Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
  • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
  • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
  • H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
  • B32B2309/60—In a particular environment
  • B32B2309/68—Vacuum
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2457/00—Electrical equipment
  • B32B2457/08—PCBs, i.e. printed circuit boards
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate
  • H05K1/0393—Flexible materials
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/06—Lamination
  • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/08—Treatments involving gases
  • H05K2203/085—Using vacuum or low pressure
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
  • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Definitions

• the invention relates to a method for bonding flexible printed circuit boards with polymer materials for partial or complete stiffening.
• heat-activatable films are used for bonding.
• Pressure-sensitive adhesive tapes and heat-activated adhesive tapes are widely used processing aids in the age of industrialization. Especially for use in the electronic industry very high demands are placed on such tapes.
• Flexible circuit boards are therefore represented in a variety of electronic devices, such as cell phones, car radios, computers, etc. Usually they consist of layers of copper (electrical conductor) and polyimide (electrical insulator). Due to the requirements of the field of application, flexible printed circuit boards must also be partially or completely reinforced. This can be done, for example, at locations where the flexible circuit board is equipped with processors. Here one would like to achieve by a stiffening on the back, that the processors do not detach themselves from the very flexible circuit board or tear out. Furthermore, stiffeners are also preferred Plug connections made. Again, stiffened on the back to facilitate handling, or if the circuit board is provided with a plug-receiving element, to protect them from the replacement.
• heat-activated adhesive tapes are used, which release no volatile components and can also be used in high temperature ranges. This requirement is due to subsequent so-called reflow oven processes (reflow soldering processes, reflow soldering processes), which are used, for example, to fix the processors on the flexible printed circuit board with solder.
• heat-activatable adhesive tapes are e.g. in US Pat. No. 5,478,885, which are based on epoxidized styrene-butadiene or styrene-isoprene block copolymers.
• Other examples of heat-activatable adhesive films are shown in WO 96/33248.
• the heating press has the advantage that a high pressure and a high temperature are applied simultaneously. Due to the high pressure, a good wetting behavior of the heat-activatable adhesive on the flexible printed circuit board and the stiffening medium is achieved. Further, the outgassing from the circuit board, especially moisture (polyimide has a strong tendency to absorb water), is suppressed by the high pressures.
• this process also has disadvantages. For example, the efficiency of the process is relatively poor, since the process is not carried out continuously and the residence time in the heating press relatively long (usually at least 90 seconds). This results in a limitation, since the process duration is relatively long and thus the number of flexible printed circuit boards per hour is limited. This is in contrast to the increasing demand for electronic components and devices.
• a method for producing printed circuit boards comprising a process for modifying a flexible printed circuit board, in particular for its stabilization, characterized by at least the following process steps: a) providing a sheet ("reinforcing plate") with lower flexibility than that of the flexible printed circuit board, b) hot lamination of a heat-activatable adhesive film on the reinforcing plate, c) placing the laminate of adhesive film and reinforcing plate with the Klebfolienseite on the flexible circuit board, d) introduction of the component from reinforcing plate, adhesive film and flexible circuit board in a vacuum atmosphere, e) hot lamination of the component under application of pressure and heat.
• the hot-laminated component is subsequently subjected to a post-curing in a further method step f), in particular in an oven.
• the heat-activatable adhesive film is preferably provided with a temporary carrier (release paper, release film, release liner or the like) prior to lamination with the reinforcing plate.
• this temporary carrier can subsequently be removed after lamination of the heat-activatable adhesive film to the reinforcing plate in method step b), so that the surface of the heat-activatable adhesive film facing away from the reinforcing plate is uncovered.
• steps c) and d) proceed in a continuous, quasi-continuous or semicontinuous process.
• the sequence of process steps a) to f) of the process according to the invention is carried out in the sequence indicated above; However, it is also possible to advantageously vary the order of the method steps according to the invention.
• a simultaneous implementation of two or more process steps can also be realized advantageously according to the invention, for example process steps d) and e), by creating the underpressure atmosphere only during the performance of the hot lamination (step e).
