coating and the electrode are preferably deposited by sputtering under reduced pressure, advantageously improved by means of a magnetic field in a device called a magnetron.
- the magnetron device may be a horizontal device where the glass substrate moves horizontally under the appropriate spray targets.
- a vertical device has the advantage of reducing the number of "pinhole" type defects from residues falling on the glass inside the deposition device.
- reducing the thickness of the electrode also has the advantage of reducing the risk of forming holes, called "pinholes", in the layer that pass ions such as sodium ions, and also to reduce the intensity of the internal stresses, which is an advantage as regards the adhesion of the electrode to the substrate.
- a layer based on mixed zinc oxide and another element is easier to deposit without defects and provides a better magnetron deposition efficiency than the known barrier layers of silicon nitride or silicon oxides. .
- the control of the deposit process is simpler and promotes a substantial saving in industrial mass production.
- this barrier layer based on a mixed oxide of zinc and another element also promotes a very good adhesion of the electrode relative to the glass substrate.
- the invention provides these advantageous results, particularly in the case of application of solar cells of CIS, CZTS or CIGS type.
- elements Zn and the other element are introduced into the structure, with respect to which the functional layer is more sensitive than vis-à-vis the silicon of the glass. If these metals reach the functional layer, it may degrade it adversely. The problem does not arise with the barriers Si 3 N 4 or SiO 2 which are elements close to the glass and silicon-based like him. It has been found that the functional layer is not polluted by these metals.
- the mixed oxide of zinc and the other element is undoubtedly sufficiently thermally stable so that there is no diffusion of zinc or the other element through the electrode.
- the glass substrate may be any suitable vitreous material containing species likely to migrate under the effect of an external phenomenon such as temperature increase.
- the substrate is formed of a glass with a high melting point, such as a glass having a softening point ("strain point") of the order of 570-590 ° C. C.
- strain point a softening point
- This type of glass makes it possible to carry out thermal treatments at very high temperatures, favorable to obtain quality functional layers for solar cells of CIS, CZTS or CIGS type. It may be glass of the system SiO 2 - Al 2 O 3 -oxides of alkaline-alkaline earth oxides.
- the glass sold under the name PD200 by Asahi Glass Company suitable for the production of emitting screens or the glass sold under the name PV200 by the same company which is more particularly adapted to serve as a substrate in the production. of photovoltaic cells.
- the glass substrate is formed of an ordinary soda-lime-calcium glass whose base composition comprises the following proportions: 60 to 75% SiO 2 , 10 to 20% Na 2 O, 0 at 16% CaO, 0 to 10% K 2 O, 0 to 10% MgO, 0 to 5% Al 2 O 3 and 0 to 2% BaO.
- base composition comprises the following proportions: 60 to 75% SiO 2 , 10 to 20% Na 2 O, 0 at 16% CaO, 0 to 10% K 2 O, 0 to 10% MgO, 0 to 5% Al 2 O 3 and 0 to 2% BaO.
- the glass substrate is transparent.
- the electrode is formed of a metal that is resistant to the high temperatures of manufacture of the electronic device.
- the metal of the electrode must withstand attack by selenium and / or sulfur. In addition, it must not readily form alloys with copper and indium. It may for example be made of tungsten, tantalum or niobium.
- the electrode is based on molybdenum. It is the metal commonly used to form the base electrode of a chalcopyrite solar photovoltaic cell type CIS, CZTS or CIGS because of its properties suitable for this purpose.
- the layer electrode may be a uniform layer over the entire surface of the glass substrate or extend over only a portion of that surface.
- the electrode layer is cut in a specific pattern adapted to the electronic device of which it is part in the finished product. It is usually cut with a laser beam. Its thickness is in general between 50 and 1500 nm.
- the layer constituting the electrode has a total thickness of less than 1000 nm, advantageously less than 800 nm, and ideally less than 600 nm.
- the thickness is advantageously between 250 and 520 nm.
