WO2007006401A1 - Procede et dispositif de production d'etiquettes rfid - Google Patents

Procede et dispositif de production d'etiquettes rfid Download PDF

Info

Publication number
WO2007006401A1
WO2007006401A1 PCT/EP2006/005947 EP2006005947W WO2007006401A1 WO 2007006401 A1 WO2007006401 A1 WO 2007006401A1 EP 2006005947 W EP2006005947 W EP 2006005947W WO 2007006401 A1 WO2007006401 A1 WO 2007006401A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive layer
cylinder
carrier material
rfid tags
cutting
Prior art date
Application number
PCT/EP2006/005947
Other languages
German (de)
English (en)
Inventor
Michael Bisges
Original Assignee
Arccure Technologies Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arccure Technologies Gmbh filed Critical Arccure Technologies Gmbh
Publication of WO2007006401A1 publication Critical patent/WO2007006401A1/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna

Definitions

  • the invention relates to a method and an arrangement for the production of RFID tags with a contact-containing electronic component whose contacts are connected to an electrically conductive layer, wherein the conductive layer serves as an antenna.
  • RFID Radio Frequency Identification
  • the data acquisition system consists of a read / write unit, which is used to query the information of the RFID tags and to store the information in the RFID tag.
  • the RFID tag is used to identify goods or people; It consists of a chip with integrated processor, an antenna and a memory.
  • the RFID tags are available in various forms, such as labels, stickers or plastic cards. There is a distinction between active and passive RFID tags.
  • the data of the RFID tag are actively sent from the chip via a radio frequency or passively read by the reader. Depending on the characteristics, ranges of 20 centimeters to several meters are possible.
  • the data from the RFID tag can not only be read out, but can also be changed, provided that an RFID writing instrument is additionally provided.
  • RFID technology An important area of application of RFID technology currently lies in the logistics and warehouse management of retailers.
  • the participating suppliers are initially equipped with pallets on which RFID tags are attached.
  • the RFID readers installed at the goods in and out of the participating locations. They record the electronic product code that is stored on the chip and transmit it to the merchandise management system.
  • Each shipping unit can be uniquely identified using this number code. Therefore, with RFID technology, it is possible to comprehensively track and control the path of the goods along the entire process chain - right through to the warehousing of the respective market or department store.
  • Investigations on the use of RFID technology in the retail sector have shown that the availability of goods is increasing significantly: Clearance sales dropped by nine to 14 percent. The shrinkage of goods has also been reduced by up to 18 percent.
  • RFID tags are produced by printing conductive ink or ink onto a substrate, such as a film or paper web.
  • the conductive ink forms the antenna.
  • the ink consists of a mixture of solvent and metal particles. The electrical conductivity of such inks is not optimal because the contacting of the individual metal particles with one another is insufficient.
  • EP 1 302895 A 2 proposes that the conductive ink be printed on a coating having an additive that lowers the surface tension. The Coating is applied to the substrate in a pattern before the conductive ink is applied. Due to the difference in the surface tension between the coating and the substrate, the conductive ink flows away from the coating and forms the antenna of the RFID tag.
  • the Fraunhofer Microelectronics Alliance specifies that the antenna and the chip are manufactured and used together with the same technology Can print paper or foil. As realization possibility, the polymer electronics is specified.
  • Antenna structures are set narrow limits, so that a mass cheap production of RFID tags in this way is not promising.
  • the invention has for its object to provide a method that allows an inexpensive and mass production of RFID tags.
  • the contacts of each electronic component are positioned on the conductive layer by means of the tool during dicing, such that the contacts are connected to regions of an antenna which are separated from each other by at least one interruption contact forming portion of the conductive layer.
  • the electrically conductive layer on the substrate such as a film or paper web, but not as in the conventional
  • the electrically conductive layer can be applied over the entire surface and the generation of an interruption only take place immediately before the cutting by means of a laser or a cutting tool.
  • the conductive layer consists for example of gold, silver, aluminum, copper or conductive polymers.
  • Antenna structure of the RFID tag formed.
  • the cut line in the conductive layer crosses the nonconductive break, so that the antenna is divided into two sections.
  • the non-conductive interruption is the area in which the electronic component is mounted by the tool.
  • the contacts of the device are thereby positioned by the cutting tool so that they rest on the separated by the interruption areas of the antenna.
  • both the planar carrier material and the electrically conductive layer arranged on the carrier material are introduced into the antennas by means of the cutting tool the RFID tag forming sections parts.
  • the cutting height of the tool must correspond at least to the thickness of the planar carrier material provided with the electrically conductive layer.
