EP2256452B1 - Échangeur de chaleur et dispositif à cycle de réfrigération le comportant - Google Patents

Échangeur de chaleur et dispositif à cycle de réfrigération le comportant Download PDF

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EP2256452B1
EP2256452B1 EP20090726196 EP09726196A EP2256452B1 EP 2256452 B1 EP2256452 B1 EP 2256452B1 EP 20090726196 EP20090726196 EP 20090726196 EP 09726196 A EP09726196 A EP 09726196A EP 2256452 B1 EP2256452 B1 EP 2256452B1
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Prior art keywords
fin
heat transfer
frost
heat exchanger
holes
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German (de)
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EP2256452A4 (fr
EP2256452A1 (fr
Inventor
Yusuke Tashiro
Mamoru Hamada
Fumitake Unezaki
Takeyuki Maegawa
Hiroyuki Morimoto
Kouji Yamashita
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/32—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means having portions engaging further tubular elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B39/00—Evaporators; Condensers
    • F25B39/02—Evaporators
    • F25B39/022—Evaporators with plate-like or laminated elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B47/00—Arrangements for preventing or removing deposits or corrosion, not provided for in another subclass
    • F25B47/006—Arrangements for preventing or removing deposits or corrosion, not provided for in another subclass for preventing frost
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
    • F28F13/187—Heat-exchange surfaces provided with microstructures or with porous coatings especially adapted for evaporator surfaces or condenser surfaces, e.g. with nucleation sites
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2500/00—Problems to be solved
    • F25B2500/01—Geometry problems, e.g. for reducing size