• the process steps d) and e) are carried out in a continuous process, in particular by carrying out the process step e) of the hot lamination while maintaining the underpressure atmosphere, wherein the realized pressure ratios can be kept constant, but can also be varied.
• Heat-activatable adhesive films are used in the process according to the invention.
• such adhesive films are strapless fabrics of a heat-activable adhesive (other designation also “heat-activable adhesive"), optionally with suitable additives
• the adhesive films used may advantageously be more or less self-tacky (tacky) at room temperature, in a further advantageous embodiment of the invention non-tacky adhesive films are used at room temperature above a (film-specific) activation temperature (or above a corresponding temperature range) have sufficient tack to allow the required, caused by the lamination process bonding process.
• Adhesive films are very advantageous which, after carrying out the process according to the invention, bring about a permanent adhesive bond of the bonded substrates (flexible printed circuit board and reinforcing film).
• the already mentioned post-curing process (depending on the film material and composition) may be advantageous.
• the heat-activatable film is advantageously one based on a mixture of reactive resins which can crosslink at room temperature and form a three-dimensional, high-strength polymer network, and of permanently elastic elastomers comprising a
• composition of the film is limited to the aforementioned
• composition of the adhesive film can be advantageously varied by changing the nature and proportion of raw material in a wide range.
• the elastomer may preferably be selected from the group of polyolefins, polyesters, polyurethanes or polyamides, or may be a modified rubber, e.g. Nitrile rubber.
• thermoplastic polyurethanes are known as reaction products of polyester or polyether polyols and organic diisocyanates such as diphenylmethane diisocyanate. They are composed of predominantly linear molecules. Such products are usually commercially available in the form of elastic granules, for example from Bayer AG under the trade name "Desmocoll”.
• the softening temperature of the adhesive sheet can be sufficiently lowered. Parallel occurs an increase in adhesion.
• Rosin, hydrocarbon and / or coumarone resins, for example, have proved to be advantageously suitable resins according to the invention.
• the amount of resins in the elastomer is to be based on the desired properties of the resulting product, but have been found to be very beneficial especially admixtures of 2 to 75, in particular to 40 wt .-% resin.
• the reduction of the softening temperature of the adhesive film by the combination of TPU with selected epoxy resins, insbeosndere epoxy resins based on bisphenol A and / or bisphenol B, preferably with the addition of a hardener suitable for epoxy systems (for example dicyandiamide or another for epoxides known hardener) can be achieved.
• a hardener suitable for epoxy systems for example dicyandiamide or another for epoxides known hardener
• the chemical crosslinking reaction of the resins achieves high strengths between the adhesive film and the stiffening material.
• a very suitable as adhesive film according to the invention system is also made of TPU and phenolic resins, optionally in the presence of other components or additives.
• the TPU-phenolic resin-based adhesive film is also provided with hardener systems for phenolic resins. All hardeners known to those skilled in the art can be used here, which lead to a reaction with the phenolic resins. For example, all formaldehyde donors, e.g. Hexamethylentretramin.
• the heat-activatable film is based on at least one nitrile rubber.
• Nitrile-butadiene rubbers suitable in accordance with the invention are described, for example, as Europrene TM by Eni Chem, or under Krynac TM and Perbunan TM by Bayer, or under Breon TM and Nipol N TM available from Zeon. Hydrogenated nitrile-butadiene rubbers are available under Therban TM from Bayer and Zetpol TM from Zeon. Nitrile butadiene rubbers are polymerized either hot or cold.
• the nitrile rubbers preferably have an acrylonitrile content of 15 to 45 wt .-% in order to avoid complete phase separation with the reactive resins.
• Another criterion for the nitrile rubber is the Mooney viscosity. Since a high degree of flexibility must be ensured at low temperatures, the Mooney viscosity should be below 100 (Mooney ML 1 + 4 at 100 0 C; DIN 53523 respectively).
