EP2183785A2 - Substrat de face avant de cellule photovoltaïque et utilisation d'un substrat pour une face avant de cellule photovoltaïque - Google Patents
Substrat de face avant de cellule photovoltaïque et utilisation d'un substrat pour une face avant de cellule photovoltaïqueInfo
- Publication number
- EP2183785A2 EP2183785A2 EP08827019A EP08827019A EP2183785A2 EP 2183785 A2 EP2183785 A2 EP 2183785A2 EP 08827019 A EP08827019 A EP 08827019A EP 08827019 A EP08827019 A EP 08827019A EP 2183785 A2 EP2183785 A2 EP 2183785A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- substrate
- coating
- layer
- antireflection
- functional layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 134
- 238000000576 coating method Methods 0.000 claims abstract description 218
- 239000011248 coating agent Substances 0.000 claims abstract description 184
- 239000010410 layer Substances 0.000 claims abstract description 129
- 239000000463 material Substances 0.000 claims abstract description 99
- 230000003287 optical effect Effects 0.000 claims abstract description 88
- 239000002346 layers by function Substances 0.000 claims abstract description 83
- 229910052751 metal Inorganic materials 0.000 claims abstract description 50
- 239000002184 metal Substances 0.000 claims abstract description 50
- 229910052709 silver Inorganic materials 0.000 claims abstract description 12
- 239000004332 silver Substances 0.000 claims abstract description 12
- 230000002745 absorbent Effects 0.000 claims abstract description 4
- 239000002250 absorbent Substances 0.000 claims abstract description 4
- 239000011521 glass Substances 0.000 claims abstract description 4
- 238000001228 spectrum Methods 0.000 claims description 34
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 29
- 238000010521 absorption reaction Methods 0.000 claims description 29
- 239000011787 zinc oxide Substances 0.000 claims description 14
- 239000010409 thin film Substances 0.000 claims description 13
- 230000000903 blocking effect Effects 0.000 claims description 9
- 238000009736 wetting Methods 0.000 claims description 7
- 229910045601 alloy Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 6
- 239000011701 zinc Substances 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 5
- 229910052718 tin Inorganic materials 0.000 claims description 5
- 239000010936 titanium Substances 0.000 claims description 5
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 claims description 4
- 229910001120 nichrome Inorganic materials 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- 229910001887 tin oxide Inorganic materials 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 3
- 229910052738 indium Inorganic materials 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims 1
- 239000006117 anti-reflective coating Substances 0.000 abstract description 5
- 238000010438 heat treatment Methods 0.000 description 16
- 230000005540 biological transmission Effects 0.000 description 13
- 229910021417 amorphous silicon Inorganic materials 0.000 description 12
- 229910021424 microcrystalline silicon Inorganic materials 0.000 description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 238000010791 quenching Methods 0.000 description 9
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 8
- 230000000171 quenching effect Effects 0.000 description 8
- 230000005855 radiation Effects 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 239000002356 single layer Substances 0.000 description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 230000003667 anti-reflective effect Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 4
- 229910004613 CdTe Inorganic materials 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 238000007669 thermal treatment Methods 0.000 description 3
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 229910006404 SnO 2 Inorganic materials 0.000 description 2
- 229910052787 antimony Inorganic materials 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 229910052793 cadmium Inorganic materials 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910003437 indium oxide Inorganic materials 0.000 description 2
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 2
- 230000005012 migration Effects 0.000 description 2
- 238000013508 migration Methods 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910052708 sodium Inorganic materials 0.000 description 2
- 239000011734 sodium Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000001771 vacuum deposition Methods 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 229910010413 TiO 2 Inorganic materials 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 238000000862 absorption spectrum Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- HVMJUDPAXRRVQO-UHFFFAOYSA-N copper indium Chemical compound [Cu].[In] HVMJUDPAXRRVQO-UHFFFAOYSA-N 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- XIMIGUBYDJDCKI-UHFFFAOYSA-N diselenium Chemical compound [Se]=[Se] XIMIGUBYDJDCKI-UHFFFAOYSA-N 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005686 electrostatic field Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000006911 nucleation Effects 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 229940071182 stannate Drugs 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0216—Coatings
- H01L31/02161—Coatings for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02167—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/02168—Coatings for devices characterised by at least one potential jump barrier or surface barrier for solar cells the coatings being antireflective or having enhancing optical properties for the solar cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the invention relates to a photovoltaic cell front-face substrate, in particular a transparent glass substrate.