Definitions

  • the present invention relates to a method for a heat exchanger disposed in an air conditioner, low-temperature equipment, water heating equipment and the like, for performing heat exchange with air.
  • the present invention particularly relates to a technology in which a region of frost formed on a heat transfer face and a formation temperature are controlled, and even if frost is formed on the heat transfer face, time until an air path becomes clogged is delayed, and device performance can be maintained for a long time by providing a plurality of holes in the heat transfer face with air of a fin constituting the heat exchanger.
  • a method having the features in the preamble of claims 1 and 2 is disclosed in JP-2002090084 .
  • US 2007/0031639 A1 discloses: an article having low wettability.
  • the article comprises a body portion and a surface portion disposed on the body portion.
  • the surface portion comprises a plurality of features disposed on the body portion, and the features have a size, shape, and orientation selected such that the surface portion has a wettability sufficient to generate, with a reference liquid, a contact angle of at least about 100 degrees.
  • US 6,764,745 B1 discloses: a structural member in which a super water-repellent function and high durability and scratch assistance can be obtained; and a method of manufacturing such a structural member.
  • a water-repellent surface consisting of appropriate irregularities comprising protrusion portions uniform in height is formed on an external surface.
  • EP 1 750 018 A2 shows: articles resistant to wetting by impinging droplets of liquid as well as a method for resisting wetting of an article by impinging droplets of liquid.
  • frost is formed on the fin surface, the thicker the frost becomes, the greater heat resistance on the fin surface is raised, and as a result, a heat exchange amount with air is decreased, which leads to deterioration of the device performance.
  • the device in order to eliminate the frost adhered to the fin surface, the device needs a periodical defrosting, which also markedly deteriorates the device performances.
  • Patent Document 1 Japanese Unexamined Patent Application Publication No. 2002-90084 ( Figs. 2 , 4 )
  • the present invention pays attention to the following two phase changes in a formation process of frost, which will be described later:
  • a radius of the holes to be provided in the fin is of nanosize, and since it is sufficiently smaller than a diameter of dust and dirt usually presumed to be present indoors and outdoors, the hole is not clogged and the performance can be maintained over a long time.
  • a heat exchanger restricts a region where condensed water droplets are generated by providing holes on a surface of a fin for heat transfer constituting the heat exchanger and by setting a radius of the holes to be smaller than a critical radius of the condensed water droplets (or condensed liquid droplets) determined by an air condition and a surface temperature of the fin.
  • a hole that creates the Gibbs-Thomson effect is provided on the surface of the fin for heat transfer constituting the heat exchanger so that a freezing point of the condensed water droplets (or condensed liquid droplets) is lowered to 0°C or below in the hole.
  • holes are provided only on one side of each of the fins for heat transfer arranged in plural in parallel constituting the heat exchanger so as to delay the time required for clogging between the fins due to a frost layer and further to shorten the time required for defrosting.
  • actions such that a frost formation range is narrowed, a frost formation amount is reduced, and frost formation is delayed, are generated, and performance can be maintained even if the frost is formed, and energy saving can be promoted.
  • FIG. 1 shows a refrigerant circuit of a refrigerating device.
  • This refrigerating device is a device used for refrigerating indoors by carrying out a vapor compression type refrigerating cycle operation.
  • reference numeral 11 denotes an outdoor unit and reference numeral 12 denotes an indoor unit.
  • the outdoor unit 11 is provided with a compressor 21, a condenser 22, and a fan 23 for the condenser for feeding air into the condenser 22, and the indoor unit 12 is provided with expanding means 24, an evaporator 25, and a fan 26 for the evaporator for feeding air into the evaporator 25.
  • the compressor 21, the condenser 22, the expanding means 24, and the evaporator 25 constitute a refrigerating cycle circuit, and a refrigerant for circulation is filled therein.
  • This device is of a form mainly found in low-temperature equipment such as a unit cooler and a showcase.
  • the refrigerant inside the refrigerating device is compressed by the compressor 21 to become of a high temperature and high pressure and flows into the condenser 22. Then, the refrigerant radiates heat in the condenser 22 to become a liquid refrigerant and then, it is expanded by the expanding means 24 to become a gas / liquid two-phase refrigerant.
  • the refrigerant absorbs heat from ambient air in the evaporator 25, becomes a gas and returns to the compressor 21. Therefore, the refrigerating cycle device carries out a cooling operation for cooling an inside air.
  • Fig. 2 shows details of the evaporator 25 shown in Fig. 1 .
  • the evaporator 25 shown in Fig. 2 is a fin-tubular heat exchanger widely used for refrigerating devices and air conditioners.
  • the condenser 25 is mainly constituted by a plurality of fins (heat transfer fins) 31 and a plurality of heat transfer pipes 32.
  • the plurality of fins 31 are stacked with a predetermined interval therebetween, and the heat transfer pipes 32 are provided so as to penetrate through holes provided in each fin 31.
  • the condenser 25 absorbs heat by evaporation of the liquid refrigerant flowing in through the heat transfer pipes 32 and carries out heat exchange with the outside air through the fins 31.
  • Aluminum plate and the like which is easy to be processed and has good thermal conductivity is suitable for the fins 31.
  • air is fed into the evaporator 25 toward the fins 31 in parallel from an evaporator fan 26.
  • an ambient temperature is 0°C and an evaporation temperature of the refrigerant is approximately -10°C
  • the ambient temperature is -20°C and the evaporation temperature is approximately -30°C.
  • the surfaces of the fins 31 are 0°C or below for both cases, and frost is formed on the fins 31. If frost is formed, an air volume flowing through the evaporator 25 is reduced, a heat exchange amount with the air is lowered, and the cooling performance of the evaporator is deteriorated.