• Examples of commercially available examples of such nitrile rubbers which are suitable according to the invention include Nipol TM N917 from Zeon Chemicals.
• Carboxyl-, amine-, epoxy- or methacrylate-terminated nitrile-butadiene rubbers may advantageously be used as additional components to the nitrile rubbers. Particular preference is given to using those elastomers having a molecular weight of M w ⁇ 20,000 g / mol and / or an acrylonitrile fraction of from 5 to 30% by weight. An acrylonitrile content of at least 5% leads to optimum miscibility. Commercial examples of such terminated nitrile rubbers are, for example, Hycar TM from Noveon.
• carboxy-terminated nitrile-butadiene rubbers preference is given to using rubbers having a carboxylic acid number of from 15 to 45, very preferably from 20 to 40.
• the carboxylic acid number is given as the value in milligrams of KOH needed to completely neutralize the carboxylic acid; based on 1 g of rubber.
• amine-terminated nitrile-butadiene rubbers particular preference is given to using rubbers having an amine value of from 25 to 150, more preferably from 30 to 125.
• the amine value refers to the amine equivalents determined by titration against HCl in ethanolic solution. The amine value is based on amine equivalents per gram of rubber.
• the proportion of the reactive resins in the nitrile rubber-based heat-activatable adhesive is preferably between 30 and 75 wt .-%.
• a very preferred group includes epoxy resins.
• the molecular weight M w of the epoxy resins used preferably varies from 100 g / mol up to a maximum of 10,000 g / mol for polymeric epoxy resins.
• the epoxy resins used here include, for example, the reaction product of bisphenol A and epichlorohydrin, the reaction product of epichlorohydrin and glycidyl ester and / or the reaction product of epichlorohydrin and p-amino phenol.
• Preferred commercial examples of epoxy resins particularly suitable according to the invention are e.g.
• Examples of commercial aliphatic epoxy resins which are advantageous according to the invention are e.g. Vinylcyclohexane dioxides such as ERL-4206, ERL-4221, ERL 4201, ERL-4289 or ERL-0400 from Union Carbide Corp.
• Vinylcyclohexane dioxides such as ERL-4206, ERL-4221, ERL 4201, ERL-4289 or ERL-0400 from Union Carbide Corp.
• novolak resins which are also very suitable as resins for nitrile rubbers according to the invention, e.g. Epi-Rez TM 5132 from Celanese, ESCN-001 from Sumitomo Chemical, CY-281 from Ciba Geigy, DEN TM 431, DEN TM 438, Quatrex 5010 from Dow Chemical, RE 305S from Nippon Kayaku, Epiclon TM N673 from DaiNipon Ink Chemistry or Epicote TM 152 from Shell Chemical.
• Epi-Rez TM 5132 from Celanese
• ESCN-001 from Sumitomo Chemical
• DEN TM 431, DEN TM 438 Quatrex 5010 from Dow Chemical
• RE 305S from Nippon Kayaku
• Epiclon TM N673 from DaiNipon Ink Chemistry or Epicote TM 152 from Shell Chemical.
• melamine resins such as e.g. Cymel TM 327 and 323 from Cytec.
• reactive polyisocyanates such as, for example, are also advantageously suitable.
• Coronate TM L from Nippon Polyurethane Ind., Desmodur TM N3300 or Mondur TM 489 from Bayer for the mentioned adhesive systems.
• the reactive resins should preferably be designed so that no volatile components are released during the crosslinking.
• tackifying resins are added; very advantageous to a proportion of up to 30 wt. %, based on the total composition of the heat-activatable adhesive.
• tackifying resins to be added all previously known adhesive resins described in the literature can be used without exception. Mention may be made representative of the pinene, indene and rosin resins, their disproportionated, hydrogenated, polymerized, esterified derivatives and salts, the aliphatic and aromatic hydrocarbon resins, terpene resins and terpene phenolic resins and C5, C9 and other hydrocarbon resins.
• Combinations of these and other resins can also be used to adjust the properties of the resulting adhesive as desired.