- a photovoltaic photovoltaic material system that generates electrical energy under the effect of incident radiation is positioned between a back-face substrate and a front-face substrate, this front-face substrate being the first substrate which is traversed by the incident radiation before it reaches the photovoltaic material.
- the front-face substrate conventionally comprises, beneath a main surface facing the photovoltaic material, a transparent electrode coating in electrical contact with the photovoltaic material disposed below when considering that the main direction arrival of incident radiation is from above.
- This front face electrode coating thus constitutes, for example, the negative terminal of the photovoltaic cell.
- the photovoltaic cell also comprises, in the direction of the rear-face substrate, an electrode coating which then constitutes the positive terminal of the photovoltaic cell, but in general, the electrode coating of the rear-face substrate is not transparent.
- photovoltaic cell must be understood to mean any set of constituents generating the production of an electric current between its electrodes by conversion of solar radiation, whatever the dimensions of this assembly and whatever the voltage may be. and the intensity of the current produced and in particular that this set of components has, or not, one or more internal electrical connection (s) (in series and / or in parallel).
- the notion of "cell photovoltaic "in the sense of the present invention is here equivalent to that of" photovoltaic module "or" photovoltaic panel ".
- the material usually used for the transparent electrode coating of the front-face substrate is generally a transparent conductive oxide ("TCO") material, such as for example an indium oxide-based material.
- TCO transparent conductive oxide
- ITO tin
- ZnO zinc oxide doped with aluminum
- ZnO: B doped with boron
- SnO 2 fluorine
- CVD chemical vapor deposition
- PECVD plasma-assisted chemical vapor deposition
- cathodic sputtering possibly assisted by magnetic field
- TCO must be deposited at a relatively large physical thickness, of the order of 500 to 1000 nm and sometimes even more, which is expensive compared to the price of these materials when they are deposited in layers of this thickness.
- Electrode coatings made of a TCO-based material lies in the fact that for a chosen material, its physical thickness is always a compromise between the electrical conduction finally obtained and the transparency finally obtained because the greater the physical thickness is important the higher the conductivity, the lower the transparency, and the lower the physical thickness, the stronger the transparency but the lower the conductivity.
- the transparent electrode coating is not made of a TCO-based material but consists of a stack of thin layers deposited on a main face of the front-face substrate, this coating comprising at least one metal functional layer, in particular based on silver, and at least two antireflection coatings, said antireflection coatings each comprising at least one antireflection layer, said functional layer being disposed between the two antireflection coatings.
- This process is remarkable in that it provides that at least one highly refractive oxide or nitride layer is deposited below the metal functional layer and above the photovoltaic material when considering the direction of incident light. who enters the cell from above.
- the present invention thus consists, for a photovoltaic cell front face substrate, of defining the optical path making it possible to obtain the - A - better performance of the photovoltaic cell according to the chosen photovoltaic material.
- the photovoltaic cell is characterized in that the antireflection coating disposed below the metal functional layer in the direction of the substrate has an optical thickness equal to about one eighth of the maximum wavelength ⁇ M of the product of the spectrum of the absorption of the photovoltaic material by the solar spectrum and the antireflection coating disposed above the metal functional layer opposite the substrate has an optical thickness equal to about half of the maximum wavelength ⁇ M of the product of the spectrum of the absorption of the photovoltaic material by the solar spectrum.
- an optimum optical path is defined as a function of the maximum wavelength ⁇ m of absorption of the photovoltaic material or preferably as a function of the maximum wavelength ⁇ M of the product of the spectrum of the absorption of the photovoltaic material by the solar spectrum, in order to obtain the best efficiency of the photovoltaic cell.
