EP2252564A1 - Metallisierte spulenkörper (induktoren) mit hohem q-wert - Google Patents
Metallisierte spulenkörper (induktoren) mit hohem q-wertInfo
- Publication number
- EP2252564A1 EP2252564A1 EP09716284A EP09716284A EP2252564A1 EP 2252564 A1 EP2252564 A1 EP 2252564A1 EP 09716284 A EP09716284 A EP 09716284A EP 09716284 A EP09716284 A EP 09716284A EP 2252564 A1 EP2252564 A1 EP 2252564A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- body according
- coating
- layer
- glass
- electrically conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000011248 coating agent Substances 0.000 claims abstract description 22
- 238000000576 coating method Methods 0.000 claims abstract description 22
- 238000001465 metallisation Methods 0.000 claims abstract description 22
- 239000011521 glass Substances 0.000 claims abstract description 21
- 239000002346 layers by function Substances 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims abstract description 12
- 239000002184 metal Substances 0.000 claims abstract description 12
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052721 tungsten Inorganic materials 0.000 claims abstract description 8
- 239000010937 tungsten Substances 0.000 claims abstract description 8
- 239000004020 conductor Substances 0.000 claims abstract description 6
- 229910010293 ceramic material Inorganic materials 0.000 claims abstract description 5
- 238000005260 corrosion Methods 0.000 claims abstract description 4
- 230000007797 corrosion Effects 0.000 claims abstract description 4
- 239000000853 adhesive Substances 0.000 claims abstract description 3
- 230000001070 adhesive effect Effects 0.000 claims abstract description 3
- 150000002739 metals Chemical class 0.000 claims abstract description 3
- 239000000470 constituent Substances 0.000 claims abstract 2
- 239000010410 layer Substances 0.000 claims description 46
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 34
- 229910052759 nickel Inorganic materials 0.000 claims description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 229910052802 copper Inorganic materials 0.000 claims description 9
- 239000010949 copper Substances 0.000 claims description 9
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 8
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 239000010931 gold Substances 0.000 claims description 8
- 229910052750 molybdenum Inorganic materials 0.000 claims description 8
- 239000011733 molybdenum Substances 0.000 claims description 8
- 150000001875 compounds Chemical class 0.000 claims description 7
- 239000003870 refractory metal Substances 0.000 claims description 5
- 150000002751 molybdenum Chemical class 0.000 abstract 1
- 230000005292 diamagnetic effect Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000004804 winding Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- 230000001419 dependent effect Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910052593 corundum Inorganic materials 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- 239000010955 niobium Substances 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- 229910001845 yogo sapphire Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/52—Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/85—Coating or impregnation with inorganic materials
- C04B41/88—Metals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
- H01F27/36—Electric or magnetic shields or screens
- H01F27/363—Electric or magnetic shields or screens made of electrically conductive material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F5/00—Coils
- H01F5/02—Coils wound on non-magnetic supports, e.g. formers
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
- C04B2111/00844—Uses not provided for elsewhere in C04B2111/00 for electronic applications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/34—Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
- H01F27/36—Electric or magnetic shields or screens
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Definitions
- the invention relates to a body made of ceramic materials with a
- Base metallization of at least one electrically conductive material such as tungsten-glass or molybdenum-glass compounds and an adhesive, electrically conductive and corrosion-resistant coating.
- Such bodies often consist of diamagnetic, oxidic materials and are generally metallized or metallized with a 3-15 ⁇ m thick layer of tungsten glass or molybdenum glass compounds and this layer is then combined with a solderable layer of nickel or nickel-gold about 1 - 5 microns coated.
- Q 1 / R * Vl_ / C
- Q Q, also commonly referred to as Q-value or Q-factor
- the invention has for its object to improve a body according to the preamble of claim 1 with respect to energy losses, ie to increase the Q-factor and to provide a method for producing such a body.
- the coating at least one functional layer of a metal and / or more metals with a lower electrical conductivity to the electrically conductive material and the other components of the coating specific
- Resistance contains / carries, the total electrical resistance of the metallization decreases, the Q-value of the body.
- the coating consists of at least two layers. This depends on the requirements that are placed on the body.
- the base metallization preferably contains at least one refractory metal, for example tungsten and molybdenum.
