EP2089838A2 - Module de puce pour un système rfid - Google Patents

Module de puce pour un système rfid

Info

Publication number
EP2089838A2
EP2089838A2 EP07819018A EP07819018A EP2089838A2 EP 2089838 A2 EP2089838 A2 EP 2089838A2 EP 07819018 A EP07819018 A EP 07819018A EP 07819018 A EP07819018 A EP 07819018A EP 2089838 A2 EP2089838 A2 EP 2089838A2
Authority
EP
European Patent Office
Prior art keywords
rfid
antenna
coupling
chip
label
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07819018A
Other languages
German (de)
English (en)
Inventor
Martin Bohn
Harry Nitschko
Kai Schaffrath
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bielomatik Leuze GmbH and Co KG
Original Assignee
Bielomatik Leuze GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bielomatik Leuze GmbH and Co KG filed Critical Bielomatik Leuze GmbH and Co KG
Publication of EP2089838A2 publication Critical patent/EP2089838A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/04—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the shape
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07756—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being non-galvanic, e.g. capacitive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2208—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems
    • H01Q1/2225—Supports; Mounting means by structural association with other equipment or articles associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • RFID labels are known manner prepared so that a so-called RFID inlay between the sheet-like, provided on the bottom with a pressure-sensitive adhesive layer covering material and a likewise web-shaped carrier material is arranged, which is removable from the pressure-sensitive adhesive layer.
  • the RFID inlay contains a RFID chip mounted on a flat antenna and electrically connected thereto, the RFID antenna being arranged on an antenna foil. It is known to attach the chip modules for processing in a row in succession on strips and thus supply the RFID antennas during processing. Each microchip with its two connection contacts is then removed from the strip and glued to the RFID antenna so that its connection contacts have galvanic contact with the contacts of the RFID antenna.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Details Of Aerials (AREA)
  • Credit Cards Or The Like (AREA)
  • Support Of Aerials (AREA)

Abstract

L'invention concerne un module de puce pour un système RFID, notamment pour une étiquette RFID, une étiquette de couplage à utiliser dans une étiquette RFID, un insert RFID pour une étiquette RFID, et une étiquette RFID fabriquée au moyen d'un insert RFID, disposée sur un matériau support en forme de bande (5, 8), notamment sur une pellicule support, une puce RFID (3) et une antenne de couplage (4) connectée électriquement, notamment galvaniquement, à la puce RFID (3), étant disposées sur la pellicule support.
EP07819018A 2006-11-06 2007-10-16 Module de puce pour un système rfid Withdrawn EP2089838A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006052517A DE102006052517A1 (de) 2006-11-06 2006-11-06 Chipmodul für ein RFID-System
PCT/EP2007/008948 WO2008055579A2 (fr) 2006-11-06 2007-10-16 Module de puce pour un système rfid

Publications (1)

Publication Number Publication Date
EP2089838A2 true EP2089838A2 (fr) 2009-08-19

Family

ID=39264964

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07819018A Withdrawn EP2089838A2 (fr) 2006-11-06 2007-10-16 Module de puce pour un système rfid

Country Status (16)

Country Link
US (1) US9324017B2 (fr)
EP (1) EP2089838A2 (fr)
JP (1) JP5355410B2 (fr)
KR (1) KR101417163B1 (fr)
CN (1) CN101589403A (fr)
AU (1) AU2007316980A1 (fr)
BR (1) BRPI0718246A2 (fr)
CA (1) CA2668973A1 (fr)
DE (1) DE102006052517A1 (fr)
IL (1) IL198527A0 (fr)
MX (1) MX2009004451A (fr)
MY (1) MY154917A (fr)
NZ (1) NZ577472A (fr)
RU (1) RU2452016C2 (fr)
WO (1) WO2008055579A2 (fr)
ZA (1) ZA200903097B (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2183707A1 (fr) * 2007-09-04 2010-05-12 Bielomatik Leuze Gmbh + Co. Kg Procédé et dispositif de fabrication d'une étiquette rfid

