EP2127810A1 - Verfahren und Vorrichtung zum beidseitigen Polieren von Halbleiterscheiben - Google Patents

Verfahren und Vorrichtung zum beidseitigen Polieren von Halbleiterscheiben Download PDF

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Publication number
EP2127810A1
EP2127810A1 EP09161077A EP09161077A EP2127810A1 EP 2127810 A1 EP2127810 A1 EP 2127810A1 EP 09161077 A EP09161077 A EP 09161077A EP 09161077 A EP09161077 A EP 09161077A EP 2127810 A1 EP2127810 A1 EP 2127810A1
Authority
EP
European Patent Office
Prior art keywords
wafers
grinding
semiconductor wafers
area
centers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP09161077A
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English (en)
French (fr)
Other versions
EP2127810B1 (de
Inventor
Yasunori Yamada
Kazushige Takaishi
Yuichi Kakizono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumco Corp
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Sumco Corp
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Publication date
Application filed by Sumco Corp filed Critical Sumco Corp
Publication of EP2127810A1 publication Critical patent/EP2127810A1/de
Application granted granted Critical
Publication of EP2127810B1 publication Critical patent/EP2127810B1/de
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/28—Work carriers for double side lapping of plane surfaces
EP09161077A 2008-05-28 2009-05-26 Verfahren und Vorrichtung zum beidseitigen Polieren von Halbleiterscheiben Not-in-force EP2127810B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008139963A JP2009285768A (ja) 2008-05-28 2008-05-28 半導体ウェーハの研削方法および研削装置

Publications (2)

Publication Number Publication Date
EP2127810A1 true EP2127810A1 (de) 2009-12-02
EP2127810B1 EP2127810B1 (de) 2011-07-20

Family

ID=41009313

Family Applications (1)

Application Number Title Priority Date Filing Date
EP09161077A Not-in-force EP2127810B1 (de) 2008-05-28 2009-05-26 Verfahren und Vorrichtung zum beidseitigen Polieren von Halbleiterscheiben

Country Status (4)

Country Link
US (1) US20090298397A1 (de)
EP (1) EP2127810B1 (de)
JP (1) JP2009285768A (de)
AT (1) ATE516923T1 (de)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110193761A (zh) * 2019-06-05 2019-09-03 广州佶兔工业设计有限公司 一种磨砂面塑料材料
CN110253370A (zh) * 2019-06-28 2019-09-20 李文裔 一种电压力锅内缸上口翻边圆周抛光装置
CN111633496A (zh) * 2020-06-12 2020-09-08 吴信任 一种离合器传动轴智能加工处理系统

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010013519B4 (de) 2010-03-31 2012-12-27 Siltronic Ag Verfahren zum Polieren einer Halbleiterscheibe
DE102010063179B4 (de) 2010-12-15 2012-10-04 Siltronic Ag Verfahren zur gleichzeitigen Material abtragenden Bearbeitung beider Seiten mindestens dreier Halbleiterscheiben
KR101285897B1 (ko) 2012-02-28 2013-07-12 주식회사 엘지실트론 웨이퍼 연마장치 및 웨이퍼를 연마하는 방법
TWI465317B (zh) * 2012-06-25 2014-12-21 Sumco Corp 工作件的硏磨方法及工作件的硏磨裝置
JP6056793B2 (ja) * 2014-03-14 2017-01-11 信越半導体株式会社 両面研磨装置用キャリアの製造方法及び両面研磨方法
CN111261542A (zh) * 2018-11-30 2020-06-09 有研半导体材料有限公司 一种碱腐蚀去除晶圆表面损伤的装置与方法
CN109926873B (zh) * 2019-01-25 2023-07-21 辽宁科技大学 一种用于非导磁薄板类零件的研磨抛光装置及方法
CN113231957A (zh) * 2021-04-29 2021-08-10 金华博蓝特电子材料有限公司 基于双面研磨设备的晶片研磨工艺及半导体晶片
CN113894635B (zh) * 2021-11-03 2022-06-21 安徽格楠机械有限公司 基于自学习的智能硅基晶圆超精密研磨抛光机
CN116394092B (zh) * 2023-04-20 2023-09-29 恒亦达智能设备(苏州)有限公司 一种全自动半导体研磨设备
CN117532480B (zh) * 2023-11-14 2024-04-16 苏州博宏源机械制造有限公司 一种晶圆双面抛光机的太阳轮调节装置