- the functional layer alone allows to obtain the desired conductivity for the electrode coating, even at a low physical thickness (of the order of 10 nm), it will strongly oppose the passage of light.
- optical path here takes on a specific meaning and is used to denote the summary of the different optical thicknesses of the different antireflection coatings underlying and overlying the functional metallic layer of the interference filter thus produced. It is recalled that the optical thickness of a coating is equal to the product of the physical thickness of the material by its index when there is only one layer in the coating or the sum of the products of the physical thickness of the material of each layer by its index when there are several layers.
- the present invention thus also relates to the use of this stack of thin layers which has undergone a quenching heat treatment, as well as the use of a stack of thin layers for architectural glazing having the characteristics of the invention having has undergone a surface heat treatment of the type known from the French patent application No. FR 2 911 130.
- T L a light transmission (in the visible) T L high of at least 65, even 70%, or even at least 75%;
- the electrode coating must be transparent. It must thus present, mounted on the substrate, a mean light transmission between 300 and 1200 nm minimum 65%, even 75% and more preferably 85% or more including at least 90%.
- the antireflection coating disposed below the metallic functional layer in the direction of the substrate has an optical thickness equal to approximately one-eighth of the maximum absorption wavelength ⁇ m of the photovoltaic material and that the antireflection coating disposed above the metal functional layer opposite the substrate has an optical thickness equal to about half of the maximum wavelength ⁇ m absorption of the photovoltaic material,
- Said antireflection coating disposed above the metallic functional layer preferably has an optical thickness of between 0.45 and 0.55 times the maximum absorption wavelength ⁇ m of the photovoltaic material, including these values and more preferably, said antireflection coating disposed above the metallic functional layer has an optical thickness of between 0.45 and 0.55 times the maximum wavelength ⁇ M of the product of the spectrum of absorption of the photovoltaic material by the solar spectrum, including these values.
- the antireflection coating disposed beneath the metal functional layer has an optical thickness of between 0.075 and 0.175 times the maximum wavelength ⁇ m of absorption of the photovoltaic material, including these values and preferably said antireflection coating disposed below the metallic functional layer has an optical thickness of between 0.075 and 0.175 times the maximum wavelength ⁇ M of the product of the spectrum of absorption of the photovoltaic material by the solar spectrum, including these values.
- the antireflection coating disposed beneath the metallic functional layer may also have a function of chemical barrier to diffusion, and in particular to the diffusion of sodium from the substrate, thus protecting the electrode coating, and more particularly the functional metallic layer, in particular during a possible heat treatment, especially quenching.
- the substrate comprises, under the electrode coating, a base antireflection layer having a low refractive index close to that of the substrate, said base antireflection layer preferably being based on silicon oxide or based on aluminum oxide, or a mixture of both.
- this dielectric layer may constitute a chemical barrier layer to the diffusion, and particularly to the diffusion of sodium from the substrate, thus protecting the electrode coating, and more particularly the functional metal layer, especially during a possible heat treatment, especially quenching.
- a dielectric layer is a layer which does not participate in the displacement of electric charge (electric current) or whose effect of participation in the displacement of electric charge can be considered as zero compared to that of the others. electrode coating layers.
- this basic antireflection layer preferably has a physical thickness of between 10 and 300 nm or between 35 and 200 nm and more preferably between 50 and 120 nm.
- the metal functional layer is preferably deposited in a crystallized form on a thin dielectric layer which is also preferably crystallized (then called "wetting layer” as promoting the proper crystalline orientation of the metal layer deposited thereon).
- This functional metal layer may be based on silver, copper or gold, and may optionally be doped with at least one other of these elements.
- Doping is usually understood as a presence of the element in an amount of less than 10% molar mass of metal element in the layer and the term "based on” is understood to mean typical of a layer containing mainly the material, that is to say containing at least 50% of this material in molar mass; the term “based on” thus covers doping.
- the stack of thin layers producing the electrode coating is preferably a functional monolayer coating, that is to say a single functional layer; it can not be multi-functional layers.
