Classifications

• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• • G—PHYSICS
  • G06—COMPUTING; CALCULATING OR COUNTING
  • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
  • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
  • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
  • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
  • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
  • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
  • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
  • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
  • G06K19/07756—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being non-galvanic, e.g. capacitive
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
  • Y10T156/10—Methods of surface bonding and/or assembly therefor

Definitions

• the invention relates to a method and a device for producing an RFID tag, as well as an RFID tag produced by the method.
• Self-adhesive RFI D labels which contain a printable, sheet or sheet-like cover material which is provided with a pressure-sensitive adhesive layer on its rear side.
• the pressure-sensitive adhesive layer of the cover material is covered by a carrier material, which is removable for adhering the label.
• an RFID inlay is arranged, which consists of a web-shaped or arcuate, provided on the back with a pressure-sensitive adhesive layer inlay material and on the upper side of an RFID chip and an RFID antenna are arranged.
• the RFID inlay is glued with its upper side to the pressure-sensitive adhesive layer of the cover material.
• the German application 10 2006 052 517 describes a chip module for an RFID tag, in which a RFID chip and a coupling antenna electrically connected to the RFID chip are arranged on a web or sheet-shaped carrier material.
• the chip module is provided with glued its carrier film to a flat RFID antenna so positioned that the coupling antenna and the RFID antenna are inductively coupled.
• Another object is to provide an RFID tag that can be produced with less equipment and financial outlay and environmentally friendly from a few recyclable materials.
• Figure 1 shows a manufacturing method for an RFID tag, in which one
• Aluminum foil stamped secondary antenna is used.
• Figure 2 shows a method in which a coupling antenna of a
• Aluminum adhesive composite is used.
• FIG. 3 shows a so-called in-pitch RFID label.
• FIG. 4 shows a section through the label according to FIG. 3.
• FIG. 5 shows a so-called off-pitch RFI D label.
• FIG. 6 shows a section through the label according to FIG. 5.
• a web-shaped substrate 1 is withdrawn in Station 1.5 a, on the upper side of a coupling antenna 2 is glued by means of an adhesive layer 3.
• an RFID chip 4 is fixed, which is galvanically connected to the coupling antenna 2.
• an adhesive layer 5 is arranged, which is covered by a peelable web-shaped separating material 7.
• the carrier material 1 made of paper and the separating material 7 made of a silicone paper are preferred.
• the coupling antennas 2 can also be arranged on a carrier material made of polyester or printed on the carrier material with an aluminum-containing ink.
• the release material 7 is first withdrawn from silicone paper and rolled up in the station 1.5 b.
• the remaining coupling antenna material is fed in the embodiment of Figure 1 a vacuum roller in station 1.9, on which a knife roller 8 is arranged to separate the coupling antennas 2, if necessary.
• an antenna film 9 is unwound, on the upper side of which secondary antennas 10 are glued at regular intervals by means of an adhesive 11.
• the antenna film 9 has on its underside an adhesive layer 12, which is covered by a peelable release material 13, preferably made of silicone paper.
• a coupling antenna 2 with chip 4 cut off from the blade shaft 8 is glued onto each secondary antenna 10.
• the coupling antenna 2 with 4 chip can also be glued endlessly without separation by the blade shaft 8 on the secondary antenna 10 "pitch"
• the self-adhesive secondary antennas 10 fed in via the station 1.4 were produced either by etching, printing or stamping, preferably those described in German patent application 10 2007 026 720 self-adhesive Secondary antennas 10 used, which are punched out of an aluminum foil of 1 .mu.m-20 .mu.m, preferably about 10 .mu.m, and adhered to the front side of an adhesive material 9.
• the adhesive material is provided on its rear side with a pressure-sensitive adhesive layer 12, which is covered by a removable carrier material 13. If these so-called aluminum adhesive antennas are peeled off in the station 1.4, an adhesive material 14 is pulled off in the station 1.2, followed by the station 1.9 in the station 2.4 on the antenna material 9 with the punched-out secondary antenna 10 and the already glued chip module Coupling antenna 2 and chip is laminated.
• the adhesive material 14 consists of a cover material 15 made of paper, which has on its underside an adhesive layer 16, which is covered by a release material 17 made of silicone paper during removal from the roll in station 1.2. Before the lamination, the release material 17 is drawn off in the station 1.1 and rolled up into a roll.
• a self-adhesive, continuous UHF inlay which contains all the components necessary for an RFID label. It can be fed directly to the punching station 2.5, where the cover material 15 is punched out into individual sections, so that on the endless release material 13 a series of spaced apart, peelable and self-adhesive RFI D labels are formed, which are shown in Figures 3 and 4 are.