  • An alternative two-stage process is characterized in that after the cutting of the conductive layer and the positioning of the electronic component, the antenna-forming sections are detached from the carrier material and transferred to a self-adhesive additional carrier material.
  • the cutting edges of the tool only divide the conductive layer, but they can also penetrate slightly into the substrate without splitting it.
  • a deflection for the carrier material is arranged in the direction of movement of the carrier material behind the cutting-bearing cylinder. The deflection angle is determined so that due to the different flexural rigidity of the conductive layer on the one hand and the carrier material on the other hand, a detachment of the conductive layer.
  • a highly flexible film is preferably used for the carrier material, against which the metallic layer has a higher intrinsic stiffness and therefore peels off in the region of the deflection.
  • the RFID tag is transferred to a self-adhesive film web.
  • the electrically conductive layer on the carrier material with at least one not conductive linear interruption is applied, which runs in the direction of movement of the carrier material.
  • the chips are positioned by the cylinder carrying the blades and contacted with the separate portions of the antenna.
  • Contact spacing of the chips must be greater than or equal to the width of the line break.
  • the required contact spacing can be ensured with small chip size by contact lugs - so-called Straps-.
  • the position fixation of the chips positioned by the cutting tool takes place on the one hand by a slight penetration of the contacts into the conductive layer, but in particular by applying an electrically conductive adhesive to the surface of each chip coming into contact with the antenna surface and its contacts prior to its positioning. Additionally or alternatively, adhesive may be applied at least in the region of the nonconductive break before the chip is positioned.
  • the adhesive is preferably dried by means of electromagnetic radiation. Due to the short curing times, UV-curing adhesives are ideal, which can be dried with a UV lamp. Also advantageous are cationic UV adhesives in which the curing reaction by means of UV irradiation immediately before the joining of the
  • Adhesive parts is started and only after joining the complete curing takes place.
  • a protective coating in particular as a thick film, is applied to the conductive layer .
  • the magazine for the chip to be supplied during the dicing is either arranged in the pragment cylinder itself or fixed on its outer circumference.
  • the insertion of the chips from the stationary magazine can be carried out either during slow rotation of the embossing cylinder or intermittent rotation of the cylinder in the standstill phase.
  • the chips are successively inserted into the distributed over the circumference of Pragezylinders shots.
  • As a means for holding and ejecting the chip from each recording are pneumatic, but also mechanical solutions into consideration.
  • the holding of the chip can be done for example by means of negative pressure, the ejection by means of overpressure. Mechanically, the chip can be held over a clamping process and ejected via a plunger.
  • Carrier material is carried out with the cylinder carrying the cutting edges, which rolls on the moving carrier material with the electrically conductive layer.
  • the moving carrier material is preferably a guided from roll to roll film web. Alternatively, however, individual sheets can also be processed in a continuous process.
  • an abutment supporting the carrier material is arranged opposite the cylinder carrying the cutting edges.
  • the anvil may be designed in the form of a counter-rotating cylinder resting against the uncoated side of the carrier material or a sliding surface in the region of the engagement of the cutting edges.
  • the adhesive applicator roll is arranged axially parallel to the cylinder carrying the cutting edges.
  • the jacket of the adhesive applicator roll touches the cylinder jacket at least in the region of each receptacle.
  • the adhesive can be in the form of a drop on the surface of the chips.
  • a radiation source for the drying of the adhesive is preferably arranged in the direction of rotation of the cylinder behind the adhesive application roller. This stimulates a so-called cationic reaction in the adhesive, as a result of which complete curing takes place only after a time delay after the adhesive surfaces have been joined together.
  • Figures 1, 2 is a schematic representation of an arrangement for carrying out the method according to the invention as a two-stage process.
  • Figure 5 is a schematic representation of an arrangement for carrying out the method according to the invention as a single-stage process.
  • the arrangement generally designated (1) for carrying out the method according to the invention consists essentially of a cylinder (3) carrying cutting (2), a cylinder (4) serving as an abutment, a magazine (5) for the chips (6) in the direction of rotation of the cylinder (3) behind the magazine (5) arranged adhesive applicator roll (7) and in the rotational direction of the cylinder (3) behind the adhesive applicator roll (7) arranged radiation source (8).
  • a film web is guided, which consists of a carrier material (9) made of plastic and an electrically conductive layer (11) arranged on the carrier material (9) ), for example made of aluminum, silver or copper.