- the functional layer is thus preferably deposited over one or even directly onto an oxide-based wetting layer, in particular based on zinc oxide, optionally doped, optionally with aluminum.
- the physical (or actual) thickness of the wetting layer is preferably between 2 and 30 nm and more preferably between 3 and 20 nm.
- This wetting layer is dielectric and is a material which preferably has a resistivity p (defined by the product of the resistance per square of the layer by its thickness) such that 0.5 ⁇ .cm ⁇ p ⁇ 200 ⁇ . cm or such that 50 ⁇ .cm ⁇ p ⁇ 200 ⁇ .cm.
- the stack is generally obtained by a succession of deposits made by a technique using the vacuum such as sputtering possibly assisted by magnetic field.
- a layer or coating deposit (comprising one or more layers) is carried out directly under or directly on another deposit, it is that there can be no interposition of 'no layer between these two deposits.
- At least one blocking coating is preferably based on Ni or Ti or is based on a Ni-based alloy, in particular is based on a NiCr alloy.
- the coating below the metal functional layer in the direction of the substrate and / or the coating above the metallic functional layer comprises (nt), preferably a layer based on mixed oxide, in particular based on mixed oxide zinc and tin or mixed tin and indium oxide (ITO).
- the coating below the metallic functional layer in the direction of the substrate and / or the coating above the metallic functional layer may have a layer with a high refractive index, in particular greater than or equal to 2.2. , for example a silicon nitride-based layer, optionally doped, for example with aluminum or zirconium.
- the coating below the metallic functional layer in the direction of the substrate and / or the coating above the metallic functional layer may have a layer with a very high refractive index, in particular greater than or equal to 2, 35, such as a titanium oxide layer.
- the substrate may include a photovoltaic material-based coating above the electrode coating opposite the front-face substrate.
- a preferred structure of front-face substrate according to the invention is thus of the type: substrate / (optional antireflective base layer) / electrode coating / photovoltaic material, or else of the type: substrate / (layer optional antireflection coating) / electrode coating / photovoltaic material / electrode coating.
- the electrode coating consists of a stack for architectural glazing, in particular a stack for architectural glazing "hardenable” or “to be tempered”, and in particular a low-emissive stack, in particular a low-emissive stack "hardenable Or “to soak", this stack of thin layers having the characteristics of the invention.
- the present invention also relates to a substrate for a photovoltaic cell according to the invention, in particular a substrate for architectural glazing coated with a stack of thin layers having the characteristics of the invention, in particular a substrate for architectural glazing "hardenable” or “Quenching” having the characteristics of the invention, and in particular a low-emissive substrate, in particular a low-emissive "quenchable” or “quenching” substrate having the characteristics of the invention.
- the present invention thus also relates to this architectural glazing substrate coated with a stack of thin layers having the characteristics of the invention and which has undergone a quenching heat treatment, as well as this substrate for architectural glazing coated with a stack of thin layers having the characteristics of the invention having undergone a heat treatment of the type known from the French patent application No. FR 2 911 130.
- All layers of the electrode coating are preferably deposited by a vacuum deposition technique, but it is not excluded, however, that the first or first layers of the stack may be deposited by a another technique, for example by a pyrolytic or CVD type thermal decomposition technique, optionally under vacuum, possibly assisted by plasma.
- the electrode coating according to the invention with a thin film stack is moreover mechanically more resistant than a TCO electrode coating. Thus, the lifespan of the photovoltaic cell can be increased.
- the electrode coating according to the invention with a thin film stack also has an electrical resistance at least as good as that of the TCO conductive oxides usually used.
- the square resistance R of the electrode coating according to the invention is between 1 and 20 ⁇ / or between 2 and 15 ⁇ /, for example of the order of 5 to 8 ⁇ /.
- the electrode coating according to the invention with a thin film stack also has a light transmission in the visible at least as good as that of the TCO conductive oxides usually used.