• all compatible with the nitrile rubbers (soluble) resins can be used, in particular reference is made to all aliphatic, aromatic, alkylaromatic hydrocarbon resins, hydrocarbon resins based on pure monomers, hydrogenated hydrocarbon resins, functional hydrocarbon resins and natural resins.
• the presentation of the state of knowledge in the "Handbook of Pressure Sensitive Adhesive Technology" by Donatas Satas (van Nostrand, 1989) is expressly pointed out.
• crosslinkers and accelerators can also be optionally added to the mixture, which in turn should advantageously release no volatile constituents in the crosslinking.
• Suitable accelerators according to the invention are e.g. Imidazoles, commercially available as 2M7, 2E4MN, 2PZ-CN, 2PZ-CNS, P0505, L07N from Shikoku Chem. or Curezol 2MZ from Air Products. Also suitable as crosslinkers dicyandiamides.
• amines in particular tertiary amines, for acceleration.
• plasticizers can advantageously also be used according to the invention.
• Plasticizers based on polyglycol ethers, polyethylene oxides, phosphate esters, aliphatic carboxylic acid esters and benzoic acid esters may preferably be used here.
• aromatic carboxylic esters relatively high molecular weight diols, sulfonamides and adipic esters.
• thermopiates or thermosets can be additized as stiffening elements to the elastomer.
• suitable formulations are, for example, polyvinyl formal or polyvinyl butyral or polyvinyl acetate.
• the heat-activatable adhesive film preferably has a thickness of 5-100 ⁇ m, preferably between 10 and 50 ⁇ m.
• the mass forming the film is coated as a solution or from the melt onto a flexible substrate ("temporary carrier” or "release liner", for example release film, release paper) and optionally dried so that the mass of the substrate is light can be removed again.
• a flexible substrate temporary carrier or "release liner", for example release film, release paper
• the heat-activatable adhesive film is also covered from above with a release liner (for example, also release film or release paper). As a result, subsequent punching process are facilitated or protected the heat-activated film from contamination.
• stiffening a variety of materials can be used. To exert a stiffening effect on the flexible circuit board, it is necessary that the stiffening material has a higher rigidity than the non-stiffened, flexible circuit board.
• the term "reinforcing plate" is in this respect no further limitation of the rigidity connected.
• stiffness the stiffness of the reinforcing plate makes it possible to produce well-defined products, ie stiffened printed circuit boards with well-defined stiffness values.
• the rigidity values of the stiffening material are not subject to any further restrictions, so - depending on the desired result - stiffening materials with low stiffnesses can be used to protect the printed circuit board only slightly reinforce and so to achieve about roll-up products, as well as very rigid materials as a reinforcing material to obtain very stable end products, such as plug-in printed circuit boards in plug sockets (plug contacts) of other components. Also in between each stiffness value of the reinforcing plate for realizing a defined rigidity of the product is selectable.
• stiffening materials are polymer films.
• polyester and / or copolyester are preferably used.
• Represented very often and very suitable according to the invention are, for example, PET films (polyethylene terephthalate films).
• PET films polyethylene terephthalate films
• the degree of stiffening is determined in particular by the thickness of the polyester film. As the thickness increases, the stiffening tendency increases.
• polyimides or polyethylene napthalates (PENs) are also very often used for stiffening. These materials have a higher temperature resistance to PET for subsequent processes and therefore also have a very high suitability for the inventive method.
• Further inventively suitable polymer materials are, for.
• LCP's Liquid Crystal Polymers, liquid crystal polymers
• the polymer materials can also be present in an advantageous variant of the process according to the invention as laminates of identical or different polymer films, in particular the aforementioned films, and / or have functional layers.
• the laminates are mostly built with adhesives to minimize manufacturing costs, but the composite may also be made by other methods known in the art.
• the stiffening polymer films are pretreated, such as e.g. by heat pretreatment and / or coronization and / or plasma pretreatment.
• Preheat treatment anticipates possible outgassing in the subsequent inventive process.