- the electrical resistance can be of the order of 10 to 15 ⁇ / D (Ohms per square), or even of the order of 5 to 8 ⁇ / D, but this type of electronic device generally requires that the electrical resistance of the electrode is as much as possible less than 5 Ohms / ⁇ (Ohms per square) or less than 2 or 3 ⁇ / D, and even preferably less than 1 Ohms / ⁇ when the device is in working order, that is that is to say that the electrode has possibly had to undergo a heat treatment at high temperature consecutive to the manufacture of the cell.
- the surface electrical resistance of a very thin layer deposited on an insulating substrate is usually expressed in "Ohms per square", the value of the resistance does not depend on the size of the square. As a reference, it is considered in the present description that this value of the surface resistance must be obtained after a thermal treatment at 500 ° C. for 30 minutes of the substrate carrying the electrode, the latter being protected from the surrounding atmosphere during the heat treatment to avoid surface oxidation.
- the electrical resistance of the electrode is less than 2 ohms / ⁇ , advantageously less than 0.8 ohms / ⁇ and preferably equal to or less than 0.6 ohms / ⁇ , and this after said heat treatment.
- this low resistance can be obtained, after heat treatment at high temperature, for a lower thickness of the electrode than in the structures without the barrier layer, especially for a thickness of less than 510 nm in the case of a molybdenum electrode. Since molybdenum is a very expensive material, the advantage of a reduction in thickness is obvious. The invention allows this reduction in thickness without having to complicate the manufacturing process and add additional conductive materials, sources of defects, as proposed in WO 02/065554 A1 which adds additional conductive layers made of a material other than molybdenum .
- the electrode in the form of a layer may be subdivided in its thickness into a multilayer deposition consisting of at least two layers formed by cathodic sputtering in a neutral atmosphere from the same cathode but under deposition conditions (power and / or pressure ) different. Preferably, it is subdivided into at least three layers, for example into five layers. It is thus possible to obtain a succession of less dense and denser layers. It has been discovered that it is thus possible to improve the adhesion to the glass substrate, in particular after heat treatment, and to obtain good electrical contact at the interface with the functional layer.
- the mixed oxide of the barrier coating comprises zinc and at least one other element.
- said other element is chosen from the following elements: Sn, Ti, Ta, Zr, Nb, Ga, Bi, Al and their mixture. Oxides of these elements mixed with zinc oxide have a favorable effect to form an effective barrier to migratory species of glass.
- the barrier coating preferably comprises a stack of at least two layers of different compositions. The multiplication of the interfaces improves the barrier effect.
- said other element is present in a proportion of at least 4% by weight, for example 5% by weight.
- said other element is present in a proportion of at least 10% by weight, preferably at least 12% by weight.
- the mixed oxide of the barrier coating may advantageously be formed of a mixed oxide of zinc and aluminum, in a proportion of at least 4% by weight of aluminum, for example 5% (ie about 12 at%). It may also preferably contain at least 10%, advantageously at least 12% by weight of aluminum and thus form a very effective barrier to migrating species of the glass.
- This mixed oxide can be formed from a cathode of a zinc-aluminum alloy sprayed in a reactive atmosphere of oxygen and argon. It can also be obtained from a mixed oxide ceramic cathode sprayed in a neutral or slightly oxidizing atmosphere.
- the mixed oxide of the barrier coating may also advantageously be formed of a mixed oxide of zinc and titanium, or a mixed oxide of zinc, titanium and aluminum.
- the mixed oxide of zinc and another element comprises at least 20% of zinc, and advantageously at least 30%.
- said other element is tin and the zinc-tin mixed oxide contains at least 20% tin. It has been found that zinc-tin mixed oxide forms a particularly effective barrier coating.
- the barrier coating may consist of a single layer of suitable thickness based on a zinc-tin mixed oxide advantageously having a composition close to Zn 2 SnO 4 .
- the barrier coating comprises a stack of at least two layers based on mixed zinc-tin oxide of different compositions.
- a zinc-tin mixed oxide layer formed by reactive cathode sputtering in the presence of oxygen from a cathode of a zinc-tin alloy of about 90% by weight of zinc and 10% by weight of tin is sandwiched between two layers based on a zinc-tin mixed oxide having a composition close to Zn 2 SnO 4 .