- the light transmission in the visible electrode coating according to the invention is between 50 and 98%, or between 65 and 95%, for example of the order of 70 to 90%.
- FIG. 2 illustrates a photovoltaic cell front face substrate according to the invention coated with an electrode coating consisting of a functional monolayer thin layer stack and an anti-reflection base layer;
- FIG. 3 illustrates the quantum efficiency curve of three photovoltaic materials
- FIG. 4 illustrates the real efficiency curve corresponding to the product of the spectrum of the absorption of these three photovoltaic materials by the solar spectrum
- FIG. 5 illustrates the principle of the durability test of photovoltaic cells
- FIG. 6 illustrates a sectional diagram of a photovoltaic cell.
- FIG. 1 illustrates a photovoltaic cell front-facing substrate 10 of the prior art with absorbent photovoltaic material 200, said substrate 10 comprising on a main surface a transparent electrode coating 100 'consisting of a layer which conducts the current 66 in TCO .
- the front-face substrate 10 is disposed in the photovoltaic cell such that the front-face substrate 10 is the first substrate traversed by the incident radiation R, before reaching the photovoltaic material 200.
- the substrate 10 also includes in the electrode coating 100 ', that is to say directly on the substrate 10 a base antireflection layer 15 having a refractive index n 15 low close to that of the substrate.
- FIG. 2 illustrates a photovoltaic cell front-face substrate 10 according to the invention.
- the front-face substrate 10 also has a transparent electrode coating 100 on a main surface, but here this electrode coating 100 consists of a thin-film stack comprising a metal-based functional layer 40, based on silver, and at least two antireflection coatings 20, 60, said coatings each having at least one fine antireflection layer 24, 26; 64, 66, said functional layer 40 being disposed between the two antireflection coatings, one called the underlying antireflection coating 20 located below the functional layer, towards the substrate, and the other called overlying antireflection coating 60 located above the functional layer, in the opposite direction to the substrate.
- this electrode coating 100 consists of a thin-film stack comprising a metal-based functional layer 40, based on silver, and at least two antireflection coatings 20, 60, said coatings each having at least one fine antireflection layer 24, 26; 64, 66, said functional layer 40 being disposed between the two antireflection coatings, one called the underlying antireflection coating 20 located below the functional layer, towards the substrate
- the stack of thin layers constituting the transparent electrode coating 100 of FIG. 2 is a structure of a stack of the type of that of a low-emissive, possibly quenchable or quenched, functional monolayer substrate, such as can be commercially available, for applications in the field of architectural glazing for buildings.
- the stack of thin layers is deposited on a substrate 10 made of clear soda-lime glass with a thickness of 4 mm.
- the electrode coating 100 'of the examples according to FIG. 1 are based on conductive aluminum-doped zinc oxide.
- Each stack constituting an electrode coating 100 of the examples according to FIG. 2 consists of a stack of thin layers comprising:
- an underlying blocking coating for example based on Ti or based on a NiCr alloy could be disposed directly under the functional layer 40, but is not provided here; this coating is generally necessary if there is no damping layer 26, but is not necessarily essential;
- the single functional layer 40 silver, is here arranged directly on the wetting coating 26; an overlying blocking coating 50 based on Ti or based on a NiCr alloy could be placed directly on the functional layer 40 but is not provided in the examples made;
- a layer which conducts the current 66, which is anti-reflective and which is a termination layer, based on zinc oxide doped with aluminum, of index n 2, is furthermore provided; its resistivity being substantially close to 1100 ⁇ . cm.
- the photovoltaic material 200 based on microcrystallized silicon (whose crystallite size is of the order of 100 nm), whereas in the examples with an odd number, the photovoltaic material 200 based on amorphous (i.e., non-crystallized) silicon.
- the QE quantum efficiency of these materials is illustrated in FIG. 3, along with that of cadmium telluride, another photovoltaic material that is also suitable in the context of the invention.
- the quantum efficiency QE is in a known manner the expression of the probability (between 0 and 1) that an incident photon with a wavelength according to the abscissa is transformed into an electron-hole pair .
