EP2087769B1 - Lagerung von elektronischen bauteilen - Google Patents
Lagerung von elektronischen bauteilen Download PDFInfo
- Publication number
- EP2087769B1 EP2087769B1 EP06804864.4A EP06804864A EP2087769B1 EP 2087769 B1 EP2087769 B1 EP 2087769B1 EP 06804864 A EP06804864 A EP 06804864A EP 2087769 B1 EP2087769 B1 EP 2087769B1
- Authority
- EP
- European Patent Office
- Prior art keywords
- mounting
- holding element
- receptacle housing
- electronic
- damping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000013016 damping Methods 0.000 claims description 33
- 239000000463 material Substances 0.000 claims description 17
- 238000001746 injection moulding Methods 0.000 claims description 9
- 229920002725 thermoplastic elastomer Polymers 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 6
- 238000003860 storage Methods 0.000 description 40
- 229920001971 elastomer Polymers 0.000 description 20
- 230000035939 shock Effects 0.000 description 12
- 238000002955 isolation Methods 0.000 description 10
- 238000010521 absorption reaction Methods 0.000 description 7
- 230000006870 function Effects 0.000 description 5
- 238000013459 approach Methods 0.000 description 4
- 238000010276 construction Methods 0.000 description 3
- 239000000806 elastomer Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000004377 microelectronic Methods 0.000 description 3
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000013013 elastic material Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 1
- 239000011358 absorbing material Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920002959 polymer blend Polymers 0.000 description 1
- 229920006124 polyolefin elastomer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 210000002023 somite Anatomy 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- -1 styrene-ethylene-butylene-styrene Chemical class 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 208000008918 voyeurism Diseases 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
- H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
- H04R25/604—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of acoustic or vibrational transducers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
- H04R25/45—Prevention of acoustic reaction, i.e. acoustic oscillatory feedback
- H04R25/456—Prevention of acoustic reaction, i.e. acoustic oscillatory feedback mechanically
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R25/00—Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
- H04R25/60—Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
Definitions
- the present invention relates to a device for damped storage of electronic components according to the preamble of claim 1 and a method for producing an integral, damping storage with a device.
- the present invention is a construction for the storage of electro-acoustic transducers or other electronic components in electronic micro devices, such as hearing aids.
- electronic components such as a handset or electroacoustic transducer, held by rubber parts in position.
- rubber mounts are usually attached directly to the electronic component, glued or slipped over this and define the contact surface with the rest of the electronic micro device, such as a hearing aid structure.
- connection lines to the component such as a sound conduit, are usually required, which connects the component to the surrounding environment, such as the acoustic environment, and often also has a mechanical support function.
- DE8704315U discloses a hearing aid whose components are mounted in a hearing aid housing, characterized in that at least a part of the components in the interior of brackets between the inside of the brackets projecting cushions, which are formed as knobs of sound-absorbing material, releasably supported.
- a storage for to develop electronic components, such as a transducer, in a micro-electronic device, such as a hearing aid which meets the main requirements below, namely to ensure vibration isolation of the component and a shock absorption in the event of a shock.
- the device for the damped storage of electronic components in a single or multi-part receiving housing of a micro electronic device is that an along, at least on parts of the inner wall of the receiving housing arranged elastic and / or flexible retaining element is provided, with in the direction of the interior the receiving inwardly projecting storage areas for in-situ bearings or holding the component in the receptacle.
- the device according to the invention for damping basically has two functions, namely the provision of vibration isolation on the one hand and shock absorption on the other hand. It has been found that for vibration isolation, the storage should have a low to very low stiffness and low attenuation. By contrast, contrary to the vibration isolation for shock absorption, storage must be much stiffer, with much higher internal damping of the material being desirable.
- the receptacle is coated or lined with an elastically soft and / or flexible material, whereby elevations projecting from the layer are provided.
- elevations may be conical or knob-like elevations, with, for example, pointed, dull or rounded bearing surfaces for the electronic component.
- the lining or the holding element may consist of the same material as the above storage areas or for the storage areas, a different material can be chosen to meet the above-mentioned, different requirements for vibration isolation and shock absorption.
- the holding element or the lining as well as the storage areas may consist of a thermoplastic elastomer (TPE).
- TPE thermoplastic elastomer
- block copolymers such as, for example, a styrene elastomer (TPE-S) or a polymer blend such as a polyolefin elastomer (TPE-O) have been found.