• the anchoring of the heat-activatable adhesive film on the stiffening material can be improved by a coronation or plasma pretreatment.
• Glass fiber / epoxy materials are particularly preferred here (glass fiber fabric bonded with epoxy resin, so-called FR-4 materials). These exhibit in the hardened Condition a high temperature resistance and have very good stiffening properties. These can also - as already described above - be pretreated.
• the flexible printed circuit boards can also be stiffened with metal foils or metal plates.
• the metal foil or metal plate in addition to the stiffening also perform other functions, such. thermal conductivity and electrical conductivity. This may be necessary, for example, for EMI shielding (electromagnetic interference shielding) measures.
• EMI shielding electromagnetic interference shielding
• metals are - without wishing to be limited by this specification - stainless steel, steel, aluminum, brass, bronze, nickel and / or copper.
• the metals may also be provided with a second layer, e.g. the passivation is used. For this purpose, e.g. Gold and / or silver coatings
• the stiffening material has, in a preferred form, a roughness (arithmetic mean roughness R a according to DIN EN ISO 4287: 1998-10) of R a ⁇ 1 ⁇ m and / or a layer thickness of 10 ⁇ m to 2 mm, preferably from 50 ⁇ m to 800 ⁇ m, very preferably from 75 ⁇ m to 500 ⁇ m.
• a roll laminator is preferably used for the lamination in process step b.
• this process step is preferably carried out in a heating roller laminator, ie such a laminator, in which the rollers - or at least some of the rollers of the laminator - can be heated.
• the highest process efficiency can be achieved.
• this step can also be carried out in a hot press.
• the heat-activatable film should be provided with two release liners, the protective release liner is removed (ie removal of the release liner layer on one of the two sides of the adhesive film). Then they become web-shaped the stiffening material (the reinforcing plate) and the heat-activatable film brought together.
• the Schurollenlaminator should be advantageously provided with at least one rubber roller. In a particular process design according to the invention the Schurollenlaminator on two rubber rollers, which apply the pressure and advantageously also the heat for the prelamination (lamination in step b).
• the heat roller laminator has two rollers of the same diameter. The rollers are heated either individually or together from inside or indirectly.
• the heating rollers run planar to one another.
• the sheet-like materials heat-activatable film and stiffening material
• Feedingplatte feeding table, Feeding Shelf. This should be on one level with the pressure point of the two rollers.
• the laminated material should advantageously be carried out again at the same level (same height as the feeding plate).
• the H exertlaminier mixes is preferably carried out in a temperature window of 60 0 C to 180 0 C (roll temperature).
• the choice of temperature depends in particular on the temperature stability of the stiffening material, the thickness of the material and the heat-activatable film.
• the roll temperature should very preferably be above the softening temperature of the heat-activatable film, but furthermore preferably below the crosslinking temperature of the heat-activatable film in order to avoid cross-linking in the prelamination step.
• very a bubble-free lamination should be ensured. For this purpose, it is advantageous to continue to optimize the roll pressure in addition to the temperature.
• the effective pressure (lamination pressure) is preferably adjusted to not higher than 60 bar, more preferably not higher than 50 bar.
• the respective pressure ratios are adapted in particular to the properties of the adhesive film (with high tendency to flow behavior under pressure is rather worked at lower pressures, with low flow tendency of the adhesive film can be selected for lamination a higher pressure).
• the heating roller laminator is operated at a process speed of 0.1 to 10 m / min, in particular in continuous process control.
• FIGURE 1 Such an advantageous process procedure is shown schematically by way of example in FIGURE 1.
• the heat-activatable film 2 provided with a release liner is unwound (release liner not shown separately, located on the surface side of the adhesive film marked "2a").
• An optionally second release liner layer on the other surface side of the adhesive film has either already been removed before winding the film or is removed during the unwinding process (not shown here) 4 (feed table, infeed shelf), the stiffening material 5 (reinforcing plate) is introduced, this can be discontinuous or preferably continuous, then the heat and the pressure are applied by the rollers 3, 6.