- the maximum absorption wavelength ⁇ m that is to say the wavelength at which the quantum efficiency is maximum (that is to say the higher) :
- amorphous silicon a-Si, ⁇ m a-Si, is 520 nm
- microcrystallized silicon ⁇ c-Si, ⁇ m ⁇ c-Si, is 720 nm
- Cadmium telluride CdTe ⁇ m CdTe, is 600 nm. In a first approach, this maximum absorption wavelength ⁇ m is sufficient.
- the antireflection coating 20 disposed below the metal functional layer 40 in the direction of the substrate then has an optical thickness equal to about one-eighth of the maximum absorption wavelength ⁇ m of the photovoltaic material and the antireflection coating 60 disposed above. above the metal functional layer 40 opposite the substrate then has an optical thickness equal to about half of the maximum absorption wavelength ⁇ m of the photovoltaic material.
- Table 1 below summarizes the preferred ranges of the optical thicknesses in nm, for each coating 20, 60, as a function of these three materials.
- the optical definition of the stack can be improved by considering the quantum efficiency to obtain an improved real efficiency by convolving this probability by the wavelength distribution of the sunlight at the surface of the earth.
- the standardized solar spectrum AM1.5 we use the standardized solar spectrum AM1.5.
- the antireflection coating 20 disposed below the metal functional layer 40 in the direction of the substrate has an optical thickness equal to about one-eighth of the maximum wavelength ⁇ M of the product of the absorption spectrum of the photovoltaic material by the solar spectrum and the antireflection coating 60 disposed above the layer metallic functional device 40 opposite the substrate has an optical thickness equal to about half of the maximum wavelength ⁇ M of the product of the spectrum of the absorption of the photovoltaic material by the solar spectrum.
- the maximum wavelength ⁇ M of the product of the spectrum of the absorption of the photovoltaic material by the solar spectrum that is to say the wavelength at which the efficiency is maximum (that is the highest):
- amorphous silicon a-Si, a-Si M ⁇ is 530 nm
- ⁇ c-Si, ⁇ c-Si ⁇ M is 670 nm
- Table 2 summarizes the preferred ranges of the optical thicknesses in nm, for each coating 20, 60, as a function of these three materials.
- a silicon oxide-based base antireflection layer 15 was deposited between the substrate and the electrode coating 100. Its refractive index n 15 being low and close to that of the substrate, its optical thickness n ' is not taken into account in the definition of the optical path of the stack according to the invention.
- the deposition conditions of these layers are known to those skilled in the art since it involves making stacks similar to those used for low-emission or solar control applications.
- Tables 3, 5 and 7 below summarize the materials and physical thicknesses measured in nanometers of each of the layers of each of Examples 1 to 12 and Tables 4, 6 and 8 show the main features of these examples.
- the performance characteristic P is calculated by the so-called "TSQE" method where the product of the integration of the spectrum is operated over the entire radiation domain under consideration with the quantum efficiency QE of the cell. All examples, 1 to 12, have been subjected to a resistance test of the electrode coatings to the stresses generated during the operation of the cell (in particular the presence of an electrostatic field), carried out as shown in FIG. 5.
- 10, 10 'coated electrode coating 100, 100' by making an electrical contact 102 on the surface thereof and connecting this contact 102 and the metal plate 5 to the terminals of a power supply 7 delivering DC current of about 200 V.
- the antireflection coating 60 has an optical thickness equal to 3.74 times the optical thickness of the antireflection coating 20.
- Example 4 The thicknesses The optical coatings 20 and 60 of Example 4 fall within the acceptable ranges for an ⁇ -Si photovoltaic material 200 according to Table 1 and Table 2. However, the optical thicknesses of the coatings 20 and 60 are respectively closer to ⁇ M / 8 and ⁇ M / 2 of Table 2 than of ⁇ m / 8 and ⁇ m / 2 of Table 1.
- the square resistance R of the electrode layer consisting of a stack of thin layers and coated with microcrystallized silicon is also better, but the performance P is less good (-1.8%) than those of TCO electrode coating coated with the same microcrystallized material (Example 1).