- TPE-S styrene elastomer
- TPE-O polyolefin elastomer
- other TPE types such as thermoplastic polyurethane (TPE-U) are also conceivable or also vulcanizates such as silicone rubber, etc.
- the retaining element can be produced, for example by means of injection molding, having the bearing areas and subsequently introduced into a receiving housing.
- the holding element or the elastic coating can in turn directly, for example by injection molding in a already existing receiving housing are entered, which receiving housing in turn may consist of a thermosetting or thermoplastic polymer.
- the basis of the proposed invention is that the storage is integrated into the housing of the electronic device, such as the hearing aid, as described in the following Figures 1 and 2 is shown using the example of a listener storage.
- the main difference between the prior art, presented in FIG. 1 is that the storage is no longer mounted on the transducer, but a part of the hearing aid housing, as in FIG. 2 is shown.
- FIG. 1 schematically shows in section a transducer 1, which is arranged in a corresponding hearing aid housing 3.
- a rubber bearing 5 is provided, having outwardly projecting support ribs 7 for point storage ..
- the transducer 1 as shown in FIG. 2 no longer stored in a rubber pad 5, but is "free” on conical elevations 17auf, which is part of a damping insert, which is arranged directly on the inner surface of the hearing aid housing 3.
- This in turn has a rubber pad 15, with inwardly projecting elevations 17 for point storage.
- the cavity in the hearing device that houses the transducer is lined with a layer of soft elastic material that has sufficient wall thickness and rigidity to meet the shock absorption requirements mentioned above. From this layer protrude different conical-like elevations 17, which provide for a defined positioning of the transducer 1. Due to the design of these support elements 17 whose rigidity can be adjusted in the direction of optimal vibration isolation. For example, these elements can be designed to be loaded primarily on thrust rather than pressure, resulting in much lower stiffness.
- FIG. 5 shows in section a further embodiment of an inventive damping arrangement for the storage of an electronic component 1.
- a damping layer 15 is disposed in the rigid receiving wall 3 of a micro electronic device, consisting of an elastic material, as described above.
- inwardly projecting projections 17 are also provided for the mounting of the component 1.
- air inclusions 31 are formed in order to achieve an additional damping effect.
- These damping air pockets 31 may be made relatively small as in FIG Fig. 5 or else can be as schematic in Fig. 6 represented and provided with the reference numeral 35, be formed such that the inwardly projecting projection 37 is formed like a pillow or leaf spring. On the one hand, this can increase the damping effect, but on the other hand, this reduces the storage stability.
- Fig. 5 recognizable are rear handles 33, which allow a better connection or even a non-adhesive connection between the damping layer 15 and the rigid housing wall 3.
- FIGS. 7a to 7d examples of protruding projections 17 are shown which are intended to indicate that any shapes are possible to achieve suitable damping or to be selected according to requirements.
- Fig. 7a a cone-like projection
- Fig. 7b a rib (not belonging to the invention) during Fig. 7c analogous.
- Fig. 6 a pillow-like or leaf-spring-like damping element 17 shows.
- Fig. 7d a leaf spring-like damping element 17 is shown, which is arranged in a corner region of the receiving housing 3.
- a cavity 35 is provided.
- damping devices or bearings are only examples of the better understanding of the present invention.
- the bearings or dampings are of course not limited to the illustrated examples, but it can also be used different bearings or damping devices, which for example have different wall thicknesses, different stiffnesses of the materials, different geometries or embodiments of projecting storage areas or elevations, different manufacturing techniques, etc., etc.
- the essence of the present invention is that the damping element or the damping bearing is arranged on the housing inner wall of the electronic construction device for positioning and holding an electronic component, wherein the damping Element facing the interior and has projecting storage areas.