• the laminate 7 of heat-activatable foil 2 (with release liner ) and ve stiffening material 5 is carried out via the outfeed table 8 (Outfeed Shelf). At this point, the heat-activatable film is still provided with a release liner and thus protected (not shown (in the drawing, the top surface side of the adhesive film in the laminate).
• the lamination can very preferably be such that an adhesive film is continuously laminated by the "endless winding" onto a sequence of several or many continuous reinforcing plates
• continuous process control is not limited to the exemplified process control of FIG. 1, but can also be carried out in other laminating methods.
• an "endless” adhesive film may also be laminated to an "endless” layer of the reinforcing material, in particular in accordance with the process control and its variants illustrated herein.
• the endless laminate can then be made up before the process steps d) and e), but it can also be used in the steps d) and e) are laminated to an endless version of the flexible printed circuit boards and the packaging takes place hereafter.
• the subsequent process step removes the release liner. This can be done manually in the simplest case. For a continuous process, this step can also be done by a Dekaschierrolle. Furthermore, it may be advantageous to perform one or more stamping steps or cutting steps prior to removal of the release liner in order to change the size dimensions of the stiffening material with the heat-activatable film.
• the laminate of stiffening material and heat-activatable film may be applied to the flexible circuit board.
• the application is made with the side of the heat-activated film on the flexible circuit board.
• the application is done manually or with a robot.
• step c) may be in an advantageous manner to a layering of an endless embodiment of the laminate of heat-activatable film and stiffening material [as a product of endless lamination from step b)] and an endless configuration of the flexible conductor -Materials act, which takes place in particular according to the above comments on method step c).
• the application of vacuum, pressure and heat can be carried out by various processes.
• the application of pressure and heat takes place via a hot roll laminator.
• the structure can be carried out in an advantageous variant of the method, in particular via a tripartite structure.
• FIG. 2 shows, by way of example and schematically, such a three-part heated roll laminator device.
• the flexible printed circuit board with the placed stiffening material is introduced into the filling chamber C1 (process line indicated by the arrow).
• the chamber C1 is closed and drawn by means of a vacuum pump V1 vacuum.
• the pressure in the vacuum (correctly: in the underpressure atmosphere) is preferably ⁇ 50 mbar, very preferably ⁇ 10 mbar, very preferably ⁇ 1 mbar.
• the chamber C2 is preferably operated with ⁇ 50 mbar, very preferably ⁇ 10 mbar, very preferably ⁇ 1 mbar (in particular in accordance with the pressure ratios selected for the chamber C1, vacuum control for example by means of a vacuum pump V2).
• the chamber C2 is equipped with one or more (n) Bankrollenlaminatoren (n ⁇ 1), so that simultaneously or with only a small time shift several components are supplied in parallel to the lamination process. Thus, the process time can be reduced.
• the Schurollenlaminatoren preferably have a structure analogous to the representation in Figure 1 and the corresponding embodiments; wherein a correspondingly different supply of the component to be laminated (lack of unwinding and introduction of the component of reinforcing plate (stiffening material), adhesive film and flexible printed circuit board on the Feedingplatte) is taken into account. For complete wetting, the laminating pressure or the laminating temperature is generally increased.
• the effective pressure (lamination pressure) is preferably not regulated higher than 60 bar, more preferably not higher than 50 bar.
• the respective pressure ratios are adapted in particular to the properties of the adhesive film (with high tendency to flow behavior under pressure is rather worked at lower pressures, with low flow tendency of the adhesive film can be selected for lamination a higher pressure).
• the H redesignlaminier mixes is preferably carried out in a temperature window of 60 0 C to 180 0 C (roll temperature).
• the heated roll laminator is operated continuously at a process speed in the range of 0.1 to 10 m / min.
• the heat roller laminators R n should each be provided with at least one rubber roller;
• each Schurollenlaminator R n has two rollers with the same diameter.
• the rollers are preferably heated either individually or together from inside or indirectly.