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10068167B2 (en) * 2002-07-09 2018-09-04 Smartrac Technology Fletcher, Inc. Transparent radio frequency identification transponder
DE102006052517A1 (de) * 2006-11-06 2008-05-08 Bielomatik Leuze Gmbh + Co.Kg Chipmodul für ein RFID-System
DE102007041752A1 (de) 2007-09-04 2009-03-05 Bielomatik Leuze Gmbh + Co Kg Chipmodul für ein RFID-System
DE102008024825A1 (de) 2008-05-23 2009-12-03 Smartrac Ip B.V. Antennenanordnung für die Chipkartenherstellung
DE102008024790A1 (de) 2008-05-23 2009-12-10 Smartrac Ip B.V. Antennenanordnung für eine Chipkarte
CN101459273B (zh) * 2008-12-24 2014-10-22 瑞化股份有限公司 无线射频识别询答器之天线构造及其制造方法
US8593256B2 (en) * 2009-06-23 2013-11-26 Avery Dennison Corporation Washable RFID device for apparel tracking
DE102010025774A1 (de) * 2010-07-01 2012-01-05 Giesecke & Devrient Gmbh Verfahren zur Herstellung eines Inlays für einen tragbaren Datenträger und Inlay
EP2432074A1 (fr) * 2010-09-21 2012-03-21 Printechnologics GmbH Bloc doté d'au moins une antenne dipôle UHF
DE202011004331U1 (de) * 2011-03-23 2011-06-09 Flexo-Print Bedienfelder GmbH, 33154 Transpondertag
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
TWI453677B (zh) * 2011-12-01 2014-09-21 Mutual Pak Technology Co Ltd 射頻識別標籤與具有其之衣物
USD703208S1 (en) * 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
US9172130B2 (en) * 2013-03-13 2015-10-27 Avery Dennison Corporation RFID inlay incorporating a ground plane
CN107431277B (zh) * 2015-04-21 2021-02-19 东洋制罐集团控股株式会社 Rf标签
CN110431559B (zh) * 2016-09-09 2023-09-19 香港物流及供应链管理应用技术研发中心 射频通信设备及其使用方法
SE543748C2 (en) * 2019-11-08 2021-07-13 Stora Enso Oyj Rfid label
CN111738393A (zh) * 2020-07-24 2020-10-02 江苏科睿坦电子科技有限公司 一种rfid智能标签及其制作工艺
DE102021131911B3 (de) 2021-08-30 2022-10-06 Bw Papersystems Stuttgart Gmbh RFID-Konvertierungsanlage und Steuerungsverfahren für eine Mehrzahl von Inlay-Spendemodulen
EP4339833A1 (fr) * 2022-09-19 2024-03-20 Assa Abloy AB Ensemble rfid

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020036237A1 (en) * 2000-07-28 2002-03-28 Mikoh Corporation Materials and construction for a tamper indicating radio frequency identification label
US20060000915A1 (en) * 2004-07-01 2006-01-05 Intermec Lp Corp. RFID tag and method of manufacture

