EP2216149B2 - Procédé de fabrication de panneaux de particules - Google Patents

Procédé de fabrication de panneaux de particules Download PDF

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Publication number
EP2216149B2
EP2216149B2 EP10152355.3A EP10152355A EP2216149B2 EP 2216149 B2 EP2216149 B2 EP 2216149B2 EP 10152355 A EP10152355 A EP 10152355A EP 2216149 B2 EP2216149 B2 EP 2216149B2
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EP
European Patent Office
Prior art keywords
chips
cover layers
wood
outer cover
layers
Prior art date
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Application number
EP10152355.3A
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German (de)
English (en)
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EP2216149A1 (fr
EP2216149B1 (fr
Inventor
Dieter Wiemann
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Glunz AG
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Glunz AG
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/007—Manufacture of substantially flat articles, e.g. boards, from particles or fibres and at least partly composed of recycled material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/08—Moulding or pressing
    • B27N3/10—Moulding of mats
    • B27N3/14—Distributing or orienting the particles or fibres

Definitions

  • the invention relates to a method for the production of chipboard using waste wood and fresh wood with the features of the preamble of independent claim 1.
  • the invention is concerned with the widest possible use of waste wood for the production of chipboard, without affecting their technological properties.
  • chips are fresh wood, usually cutting chips and / or Gatters Georgne, and chips from waste wood dried in separate lines and then fractionated in separate screening devices.
  • the chips are divided into four fractions in both lines: (1) oversized chips returned to comminution, (2) chips for the middle layer of chipboard, (3) chips for the chipboard cover layers and (4) dust, which can be added to the outer layers to a limited extent and otherwise burned.
  • the yield of the individual fractions in addition to the type of generation of chips, can be influenced by the mesh size of the screen coverings.
  • coarse chips are created in both lines, which can be used in the middle layer of chipboard, and fine chips for the surface layers of chipboard.
  • From the DE 197 51 326 A1 is a method for the production of wood-based materials, including chipboard, using waste wood and fresh wood with the features of the preamble of independent claim 1 known.
  • aminoplas-containing waste wood is to be used.
  • the shredded waste wood is mixed with the fresh chips shaved with aminoplast in customary quantities and thus used as cover layer or middle layer material in the customary production of chipboard.
  • From the DE 29 34 212 A1 is a combination plate known in the cover layers of wood and a middle layer of other types of materials such.
  • a middle layer of other types of materials such as hemp, flax, bagasse, rice straw, straw, etc., possibly with the addition of wood, are formed to use instead of scarce raw material wood waste in the middle class.
  • the preparation of the wood chips for the outer layers and the materials for the middle layer is carried out in separate chip processing lines.
  • the invention has for its object to provide a method with the features of the preamble of independent claim 1, with the best possible use of waste wood high quality chipboard with best technological properties and high quality surface can be produced.
  • the object is achieved by a method having the features of independent claim 1.
  • the dependent claims 2 to 10 relate to preferred embodiments of the new method.
  • the claim 11 is directed to a chipboard produced by the new method.
  • the chips for the middle layer and the chips for each two outer layers are processed separately on each side of the chipboard. That is, on each side of the chipboard there is an outer cover layer, for which the chips are at least predominantly processed from fresh wood, and an inner cover layer, for which the chips are at least predominantly processed from waste wood.
  • the chips for the outer and inner cover layers are kept separated from each other during production of the chipboard and glued and sprinkled separately.
  • the chips of fresh wood are concentrated in the outer cover layers, while the chips of waste wood are concentrated in the inner cover layers and in the middle layer. In this way, the maximum possible benefit is drawn from the fresh wood used.
  • the quality of the plate surface of a chipboard produced according to the invention corresponds to the quality of the surface of a chipboard, which is entirely made exclusively of fresh wood.
  • Fresh wood chips can be made much longer and leaner than old wood shavings.
  • less binder can be used in the outer cover layers to achieve the same strength values.
  • the strength of a chipboard is essentially determined by its flexural strength.
  • the bending strength is determined by the chip quality, i. H. determines the degree of slimming, and the degree of gluing especially the outer cover layers.
  • the shavings of waste wood in the inner cover layers which lie below the flexurally resistant outer cover layers in the case of a chipboard produced according to the invention, can be glued with less binder while achieving comparable strength properties.
  • fine chips made of waste wood have an approximately cubic structure and therefore a much larger surface area in terms of weight than chips made of fresh wood and therefore normally require correspondingly more binder.
  • a part of the cost advantage of waste wood over fresh wood which is more expensive as such and requires more energy to dry, is usually compensated.
  • a maximum cost advantage can be achieved by the use of waste wood, since it is used with a relatively low binder content. So can u.a. Plates are produced with a very high proportion of waste wood, the surfaces of which can be directly painted and printed.
  • the outer cover layers are preferably composed only of fresh wood in order to maximize their surface quality.