  • the conductive layer (11) is applied to the carrier material (9) with a linear interruption (12). The interruption is in the middle of the film web which is moved in the direction of the arrow (13) between the cylinders (3, 4).
  • the width of the cylinder (3, 4) corresponds approximately to the width of the film web.
  • a deflection (14) which serves as a detachment edge for the electrically conductive layer (11).
  • a guide (15) which removes the RFID tags (16) which detach from the carrier material (9) and are cut out of the conductive layer onto a film web (17) coated with adhesive on the upper side. transfers the isolated RFID tags (16) in the direction of the arrow (18).
  • the wedge-shaped cutting edges (2) projecting beyond the cylinder jacket (19) of the cylinder (3) correspond in plan view to the cylinder (3), the cutting line (21) introduced by them into the conductive layer (11). the contour of the RFID tag (16) forms (see Figure 1 B)).
  • the magazine (5) for the chips (6) arranged on the outer circumference of the cylinder (3) fills the receptacles (22) arranged in the cylinder jacket (19) during the rotation of the cylinder (3) with chips (6).
  • the chips have contact lugs (23) - so-called straps - which are clearly recognizable, in particular in FIG. 1 B).
  • the chips (6) with their contact lugs (23) are stored in the magazine (5) as a roller (24).
  • Rotary feedthrough (25) for underpressure or overpressure.
  • Rotary feedthrough (25) leads to each receptacle (22) a line (26) for ejecting or picking up the chips (6).
  • an electrically conductive adhesive is first applied to the underside of the chip having the contacts and to the contact lugs (23) with the aid of the adhesive application roller (7), which is subsequently exposed by the UV radiation source (8 ) is excited and hardened.
  • the adhesive-coated surface due to the further rotation of the cylinder (3), reaches the interruption 12 in the surface of the conductive
  • FIG. 1 B shows a plan view of the antenna which is cut out of the electrically conductive layer (11) by means of the cutting edges (2).
  • the height of the cutting edges (2) is slightly larger than the thickness of the electrically conductive layer (11). This ensures that even with a slightly fluctuating thickness of the electrically conductive layer (11) a secure division of the electrically conductive layer is ensured.
  • FIG. 2 A) shows a plan view of the cylinder jacket (19) of the cylinder (3). From this view, a complete cutting edge (2) can be seen for a dipole according to FIG. 1B. Inside the cutting edge is the receptacle (22) for the chip (6) arranged. The applied on the contact lugs (23) adhesive is indicated by the position number 24. The area enclosed by the cutting edge (2) corresponds to the area of the antenna of the RFID tag (16).
  • the RFID tags (16) are released from the carrier material (9) with the aid of the deflection (14).
  • the carrier material (9) from an horizontal plane is continued approximately 90 ° downward angled. Due to the higher flexural rigidity of the electrically conductive layer (11), which does not follow the bending of the carrier material, the RFID tags released from the composite of the electrically conductive layer (11) detach from the carrier material and are guided by the guide
  • the detached RFID tags (16) are deposited on the self-adhesive film web with a handling facilitating distance.
  • Figure 3 A) shows the starting material with continuous line-shaped interruption (12) while the starting material of Figure 3 B) has a plurality of line-shaped interruptions (31).
  • the starting material according to FIG. 3 A) is used to produce an RFID tag with a dipole antenna (32), the starting material according to FIG. 3 B) to produce an RFID tag with a loop dipole antenna.
  • a loop dipole antenna (33) the two arranged in extension of the contacts of the chip poles are separated from each other by the interruptions (31), but electrically interconnected by a bridge (34).
  • Loop dipole which is to be arranged on the cylinder surface of the cylinder (3) corresponds in plan view exactly the cut lines (34 a, b) shown in Figure 3 B). Incidentally, for the production of an RFID tag with loop dipole antenna (33) fully referenced to the embodiment for making an RFID tag with dipole antenna (32).
  • FIG. 4 shows the RFID tags (16) detached from the carrier material (9) after transfer to the film web (17), wherein FIG. 4 A) shows the RFID tag (16) with dipole antenna (32) and FIG B) shows the RFID tag (16) with loop dipole antenna (33).
  • FIG. 5 shows an arrangement for carrying out the method according to the invention in a single-stage process.
  • the arrangement for carrying out the method corresponds to the arrangement according to FIGS. 1 and 2, so that in this respect reference is made to the statements there.
  • the one-step process differs from the two-step process in that no detachment of the electrically conductive layer (11) from the substrate (9) is required.
  • the arrangement of Figure 5 waives a deflection and the guide means for Transfer of the detached RFID tags to another film web.
  • the cylinder (3) carrying the cutting edges differs only in that the cutting edge height of the cutting edges (2) corresponds at least to the thickness of the carrier material (9) provided with the electrically conductive layer (11).
  • both the carrier material (9) and the electrically conductive layer (11) arranged on the carrier material (9) are divided by the cutting edges (2).
  • finished RFID tags (35) leave the gap between the cylinders (3) and (4), the others
  • the RFID tags (35) differ from the RFID tags (16) in that they remain permanently attached to the original substrate (9).

