EP2207628A1 - Zusammensetzung und verfahren zur steuerung der galvanischen korrosion in bestückten leiterplatten - Google Patents

Zusammensetzung und verfahren zur steuerung der galvanischen korrosion in bestückten leiterplatten

Info

Publication number
EP2207628A1
EP2207628A1 EP08850014A EP08850014A EP2207628A1 EP 2207628 A1 EP2207628 A1 EP 2207628A1 EP 08850014 A EP08850014 A EP 08850014A EP 08850014 A EP08850014 A EP 08850014A EP 2207628 A1 EP2207628 A1 EP 2207628A1
Authority
EP
European Patent Office
Prior art keywords
coating composition
resistant coating
corrosion resistant
mercaptan
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08850014A
Other languages
English (en)
French (fr)
Other versions
EP2207628A4 (de
Inventor
Ernest Long
Andrew Krol
Lenora M. Toscano
Steven A. Castaldi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Inc
Original Assignee
MacDermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MacDermid Inc filed Critical MacDermid Inc
Publication of EP2207628A1 publication Critical patent/EP2207628A1/de
Publication of EP2207628A4 publication Critical patent/EP2207628A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3613—Polymers, e.g. resins
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/40—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing molybdates, tungstates or vanadates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/16—Sulfur-containing compounds
    • C23F11/161—Mercaptans
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C23F11/173—Macromolecular compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/121—Metallo-organic compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol

Definitions

  • the present invention is directed to an aqueous corrosion resistant coating composition for reducing corrosion on surfaces of printed circuit boards.
  • PCB manufacturing processes typically comprise many steps, in part because of the increasing demand for enhanced performance.
  • Surface circuits on PCBs usually include copper and copper alloy materials that are coated to provide good mechanical and electrical connection with other devices in the assembly.
  • a first stage comprises preparing the circuit board and a second stage comprises mounting various components on the circuit board.
  • legged components such as resistors, transistors, etc.
  • surface mount devices which are attached to the surface of the board by soldering with a flat contact area or by adhesion with a suitable adhesive.
  • Plated through-hole printed circuit boards may generally be fabricated by a process comprising the following sequence of steps:
  • sequences of steps may also be used and are generally well known to those skilled in the art.
  • fresh water rinses may be interposed between each step.
  • sequences of steps that may be used to prepare the printed circuit boards in the first stage are described, for example, in U.S. Patent No. 6,319,543 to Soutar et al., U.S. Patent No. 6,656,370 to Toscano et al., and U.S. Patent No. 6,815,126 to Fey et al., the subject matter of each of which is herein incorporated by reference in its entirety.
  • Solder masking is an operation in which the entire area of a printed circuit board, except solder pads, surface mount pads, and plated through-holes, is selectively covered with an organic polymer coating.
  • the polymer coating acts like a dam around the pads to prevent the undesirable flow of solder during assembly and also improves the electrical insulation resistance between conductors and provides protection from the environment.
  • the solder mask compound is typically an epoxy resin that is compatible with the substrate.
  • the solder mask may be screen printed onto the printed circuit board in the desired pattern or may also be a photoimageable solder mask that is coated onto the surface. Both types of solder masks are generally well known to those skilled in the art.
  • the contact areas include wire-bonding areas, chip attach areas, soldering areas and other contact areas.
  • Contact finishes must provide good solderability, good wire bonding performance and high corrosion resistance. Some contact finishes must also provide high conductivity, high wear resistance, and high corrosion resistances.
  • a typical prior art contact finish coating may include an electrolytic nickel coating with an electrolytic gold layer on top, although other coatings are also known to those skilled in the art.
  • Soldering is generally used for making mechanical, electromechanical, or electronic connections to a variety of articles.
  • connections of electronic components to the printed circuits are made by soldering of the leads of the components to the through-holes, surrounding pads, lands and other points of connection (collectively, "Areas of Connection").
  • Immersion plating is a process which results from a replacement reaction whereby the surface being plated dissolves into solution and at the same time the metal being plated deposits from the plating solution onto the surface.
  • the immersion plating typically initiates without prior activation of the surfaces.
  • the metal to be plated is generally more noble than the surface metal.
  • immersion plating is usually significantly easier to control and significantly more cost effective than electroless plating, which requires sophisticated auto catalytic plating solutions and processes for activation of the surfaces prior to plating.
  • SMIA solder mask interface attack
  • galvanic attack may erode the copper trace at the interface between the solder mask and the copper trace.
  • SMIA is also known by other names such as solder mask crevice corrosion and simply galvanic attack at the solder mask interface. Regardless of the name, the problem comprises a galvanic attack at the solder mask-copper interface. This interfacial galvanic attack arises as a result of the soldermask-copper interfacial structure and the immersion plating mechanism.
  • Galvanic corrosion is caused by the junction of two dissimilar metals. Differences in the metal can be seen as composition of the metal itself varying, or differences in grain boundaries, or localized shear or torque from the manufacturing process. Almost any lack of homogeneity of the metal surface or its environment may initiate a galvanic corrosion attack, by causing a difference in potential. Contact between dissimilar metals also causes this galvanic current to flow, due to the difference in potential of the two, or more, different metals. Galvanic corrosion can occur when one metal is coated with a more noble metal, for example silver over copper. Any exposed copper can accelerate this process as well. Higher failure rates and accelerated corrosion are seen in environments that have high levels of reduced sulfur gasses such as elemental sulfur and hydrogen sulfide.
  • Circuit boards are normally composed of several different metals, including copper, tin and silver, given by way of example and not limitation. These metals are at different levels in the galvanic series, so they may galvanically react with each other. Thus, it would be desirable to develop a composition for treating printed circuit boards to reduce galvanic corrosion and prevent the chemical mechanism of galvanic corrosion as well.
  • the present invention in a broad aspect, relates to inhibiting the corrosion of metals.
  • the invention more particularly concerns compositions and methods of controlling/inhibiting galvanic corrosion on surfaces of printed circuit boards.
  • the present invention relates to an aqueous corrosion resistant coating composition
  • an aqueous corrosion resistant coating composition comprising: a) a mercaptan; b) preferably, an ethoxylated alcohol; and c) at least one metal ionic species selected from the group consisting of molybdates, tungstates, vanadates, zirconium, cobalt and titanium.
  • the present invention relates to a method of treating surfaces of substrates with the aqueous corrosion resistant coating composition to reduce corrosion thereon.
  • the present invention relates generally to an aqueous corrosion resistant coating composition
  • an aqueous corrosion resistant coating composition comprising: a) a mercaptan; b) preferably, an ethoxylated alcohol; and c) at least one metal ionic species selected from the group consisting of molybdates, tungstates, vanadataes, zirconium, cobalt and titanium.
  • the corrosion resistant coating composition also includes xanthan gum. If used, the concentration of xanthan gum is preferably from 1 to 10 g/1.
  • the ethoxylated alcohol is preferably a C-IO alcohol ethoxylate.
  • concentration of ethoxylated alcohol is preferably 0.1 to 10 g/1.
  • various mercaptans are usable in the composition of the invention, including for example C 12 to Cl 8 chain length mercaptans.
  • the mercaptan is stearyl mercaptan (1-octadecanethiol).
  • concentration of mercaptan is preferably from 1 to 20 g/1.
  • the at least one metal species is ammonium molybdate tetrahydrate. In another preferred embodiment, the at least one metal species is ammonium metatungstate and/or ammonium metavanadate.
  • the concentration of metal species is preferably from 2 to 100 g/1.
  • the corrosion resistant coating composition described herein comprises:
  • Ethoxylated alcohol (C-10) 0.10-1.00 % by wt.
  • the aqueous corrosion resistant coating composition of the invention is particularly suited for treating surfaces of printed circuit boards, including printed circuit boards having both copper and silver deposits, to reduce galvanic corrosion.
  • the present invention also relates to a method of treating surfaces of a printed circuit board to reduce corrosion thereon, the method comprising the step of: contacting surfaces of the printed circuit board with an aqueous corrosion resistant coating composition comprising: a) a mercaptan; b) preferably, an ethoxylated alcohol; and c) at least one metal ionic species selected from the group consisting of molybdates, tungstates, vanadataes, zirconium, cobalt and titanium.
  • an aqueous corrosion resistant coating composition comprising: a) a mercaptan; b) preferably, an ethoxylated alcohol; and c) at least one metal ionic species selected from the group consisting of molybdates, tungstates, vanadataes, zirconium, cobalt and titanium.
  • compositions are preferably contacted with the printed circuit board at 5O 0 C and for a sufficient period of time to obtain the desired result.
  • temperatures between 20 to 7O 0 C would also be usable.
  • the contact period is typically in the range of about 10 to 300 seconds.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Preventing Corrosion Or Incrustation Of Metals (AREA)
EP08850014A 2007-11-13 2008-09-08 Zusammensetzung und verfahren zur steuerung der galvanischen korrosion in bestückten leiterplatten Withdrawn EP2207628A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/983,982 US20090123656A1 (en) 2007-11-13 2007-11-13 Composition and method for controlling galvanic corrosion in printed circuit boards
PCT/US2008/010489 WO2009064329A1 (en) 2007-11-13 2008-09-08 Composition and method for controlling galvanic corrosion in printed circuit boards