  • grinding dust can be recycled from the grinding of the chipboard produced according to the invention and added to the cover layers.
  • this sanding dust is to be evaluated as fresh wood, since it is produced by sanding the cover layers consisting exclusively of fresh wood and accordingly contains no impurities.
  • the inner cover layers as well as the middle layer of the chipboard can be composed exclusively of waste wood. Accordingly, in the new process it is preferred to comminute all the chips obtained from the fresh wood to a size which makes them suitable for use in the outer cover layers.
  • the middle layer can also be sprinkled from chips from waste wood and chips from fresh wood.
  • the chips made of fresh wood according to the invention only or at least largely used for the outer layers, only a relatively small drying device is required for their drying.
  • the completely separate preparation of the chips for the inner and outer cover layers also makes it possible to optimize the gluing of the various cover layers with regard to the chips contained and their function.
  • different binder amounts or binder compositions may be used.
  • the chips for the inner cover layers are generally made coarser than the chips for the outer cover layers.
  • the chips for the outer cover layers fall through a sieve with a mesh size in the range of 1.3 to 1.6 mm and are substantially retained by a sieve with a mesh size of 0.3 to 0.6 mm, while the chips for the inner cover layers pass through a sieve with a mesh size in the range of 1.6 to 1.8 mm and are substantially retained by a sieve with a mesh size of 0.5-0.75 mm.
  • the chips for the outer cover layers have a relatively high degree of slimming of 1: 2.5 to 5.
  • the thickness of the inner cover layers may be greater than that of the outer cover layers.
  • the thickness of the inner cover layers can be set to 1 to 3 mm, while a thickness of the outer cover layers of only 0.5 to 1.5 mm is sufficient.
  • this specification refers to the thickness of the outer cover layers after sanding.
  • the at least five-layer structure of outer cover layers, inner cover layers and middle layer, wherein only the outer cover layers predominantly consist of fresh wood, is easily detectable.
  • a chipboard 1 according to the invention produced according to Fig. 1 has two outer cover layers 2, two inner cover layers 3 and a middle layer 4.
  • the middle layer 4 can additionally be subdivided into further partial layers.
  • the outer cover layers 2 consist exclusively of chips of fresh wood and sanding dust from surface grinding of previously manufactured chipboard 1.
  • fresh wood is treated separately to obtain chips of a single sieve fraction, typically through a sieve with a mesh size of 1.3 to 1.6 mm but is retained by a screen with a mesh size of 0.3 to 0.6 mm.
  • Coarse chips are recalculated. Finer chips can be used to a limited extent as the previously mentioned fine grinding as a filler for the outer layers 2. Otherwise they will be burned.
  • the chips of fresh wood of the sieve fraction described preferably have a high degree of slimming of about 1: 2.5 to 5, which allows to set a high bending strength of the particle board 1 on the outer cover layers 2 with a relatively low binder content.
  • the outer cover layers 2, which are made exclusively of fresh wood, are free of contaminants. Your plan grinding is therefore easy, as well as a division of the chipboard 1 in desired formats. Outside the outer cover layers 2, the chipboard 1 can be completely formed on the basis of waste wood.
  • wood chips from two sieve fractions for the inner cover layers 3 on the one hand and the middle layer 4 on the other hand are made of shredded waste wood edited.
  • the chips made of waste wood of the inner cover layers 3 are typically somewhat coarser than those of the outer cover layers 2.
  • the binder can basically be the same over all layers two to four of the chipboard 1.
  • the person skilled in the art has optimization possibilities in which he sensibly also takes into account the different compositions of the outer cover layers 2 on the one hand and the inner cover layers 3 and the middle layer 4 on the other hand from chips made of fresh wood or waste wood.
  • Fig. 2 outlines a possible distribution of the mean chip size G over the thickness d of a chipboard 1 produced according to the invention Fig. 1 .
  • the chips for the outer cover layers 2 are typically sprinkled with shavings becoming coarser towards the middle of the plate.
  • the chips for the inner cover layers 3 and the middle layer 4 can, as indicated here, also be scattered with a homogeneous distribution over the thickness d.
  • Fig. 3 indicated Spanschnverotti G over the thickness d, are avoided in the jumps in the chip sizes between the individual layers 2 to 4 targeted. Smaller jumps in the chip size distribution are not critical. However, larger jumps may act as interfaces or interfaces at which there is an increased risk of dissolution of the composite of layers 2 to 4.
  • the table below gives possible dimensions of the various layers 2 to 4 of a chipboard 1 according to Fig. 1 for different thicknesses of chipboard 1 again. It follows that the cover layers 1 are produced with a typical grinding allowance of 0.3 mm. In addition, the average densities of the individual layers are given, which correlate with the chip size in the individual layers.
  • the scattering units for the outer cover layers may be Windstreuschn or roller screens.
  • roll gripper heads are preferably used with two superimposed roller beds. With appropriate adjustment, these devices can be used to produce homogeneous layers, layers with a "fine / coarse” selection and also combinations from "homogeneous to fine”.
  • a homogeneous Spanuggnverogue in the middle layer scattering heads with so-called cage rollers (cage-former) or roller screens with two superimposed roller beds can be used.
  • a Spanuggnverander which is a combination of in the FIGS. 2 and 3 shown Span supportivenveranderen is possible.
  • the chip sizes of the middle layer 4 according to the symmetrical distribution Fig.