• the heating rollers should preferably be planar to each other.
• the stiffened circuit board is transferred through the lock D3 from the chamber C2 into the removal chamber C3, which was previously preferably at ⁇ 50 mbar, very preferably ⁇ 10 mbar, most preferably ⁇ 1 mbar was vacuumed (in particular identical to that in the chamber C2 selected pressure ratio, adjustment of the chamber pressure, for example by a further vacuum pump V3).
• the chamber C3 is then ventilated in the chamber C3 (in particular to atmospheric pressure of 1013 mbar or up to the ambient pressure) and the printed circuit board is then removed after opening the lock D4.
• the system can be operated semi-continuously thanks to the three-part structure.
• the chamber C2 and / or C1 can be filled in parallel.
• the cycle times can be reduce per chamber C1, C2, C3 to a maximum of 15 s, so that a fast and efficient process management is ensured.
• FIG. 3 shows a vacuum heat roller laminator.
• the vacuum-heated roller laminator is first filled via the lock I-D1.
• the material to be laminated 1 1 [layer sequence of flexible printed circuit board, according to the stratification (placement) from step c); in particular present as an endless variant] is introduced into the laminator.
• the introduction is preferably roll-shaped; in particular, when the stiffening material has sufficient flexibility to allow rewinding to the roll 12 (correctly: to the Archimedean spiral).
• the chamber is closed via the lock I-D1 (the removal lock I-D2 is also closed) and evacuated via the vacuum pump 1 -V.
• the heating roller laminator has a laminating pressure of at least 15 bar, more preferably of at least 25 bar, most preferably of at least 30 bar; in particular, the procedure is such that - depending on the adhesive film used - an upper limit of the laminating pressure of 60 bar, preferably 50 bar is not exceeded.
• the Wienrollenlaminator is continuously with a
• the H thoroughlylaminier mixes is preferably in a temperature window of 60 0 C to 180 0 C.
• the laminated material 16 is transferred via the outfeed plate
• Sluice I-D1 can be refilled at the same time for another lamination process.
• the Schurollenlaminator should be advantageously provided with at least one rubber roller.
• the heat roller laminator has two rubber rollers that apply the pressure and heat for lamination.
• the Schurollenlaminator has two rollers with the same diameter. The rollers are heated either individually or together from inside or indirectly. For efficient lamination, the heating rollers should very preferably be planar with respect to one another.
• This variant shown schematically by way of example in FIG. 4 is particularly suitable for the lamination of prefabricated components.
• the flexible printed circuit board is inserted into the board laminator with one or more stiffening materials, each of which is provided with an adhesive film layer (in FIG. 4a, the not yet laminated composite of flexible circuit board and reinforcing material as Item number 21 a shown).
• the plate laminator consists of two metal plates 22 and 23, wherein at least one of the metal plates 22, 23 is heatable, but preferably both metal plates.
• a metal plate 23 is provided with one or more seals 24 so that a vacuum can be generated within the apparatus when the apparatus is closed, and at least one metal plate 23 equipped with at least one opening allowing evacuation (vacuum pump NV) (as opposed to this can also be the metal plate 22 in schematic drawing).
• the flexible circuit board with the stiffening material (composite 21 a) is placed within the evacuatable area formed by the seal (s) 24.
• process step II-b) according to FIG. 4b) the chamber formed by the seal (s) 24 is closed, in particular by the lowering of the metal plate 22.
• the process step II-c) according to FIG. 4c) by evacuation with the vacuum pump NV the metal plates 22, 23 contracted.
• the process is preferably operated with a vacuum (underpressure atmosphere) of ⁇ 50 mbar, very preferably ⁇ 10 mbar, very preferably ⁇ 1 mbar.
• both metal plates (22, 23) are preferably heatable.
• the metal plate temperature is preferably between 60 and 250 ° C., very preferably between 130 and 200 ° C.
• Preference is given to choosing a laminating pressure of at least 15 bar, more preferably of at least 25 bar, most preferably of at least 30 bar; in particular, the procedure is such that - depending on the adhesive film used - an upper limit of the laminating pressure of 60 bar, preferably 50 bar is not exceeded.