Family Cites Families (60)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7158031B2 (en) * 1992-08-12 2007-01-02 Micron Technology, Inc. Thin, flexible, RFID label and system for use
JPH10293828A (ja) * 1997-04-18 1998-11-04 Omron Corp データキャリア、コイルモジュール、リーダライタ及び衣服データ取得方法
CN1179295C (zh) 1997-11-14 2004-12-08 凸版印刷株式会社 复合ic模块及复合ic卡
US6107920A (en) * 1998-06-09 2000-08-22 Motorola, Inc. Radio frequency identification tag having an article integrated antenna
US6140146A (en) 1999-08-03 2000-10-31 Intermec Ip Corp. Automated RFID transponder manufacturing on flexible tape substrates
FR2801709B1 (fr) * 1999-11-29 2002-02-15 A S K Carte a puce sans contact ou hybride contact-sans contact permettant de limiter les risques de fraude
US6951596B2 (en) * 2002-01-18 2005-10-04 Avery Dennison Corporation RFID label technique
US7095324B2 (en) * 2001-03-06 2006-08-22 Intermec Ip Corp Tamper evident smart label with RF transponder
JP2002308437A (ja) * 2001-04-16 2002-10-23 Dainippon Printing Co Ltd Ｒｆｉｄタグを用いた検査システム
JP4770065B2 (ja) * 2001-06-06 2011-09-07 大日本印刷株式会社 意匠性の高いｒｆｉｄタグ、およびその製造方法
BR0215271A (pt) * 2001-12-21 2004-10-19 Giesecke & Devrient Gmbh Material em folha e aparelhos e métodos para produzir e processar esse material em folha
US6937153B2 (en) * 2002-06-28 2005-08-30 Appleton Papers Inc. Thermal imaging paper laminate
GB2393076A (en) * 2002-09-12 2004-03-17 Rf Tags Ltd Radio frequency identification tag which has a ground plane not substantially larger than the area spanned by the patch antenna
DE10258670A1 (de) * 2002-12-13 2004-06-24 Giesecke & Devrient Gmbh Transponder zur berührungslosen Übertragung von Daten
US7224280B2 (en) * 2002-12-31 2007-05-29 Avery Dennison Corporation RFID device and method of forming
US6940408B2 (en) * 2002-12-31 2005-09-06 Avery Dennison Corporation RFID device and method of forming
US7242996B2 (en) * 2003-03-25 2007-07-10 Id Solutions, Inc. Attachment of RFID modules to antennas
JP4236971B2 (ja) * 2003-03-28 2009-03-11 トッパン・フォームズ株式会社 非接触型情報記録媒体の製造方法
JP4236974B2 (ja) * 2003-03-28 2009-03-11 トッパン・フォームズ株式会社 非接触型情報記録媒体
US7398054B2 (en) * 2003-08-29 2008-07-08 Zih Corp. Spatially selective UHF near field microstrip coupler device and RFID systems using device
WO2005022443A2 (fr) * 2003-08-29 2005-03-10 Mikoh Corporation Etiquette d'identification radiofrequence inviolable
JP2005198168A (ja) * 2004-01-09 2005-07-21 Toppan Forms Co Ltd 非接触型情報記録媒体及びこれを用いたラベル
DE102004006457A1 (de) * 2004-02-04 2005-08-25 Bielomatik Leuze Gmbh + Co Kg Verfahren und Vorrichtung zum kontinuierlichen Herstellen elektronischer Folienbauteile
US7057562B2 (en) * 2004-03-11 2006-06-06 Avery Dennison Corporation RFID device with patterned antenna, and method of making
NL1025869C2 (nl) * 2004-04-02 2005-10-05 Capturetech Benelux B V Samenstel van kluis en daarbij te gebruiken verzegelbare flexibele waardehouders.
US7098794B2 (en) * 2004-04-30 2006-08-29 Kimberly-Clark Worldwide, Inc. Deactivating a data tag for user privacy or tamper-evident packaging
US7151455B2 (en) 2004-04-30 2006-12-19 Kimberly-Clark Worldwide, Inc. Activating a data tag by load or orientation or user control
US7549591B2 (en) * 2004-06-28 2009-06-23 International Barcode Corporation Combined multi-frequency electromagnetic and optical communication system
US20060012482A1 (en) * 2004-07-16 2006-01-19 Peter Zalud Radio frequency identification tag having an inductively coupled antenna
US20060055541A1 (en) * 2004-08-19 2006-03-16 Frederick Bleckmann RFID tag having a silicon micro processing chip for radio frequency identification and a method of making the same
US20060044769A1 (en) * 2004-09-01 2006-03-02 Forster Ian J RFID device with magnetic coupling
US7158033B2 (en) * 2004-09-01 2007-01-02 Avery Dennison Corporation RFID device with combined reactive coupler
RU44855U1 (ru) * 2004-11-23 2005-03-27 Лагутин Юрий Геннадьевич Система идентификации материальных объектов, маркированный материальный объект и комплект средств маркировки материального объекта
US7417550B2 (en) * 2004-12-20 2008-08-26 3M Innovative Properties Company Environmentally friendly radio frequency identification (RFID) labels and methods of using such labels
JP2006287660A (ja) * 2005-03-31 2006-10-19 Tdk Corp アンテナ装置
US20060238989A1 (en) * 2005-04-25 2006-10-26 Delaware Capital Formation, Inc. Bonding and protective method and apparatus for RFID strap
US20070040686A1 (en) * 2005-08-16 2007-02-22 X-Cyte, Inc., A California Corporation RFID inlays and methods of their manufacture
DE102005042444B4 (de) * 2005-09-06 2007-10-11 Ksw Microtec Ag Anordnung für eine RFID - Transponder - Antenne
RU54690U1 (ru) * 2005-10-03 2006-07-10 Владимир Владимирович Ручкин Рекламная сборка
CN101385202A (zh) * 2005-12-14 2009-03-11 堪萨斯州立大学 射频识别装置用的微带天线
US20070146135A1 (en) * 2005-12-27 2007-06-28 David Boyadjieff Assembling RFID components using webs
US7391325B2 (en) * 2006-01-13 2008-06-24 Honeywell International Inc. Multifunctional multichip system for wireless sensing
EP1821241A3 (fr) * 2006-02-15 2008-07-23 Assa Abloy AB Unité de transpondeur sans contact à fréquence hybride, module pour celle-ci et procédé de fabrication de celle-ci
US9146564B2 (en) * 2006-03-06 2015-09-29 Deka Products Limited Partnership Product dispensing system
US20070210924A1 (en) * 2006-03-10 2007-09-13 Wavezero, Inc. RFID Smart Label with Reduced Layers and Method of Production
US8031127B2 (en) * 2006-04-03 2011-10-04 Panasonic Corporation Semiconductor memory module incorporating antenna
DE602006018202D1 (de) * 2006-05-12 2010-12-23 Confidex Oy Verfahren zur herstellung von transponder umfassenden produkten
US7954722B2 (en) * 2006-05-30 2011-06-07 Hitachi, Ltd. IC tag and inlet for IC tag
US7808384B2 (en) * 2006-07-14 2010-10-05 Eyes Open Corporation Information carrier arrangement, washable textile goods and electronic ear tag for living beings
US8286332B2 (en) * 2006-09-26 2012-10-16 Hid Global Gmbh Method and apparatus for making a radio frequency inlay
US8322624B2 (en) * 2007-04-10 2012-12-04 Feinics Amatech Teoranta Smart card with switchable matching antenna
US7546671B2 (en) * 2006-09-26 2009-06-16 Micromechanic And Automation Technology Ltd. Method of forming an inlay substrate having an antenna wire
DE102006052517A1 (de) * 2006-11-06 2008-05-08 Bielomatik Leuze Gmbh + Co.Kg Chipmodul für ein RFID-System
US7701352B2 (en) * 2006-11-22 2010-04-20 Avery Dennison Corporation RFID label with release liner window, and method of making
US8026818B2 (en) * 2006-12-20 2011-09-27 Checkpoint Systems, Inc. EAS and UHF combination tag
DE102007041751B4 (de) * 2007-09-04 2018-04-19 Bielomatik Leuze Gmbh + Co. Kg Verfahren und Vorrrichtung zur Herstellung eines RFID-Etiketts
DE102007041752A1 (de) * 2007-09-04 2009-03-05 Bielomatik Leuze Gmbh + Co Kg Chipmodul für ein RFID-System
US20100097280A1 (en) * 2008-10-20 2010-04-22 Smartrac Ip B.V. Transponder device
EP2182471A1 (fr) * 2008-11-03 2010-05-05 Schreiner Group GmbH & Co. KG Etiquette de transpondeur sur une surface métallique et procédé destiné à l'agencement d'une étiquette de transpondeur sur une surface métallique
EP2472438B1 (fr) * 2009-08-26 2019-05-08 Toppan Printing Co., Ltd. Support de communication sans contact