- the layer based on a zinc-tin mixed oxide may contain at least
- At least one zinc-tin mixed oxide layer comprises at least 40% tin and at least 40% zinc.
- the zinc-tin mixed oxide is formed by reactive cathodic sputtering in the presence of oxygen from a cathode of a tin-zinc alloy at 52% by weight of zinc and 48% by weight of tin, in to obtain an oxide having the composition closest to zinc stannate Zn 2 SnO 4 in the layer. We have discovered that it is by approaching this particular composition that the best effect of blocking the migration of the alkaline ions is obtained.
- the total thickness of the barrier coating must be sufficient to provide an effective barrier and oppose the migration of alkali ions from the glass substrate to the electrode and even to the functional layer deposited on the electrode.
- a barrier thickness of at least 50 nm is necessary when the heat treatment is more than 400 0 C for a duration greater than 5 minutes. The thickness should not be unnecessarily high so as not to burden the manufacturing costs.
- a thickness greater than 500 nm is not justified and a thickness of less than 200 nm is sufficient for most applications.
- the barrier coating has a total thickness of between 80 and 500 nm, advantageously between 80 and 200 and preferably between 100 and 150 nm.
- Good adhesion of the electrode to the substrate is important because if the electrode is detached from the substrate, the electronic device becomes defective.
- an adhesion test which is as follows: A flat circular Teflon head covered with a cotton fabric is dragged on the layer with a constant load and integrated. The area of the layer covered by the friction of the fabric is 2.81 cm 2 and the applied load is 3.850 g. The abrasion of the cotton on the coated surface will damage (or remove) the layer after a number of cycles.
- Cotton should be kept moist with deionized water for the duration of the test.
- the speed must be adjusted between 60 and 90 full oscillations (back-and-forth) per minute.
- the test is used to define the threshold where the layer fades and / or the threshold where scratches appear in the layer.
- the sample is observed under an artificial sky to determine if discoloration or scratches can be seen on the sample. No detachment should be identified to pass the test.
- the electrode is not torn off from the substrate when subjected to the adhesion test described above.
- Adhesion is also an important element at the interface between the functional layer and the electrode. If the sodium migrated to this interface, there would be a risk of detachment of the functional layer relative to the electrode.
- the invention also extends to an electronic device comprising a glass substrate carrying an electrode as described above.
- This electronic device is preferably a photovoltaic solar cell based on chalcopyrite, comprising a selenide layer and / or copper sulphide and indium or tin, optionally with gallium or aluminum or zinc, deposited on the electrode, preferably in molybdenum.
- FIG. 1 shows a cross-section of a glass sheet carrying an electrode according to the invention
- FIG. 2 represents the graph of an XPS analysis carried out on the glass sheet carrying the electrode of FIG. 1 before heat treatment
- FIG. 3 represents the graph of an XPS analysis carried out on the glass sheet carrying the electrode of FIG. 1 after heat treatment.
- the reference 1 represents the glass substrate
- the reference 2 represents the barrier coating as a whole
- the reference 3 represents the electrode.
- Comparative example An ordinary 2.1 mm thick soda-lime glass sheet was introduced into a magnetron layer deposition device. In this device, an electrode was deposited in the form of a 500 nm thick layer of Mo at a pressure of 0.4 Pa and a power of 1.14 W / cm 2 . The resistance of the electrode is 0.6 ⁇ / D. In order to test this structure for comparison purposes, it was subjected to a heat treatment similar to that carried out during the manufacture of a CIS type solar cell. It should be noted that the Mo electrode was not protected from the external atmosphere during heat treatment. The molybdenum layer has therefore oxidized on the outer surface, which is not the case during the actual manufacture of the solar cell. The heat treatment was carried out at 500 ° C. for 30 minutes in an uncontrolled atmosphere, therefore in air.
- the electrical resistance of the molybdenum electrode was again measured after heat treatment and a value of 3.2 to 12 ⁇ / D was found depending on the location on the surface of the electrode. This value is variable depending on the location because of oxidation of molybdenum during heat treatment.
- a barrier coating formed of a zinc-zinc mixed oxide layer was first deposited on the glass.