• the process times depend on the composition of the heat-activatable film (speed of crosslinking) and the period for evacuation. In a most preferred method, the maximum vacuum is achieved within 45 seconds, more preferably within 30 seconds, and preferably within 15 seconds. At constant vacuum, the pressure through the metal plates (22, 23) can be constant be held until it is ventilated again. After aeration, the laminated circuit boards are removed with the stiffening material (laminated composite 21b).
• the seal (24) can be replaced by a full-surface diaphragm, which on the one hand assumes the sealing function, but also presses the printed circuit board composite to the upper metal plate. Due to the flexible nature, a very uniform pressure is applied to the composite.
• the evacuation is preferably carried out from the upper metal plate (22); In particular, the heating by means of this metal plate (22).
• the lower metal plate (23) is pressed against the closure before the vacuum is pulled and the pressure is applied to the flexible circuit board with the stiffening material (composite 21).
• the curing process can be done in an oven, for example.
• the furnace is operated in a preferred procedure according to the invention with circulating air.
• the temperature is - depending on the curing temperature of the heat-activatable adhesive, after which the process temperature should be selected accordingly - preferably between 100 0 C and 230 0 C.
• the laminate of flexible printed circuit board and stiffening material is not cured at a constant temperature but via a temperature gradient. It is heated, for example, only at 70 0 C, then at 1 10 0 C and then at 150 0 C.
• the flexible printed circuit board materials and the stiffening materials may optionally be gently dried to blistering within the Verklebungshegung (especially within and / or on the laminated-in adhesive film, ie in the "joint" between the flexible printed circuit board and the reinforcing plate), which could be based, for example, on polyimide water vapor ..
• stepwise processes but also continuous temperature gradients are suitable for drying and drying hardening.
• the process time in the oven is preferably between 10 minutes and 12 hours, depending on the chemical composition and curing mechanism of the heat-activatable film.
• the process according to the invention can also be used by multiple process sequences for providing flexible printed circuit boards with a plurality of reinforcing plates and for producing a correspondingly multilayer laminate (two, three or more reinforcing layers).
• the laminators corresponded to the arrangement in Figure 1 in process step a) or the arrangement in Figure 2 with laminators according to Figure 1 in the process steps d) and e) and were 170 0 C, an effective bond pressure of 20 bar and a speed of 1 m / min, operated The vacuum was less than 10 mbar in all cases. It was post cured at 70 0 C for 10 minutes, at 1 10 0 C for 10 minutes and at 150 0 C for 10 minutes in the oven.
• the bonds were bubble-free according to the different inventive process.
• the bubble-free bonding was evaluated with a microscope (10-fold magnification). Even after performing a reflow oven process (simulation test: 5 minutes at 260 0 C in a convection oven), no bubbles formed in the bond line.

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• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Physics & Mathematics (AREA)
• Fluid Mechanics (AREA)
• Laminated Bodies (AREA)
• Adhesives Or Adhesive Processes (AREA)
• Structure Of Printed Boards (AREA)

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• 2008
  • 2008-01-28 DE DE102008006390A patent/DE102008006390A1/de not_active Withdrawn
• 2009
  • 2009-01-12 TW TW098100893A patent/TW200942109A/zh unknown
  • 2009-01-21 WO PCT/EP2009/050666 patent/WO2009095347A2/de active Application Filing
  • 2009-01-21 JP JP2010543488A patent/JP2011527095A/ja not_active Withdrawn
  • 2009-01-21 US US12/864,637 patent/US20110094676A1/en not_active Abandoned
  • 2009-01-21 EP EP09705439A patent/EP2238815A2/de not_active Withdrawn
  • 2009-01-21 KR KR1020107019158A patent/KR20100111734A/ko not_active Application Discontinuation
  • 2009-01-21 CN CN200980109258.2A patent/CN101990790A/zh active Pending

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