  • frost is formed by sublimation, but it has also been reported that over-cooled liquid water exists up to -40°C. However, essentially, the frost formation process is not different from that of 0°C or above.
  • the condensed water droplets or ice droplets formed on the cooled surface amalgamate together, the needle-like frost is generated from the ice droplets, and the frost layer is formed as a whole.
  • the above growth process from water vapor to frost is generated by two phase changes.
  • One is a phase change from water vapor to the condensed water droplets, while the other is the phase change from the condensed water droplets to ice droplets.
  • nuclei are generated in a stable environment phase, and growth of the nuclei leads to formation of a different phase.
  • v denotes the volume of one molecule
  • d ⁇ denotes a change amount of chemical potential per molecule
  • ⁇ denotes the surface energy density.
  • This r is referred to as a critical radius r*, and r* can be acquired by differentiating the formula (1) by r and is given by the following formula (2).
  • r * 2 ⁇ ⁇ v / d ⁇
  • k denotes the Boltsmann constant
  • T denotes a temperature of the fin surface (or a temperature of condensed water droplets)
  • p denotes water vapor pressure
  • pe denotes an equilibrium vapor pressure of the condensed water droplets.
  • Fig. 5 is a diagram illustrating p/pe as a function of r* when the condensed water droplets are assumed to be 0°C.
  • the difference in the frost growing process is shown using Fig. 6 between a fin surface 51 ( Fig. 6B ) in which holes 52 are provided on the surface and a surface 50 ( Fig. 6A ) without holes.
  • a fin surface 51 Fig. 6B
  • a surface 50 Fig. 6A
  • a reference value of the diameter of the hole 52 is changed in accordance with a state in which the device is to be used.
  • the hole radius is too small, the above effect cannot be expected unless countless number of holes are provided on the fin surface. If a hole with a radius of approximately 0.5 nm or more is opened, it can be used for current air conditioners and refrigerators.
  • the diameter of the hole provided on the fin is of nanosize and since it is sufficiently smaller than the diameter of dirt, dust and the like usually presumed to be present indoors and outdoors, the hole does not become clogged and the performance is maintained over a long time.
  • Methods of opening a hole of nanoorder in the fin include an anodization method.
  • a metal is treated as an anode, an insoluble electrode is made to be a cathode and a direct-current electrolysis operation is conducted in an electrolytic solution.
  • a surface of the anode metal is oxidized, and a part of the metal is ionized to be dissolved into the electrolytic solution.
  • aluminum, niobium, tantalum and the like are given an oxidized film by the anodization method.
  • the oxidized film Since the oxidized film has poor electric conductivity, as the anodization processing progresses, a metal oxide is formed on a base metal, and a thin hole structure grown regularly is formed. A depth of the thin hole is determined by the time during which a voltage is applied, but it is preferable the depth be such that the hole does not penetrate the fin as mentioned above. Also, since the oxidized film also has a poor heat conductivity, which deteriorates heat exchange between the surface and the air, it is not necessarily favorable to open a deep hole. However, the above effect is not essentially changed for a penetrated hole. For a heat exchanger having an extremely thin fin, a penetrated hole may be opened
  • the condensed water droplets can be generated only in a region other than the holes on the fin surface, the frost formation amount on the fin can be reduced, and the frost height can be lowered.
  • the air passes on the upwind side, the water vapor is not condensed but flows to a downwind side.
  • clogging of the fin can be delayed, and performance deterioration caused by the frost formation can be delayed.
  • an interval between the fins can be further narrowed so that a small-sized heat exchanger with good performance can be obtained.
  • the fin interval is made narrower than that of the general heat exchanger.
  • an amount of frost 64 formed on the upwind side is larger, and the height of the frost 64 is higher on the upwind side and becomes lower toward the downwind side. That is because since most of the water vapor in the air becomes condensed water droplets in the upwind side, the water vapor amount contained in the air decreases toward the downwind side.
  • a heat exchanger by decreasing the frost formation amount on the upwind side, the height of the frost formed on the upwind side can be lowered, and by having the frost formed uniformly on the entire fin, the time to an air path clogging can be delayed. Therefore, as shown in Fig. 7B , by providing a hole 63 of not more than the above-mentioned critical radius r* on the upwind side of the fin 61, the frost amount formed on the upwind side can be decreased, and the height of the frost formed on the upwind side can be lowered.
  • Reference numeral 62 in Fig. 7 denotes a heat transfer pipe.
  • Fig. 8 shows a fin 71 and a heat transfer pipe 72 constituting the evaporator (heat exchanger) 25.
  • the condenser (heat exchanger) 25 conducts heat absorption by evaporating a liquid refrigerant flowing in through the heat transfer pipe 72 to heat exchange with the outside air through the fin 71.
  • the refrigerating conditions are the ambient air temperature of -20°C, the evaporation temperature of about -30°C, and the fin 71 surface becomes 0°C or below to cause frost formation. Also, as shown in Fig.
  • the periphery of the heat transfer pipe 72 can be considered to particularly have a low temperature on the fin 71 surface.
  • the embodiment 2 by providing holes 73 offered for dropping the freezing point of the condensed water droplets by the Gibbs-Thomson effect in the following formulas (5), (6) on the entire fin 71 or around the heat transfer pipe 72, time to the frost formation is delayed, and performance deterioration of the device is suppressed.
  • L denotes a latent heat of melting
  • Tm a freezing temperature
  • the left-hand side of the formula (6) represents a temperature difference between the freezing temperature and the liquid phase.
  • Fig. 9 is a diagram illustrating the r* dependency of Tm - T of water.
  • r* when r* is sufficiently large, Tm - T is asymptotic to 0, and the liquid phase temperature corresponds to Tm. This is a state of freezing found in a bulk system.
  • Tm - T increases. That is, the smaller r* is, Tm does not become a freezing point and freezing point depression occurs. This effect is called the Gibbs-Thomson effect.