- tin 130 nm thick according to the invention. This layer was deposited from a cathode zinc-tin alloy at 52% by weight of zinc and 48% by weight of tin to form a layer of Zn 2 SnO 4 on the glass.
- An ordinary soda-lime glass sheet 2.1 mm thick was introduced into a magnetron layer deposition device. Under a total pressure of 0.4 Pa and in an atmosphere of an oxygen-argon mixture at 80% O 2 , a 130 nm zinc-tin 2 mixed oxide layer 2 was deposited on the glass. from a cathode of zinc-tin alloy at 52% by weight of zinc and 48% by weight of tin. A molybdenum electrode layer 3 having a total thickness of 500 nm was then deposited from a molybdenum target in a neutral atmosphere of argon.
- This molybdenum electrode has been subdivided into 5 layers whose thicknesses are respectively 40/190/40/190/40 nm under conditions of total pressure and power respectively identified by A / C / A / C / A, these corresponding letters under the conditions given in Table 1 below.
- the electrical resistance of the molybdenum electrode was measured before and after heat treatment. Before heat treatment, the value of 0.29 Ohm / ⁇ was found. After heat treatment, the value of 0.36 Ohm / ⁇ was found. It can therefore be seen that the electrical resistance has not substantially increased as a result of the heat treatment and that its final value, for a 500 nm electrode, is entirely adequate to constitute a solar cell of CIS, CZTS or CIGS type.
- the sample is irradiated with monochromatic x-rays that cause the ionization of its atoms by photoelectric effect.
- the kinetic energy of these photoelectrons is measured which allows to deduce the binding energy and therefore the nature of the atom.
- the surface of the sample to be analyzed is bombarded with an ion beam.
- the sample is then pulverized, and some of the pulverized material is ionized.
- These secondary ions are then accelerated to a mass spectrometer that will measure the elemental or isotopic composition of the surface of the sample.
- FIG. 2 represents the graph obtained following the XPS analysis of the sample according to example 2 before the heat treatment.
- Figure 3 represents the graph obtained following the XPS analysis of the sample according to Example 2 after the heat treatment.
- the irradiation time in seconds is represented as the abscissa and the atomic percentage of the elements is represented on the ordinates.
- Example 1 was repeated by modifying certain parameters.
- the structures and electrode deposition conditions are given in Table 2 below.
- the molybdenum electrode has been subdivided into 5 layers whose thicknesses and deposition conditions are given in Table 2, the letters A, B, C and D corresponding to the given deposition conditions. in Table 1 above.
- the barrier coating was subdivided into three layers of zinc-tin mixed oxide: a layer of lower tin content was enclosed between two layers of Zn 2 SnO 4 zinc stannate.
- the initials ZSO5 represents a zinc-tin mixed oxide obtained by sputtering in an oxidizing atmosphere from a metal target of a ZnSn alloy containing 52% by weight of Zn and 48% by weight of Sn
- the initials ZSO9 represents a zinc-tin mixed oxide obtained by cathodic sputtering in an oxidizing atmosphere from a metal target of a ZnSn alloy containing 90% by weight of Zn and 10% by weight of Sn weight.
- the samples of these examples were subjected to a heat treatment at 500 ° C. for 30 minutes in an uncontrolled atmosphere, ie in air, as in the previous examples. It should be noted, however, that the molybdenum electrodes were not covered and were therefore not protected from oxidation during heat treatment.
- the electrical resistances of the electrodes were measured before and after heat treatment.
- the measured values are given in Table 2. It should be noted that these values are variable depending on the location due to oxidation of molybdenum during the heat treatment, so the table gives the minimum and maximum measured.
- Example 7 shows that it is advantageous to subdivide the barrier coating.
- Examples 8 to 10 show that, for the given structure and for any other parameter remaining constant, the 130 nm thickness of the barrier coating is sufficient and that a thickness of 180 nm is superfluous. Examples 11 and 12.
