EP2050148A2 - Systèmes de commande de la température thermoélectriques à forte capacité - Google Patents

Systèmes de commande de la température thermoélectriques à forte capacité

Info

Publication number
EP2050148A2
EP2050148A2 EP07836303A EP07836303A EP2050148A2 EP 2050148 A2 EP2050148 A2 EP 2050148A2 EP 07836303 A EP07836303 A EP 07836303A EP 07836303 A EP07836303 A EP 07836303A EP 2050148 A2 EP2050148 A2 EP 2050148A2
Authority
EP
European Patent Office
Prior art keywords
thermoelectric
heat transfer
elements
working fluid
transfer devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07836303A
Other languages
German (de)
English (en)
Inventor
Lon E. Bell
Douglas Todd Crane
Robert W. Diller
Fred R. Harris
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gentherm Inc
Original Assignee
BSST LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BSST LLC filed Critical BSST LLC
Publication of EP2050148A2 publication Critical patent/EP2050148A2/fr
Withdrawn legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device

Definitions

  • thermoelectric devices utilize the properties of certain materials to develop a temperature gradient across the material in the presence of current flow.
  • Conventional thermoelectric devices utilize P-type and N-type semiconductors as the thermoelectric material within the device. These are physically and electrically configured in such a manner that the desired function of heating or cooling is obtained.
  • thermoelectric devices today The most common configuration used in thermoelectric devices today is illustrated in Figure I A.
  • P-type and N-type thermoelectric elements 102 are arrayed in a rectangular assembly 100 between two substrates 104.
  • a current, I passes through both element types.
  • the elements are connected in series via copper shunts 106 saddled to the ends of the elements 102.
  • a DC voltage 108 when applied, creates a temperature gradient across the TE elements.
  • TEs are commonly used to cool liquids, gases and solid objects.
  • SSCHP Solid-state cooling, heating and power generation
  • g COPT is the optimum cooling thermal power
  • J op ⁇ is the optimum current
  • a is the Seebeck Coefficient
  • R is the system electrical resistance
  • K is the system thermal conductance; the difference between the hot and cold side temperatures.
  • T c is the cold side temperature.
  • Z is the material thermoelectric figure of merit
  • Equation (3) is independent of the size (or dimensions) of the TE system, and so the amount of cooling q OP1 is only a function of material properties and K.
  • K can be written as:
  • ⁇ is the average thermal conductivity of the N & P materials
  • a c is the area of the elements
  • / is the length of each element.
  • the resistance is: where / Cfeis the intrinsic average resistivity of the TE elements; R oc is the TE material resistance; and R PC is parasitic resistances.
  • thermoelectric systems it is advantageous to make a device smaller for the same cooling output.
  • An important limitation in thermoelectric systems is that as, for example, the length L c is decreased for fixed A c , the ratio of the parasitic resistive losses to TE material losses, ⁇ becomes relatively large:
  • FIG. 1C depicts a typical TE couple. While several parasitic losses occur, one of the largest for a well-designed TE is that from shunt 106.
  • the resistance of shunt 106 per TE element 102 is approximately, where G c is the gap between the TE elements; B c is the TE element and shunt breadth; W c is the TE clement and shunt width; T c is the shunt thickness; and P sc is the shunt resistivity.
  • G c is the gap between the TE elements
  • B c is the TE element and shunt breadth
  • W c is the TE clement and shunt width
  • T c is the shunt thickness;
  • P sc is the shunt resistivity.
  • thermoelectric system comprises a first plurality of thermoelectric elements and a second plurality of thermoelectric elements.
  • the thermoelectric system further comprises a plurality of heat transfer devices.
  • Each heat transfer device has a first side in thermal communication with two or more thermoelectric elements of the first plurality of thermoelectric elements and a second side in thermal communication with one or more thermoelectric elements of the second plurality of thermoelectric elements, so as to form a stack of thermoelectric elements and heat transfer devices.
  • the two or more thermoelectric elements of the first plurality of thermoelectric elements are in parallel electrical communication with one another, and the two or more thermoelectric elements of the first plurality of thermoelectric elements are in series electrical communication with the one or more thermoelectric elements of the second plurality of thermoelectric elements.
  • thermoelectric system comprises a plurality of thermoelectric modules and a plurality of heat transfer devices.