- Refractory metals are refractory, base metals, the 4th subgroup
- Refractory metals are relatively corrosion resistant at room temperature due to passivation. Not only the high melting point of the refractory metals is advantageous, but also the low thermal expansion coefficient and the high conductivity for heat and electric current compared to steel.
- the coating preferably consists of a nickel and / or a gold layer.
- At least one functional layer is arranged between the layers of the coating.
- the function of the functional layer can be divided into different layers; only the interaction of all functional layers is important.
- the nickel layer contained in the coating preferably has a thickness of 0.5-2 ⁇ m.
- the nickel layer contained in the coating preferably has a specific resistance of 4 to 10 * 10 -8 ohm * m, preferably 7 * 10 -8 ohm * m.
- a preferred embodiment is characterized in that the functional layer made of a metal having a low electrical resistivity is a copper layer.
- the copper layer has a thickness of 1 - 10 microns.
- the copper layer has a resistivity of 1, 0 to 2.6 * 10-8 Ohm * m, preferably 1, 8 * 10-8 Ohm * m.
- the ceramic material is preferably alumina, preferably 96% alumina.
- the base metallization is eliminated and the LJ coating fulfills its function.
- the body is a bobbin of diamagnetic oxide materials with a base metallization of tungsten glass or molybdenum glass compounds and a coating of a nickel layer and a gold layer.
- the nickel layer and the gold layer at least one further layer, i. Functional layer of a metal with low specific electrical resistance applied.
- the nickel layer has a thickness of 0.5-2 ⁇ m and / or a specific one
- the further layer is a copper layer with a layer thickness of 1-10 ⁇ m and / or a resistivity of 1.0-0.6 * 10 -8 ohm * m, preferably 1.8 * 10 ⁇ 8 ohms * m.
- the diamagnetic oxide material is alumina, preferably 96% alumina.
- a method for producing such a bobbin from diamagnetic, oxidic materials, wherein the bobbin coated with a tungsten-glass metallization and this metallization is baked, coated with a nickel layer and deposited thereon a gold layer is characterized in that the nickel layer is first applied at least one further layer of a metal with low electrical resistivity and then the gold layer is deposited first.
- the nickel layer is copper-plated cathodically.
- the nickel layer is copper-plated to a thickness of 1 to 10 microns.
- the diamagnetic, oxidic material used is preferably alumina, particularly preferably 96% of aluminum oxide.
- a thin nickel layer (preferably with a specific resistance of 7 * 10 -8 ohm * m) of 0.5-2 ⁇ m is applied.
- At least one layer (functional layer) of a metal with a low electrical resistivity is applied.
- This layer consists in an inventive embodiment of a copper layer (preferably with 1, 8 * 10 "8)
- Ohm * m with a thickness or thickness of 1 - 10 microns.
- the Q value is increased.
- the Q value was increased from 62-75 (comparative example) to 80-90 (example according to the invention).
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Power Engineering (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Coils Or Transformers For Communication (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Non-Insulated Conductors (AREA)
Abstract
Description
Claims
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102008000542 | 2008-03-06 | ||
| DE102008000557 | 2008-03-07 | ||
| PCT/EP2009/052655 WO2009109652A1 (de) | 2008-03-06 | 2009-03-06 | Metallisierte spulenkörper (induktoren) mit hohem q-wert |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP2252564A1 true EP2252564A1 (de) | 2010-11-24 |
Family
ID=40602511