- An ordinary soda-lime glass sheet 2.1 mm thick was introduced into a magnetron layer deposition device. Under a total pressure of 0.4 Pa and in an atmosphere of an oxygen-argon mixture at 80% O 2 , a layer of mixed zinc-titanium oxide 2 was deposited on the glass. 130 nm from a planar cathode of 432 x 127 mm of a zinc-titanium alloy with 70% by weight of zinc and 30% by weight of titanium. A molybdenum electrode layer 3 was then deposited from a molybdenum target, of the same size as the zinc-titanium alloy cathode, in a neutral atmosphere of argon at a pressure of 0.6 Pa and at a temperature of power of 3 kW. The thickness of the molybdenum electrode layer was 300 nm in Example 11 and 500 nm in Example 12.
- this structure was subjected to a heat treatment similar to that carried out during the manufacture of a CIS type solar cell. To protect this structure from the external atmosphere during the heat treatment, it was covered, for examination, with a 130 nm layer of Zn 2 SnO 4 zinc stannate. The heat treatment was carried out at 500 ° C. for 30 minutes in an uncontrolled atmosphere, therefore in air.
- the electrical resistance of the molybdenum electrode was measured before and after heat treatment. Before heat treatment, the value of 0.61 Ohm / ⁇ was found for Example 11 and 0.35 Ohm / ⁇ for Example 12. After heat treatment, the value of 0.94 Ohm / was found. ⁇ for example 11 and of
- the electrical resistance has changed little as a result of the heat treatment and that its final value is less than 1 Ohm / ⁇ , and even less than 0.6 Ohm / ⁇ for Example 12, quite adequate to constitute a solar cell type CIS, CZTS or CIGS.
- Example 13 As an alternative to Example 11, the replacement of titanium by 12% by weight of aluminum in the zinc-titanium alloy cathode forming the mixed oxide layer 2 also provided a suitable substrate for forming a solar cell CIS, CZTS or CIGS type.
- Example 13
- Example 11 was reproduced except for the mixed oxide layer 2.
- the layer 2 was subdivided into three films according to the following sequence: a first 50 nm film of ZSO5 (mixed oxide zinc-tin as in Example 3), followed by a second 30 nm film of a zinc-titanium mixed oxide ZnTiOx having the same composition as in Example 11 and a third 50 nm film of ZSO5 (identical to first film).
- This Example 13 was subjected to the same heat treatment as Example 11, and the electrical resistance of the molybdenum electrode was measured before and after heat treatment. Before heat treatment, the value of 0.58 Ohm / ⁇ was found. After heat treatment, the value of 0.89 Ohm / ⁇ was found.
- the molybdenum electrode 3 had a total thickness of 330 nm and was subdivided into two films: a first film 30 nm thick deposited at 0.4 Pa by activating the cathode of Mo under a power of specific 2.41 kW / cm 2 , followed by a second film 300 nm thick deposited at 0.6 Pa by activating the cathode of Mo under a specific power of 9.64 kW / cm 2 .
- the mixed oxide layer 2 according to Example 14 was subdivided into three films in the same manner as in Example 7.
- the assembly was subjected to the same heat treatment as in Example 1, the electrode layer 3 being Mo was not protected from the atmosphere during the treatment, and the electrical resistance of the molybdenum electrode was measured before and after heat treatment. Before heat treatment, the value of 0.58 Ohm / ⁇ was found. After heat treatment, a value of 0.99 to 1.06 ⁇ / D was found depending on the location on the surface of the electrode.