  • Each heat transfer device comprises a housing and one or more heat exchanger elements inside the housing.
  • Each heat transfer device accepts a working fluid to flow therethrough.
  • At least some of the heat transfer devices are in thermal communication with and sandwiched between at least two thermoelectric modules of the plurality of thermoelectric modules so as to form a stack of alternating thermoelectric modules and heat transfer devices arranged to provide thermal isolation along a direction of a working medium movement.
  • thermoelectric system comprises a plurality of the ⁇ noelectric modules and a plurality of heat transfer devices. Each heat transfer device accepts a working fluid to flow therethrough. At least some of the heat transfer devices are in thermal communication with and sandwiched between at least two thermoelectric modules of the plurality of thermoelectric modules so as to form a stack of alternating thermoelectric modules and heat transfer devices arranged to provide thermal isolation along a direction of a working medium movement. A first working fluid is cooled by flowing throvigh a first set of the heat transfer devices and a second working fluid is heated by flowing through a second set of the heat transfer devices.
  • Figure I A-IB depicts a conventional TE module.
  • Figure 1 C depicts a conventional TE couple.
  • FIG. 2 depicts a general arrangement of a SSCHP system with thermal isolation and counter flow movement of its working media.
  • Figure 3 depicts the temperature changes that occur in the media, as the working media progress through the system.
  • Figures 4A - 4B depict a system with three TE modules, four fin heat exchangers, and liquid-working media.
  • Figures 5A - 5B depict a system with two TE modules, a segmented heat exchanger to achieve a degree of thermal isolation with a single heat exchanger, and counter flow of the liquid media
  • Figure 6 depicts and gaseous media system with two TE modules and ducted fans to control fluid flow.
  • Figures 7A - 7D depict a solid media system with counter flow to further enhance performance.
  • the TE elements utilize a high length to thickness ratio to achieve added thermal isolation.
  • Figure 8 depicts a system with TE elements arranged so that current passes directly through the array and thereby lowers cost, weight and size while providing improved performance.
  • Figure 9 depicts a system with TE elements, heat pipes and heat exchangers that is simple and low cost.
  • the hot side and cold side are separated by thermal transport through heat pipes.
  • Figure 10 depicts a fluid system in which the fluid is pumped through the heat exchanger and TE module array so as to achieve a low temperature at one end to condense moisture out of a gas or a precipitate from a liquid or gas.
  • the system has provisions to shunt working fluid flow to improve efficiency by lowering the temperature differential across portions of the array.
  • Figure 1 1 depicts an array in which working fluid enters and exits at a variety of locations, and in which part of the system operates in counter flo.w and part in parallel flow modes.
  • Figure 12 depicts a stack TE system with reduced parasitic electrical resistive losses.
  • Figure 13A depicts details of a TE element and heat exchange member in a preferred embodiment for a stack system.
  • Figure 13B depicts a section of a stack system constructed from elements shown in Figure 13 A.
  • Figure 15 depicts yet another TE element and heat exchanger configuration.
  • Figure 16 depicts a stack configuration with two vertical rows of TE elements electrically in parallel.
  • Figure 17 depicts a cooling/heating assembly with two rows of TE elements electrically in parallel.
  • Figure 18 depicts another configuration with two TE elements electrically in parallel.
  • Figure 19 depicts a heat exchanger element with one portion electrically isolated from another portion.
  • Figure 20 depicts another configuration of a heat exchanger element with one portion electrically isolated from another portion.
  • Figure 21 depicts yet another configuration of a heat exchanger with one portion electrically isolated from another portion:
  • 10042J Figure 22 depicts a heat exchanger segment configured in an array of electrically and thermally isolated portions.
  • Figure 23 depicts a cooler/heater constructed in accordance with the concepts of Figure 22.
  • Figure 24A depicts a heat exchange segment with TE elements aligned in the direction of fluid flow.
  • Figure 24B depicts segments of Figure 24A configured as an isolated element heat exchanger array in which electrical current flows generally parallel to working medium flow.
  • Figure 25A depicts segments of a design configured as an isolated element heat exchanger array in which electrical current flows generally perpendicular to the direction of current flow.
  • Figure 25B depicts a plan view of the assembly in Figure 25 A.
  • Figure 26A depicts a TE heat exchanger module with reduced parasitic electrical resistance, which operates at relatively high voltage.