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Dry Formation Of Fiberboard And The Like (AREA)
  • Polysaccharides And Polysaccharide Derivatives (AREA)
  • Heterocyclic Carbon Compounds Containing A Hetero Ring Having Oxygen Or Sulfur (AREA)
  • Die Bonding (AREA)

Claims (11)

  1. Procédé pour fabriquer des panneaux de particules (1) en utilisant du bois ancien et du bois récent, des copeaux destinés à une couche centrale (4) et des copeaux destinés à des couches de revêtement (2, 3) des panneaux de particules (1) étant traités séparément, caractérisé en ce que les copeaux destinés à des couches de revêtement (2) extérieures sont traités au moins principalement à partir du bois récent, en ce que les copeaux destinés à des couches de revêtement (3) intérieures sont traités au moins principalement à partir du bois ancien et en ce que les copeaux destinés aux couches de revêtement (2) extérieures et aux couches de revêtement (3) intérieures sont dispersés séparément, les copeaux pour les couches de revêtement (2) extérieures tombant à travers un tamis présentant une largeur de maille de l'ordre de 1,3 à 1,6 mm et étant retenus pour l'essentiel par un tamis présentant une largeur de maille de 0,3 à 0,6 mm, tandis que les copeaux pour les couches de revêtement intérieures (3) tombent à travers un tamis présentant une largeur de maille de l'ordre de 1,6 à 1,8 mm et sont retenus pour l'essentiel par un tamis présentant une largeur de maille de 0,5 à 0,75 mm.
  2. Procédé selon la revendication 1, caractérisé en ce que les couches de revêtement (2) extérieures uniquement à base de copeaux de bois récent sont dispersées.
  3. Procédé selon la revendication 1 ou 2, caractérisé en ce que de la poussière de ponçage est ajoutée aux copeaux de bois récent pour les couches de revêtement (2) extérieures.
  4. Procédé selon l'une quelconque des revendications 1 à 3, caractérisé en ce que les couches de revêtement (3) intérieures uniquement à base de copeaux de bois ancien sont dispersées.
  5. Procédé selon l'une quelconque des revendications 1 à 4, caractérisé en ce que la couche centrale (4) uniquement à base de copeaux de bois ancien est dispersée.
  6. Procédé selon l'une quelconque des revendications 1 à 5, caractérisé en ce que les copeaux pour les couches de revêtement (3) intérieures et les couches de revêtement (2) extérieures sont collées différemment.
  7. Procédé selon l'une quelconque des revendications précédentes, caractérisé en ce que les copeaux pour les couches de revêtement (2) extérieures présentent un degré d'élancement de 1:2,5 à 5.
  8. Procédé selon l'une quelconque des revendications précédentes, caractérisé en ce que, entre les couches de revêtement (3) intérieures et les couches de revêtement (2) extérieures ainsi que la couche centrale (4), on ne trouve pas de couches de séparation sur lesquelles la grandeur des copeaux varie brusquement.
  9. Procédé selon l'une quelconque des revendications précédentes, caractérisé en ce que l'épaisseur des couches de revêtement (3) intérieures est réglée sur 1 à 3 mm.
  10. Procédé selon l'une quelconque des revendications précédentes, caractérisé en ce que l'épaisseur des couches de revêtement (2) extérieures est réglée sur 0,5 à 1,5 mm après le ponçage.
  11. Panneau en bois fabriqué selon le procédé selon l'une quelconque des revendications 1 à 10, comprenant une couche centrale (4) et des couches de revêtement (2, 3) à base de copeaux provenant de bois ancien et de bois récent, caractérisé en ce que les copeaux des couches de revêtement (2) extérieures sont au moins principalement à base de bois récent et les copeaux de couches de revêtement (3) intérieures au moins principalement à base de bois ancien, les copeaux pour les couches de revêtement (2) extérieures tombant à travers un tamis présentant une largeur de maille de l'ordre de 1,3 à 1,6 mm et étant retenus pour l'essentiel par un tamis présentant une largeur de maille de 0,3 à 0,6 mm tandis que les copeaux pour les couches de revêtement intérieures (3) tombent à travers un tamis présentant une largeur de maille de l'ordre de 1,6 à 1,8 mm et sont retenus pour l'essentiel par un tamis présentant une largeur de maille de 0,5 à 0,75 mm.
EP10152355.3A 2009-02-04 2010-02-02 Procédé de fabrication de panneaux de particules Active EP2216149B2 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102009000623A DE102009000623A1 (de) 2009-02-04 2009-02-04 Verfahren zur Herstellung von Spanplatten