  • Fig. 10 For example, consider a case in which a large number of holes 83, each having the radius of 10 nm, are opened on a surface 81. If the hole 83 is filled with a condensed water droplet 84, the radius of the condensed water droplet 84 can be considered to be 10 nm. Then, the freezing temperature of the condensed water droplet 84 in the hole 83 is known from Fig. 9 to be close to -15°C. Then, even if the surface 81 is cooled to -10°C, the condensed water droplet 84 in the hole 83 is not frozen but become the ice droplet 85 only in a region other than the hole 83.
  • the frost formation amount is reduced. That is, in the hole with the radius of r* in the formula (6), the freezing point of the condensed water droplet in the hole becomes 0°C or below.
  • the holes 83 having the Gibbs-Thomson effect on the entire fin the clogging time caused by frost formation is delayed. Also, by providing a large number of such holes 83 around the heat transfer pipe of the evaporator (heat exchanger), condensed water droplets to become ice droplets around the heat transfer pipe are decreased. When the device is operated at a low temperature at 0°C or below, the frost formation amount around the heat transfer pipe can be reduced.
  • An interval between the holes 83 is preferably an interval of approximately in the order of several nm, which is equal to the hole diameter, and at least 200 holes 83 are needed on a plane of 200 nm ⁇ 200 nm, so that an optimal effect cannot be expected with the number of holes of approximately 50.
  • the diameter of the hole 83 provided on the fin is of nanosize, and since it is sufficiently smaller than the diameter of dirt, dust and the like usually presumed to be present indoors and outdoors, the holes are not clogged, and the performance is maintained over a long time.
  • FIG. 11 shows an example of a well-known configuration of an evaporator (heat exchanger).
  • a heat exchanger heat exchanger
  • a plurality of the fins 31 are arranged in parallel with a predetermined interval, and the heat transfer pipes 32 penetrate them.
  • the frost grows from both faces of the opposing fins 31.
  • the gap between the fins 31 becomes clogged by the frost, the fins 31 are buried, and the performance of the evaporator is deteriorated.
  • a general defrosting method is to switch a four-way valve so as to reverse the direction of a refrigerant flow and to switch an evaporator heat exchanger and a condenser heat exchanger for defrosting.
  • the holes 52, 63, 73, 83 described in the embodiment 1 or the embodiment 2 are provided on the entire surface of only on one face of the opposing fins 31.
  • the frost grows on one face of the fin 31 through the above-mentioned process, but on the face with the holes 52, 63, 73, 83, the condensed water droplets are hard to be generated on the entire fin 31, the freezing point is further lowered, and the growth of the frost is delayed more than on the untreated face. As a result, the time to the air path clogging can be prolonged.
  • the diameter of the hole provided on the fin is of nanosize, and since it is sufficiently smaller than the diameter of dirt, dust and the like usually presumed to be present indoors and outdoors, the hole is not clogged and the performances are maintained over a long time.
  • Fig. 12 shows the heat transfer fin 31 of the condenser (heat exchanger) shown in the embodiment 1.
  • the fins 31 are arranged in plural in parallel with a predetermined interval, and when the fins 31 are cooled to 0°C or below, the frost formation begins. Then, the gap between the fins 31 becomes clogged by the frost, the fins 31 are buried, and the performance of the device is deteriorated.
  • the holes 52, 63, 73, 83 described in the embodiment 1 or the embodiment 2 are provided in plural rows arranged in parallel with a wind direction in the fin 31. With this arrangement, even if the gap between the fins 31 is clogged, a passage for wind is ensured, and drop in wind velocity can be delayed.
  • the holes to be provided on the fin 31 are preferably arranged close together with a small pitch or located close to each other in plural rows. This applies not only to the embodiment 4 but also to other embodiments.
  • a frost formation delay effect can be obtained. Also, it is effective to provide the above holes in the heat exchanger having a slit in the fin so that the heat exchange with air can be performed efficiently.
  • a slit fin has a slit 92 on a fin 91 in order to positively perform heat exchange with the air.
  • a generation amount of condensed water droplets in the slit 92 portion is large and the frost formation amount also becomes large. When the amount of frost is increased, the effect of the slit 92 is lost.
  • Types of the heat exchanger to which the present invention can be applied are not limited to those described above, but also to a heat exchanger having a corrugated fin used in an automobile, for example.
  • condensed water droplets of water vapor in the air generated on the fin surface can be generated only in a specific area, and the frost formation amount generated on the fin surface can be decreased.
  • the frost layer on the fin surface has an almost constant height with respect to an travelling direction of the wind. As a result, air path resistance is reduced, performance at the frost formation is improved, and energy saving can be promoted.
  • thermal resistance can be reduced, and performance deterioration can be delayed when the heat exchanger is operated at a low temperature of 0°C or below.
  • the frost growth can be limited only to one face of the fin, the time required for a gap between the fins to become clogged can be delayed, and moreover, when defrosting, the frost can be easily peeled off the fin, and time required for defrosting is shortened.
  • the diameter of the holes provided on the fin is of nanosize, and since it is sufficiently smaller than the diameter of dirt, dust and the like usually presumed to be present indoors and outdoors, no hole is clogged and the performances are maintained over a long time.
  • the problem of frost formation can be solved on the surface of the heat exchanger for heat exchange with air at 0°C or below.
  • the air-path clogging is caused by frost formation in the heat exchanger, which results in performance deterioration such as thermal resistance and defrosting.
  • the time to the air path clogging can be prolonged, performance deterioration of the heat exchanger can be delayed, and energy can be also saved.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Geometry (AREA)
  • Other Air-Conditioning Systems (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Cold Air Circulating Systems And Constructional Details In Refrigerators (AREA)