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020036237A1 (en) * 2000-07-28 2002-03-28 Mikoh Corporation Materials and construction for a tamper indicating radio frequency identification label
US20060000915A1 (en) * 2004-07-01 2006-01-05 Intermec Lp Corp. RFID tag and method of manufacture

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2183707A1 (fr) * 2007-09-04 2010-05-12 Bielomatik Leuze Gmbh + Co. Kg Procédé et dispositif de fabrication d'une étiquette rfid

Also Published As

Publication number Publication date
WO2008055579A3 (fr) 2008-06-26
AU2007316980A1 (en) 2008-05-15
JP2010508794A (ja) 2010-03-18
MX2009004451A (es) 2009-05-11
ZA200903097B (en) 2010-03-31
KR101417163B1 (ko) 2014-07-08
MY154917A (en) 2015-08-28
BRPI0718246A2 (pt) 2014-01-07
WO2008055579A2 (fr) 2008-05-15
DE102006052517A1 (de) 2008-05-08
RU2452016C2 (ru) 2012-05-27
IL198527A0 (en) 2010-02-17
NZ577472A (en) 2012-04-27
US9324017B2 (en) 2016-04-26
JP5355410B2 (ja) 2013-11-27
US20100032487A1 (en) 2010-02-11
CN101589403A (zh) 2009-11-25
RU2009121443A (ru) 2010-12-20
KR20090079196A (ko) 2009-07-21
CA2668973A1 (fr) 2008-05-15

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