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP09716284A Withdrawn EP2252564A1 (de) | 2008-03-06 | 2009-03-06 | Metallisierte spulenkörper (induktoren) mit hohem q-wert |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US20110003145A1 (de) |
| EP (1) | EP2252564A1 (de) |
| JP (1) | JP5599323B2 (de) |
| KR (1) | KR20100136487A (de) |
| CN (1) | CN101970380A (de) |
| DE (1) | DE102009001367A1 (de) |
| IL (1) | IL207940A0 (de) |
| MX (1) | MX2010009665A (de) |
| TW (1) | TW200943330A (de) |
| WO (1) | WO2009109652A1 (de) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105246861A (zh) | 2013-06-05 | 2016-01-13 | 陶瓷技术有限责任公司 | 在陶瓷基材上的金属层 |
| BR112019025761B1 (pt) * | 2017-07-17 | 2023-12-26 | Tetra Laval Holdings & Finance S.A. | Bobina indutora para soldagem, dispositivo e máquina de vedação, e, método para fabricação de bobina indutora |
| CN110033931B (zh) * | 2018-01-12 | 2021-10-29 | 乾坤科技股份有限公司 | 电子装置及其制作方法 |
| CN112441822B (zh) * | 2020-11-27 | 2022-11-22 | 娄底市安地亚斯电子陶瓷有限公司 | 一种5g用陶瓷电感及其制备工艺 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2325774A1 (de) * | 1973-05-21 | 1974-12-19 | Siemens Ag | Mit einer oberflaechenglatten schicht bedeckter oberflaechenrauher koerper sowie verfahren zu seiner herstellung |
| JPS5830194A (ja) * | 1981-08-14 | 1983-02-22 | 日本碍子株式会社 | セラミック多層配線基板の製造法 |
| JPS6077490A (ja) * | 1983-10-04 | 1985-05-02 | 日本碍子株式会社 | セラミツク多層配線基板及びその製造法 |
| US4632846A (en) * | 1984-09-17 | 1986-12-30 | Kyocera Corporation | Process for preparation of glazed ceramic substrate and glazing composition used therefor |
| JPS61222143A (ja) * | 1986-01-25 | 1986-10-02 | Ngk Spark Plug Co Ltd | 金メツキされた電子部品とその製法 |
| JPS62250179A (ja) * | 1986-04-23 | 1987-10-31 | Mitsubishi Electric Corp | セラミツクス上への表面処理方法 |
| DE3638286A1 (de) * | 1986-11-10 | 1988-05-11 | Siemens Ag | Elektrisches bauelement aus keramik mit mehrlagenmetallisierung und verfahren zu seiner herstellung |
| US5508228A (en) * | 1994-02-14 | 1996-04-16 | Microelectronics And Computer Technology Corporation | Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same |
| JP3575068B2 (ja) * | 1994-08-02 | 2004-10-06 | 住友電気工業株式会社 | 平滑なめっき層を有するセラミックスメタライズ基板およびその製造方法 |
| DE19514018C1 (de) * | 1995-04-13 | 1996-11-28 | Hoechst Ceram Tec Ag | Verfahren zur Herstellung eines metallbeschichteten, metallisierten Substrats aus Aluminiumnitridkeramik und damit erhaltenes metallbeschichtetes Substrat |
| US6582887B2 (en) * | 2001-03-26 | 2003-06-24 | Daniel Luch | Electrically conductive patterns, antennas and methods of manufacture |
| CN100405543C (zh) * | 2006-07-21 | 2008-07-23 | 中国科学院上海微系统与信息技术研究所 | 一种cmos工艺兼容的嵌入悬浮螺管结构电感或互感的制作方法 |
-
2009
- 2009-03-06 TW TW98107296A patent/TW200943330A/zh unknown
- 2009-03-06 MX MX2010009665A patent/MX2010009665A/es not_active Application Discontinuation
- 2009-03-06 DE DE102009001367A patent/DE102009001367A1/de not_active Withdrawn
- 2009-03-06 US US12/920,123 patent/US20110003145A1/en not_active Abandoned
- 2009-03-06 KR KR1020107022318A patent/KR20100136487A/ko not_active Ceased
- 2009-03-06 JP JP2010549157A patent/JP5599323B2/ja not_active Expired - Fee Related
- 2009-03-06 WO PCT/EP2009/052655 patent/WO2009109652A1/de not_active Ceased
- 2009-03-06 CN CN2009801077385A patent/CN101970380A/zh active Pending
- 2009-03-06 EP EP09716284A patent/EP2252564A1/de not_active Withdrawn
-
2010
- 2010-09-02 IL IL207940A patent/IL207940A0/en unknown
Non-Patent Citations (1)
| Title |
|---|
| See references of WO2009109652A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| MX2010009665A (es) | 2010-11-30 |
| JP5599323B2 (ja) | 2014-10-01 |
| IL207940A0 (en) | 2010-12-30 |
| CN101970380A (zh) | 2011-02-09 |
| US20110003145A1 (en) | 2011-01-06 |
| JP2011517307A (ja) | 2011-06-02 |
| TW200943330A (en) | 2009-10-16 |
| KR20100136487A (ko) | 2010-12-28 |
| WO2009109652A1 (de) | 2009-09-11 |
| DE102009001367A1 (de) | 2009-09-10 |
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