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EP2216149A1 EP2216149A1 (fr) 2010-08-11
EP2216149B1 EP2216149B1 (fr) 2011-03-23
EP2216149B2 true EP2216149B2 (fr) 2017-11-15

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EP10152355.3A Active EP2216149B2 (fr) 2009-02-04 2010-02-02 Procédé de fabrication de panneaux de particules

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EP (1) EP2216149B2 (fr)
AT (1) ATE502747T1 (fr)
DE (2) DE102009000623A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202017103956U1 (de) 2017-07-03 2017-09-13 Kronospan Luxembourg S.A. OSB-Platte sowie Vorrichtung zur Herstellung einer OSB-Platte
IT201900014682A1 (it) * 2019-08-12 2021-02-12 Fantoni Arredamenti Spa Pannello in fibra di legno e relativo impianto e metodo di realizzazione

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH438709A (de) † 1965-08-12 1967-06-30 Fischer Georg Verfahren und Vorrichtung zur Herstellung einer heissgepressten Holzwerkstoffplatte
DE3820376A1 (de) † 1988-06-15 1989-12-21 Novopan Gmbh Verfahren zur herstellung von mehrschichtigen spanplatten
DE4434876A1 (de) † 1994-09-29 1996-04-04 Dieffenbacher Gmbh Maschf Verfahren und Anlage zur kontinuierlichen Herstellung einer Mehrschichtplatte

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4035120A (en) * 1970-04-24 1977-07-12 Ab Karlstadplattan Apparatus for making sawdust chipboard
DE2934212A1 (de) * 1979-07-19 1981-02-05 Hubertus Schmid Kombiplatte
DE19622421A1 (de) * 1996-06-04 1997-12-11 Fraunhofer Ges Forschung Verfahren zur Aufbereitung von Altholz
DE19751326C2 (de) * 1997-11-19 2001-01-04 Pfleiderer Unternehmensverwalt Verfahren zur Herstellung von Holzwerkstoffen unter Verwertung von Gebraucht-, Rest- und Abfallholzwerkstoffen
JP3401554B2 (ja) * 1999-03-03 2003-04-28 独立行政法人森林総合研究所 木質系材の水蒸気爆発により得られる爆裂細片、この爆裂細片を骨材とした木質系資材ならびにこれらの製造方法および製造装置。
DK176535B1 (da) * 2002-05-08 2008-07-21 Inter Ikea Sys Bv Spånplade og fremgangsmåde til fremstilling heraf

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH438709A (de) † 1965-08-12 1967-06-30 Fischer Georg Verfahren und Vorrichtung zur Herstellung einer heissgepressten Holzwerkstoffplatte
DE3820376A1 (de) † 1988-06-15 1989-12-21 Novopan Gmbh Verfahren zur herstellung von mehrschichtigen spanplatten
DE4434876A1 (de) † 1994-09-29 1996-04-04 Dieffenbacher Gmbh Maschf Verfahren und Anlage zur kontinuierlichen Herstellung einer Mehrschichtplatte

Also Published As

Publication number Publication date
DE502010000007D1 (de) 2011-05-05
EP2216149A1 (fr) 2010-08-11
EP2216149B1 (fr) 2011-03-23
DE102009000623A1 (de) 2010-08-05
ATE502747T1 (de) 2011-04-15

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