  • Figure 26B depicts a plan view of a heat exchanger array that uses TE modules of Figure 26A.
  • Figure 27 depicts an isolated element and stack configuration with heat transfer to moving solid members.
  • Figure 28 depicts an isolated element stack array with heat transfer between a liquid and a gas.
  • Figure 29 depicts a heat exchanger module with low parasitic electrical resistance for use in the stack array of Figure 28.
  • Figure 30 depicts a segment of an isolated element heat exchanger with solid heat sink and moving gaseous working fluid.
  • Figure 31 A depicts a heat exchanger element with TE elements generally in the center to about double heat transfer from the element.
  • Figure 31B depicts another heat transfer element generally for liquids with the TE element generally in the center.
  • Figure 31 C depicts yet another heat exchanger with the TE element generally in the center.
  • Figure 32 schematically illustrates a partial cut-away view of an example heat transfer device in accordance with certain embodiments described herein.
  • Figure 33 is a view of an example thermoelectric system subassembly compatible with certain embodiments described herein.
  • Figure 34 schematically illustrates the working fluid paths and the electrical connections of a heat exchanger subassembly or stack of an example thermoelectric system compatible with certain embodiments described herein.
  • Figure 35 illustrates an example subassembly mounted in a test fixture.
  • Figure 36 shows a comparison of the measured performance results of the testing of the subassembly of Figure 33 with simulated model results.
  • , 5°C (the uppermost curve in Figure 36) with the performance of a conventional thermoelectric module-based design without thermal isolation.
  • Figure 38 shows a thermoelectric device with a plurality of subassemblies (front cover and insulation removed for illustration).
  • Figure 39 shows a comparison of the measured experimental results for the device of Figure 38 with computed model results.
  • Figure 40 schematically illustrates the temperature profiles of three thermoelectric systems as the working fluid circumnavigates the thermoelectric system.
  • Figure 42 shows an example thermoelectric system used to validate the model under various conditions.
  • Figure 43 shows the maximum ⁇ Tc achievable for various numbers of thermal isolation stages.
  • Figure 44 shows the effect of thermal isolation on maximum power.
  • Figure 45 schematically illustrates a configuration utilizing the cross connection of fluids compatible with certain embodiments described herein.
  • Figure 46 schematically illustrates the effect of introduction of moderate temperature fluid into the heated side where its temperature matches that of the original flow in accordance with certain embodiments described herein.
  • Figure 47 shows an example temperature profile for an example thermoelectric system for removing vapor from a gas (e.g., dehumidif ⁇ cation of air) in accordance with certain embodiments described herein.
  • a gas e.g., dehumidif ⁇ cation of air
  • Figure 48 shows the relative abilities of a conventional thermoelectric system and of a thermoelectric system utilizing thermal isolation to remove water from the air stream.
  • Figure 49 shows a comparison of dehumidification ability of a scaled-up conventional thermoelectric system and a scaled-up thermally isolated thermoelectric system.
  • thermoelectric module and TE module are used in the broad sense of their ordinary and accustomed meaning, which is (1) conventional thermoelectric modules, such as those produced by Hi Z Technologies, Inc. of San Diego, California, (2) quantum tunneling converters, (3) thermionic modules, (4) magneto caloric modules, (5) elements utilizing one, or any combination of thermoelectric, .magneto caloric, quantum, tunneling and thermionic effects, (6) any combination, array, assembly and other structure of (1 ) through (6) above.
  • thermoelectric element is more specific to indicate an individual element that operates using thermoelectric, thermionic, quantum, tunneling, and any combination of these effects.
  • thermoelectric or SSCHP systems are described by way of example. Nevertheless, it is intended that such technology and descriptions encompass all SSCHP systems.
  • thermoelectric element or array or module may be at ambient temperature with the "cold,” side at a cooler temperature than the ambient. The converse may also be true. Thus, the terms arc relative to each other to indicate that one side of the thermoelectric is at a higher or lower temperature than the counter-designated temperature side.
  • this disclosure describes a new family of SSCHP configurations. These configurations achieve compact, high-efficiency energy conversion and can be relatively low cost.
  • TE elements or modules are sandwiched between heat exchangers.
  • the TE elements are advantageously oriented such that for any two elements sandwiching a heat exchanger, the same temperature type side faces the heat exchanger.