Publications (2)

Publication Number Publication Date
EP2207628A1 true EP2207628A1 (de) 2010-07-21
EP2207628A4 EP2207628A4 (de) 2012-03-07

Family

ID=40623976

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08850014A Withdrawn EP2207628A4 (de) 2007-11-13 2008-09-08 Zusammensetzung und verfahren zur steuerung der galvanischen korrosion in bestückten leiterplatten

Country Status (6)

Country Link
US (1) US20090123656A1 (de)
EP (1) EP2207628A4 (de)
JP (1) JP2011503897A (de)
CN (1) CN101855027A (de)
TW (1) TW200927857A (de)
WO (1) WO2009064329A1 (de)

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GB2485419B (en) * 2010-11-15 2015-02-25 Semblant Ltd Method for reducing creep corrosion
US8803295B2 (en) 2011-05-04 2014-08-12 Subtron Technology Co., Ltd. Circuit structure and manufacturing method thereof
CN102768963B (zh) * 2011-05-04 2015-06-24 旭德科技股份有限公司 线路结构及其制作方法
US8552303B2 (en) * 2011-05-04 2013-10-08 Subtron Technology Co., Ltd. Circuit structure and manufacturing method thereof
US20150029664A1 (en) * 2013-07-23 2015-01-29 Asia Vital Components Co., Ltd. Fan anti-corrosion structure

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Also Published As

Publication number Publication date
WO2009064329A1 (en) 2009-05-22
JP2011503897A (ja) 2011-01-27
TW200927857A (en) 2009-07-01
CN101855027A (zh) 2010-10-06
US20090123656A1 (en) 2009-05-14
EP2207628A4 (de) 2012-03-07

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