Claims (2)

  1. Procédé de fabrication d'un échangeur de chaleur (25) doté d'une canalisation de transfert de la chaleur (32) à travers laquelle passe un fluide, et d'une ailette de transfert de la chaleur (31) dans laquelle pénètre ladite canalisation de transfert de la chaleur, et qui exécute un échange de chaleur avec l'air ;
    en prévoyant une pluralité de trous (52) sur une surface de ladite ailette de transfert de la chaleur, caractérisé en ce que le procédé comprend en outre lesdits trous, chacun d'eux présentant un rayon inférieur au rayon critique r* d'une gouttelette d'eau condensée, ledit rayon critique r* étant déterminé par la température de l'air et par l'humidité de l'air autour de ladite ailette de transfert de la chaleur, et par la température de surface de ladite ailette de transfert de la chaleur, ledit rayon critique r* satisfaisant à la relation : p / pe = exp 2 □ v / kTr * ;
    Figure imgb0007
    dans laquelle p représente la pression de vapeur d'eau, pe représente la pression de vapeur d'équilibre de ladite gouttelette d'eau condensée, □ représente la densité d'énergie de surface, v représente le volume d'une seule molécule, k représente la constante de Boltzmann, et T représente la température de surface de ladite ailette de transfert de la chaleur.
  2. Procédé de fabrication d'un échangeur de chaleur (25) doté d'une canalisation de transfert de la chaleur (32) à travers laquelle passe un fluide, et d'une ailette de transfert de la chaleur (31) dans laquelle pénètre ladite canalisation de transfert de la chaleur pénètre, et qui exécute un échange de chaleur avec l'air ;
    en prévoyant une pluralité de trous sur une surface de ladite ailette de transfert de la chaleur, caractérisé en ce que le procédé comprend en outre lesdits trous, chacun d'eux présentant un rayon inférieur à une valeur r* qui satisfait à la relation : Tm - T = (2 □ v Tm / L) (1 / r*), avec une valeur au moins égale à 200 sur un plan de 200 nm × 200 nm, dans laquelle □ représente la densité d'énergie de surface, v représente le volume d'une seule molécule, Tm représente la température de congélation, L représente la chaleur latente, et T représente la température de surface de ladite ailette de transfert de la chaleur.
EP20090726196 2008-03-24 2009-03-23 Échangeur de chaleur et dispositif à cycle de réfrigération le comportant Active EP2256452B1 (fr)

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JP2002001106A (ja) * 2000-06-20 2002-01-08 Ebara Corp 除湿又は熱交換用機能素子とその製造方法
JP2002090084A (ja) 2000-09-14 2002-03-27 Daikin Ind Ltd フィンとその製造方法及び該フィンを備えた熱交換器
CN2613741Y (zh) * 2003-04-02 2004-04-28 双鸿科技股份有限公司 具有微小凸粒的散热器
US20070031639A1 (en) * 2005-08-03 2007-02-08 General Electric Company Articles having low wettability and methods for making
EP1750018A3 (fr) * 2005-08-03 2011-12-14 General Electric Company Surfaces et articles resistants à l'impacte de liquides

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EP2256452A4 (fr) 2013-07-31
CN101960247B (zh) 2012-07-18
WO2009119474A1 (fr) 2009-10-01
CN101960247A (zh) 2011-01-26
JP5132762B2 (ja) 2013-01-30
EP2256452A1 (fr) 2010-12-01
JPWO2009119474A1 (ja) 2011-07-21
MY160844A (en) 2017-03-31

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