  • the cooler side of each of the TE elements sandwiching a heat exchanger face the same heat exchanger or shunt, and thus each other.
  • at least one working medium is passed sequentially through at least two heat exchangers so that the cooling or heating provided is additive on the working medium.
  • a TE device achieves increased or improved efficiency by subdividing the overall assembly of TE elements into thermally isolated subassemblies or sections.
  • the heat exchangers may be subdivided so as to provide thermal isolation in the direction of working medium flow.
  • a TE system has a plurality of TE elements forming a TE array with a cooling side and a heating side, wherein the plurality of TE elements are substantially isolated from each other in at least one direction across the array.
  • the thermal isolation is in the direction of the working media flow.
  • This thermal isolation can be provided by having a heat exchanger configured in sections such that the heat exchanger has portions which are thermally isolated in the direction of working fluid flow.
  • heat exchangers of the same temperature type for the working fluid provides a type of thermal isolation in itself.
  • the heat exchangers or the TE elements, or TE modules or any combination may be configured to provide thermal isolation in the direction of the working fluid flow over and above the thermal isolation provided by having a series or sequence of heat exchangers through which at least one working fluid passes in sequence.
  • thermoelectric system having a plurality of N-type thermoelectric elements and a plurality of P-type thermoelectric elements.
  • a plurality of first shunts and a plurality of second shunts are provided.
  • At least some of the first shunts are sandwiched between at least one N-type thermoelectric element and at least one P-type thermoelectric element, and at least some of the second shunts sandwiched between at least one P-type thermoelectric element and at least one N-type thermoelectric elements, so as to form a stack of thermoelectric elements, with alternating first and second shunts, wherein at least some of the first shunts and at least some of the second shunts project away from the stack in differing directions.
  • thermoelectric elements are constructed to be quite thin, such as from 5 microns, to 1.2 mm, from 20 microns to 200 microns for superlattice and heterostructure thermoelectric designs, and in another embodiment from 100 to 600 microns. These designs provide for significant reduction in the usage of thermoelectric material.
  • thermoelectric system further comprises a current source electrically coupled to the stack, the drive current traversing through the heat transfer devices and thermoelectric elements in series.
  • the heat transfer devices thermally isolate at least some of the P-type thermoelectric elements from at least some of the N-type thermoelectric elements.
  • the heat transfer devices accept a working fluid to flow through them in a defined direction.
  • the heat transfer devices are heat exchangers and may have a housing with one or more heat exchanger elements inside.
  • the first shunts are constructed of a first electrode portion electrically isolated from and thermally coupled to a second shunt portion.
  • Figure 2 illustrates a first generalized embodiment of an advantageous arrangement for a thermoelectric array 200.
  • the array 200 has a plurality of TE modules 201 , 21 1. 212, 213, 218 in good thermal communication with a plurality of first side heat exchangers 202, 203, 205 and a plurality of second side heat exchangers 206, 207 209.
  • the designation first side heat exchanger and second side heat exchanger does not implicate or suggest that the heat exchangers are on one side or the other side of the entire SSCHP system, but merely that they are in thermal communication with either the colder side or the hotter side of the thermoelectric modules. This is apparent from the figure in that the heat exchangers are actually sandwiched between thermoelectric modules.
  • thermoelectric modules In that sense, they are in thermal communication with a first side or a second side of the thermoelectric modules.
  • the colder side of a first TE module 201 is in thermal contact with a first side heat exchanger 205 and the hot side of the TE module 201 is in thermal contact with an inlet second side heat exchanger 206.
  • a second working media 215, such as a fluid enters the array 200 in the upper right hand corner of Figure 2 through the inlet second side heat exchange 206, and exits near the lower left from a final or outlet second side heat exchanger 209.
  • a first working media 216 enters at the upper left through an inlet first side heat exchanger 202 and exits near the lower right from a final or outlet first side heat exchanger 205.
  • First conduits 208 convey the second working media 215 and second conduits 204 convey the first working media 216 sequentially through various heat exchangers 202, 203, 205, 206, 207 and 209 as depicted.
  • the second working media 215 absorbs heat from the TE module 201 as it passes downward through the inlet second side heat exchanger 206.
  • the second working media 215 passes through conduit 208 and upwards into and through the second side heat exchanger 207.