- the optical thickness of 270.6 nm of the coating 60 of Example 3 does not fall within the acceptable range of 324-396 nm for a photovoltaic material 200 in ⁇ c-Si according to Table 1 or a fortiori in the acceptable range. of 302-369 nm for a photovoltaic material 200 in ⁇ c-Si according to Table 2.
- the proportion of electrode coating with a thin-film stack remaining after the resistance test is much higher, whatever the photovoltaic material, at the TCO electrode coating proportion remaining after the resistance test (Examples 1 and 3).
- the antireflection coating 60 has an optical thickness equal to 3.2 times the optical thickness of the antireflection coating 20.
- the second series shows that it is possible to obtain an electrode coating consisting of a stack of thin layers and coated with microcrystallized silicon (Example 7) which has a better square resistance R ( - 3 ohms /) and a better performance P (+ 6%) than a TCO electrode coating coated with the same microcrystallized material (Example 5).
- the optical thicknesses of coatings 20 and 60 Example 7 fall within the acceptable ranges for a photovoltaic material 200 ⁇ c-Si according to Table 1 and Table 2.
- the optical thickness of the coating 60 is, however, closer to ⁇ M / 2 of ⁇ c-Si in the table 2 than ⁇ m / 2 of Table 1.
- the square resistance R of the electrode coating consisting of a stack of thin layers and coated with amorphous silicon (Example 8) is also better, but the performance P is less good (-13.1%) than those of TCO electrode coating coated with the same amorphous material (Example 6).
- the optical thicknesses of 345 nm of the coating 60 and 107.6 nm of the coating 20 of Example 8 do not fall within the acceptable ranges of 234-286 nm and 39-91 nm respectively for a photovoltaic material 200.
- -Si according to Table 1 or a fortiori in the acceptable ranges respectively of 239-292 nm and 40-93 for photovoltaic material 200 a-Si according to Table 2.
- the antireflection coating 60 has an optical thickness equal to 4.05 times the optical thickness of the antireflection coating 20.
- the third series shows that it is possible to obtain an electrode coating consisting of a thin film stack coated with amorphous silicon (Example 12 which has a better R-square resistance (-2.9 ohms /) and a better performance P (+ 9.6%) than a coated TCO electrode coating; same amorphous material (Example 10)
- the optical thicknesses of the coatings 20 and 60 of Example 12 fall within the acceptable ranges for an ⁇ -Si photovoltaic material 200 according to Table 1 and Table 2.
- optical thicknesses of the coatings 20 and 60 are however respectively closer to ⁇ M / 8 and ⁇ M / 2 of Table 2 than to ⁇ m / 8 and ⁇ m / 2 of Table 1. These optical thicknesses of coatings 20 and 60 of Example 12 are elsewhere almost identi respectively at the values ⁇ M / 8 and ⁇ M / 2 in Table 2.
- the square resistance R of the electrode layer consisting of a stack of thin layers and coated with microcrystallized silicon is also better, but the performance P is less good (-11.6%) than those of FIG. TCO electrode coating coated with the same microcrystallized material (Example 9).
- the optical thickness of 266 nm of the coating 60 of Example 11 does not fall within the acceptable range of 324-396 nm for a photovoltaic material 200 in ⁇ c-Si according to Table 1, or a fortiori in the acceptable range of 302-369 nm for a photovoltaic material 200 in ⁇ c-Si according to Table 2.
- the optical thicknesses of the coatings 20 and 60 of Example 12 are closer to the ideal theoretical values of a-Si ( respectively of 65 nm and 260 nm considering ⁇ m and 66 nm and 265 nm considering ⁇ M ) than those of example 4 (respectively 72.3 nm and 270.6 nm) and that the performance of the Example 12 is higher (+ 4.8%), with almost identical R-square resistance and with a proportion of thin film stack electrode coating remaining after the PRT resistance test which is almost identical.