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

L'invention concerne un procédé et un dispositif pour produire des étiquettes RFID comprenant un composant électronique pourvus de contacts qui sont reliés à une couche électroconductrice servant d'antenne. L'objectif de cette invention est pouvoir produire des étiquettes RFID de manière peu onéreuse et à grande échelle. A cet effet, une couche électroconductrice (11) qui est disposée sur un matériau support (9) et qui comporte moins une rupture non conductrice (12, 31), est divisée au moyen d'un outil (3) équipé de lames au niveau des sections qui forment les antennes (32, 33) de l'étiquette RFID. En outre, les contacts (23) de chaque composant électronique sont positionnés sur la couche électroconductrice (11) à l'aide dudit outil (3) pendant le processus de division, de façon que ces contacts soient en contact avec les zones divisées (27, 28) d'une section de la couche conductrice (11) formant les antennes. Selon l'invention, les zones (27, 28) sont séparées par au moins une des ruptures non conductrices (12, 31).
PCT/EP2006/005947 2005-07-13 2006-06-21 Procede et dispositif de production d'etiquettes rfid WO2007006401A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005033196.3 2005-07-13
DE200510033196 DE102005033196A1 (de) 2005-07-13 2005-07-13 Verfahren und Anordnung zur Herstellung von RFID-Tags

Publications (1)

Publication Number Publication Date
WO2007006401A1 true WO2007006401A1 (fr) 2007-01-18

Family

ID=36695027

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2006/005947 WO2007006401A1 (fr) 2005-07-13 2006-06-21 Procede et dispositif de production d'etiquettes rfid

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DE (1) DE102005033196A1 (fr)
WO (1) WO2007006401A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022116992A1 (de) 2022-07-07 2024-01-18 All4Labels Group GmbH Vorrichtung und Verfahren zum Entfernen von Spänen aus Metallfolienresten von RFID-Antennen

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102008016830A1 (de) 2008-03-28 2009-10-15 Smartrac Ip B.V. Verfahren und Vorrichtung zur Applikation eines Chipmoduls
DE102010056055A1 (de) * 2010-12-23 2012-06-28 Schreiner Group Gmbh & Co. Kg Etikett mit einem elektronischen Funktionselement
DE102021102349A1 (de) 2021-02-02 2022-08-04 Manfred Rietzler RFID-Funketikett zum Befestigen an einer Textilie

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003105063A2 (fr) * 2002-01-18 2003-12-18 Avery Dennison Corporation Technique de production d'etiquettes rfid
WO2006056280A1 (fr) * 2004-11-22 2006-06-01 Arccure Technologies Gmbh Procede et systeme pour produire des etiquettes rfid

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3724068A (en) * 1971-02-25 1973-04-03 Du Pont Semiconductor chip packaging apparatus and method
EP1302974A3 (fr) * 2001-10-11 2004-04-07 Westvaco Corporation, Alfred H Nissan Technical Center Appareil d'alignement et de placement de puces pour un circuit intégré, MEMS, composant photonique ou autres dispositifs

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003105063A2 (fr) * 2002-01-18 2003-12-18 Avery Dennison Corporation Technique de production d'etiquettes rfid
WO2006056280A1 (fr) * 2004-11-22 2006-06-01 Arccure Technologies Gmbh Procede et systeme pour produire des etiquettes rfid

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022116992A1 (de) 2022-07-07 2024-01-18 All4Labels Group GmbH Vorrichtung und Verfahren zum Entfernen von Spänen aus Metallfolienresten von RFID-Antennen

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Publication number Publication date
DE102005033196A1 (de) 2007-01-25

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