  • In good thermal communication with the heat exchanger 207 are the hotter sides of the TE modules 21 1 and 212, which have been configured so that their respective hotter sides face toward one another to sandwich the second side heat exchanger 207.
  • the second side working media 215, is further heated as it passes through the second side heat exchanger 207.
  • the second side working media 215 next passes through the second side heat exchanger 209, where again, the hotter sides of the TE modules 213 and 218 sandwich and transfer heat to the second side heat exchanger 209, further heating the second side working media 215. From the heat exchanger 209, the second working media 215 exits the array 200 from the outlet or final second side heat exchange 209.
  • the first working media 216 enters the inlet first side heat exchanger 202 at the upper left corner of Figure 2.
  • This heat exchanger 202 is in good thermal communication with the colder side of the TE module 218.
  • the first working media 216 is cooled as it passes through the inlet first side heat exchanger 202, on through another first side exchanger 203 and finally through the outlet first side heat exchanger 205, where it exits as colder working media 217.
  • thermoelectric cooling and heating is provided by electrical power through wiring 210 into TE module 218, and similarly into all the other TE modules.
  • working media is placed in good thermal contact with the cold side of the TE module at the left hand side of the array, so that heat is extracted from the media.
  • the media then contacts a second and third TE module where additional heat is extracted, further cooling the media.
  • the process of incremental cooling continues, as the media progresses to the right through the desired number of stages.
  • the media exits at the right, after being cooled the appropriate amount.
  • a second media enters the system at the far right and is incrementally heated as it passes through the first stage. It then enters the next stage where it is further heated, and so on.
  • the heat input at a stage is the resultant of the heat extracted from the adjacent TE modules' cold sides, and the electrical power into those modules.
  • the hot side media is progressively heated as it moves in a general right to left direction.
  • the system provides benefit if both media enter at the same temperature and progressively get hotter and colder.
  • the media can be removed from or added to the cool or hot side at any location within the array.
  • the arrays can be of any useful number of segments such as 5, 7, 35, 64 and larger numbers of segments.
  • the system can also be operated by reversing the process with hot and cold media in contact with TE modules, and with the hot and cold media moving from opposite ends (as in Figure 2 but with the hot media entering as media 216 and the cold media entering as media 215).
  • the temperature gradient so induced across the TE modules produces an electric current and voltage, thus converting thermal power to electrical power. All of these modes of operation and those described in the text that follows are part of the inventions.
  • thermoelectric modules themselves may be constructed to provide thermal isolation in the direction of media flow and each heat exchanger or some of the heat exchangers may be configured to provide thermal isolation in a individual heat exchanger through a configuration as will be described further in Figure 5 or other appropriate configurations.
  • Figure 3 depicts an array 300 of the same genera] design as in Figure 2, consisting of a plurality of TE modules 301 and colder side heat exchangers 302, 305, and 307 connected so that a first working medium 315 follows the sequential heat exchanger to heat exchanger path shown.
  • a plurality of hot side heat exchangers 309, 31 1 and 313 convey a hotter side working medium 317 in a sequential or staged manner in the direction shown by the arrows.
  • the TE modules 301 are arranged and electrically powered as in the description of Figure 2.
  • the colder side working medium 315 enters and passes through an inlet colder side heat exchanger 302.
  • the working medium's temperature drop 303 in passing through the inlet colder side heat exchanger 302 is indicated by the drop 303 in the cold side temperature curve Tc.
  • the colder side working medium 315 is further cooled as it passes through the next stage colder side heat exchanger 305, as indicated by a temperature drop 304 and again as it passes through a third colder side heat exchanger 307, with an accompanying temperature drop 306.
  • the colder side working medium 315 exits as colder fluids 316 at temperature 308.
  • the hotter side working medium 317 enters a first or inlet hotter side heat exchanger 309 and exits at a first temperature 310 as indicated by the hotter side temperature curve Tn in the Figure 3.
  • the hotter side working medium progresses through the array 300 in stages as noted in Figure 2, getting progressively hotter, finally exiting after passing through outlet hotter side heat exchanger 313 as hotter working fluid at 318 and at a hotter temperature 314.
  • stages that is TE modules and heat exchangers
  • efficiency also can increase with more stages, albeit at a diminishing rate.