• the stamping grid obtained as waste during punching is wound up in station 2.2 into a roll.
• the web-shaped release material 13 with the self-adhesive labels thereon is wound up as a final product in station 2.3 into a roll.
• the self-adhesive RFID inlay is dispensed into a larger tag format.
• label material consisting of a printable cover material 18 made of paper, which has an adhesive layer 19 on its rear side, which is covered by a release material 20 made of silicone paper, unrolled from a roll.
• the cover material 18 with the adhesive layer 19 is first separated from the release material 20 in the station 2.7. While the cover material 18 is returned in a large loop, the individual RFID inlays are glued to the release material in station 2.7 so that an RFID inlay is glued for each label depending on the label length.
• the release material 20 with the inlays is then at the beginning of the station 2.5 again with the Cover material 18 connected. There is a contamination of the label material.
• the punching of the individual labels, wherein the silicone paper 20 remains endless and the peeled punched grid is wound in the station 2.2 to a roll.
• the endless silicone paper 20 with the RFID self-adhesive labels adhering thereto is then wound into a roll in the station 2.3.
• each punched RFID tag is checked by means of an RF or UHF reader for its correct function and possibly marked or labeled, for example by means of an ink-jet printer.
• a sheet-shaped aluminum adhesive composite material consisting of a substrate, on the upper side of thin aluminum foil of 1 .mu.m - 20 .mu.m, preferably about 10 .mu.m, punched out thickness
• Coupling antennas 2 are fixed, on each of which an electrically connected to them RFID chip is arranged.
• the back of the substrate 1, which preferably consists of paper, has an adhesive layer 5, which is covered by a release material 7 made of silicone paper.
• the aluminum adhesive composite is withdrawn from a roll in the station 1.5 a of feed rollers and fed to the stripped in station 1.2 adhesive material 14.
• the coupling antennas 2 are glued to the underside of the cover material 15, after the silicone carrier 17 of the adhesive material 14 was withdrawn and wound up in station 1.1.
• the release material 7 is removed from the aluminum adhesive composite of the coupling antennas 2 and wound up in station 1.5 b to form a roll. It is so exposed on the underside of the coupling antennas 2, the adhesive layer 5, then the antenna material 9 "pitch" is moved so that the secondary antenna 10 on the underside of the cover material 15 with the adhesive layer 16 and the adhesive layer 5 of the coupling antenna 2 sticks and an inductive connection is thus produced with the coupling antenna 2 and the secondary antenna 10.
• the separating material 13 of the antenna material 9 is withdrawn and wound up into a reel in station 1.7
• the division into individual RFI D labels and the transfer to the silicone carrier 20 of the label material in station 2.7 is then carried out in the manner described in connection with the method of Figure 1. The same applies to the subsequent contamination, the exchange of the individual labels in the station 2.5, the review of Functioning and winding of the end product into a roll in station 2.3.
• all support materials of the finished paper label and all antennas are made of aluminum. This enables cost-effective and environmentally friendly production because these materials are recyclable and a minimum number of materials are used.
• a continuous pressure-sensitive adhesive layer consists of a pressure-sensitive adhesive. It is thus impossible that occur when sticking the label interference that could be caused by another adhesive for the RFID inlay. Even if the carrier materials are all made of paper, there is no need to stock up on the inlay material for the RFID inlay. It can be separated for the inlay a proportion of the label material. This applies to the complete inlay material, including the carrier materials for the coupling antenna and the secondary antenna.

Landscapes

• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Computer Hardware Design (AREA)
• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Theoretical Computer Science (AREA)
• Details Of Aerials (AREA)
• Credit Cards Or The Like (AREA)
• Making Paper Articles (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=39874892

Family Applications (1)

Country Status (8)

Families Citing this family (9)

Citations (5)

Family Cites Families (28)

• 2007
  • 2007-09-04 DE DE102007041751.0A patent/DE102007041751B4/de not_active Expired - Fee Related
• 2008
  • 2008-08-01 US US12/593,947 patent/US8368538B2/en active Active
  • 2008-08-01 WO PCT/EP2008/006343 patent/WO2009030325A1/de active Application Filing
  • 2008-08-01 KR KR1020097019936A patent/KR101597365B1/ko active IP Right Grant
  • 2008-08-01 EP EP08785284A patent/EP2183707A1/de not_active Withdrawn
  • 2008-08-01 JP JP2010523292A patent/JP5496093B2/ja not_active Expired - Fee Related
  • 2008-08-01 CN CN200880012466.6A patent/CN101681444B/zh not_active Expired - Fee Related
  • 2008-08-01 CA CA2696091A patent/CA2696091A1/en not_active Abandoned

Patent Citations (5)

Non-Patent Citations (1)

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