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Abstract
Description
Claims
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EP09753741A EP2266140A1 (fr) | 2008-04-16 | 2009-04-16 | Substrat en verre portant une electrode |
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PCT/EP2009/054509 WO2009144086A1 (fr) | 2008-04-16 | 2009-04-16 | Substrat en verre portant une electrode |
EP09753741A EP2266140A1 (fr) | 2008-04-16 | 2009-04-16 | Substrat en verre portant une electrode |
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US (1) | US20090260678A1 (fr) |
EP (1) | EP2266140A1 (fr) |
JP (1) | JP2011517132A (fr) |
CN (1) | CN102047433B (fr) |
WO (1) | WO2009144086A1 (fr) |
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TWI402996B (zh) * | 2010-01-12 | 2013-07-21 | Univ Nat Kaohsiung Marine | 以銅鋅錫(CuZnSn)合金製備太陽能電池的CuxZn SnSy(CZTS)薄膜之方法 |
EP2556542A1 (fr) * | 2010-04-09 | 2013-02-13 | Platzer-Björkman, Charlotte | Cellules solaires photovoltaïques à couches minces |
CN101838788A (zh) * | 2010-05-06 | 2010-09-22 | 深圳丹邦投资集团有限公司 | 一种原位生长Cu2SixSn1-xS3光伏薄膜的方法 |
WO2012037242A2 (fr) * | 2010-09-14 | 2012-03-22 | E. I. Du Pont De Nemours And Company | Substrats polymères flexibles enrobés de verre pour cellules photovoltaïques |
US20120064352A1 (en) * | 2010-09-14 | 2012-03-15 | E. I. Du Pont De Nemours And Company | Articles comprising a glass - flexible stainless steel composite layer |
FR2969389A1 (fr) * | 2010-12-21 | 2012-06-22 | Saint Gobain | Substrat conducteur a base de molybdène |
JP2012160556A (ja) * | 2011-01-31 | 2012-08-23 | Showa Shell Sekiyu Kk | Czts系薄膜太陽電池の製造方法 |
GB201101910D0 (en) * | 2011-02-04 | 2011-03-23 | Pilkington Group Ltd | Growth layer for the photovol taic applications |
EP2742533A2 (fr) * | 2011-08-10 | 2014-06-18 | Saint-Gobain Glass France | Module solaire avec perte de puissance réduite et procédé de fabrication dudit module solaire |
US20130133745A1 (en) * | 2011-11-30 | 2013-05-30 | James Patrick Hamilton | Incorporation of alkaline earth ions into alkali-containing glass surfaces to inhibit alkali egress |
US9246025B2 (en) | 2012-04-25 | 2016-01-26 | Guardian Industries Corp. | Back contact for photovoltaic devices such as copper-indium-diselenide solar cells |
US9419151B2 (en) | 2012-04-25 | 2016-08-16 | Guardian Industries Corp. | High-reflectivity back contact for photovoltaic devices such as copper—indium-diselenide solar cells |
US8809674B2 (en) | 2012-04-25 | 2014-08-19 | Guardian Industries Corp. | Back electrode configuration for electroplated CIGS photovoltaic devices and methods of making same |
US9935211B2 (en) | 2012-04-25 | 2018-04-03 | Guardian Glass, LLC | Back contact structure for photovoltaic devices such as copper-indium-diselenide solar cells |
US9876129B2 (en) * | 2012-05-10 | 2018-01-23 | International Business Machines Corporation | Cone-shaped holes for high efficiency thin film solar cells |
CN102867860B (zh) * | 2012-09-12 | 2015-08-12 | 厦门神科太阳能有限公司 | 一种用于cigs基薄膜光伏电池的过渡层及其制备方法 |
KR101436539B1 (ko) | 2012-11-06 | 2014-09-02 | 엘에스엠트론 주식회사 | 박막형 태양전지 및 그 제조방법 |
US20140261669A1 (en) * | 2013-03-15 | 2014-09-18 | The Government Of The United States Of America, As Represented By The Secretary Of The Navy | Growth of cigs thin films on flexible glass substrates |
AT14576U1 (de) * | 2014-08-20 | 2016-01-15 | Plansee Se | Metallisierung für ein Dünnschichtbauelement, Verfahren zu deren Herstellung und Sputtering Target |
CN106796991B (zh) * | 2014-10-14 | 2020-03-13 | 积水化学工业株式会社 | 太阳能电池 |
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- 2009-04-16 CN CN2009801135056A patent/CN102047433B/zh not_active Expired - Fee Related
- 2009-04-16 JP JP2011504460A patent/JP2011517132A/ja active Pending
- 2009-04-16 EP EP09753741A patent/EP2266140A1/fr not_active Withdrawn
- 2009-04-16 WO PCT/EP2009/054509 patent/WO2009144086A1/fr active Application Filing
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CN102047433B (zh) | 2013-02-13 |
US20090260678A1 (en) | 2009-10-22 |
WO2009144086A1 (fr) | 2009-12-03 |
CN102047433A (zh) | 2011-05-04 |
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