  • Figure 4A depicts an array 400 with three TE modules 402, four heat exchangers 403 and two conduits 405 configured as described in Figures 2 and 3.
  • Colder and hotter side working fluids enters at a colder side inlet 404 and a hotter side inlet 407, respectively and exit respectively at a colder side exit 406 and a hotter side exit 408.
  • Figure 4B is a more detailed view of one embodiment of a heat exchanger 403. It is shown as a type suitable for fluid media.
  • the heat exchanger assembly 403, has consists of an outer housing 412 with an inlet 410 and an exit 411 , heat exchanger fins 414, and fluid distribution manifolds 413.
  • the operation of array 400 is essentially the same as described in Figures 2 and 3.
  • the number of the TE modules 402 is three in Figure 4, but could be any number.
  • the housing 412 is thermally conductive, being made from a suitable material such as corrosion protected copper or aluminum.
  • heat exchanger fins 414 advantageously are folded copper, or aluminum soldered or braised to the housing 412, so as to achieve good thermal conductivity across the interface to the TE Module.
  • the Fins 414 can be of any form, but preferably of a design well suited to achieve the heat transfer properties desired for the system. Detailed design guidelines can be found in "Compact Heat Exchangers", Third Edition by W. M. Kays and A. L. London.
  • any other suitable heat exchangers can be used, such as perforated fins, parallel plates, louvered fins, wire mesh and the like.
  • Such configurations are known to the art, and can be used in any of the configurations in any of Figures 2 through 1 1.
  • Figure 5A depicts an alternative configuration to that of Figure 4 for the conduit connections to provide flow from heat exchanger stage to heat exchanger.
  • the array 500 has first and second TE modules 501 and 510, three heat exchangers 502, 503 and 506, and a conduit 504.
  • first and second TE modules 501 and 510 three heat exchangers 502, 503 and 506, and a conduit 504.
  • the particular number of two first side heat exchangers 502, 503 and one second side heat exchanger 506 is not restrictive and other numbers could be provided.
  • FIG. 5B illustrates an enlarged view of a preferred embodiment for the heat exchangers 502, 503, 506.
  • This heat exchanger configuration as shown in Figure 5B would be appropriate for the other embodiments and can be used in any of the configuration in Pigures 2-8 and Figure 1 1.
  • This advantageous embodiment for one or more of the heat exchangers in such configurations has an outer housing 516 with segmented heat exchanger fins 51 1 separated by gaps 513.
  • Working fluid enters through an inlet 505 and exits through exit 508.
  • the heat exchanger could be made so that it is anisotropic such that it is thermally conductive for a section and non-thermally conductive for another section rather than having actual physical gaps between heat exchanger fins.
  • the point is for thermal isolation to be obtained between stages of an individual heat exchanger segment and another individual heat exchanger segment in the direction of flow. This would be thermal isolation provided in addition to the thermal isolation provided by having stages of heat exchangers in the embodiments described in Figures 2-5.
  • a first working fluid 507 which, for example is to be heated, enters an inlet 505 and passes downward through an inlet or first heat exchanger 502 in thermal communication with a first TE module 501.
  • the working fluid 507 exits at the bottom and is conducted to subsequent heat exchanger 503 through conduit 504, where it again passes in a downward direction past a second TE module 510 and exits through as a hotter working 508.
  • a second working fluid 517 enters from the bottom of Figure 5 A through inlet 518 and travels upward through a third heat exchanger 506 past the colder sides (in the present example) of TE modules 501 and 510.
  • the heat exchanger 506 is in good thermal communication with the colder sides of the TE modules 501 and 510.
  • the working fluids 507 and 517 form a counter flow system in accordance with the teaching of U.S. Patent No. 6,539,725 referenced above.
  • the heat exchangers 502, 503 and 506, shown in detail in Figure 5B are constructed to have high thermal conductivity from the faces of the TE modules 501 , 510, 510, through the housing 516 and to the heat exchanger fins 51 1 (depicted in four isolated segments).
  • Figure 6 depicts yet another heater/cooler system 600 that is designed to operate beneficially with working gases.
  • the heater/cooler 600 has TE modules 601 , 602 in good thermal communication with first side heat exchangers 603, 605 and second side heat exchangers 604.
  • a first working fluid, such as air or other gases 606, is contained by ducts 607, 708, 610 and a second working fluid 616 is contained by ducts 615. 613.