- the antireflection coating 20 disposed below the metal functional layer 40 towards the substrate has an optical thickness equal to about one-eighth of the maximum wavelength ⁇ M of the produces the spectrum of absorption of the photovoltaic material by the solar spectrum and that the antireflection coating 60 disposed above the metallic functional layer 40 opposite the substrate has an optical thickness equal to about half the length of the maximum wave ⁇ M of the product of the spectrum of the absorption of the photovoltaic material by the solar spectrum.
- FIG. 6 illustrates a photovoltaic cell 1 in section provided with a front-face substrate 10 according to the invention, through which incident radiation R and a back-face substrate 20 penetrate.
- the photovoltaic material 200 for example amorphous silicon or crystalline silicon or microcrystalline or Cadmium telluride or Diselenide Copper Indium (CuInSe 2 - CIS) or Copper-Indium-Gallium-Selenium, is located between these two substrates . It consists of a layer of n-doped semiconductor material 220 and a p-doped semiconductor material layer 240, which will produce the electric current.
- the electrode coatings 100, 300 interposed respectively between firstly the front-face substrate 10 and the layer of n-doped semiconductor material 220 and secondly between the p-doped semiconductor material layer 240 and the substrate of FIG. rear face 20 complete the electrical structure.
- the electrode coating 300 may be based on silver or aluminum, or may also consist of a thin film stack comprising at least one metallic functional layer and according to the present invention.
- the present invention is described in the foregoing by way of example. It is understood that the skilled person is able to achieve different variants of the invention without departing from the scope of the patent as defined by the claims.
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Abstract
Description
Claims
Applications Claiming Priority (3)
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FR0756767A FR2919429B1 (fr) | 2007-07-27 | 2007-07-27 | Substrat de face avant de cellule photovoltaique et utilisation d'un substrat pour une face avant de cellule photovoltaique |
FR0759182A FR2919430B1 (fr) | 2007-07-27 | 2007-11-20 | Substrat de face avant de cellule photovoltaique et utilisation d'un substrat pour une face avant de cellule photovoltaique. |
PCT/FR2008/051400 WO2009019401A2 (fr) | 2007-07-27 | 2008-07-25 | Substrat de face avant de cellule photovoltaïque et utilisation d'un substrat pour une face avant de cellule photovoltaïque |
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EP2183785A2 true EP2183785A2 (fr) | 2010-05-12 |
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EP08827019A Withdrawn EP2183785A2 (fr) | 2007-07-27 | 2008-07-25 | Substrat de face avant de cellule photovoltaïque et utilisation d'un substrat pour une face avant de cellule photovoltaïque |
EP08827100A Withdrawn EP2183786A2 (fr) | 2007-07-27 | 2008-07-25 | Substrat de face avant de cellule photovoltaïque et utilisation d'un substrat pour une face avant de cellule photovoltaïque |
EP08827143A Withdrawn EP2183787A2 (fr) | 2007-07-27 | 2008-07-25 | Substrat de face avant de cellule photovoltaïque et utilisation d'un substrat pour une face avant de cellule photovoltaïque |
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EP08827100A Withdrawn EP2183786A2 (fr) | 2007-07-27 | 2008-07-25 | Substrat de face avant de cellule photovoltaïque et utilisation d'un substrat pour une face avant de cellule photovoltaïque |
EP08827143A Withdrawn EP2183787A2 (fr) | 2007-07-27 | 2008-07-25 | Substrat de face avant de cellule photovoltaïque et utilisation d'un substrat pour une face avant de cellule photovoltaïque |
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US (3) | US20100269900A1 (fr) |
EP (3) | EP2183785A2 (fr) |
JP (3) | JP2010534930A (fr) |
KR (3) | KR20100046040A (fr) |
CN (3) | CN101809753A (fr) |
BR (3) | BRPI0814171A2 (fr) |
FR (2) | FR2919429B1 (fr) |
MX (3) | MX2010001041A (fr) |
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ZA (3) | ZA201000543B (fr) |
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2007
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2008
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- 2008-07-25 US US12/373,528 patent/US20100269900A1/en not_active Abandoned
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