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US4996798A (en) * 1989-05-31 1991-03-05 Moore Steven C Ultra-precision lapping apparatus
JP2002254299A (ja) 2001-02-26 2002-09-10 Sumitomo Metal Ind Ltd ウエーハ研磨方法
JP2009004616A (ja) 2007-06-22 2009-01-08 Sumco Corp 半導体ウェーハ研磨装置および研磨方法

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US6080042A (en) * 1997-10-31 2000-06-27 Virginia Semiconductor, Inc. Flatness and throughput of single side polishing of wafers
JPH11254304A (ja) * 1998-03-10 1999-09-21 Super Silicon Kenkyusho:Kk センサを組み込んだ定盤
JPH11333707A (ja) * 1998-05-26 1999-12-07 Toshiba Ceramics Co Ltd キャリア
JP4384742B2 (ja) * 1998-11-02 2009-12-16 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 半導体ウェーハのラッピング装置及びラッピング方法
DE10023002B4 (de) * 2000-05-11 2006-10-26 Siltronic Ag Satz von Läuferscheiben sowie dessen Verwendung
JP2002046058A (ja) * 2000-08-02 2002-02-12 Super Silicon Kenkyusho:Kk 両面研磨用研磨布のドレッシング方法
DE10060697B4 (de) * 2000-12-07 2005-10-06 Siltronic Ag Doppelseiten-Polierverfahren mit reduzierter Kratzerrate und Vorrichtung zur Durchführung des Verfahrens
DE10132504C1 (de) * 2001-07-05 2002-10-10 Wacker Siltronic Halbleitermat Verfahren zur beidseitigen Material abtragenden Bearbeitung von Halbleiterscheiben und seine Verwendung
EP1489649A1 (de) * 2002-03-28 2004-12-22 Shin-Etsu Handotai Co., Ltd Doppelseitige poliereinrichtung für einen wafer und doppelseitiges polierverfahren
JP2004058201A (ja) * 2002-07-29 2004-02-26 Hoya Corp ワークの研磨方法および電子デバイス用基板の製造方法
JP2004071833A (ja) * 2002-08-06 2004-03-04 Sumitomo Mitsubishi Silicon Corp 半導体ウェーハの両面研磨方法
KR100797734B1 (ko) * 2003-12-05 2008-01-24 가부시키가이샤 섬코 편면 경면 웨이퍼의 제조 방법
JP4343020B2 (ja) * 2003-12-22 2009-10-14 株式会社住友金属ファインテック 両面研磨方法及び装置
JP4198607B2 (ja) * 2004-01-13 2008-12-17 Ｈｏｙａ株式会社 磁気ディスク用ガラス基板の製造方法及び磁気ディスクの製造方法
JP2005238413A (ja) * 2004-02-27 2005-09-08 Yachiyo Microscience Inc ラップ盤用回転定盤
JP4860192B2 (ja) * 2004-09-03 2012-01-25 株式会社ディスコ ウェハの製造方法
JP4727218B2 (ja) * 2004-12-10 2011-07-20 株式会社住友金属ファインテック 両面研磨用キャリア
DE102006032455A1 (de) * 2006-07-13 2008-04-10 Siltronic Ag Verfahren zum gleichzeitigen beidseitigen Schleifen mehrerer Halbleiterscheiben sowie Halbleierscheibe mit hervorragender Ebenheit

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4996798A (en) * 1989-05-31 1991-03-05 Moore Steven C Ultra-precision lapping apparatus
JP2002254299A (ja) 2001-02-26 2002-09-10 Sumitomo Metal Ind Ltd ウエーハ研磨方法
JP2009004616A (ja) 2007-06-22 2009-01-08 Sumco Corp 半導体ウェーハ研磨装置および研磨方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110193761A (zh) * 2019-06-05 2019-09-03 广州佶兔工业设计有限公司 一种磨砂面塑料材料
CN110253370A (zh) * 2019-06-28 2019-09-20 李文裔 一种电压力锅内缸上口翻边圆周抛光装置
CN111633496A (zh) * 2020-06-12 2020-09-08 吴信任 一种离合器传动轴智能加工处理系统
CN111633496B (zh) * 2020-06-12 2022-02-18 上海伟奕传动轴配件有限公司 一种离合器传动轴智能加工处理系统

Also Published As

Publication number Publication date
US20090298397A1 (en) 2009-12-03
ATE516923T1 (de) 2011-08-15
EP2127810B1 (de) 2011-07-20
JP2009285768A (ja) 2009-12-10

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