  • Fans or pumps 609, 614 are mounted within ducts 608, 615.
  • the first working fluid 606 enters the system 600 through an inlet duct 607.
  • the working fluid 606 passes through a first heat exchanger 603 where, for example, it is heated (or cooled).
  • the working fluid 606 then passes through the fan 609 which acts to pump the working fluid 606 through the duct 608, and through the second heat exchanger 605, where it is further heated (or cooled), and out an exit duct 610.
  • a working fluid such as air or another gas, enters through an inlet duct 615. It is pushed by a second fan or pump 614 through a third heat exchanger 604 where, in this example, it is cooled (or heated).
  • the cooled (or heated) working fluid 616 exits through an exit duct 613.
  • the system 600 can have multiple segments consisting of additional TE modules and heat exchangers and isolated, segmented heat exchangers as described in Figure 5B. It can also have multiple fans or pumps to provide additional pumping force.
  • one duct, for example 607, 608, can have one fluid and the other duct 613, 615 a second type of gas. Alternately, one side may have a liquid working fluid and the other a gas. Thus, the system is not restricted to whether a working medium is a fluid or a liquid. Additionally, it should be noted that the exit duct 613 could be routed around the fan duct 609.
  • FIG. 7A depicts a heating and cooling system 700 for beneficial use with a fluid.
  • the assembly has a plurality of TE modules 701 with a plurality of first side working media 703 and a plurality of second side working media 704.
  • both the first side working media 703 and the second side working media 704 form disks.
  • the first side working media 703 are attached to a first side shaft 709, and the second side working media 704 arc attached to a second side shaft 708.
  • the shafts 708, 709 are in turn attached to first side motor 706 and second side motor 705, respectively, and to corresponding bearings 707.
  • the preferred direction of motor rotation is indicated by arrows 710 and 71 1.
  • a separator 717 both divides the array into two portions and positions the TE modules 701.
  • the TE modules 701. held in position by the separator 717, are spaced so as to alternately sandwich a first side working medium 703 and a second side working medium 704.
  • the modules are oriented such that their cold sides and hot sides face each other as in the previous embodiments.
  • the working media 703, 704 are in good thermal communication with the TE elements 701.
  • Thermal grease or the like is advantageously provided at the interface between the thermoelectric element 701. and the working media 703, 704. The purpose of the grease becomes apparent in the discussion below regarding the operation of the working media 703, 704.
  • a first side housing section 714 and second side housing section 715 contain fluid conditioned by the system 700. Electrical wires 712, 713 connect to the TE modules 701 to provide drive current for the TE modules.
  • FIG. 7B is a cross sectional view 7B-7B through a portion of the system 700 of Figure 7A.
  • a first fluid 721 and a second fluid 723 are represented along with their direction of flow by arrows 721 and 723.
  • the first fluid exits as represented by the arrow 722 and a second exits as represented by the arrow 724.
  • the system 700 operates by passing current through electrical wires 712 and 713 to TE modules 701.
  • the TE modules 701 have their cold and hot sides facing each other, arranged in the fashion as described in Figures 2 and 3. For example, their adjacent cold sides both face the first side working media 703 and their hot sides face the second side working media 704.
  • the Separator 717 serves the dual function of positioning the TE modules 701 and separating the hot side from the cooled side of the array 700.
  • a second fluid 723 is to be cooled.
  • the cooling occurs by thermal exchange with second side media 704.
  • the second side media 704 rotate, the portion of their surface in contact with the colder side of the TE modules 701 at any given time is cooled.
  • the second media 704 cool the second side fluid that then exits at exit 724.
  • the second fluid is confined within the array 700 by the housing section 715 and the separator 717.
  • the first fluid 721 is heated by the first side media 703 in thermal contact with the hotter side of the TE modules 701. Rotation (indicated by arrow 711 ) moves the heated portion of first media 703 to where the first fluid 721 can pass through them and be heated via thermal contact.
  • the first fluid 721 is contained between the housing 714 and the separator 717 and exits at exit 722.
  • thermally conductive grease or liquid metal such as mercury can be used to provide good thermal contact between the TE modules 701 and the media 703. 704 at the region of contact.
  • Figure 7A and 7B may also be advantageously used to cool or heat external components such as microprocessors, laser diodes and the like.