Landscapes
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Neurosurgery (AREA)
- Otolaryngology (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Vibration Prevention Devices (AREA)
- Casings For Electric Apparatus (AREA)
- Mounting Components In General For Electric Apparatus (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CH2006/000630 WO2007038897A2 (de) | 2006-11-09 | 2006-11-09 | Lagerung von elektronischen bauteilen |
Publications (2)
Publication Number | Publication Date |
---|---|
EP2087769A2 EP2087769A2 (de) | 2009-08-12 |
EP2087769B1 true EP2087769B1 (de) | 2019-02-27 |
Family
ID=37906519
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP06804864.4A Active EP2087769B1 (de) | 2006-11-09 | 2006-11-09 | Lagerung von elektronischen bauteilen |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP2087769B1 (da) |
DK (1) | DK2087769T3 (da) |
WO (1) | WO2007038897A2 (da) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102007031872B4 (de) | 2007-07-09 | 2009-11-19 | Siemens Audiologische Technik Gmbh | Hörgerät |
DE102010009784B4 (de) * | 2010-03-01 | 2014-01-16 | Audifon Gmbh & Co. Kg | Hörgerät |
DE202010018056U1 (de) * | 2010-03-01 | 2013-11-20 | Audifon Gmbh & Co. Kg | Hörgerät |
EP3624466B1 (en) * | 2015-09-30 | 2024-04-03 | Oticon A/s | Hearing aid comprising a receiver assembly |
EP3337191B1 (en) | 2016-12-16 | 2021-05-19 | Sonion Nederland B.V. | A receiver assembly |
US10405085B2 (en) | 2016-12-16 | 2019-09-03 | Sonion Nederland B.V. | Receiver assembly |
DE102018214321B4 (de) | 2018-08-24 | 2020-06-18 | Sivantos Pte. Ltd. | Elastisches Dämpfungselement für einen Hörer eines Hörinstruments sowie Hörinstrument mit einem solchen Dämpfungselement |
DE102018214322A1 (de) * | 2018-08-24 | 2020-02-27 | Sivantos Pte. Ltd. | Dämpfungseinrichtung für einen Hörer eines Hörinstruments sowie Hörinstrument mit einer solchen Dämpfungseinrichtung |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE8704315U1 (da) * | 1987-03-23 | 1987-05-27 | Siemens Ag, 1000 Berlin Und 8000 Muenchen, De | |
FR2593445A1 (fr) * | 1986-01-27 | 1987-07-31 | Peugeot | Profiles a monter par clippage. |
US6766030B1 (en) * | 1999-04-19 | 2004-07-20 | Sunil Chojar Llc | Hearing aid receiver with external mechanical shock and vibration damper and hearing aid that uses it |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL8101286A (nl) * | 1981-03-17 | 1982-10-18 | Philips Nv | Verbeterde ophanging voor een telefoon in een hoorapparaat. |
DE3484450D1 (de) | 1983-05-30 | 1991-05-23 | Fujitsu Ltd | Piezoelektrischer resonator. |
US4729451A (en) | 1984-05-30 | 1988-03-08 | Beltone Electronics, Corporation | Receiver suspension and acoustic porting system |
US6041131A (en) | 1997-07-09 | 2000-03-21 | Knowles Electronics, Inc. | Shock resistant electroacoustic transducer |
AU2068701A (en) * | 1999-12-10 | 2001-06-18 | Sonic Innovations, Inc. | Hearing device shell with integrated windscreen and microphone suspension |
AU2001245773A1 (en) | 2000-03-15 | 2001-09-24 | Knowles Electronics, Llc. | Vibration-dampening receiver assembly |
US7088839B2 (en) | 2001-04-04 | 2006-08-08 | Sonion Nederland B.V. | Acoustic receiver having improved mechanical suspension |
JP2005252420A (ja) * | 2004-03-02 | 2005-09-15 | Rion Co Ltd | 耳あな形補聴器 |
US7376237B2 (en) * | 2004-09-02 | 2008-05-20 | Oticon A/S | Vibrator for bone-conduction hearing |
-
2006
- 2006-11-09 DK DK06804864.4T patent/DK2087769T3/da active
- 2006-11-09 WO PCT/CH2006/000630 patent/WO2007038897A2/de active Application Filing
- 2006-11-09 EP EP06804864.4A patent/EP2087769B1/de active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2593445A1 (fr) * | 1986-01-27 | 1987-07-31 | Peugeot | Profiles a monter par clippage. |
DE8704315U1 (da) * | 1987-03-23 | 1987-05-27 | Siemens Ag, 1000 Berlin Und 8000 Muenchen, De | |
US6766030B1 (en) * | 1999-04-19 | 2004-07-20 | Sunil Chojar Llc | Hearing aid receiver with external mechanical shock and vibration damper and hearing aid that uses it |
Also Published As
Publication number | Publication date |
---|---|
WO2007038897A2 (de) | 2007-04-12 |
EP2087769A2 (de) | 2009-08-12 |
DK2087769T3 (da) | 2019-05-13 |
WO2007038897A3 (de) | 2007-11-01 |
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