  • the disks would contact the part using the thermal grease or liquid metal or the like to transfer the heat to or from the part.
  • Figure 7C depicts a modified version of the system 700 in which the TE modules 701 are segmented to achieve thermal isolation.
  • Figure 1C shows a detailed view of the portion of array 700 in which TE modules 701 and 702 transfer thermal power to heat moving media 704 and 703 (the rotating discs in this example).
  • the moving media 704 and 703 rotate about axes 733 and 734, respectively.
  • the working media 704 and 703 rotate in opposite directions as indicated by arrows 710 and 71 1.
  • moving media 704, 703 rotate, heat transfer from different sections of TE modules 701 and 702 come into thermal contact with them and incrementally change the temperature of the moving media 704, 703.
  • a first TE module 726 heats moving medium 704 at a particular location.
  • the material of the moving media 704 at that location moves into contact with a second TE module 725 as moving medium 704 rotates counter clockwise.
  • the same portion of moving medium 704 then moves on to additional TE module segments 701.
  • the opposite action occurs as moving medium 703 rotates counterclockwise and engages TE modules 701 and then subsequently TE modules 725 and 726.
  • moving media 704, 703 have good thermal conductivity in the radial and axial directions, and poor thermal conductivity in their angular direction, that is, the direction of motion. With this characteristic, the heat transfer from one TE module 725 to another TE module 726 by conductivity through the moving media 704 and 708 is minimized, thereby achieving effective thermal isolation.
  • TE modules or segments 701 , 725, 726 a single TE element or several TE element segments may be substituted.
  • the TE elements 701 are very thin compared to their length in the direction of motion of moving media 704, 703, and have relatively poor thermal conductivity in that direction, they will exhibit effective thermal isolation over their length. They will conduct heat and thus respond thermally as if they were constructed of separate TE modules 701. This characteristic in combination with low thermal conductivity in the direction of motion within the moving media 704, 703 can achieve effective thermal isolation and thereby provides performance enhancements.
  • Figure 7D depicts an alternative configuration for moving media 704, 703 in which the media are constructed in the shape of wheels 729 and 732 with spokes 727 and 731. In the spaces between spokes 727 and 731 and in good thermal contact with them, are heat exchanger material 728 and 730.
  • the system 700 can operate in yet another mode that is depicted in Figure 7D.
  • working fluid (not shown) moves axially along the axes of the array 700 passing through moving media 704, 703 sequentially from one medium 704 to the next moving medium 704, and so on in an axial direction until it passes through the last medium 704 and exits.
  • a separate working fluid passes through individual moving medium 703 axially through array 700.
  • the ducts 714 and 715 and separator 717 are shaped to form a continuous ring surrounding moving media 704, 703 and separating medium 704 from medium 703.
  • the thermally active components can be TE modules 701 that can be constructed so as to have effective thermal isolation in the direction of motion of the moving media 704, 703.
  • the TE modules 701 and 702 can be segments as described in Figure 7C. In the latter case, it is further advantageous for the thermal conductivity of the moving media 704, 703 to be low in the direction of motion so as to thermally isolate portions of the outer discs 729 and 732 of the moving media 704, 703.
  • the design could be further contain radial slots (not shown) in the sections 729 and 732 that are subject to heat transfer from TE modules 701 and 702 to achieve thermal isolation in the direction of motion.
  • FIG. 8 depicts another embodiment of a thermoelectric system an 800 having a plurality of TE elements 801 (hatched) and 802 (unhatched) between first side heat exchangers 803 and second side heat exchangers 808.
  • a power supply 805 provides current 804 and is connected to heat exchangers 808 via wires 806, 807.
  • the system 800 has conduits and pumps or fans (not shown) to move hot and cold side working media through the array 800 as described, for example, in Figures 2, 3, 4, 5, 6 and 7.
  • the TE modules (having many TE elements) are replaced by TE elements 801 and 802.
  • hatched TE elements 801 may be N-type TE elements and unhatched TE elements 802 may be P-type TE elements.
  • the housing of the heat exchangers 803, 808 and their internal fins or other types of heat exchanger members can be made of copper or other highly thermal and electrical conductive material.
  • the heat exchangers 803 and 808 can be in very good thermal communication with the TE elements 801 and 802, but electrically isolated.
  • electrical shunts can be connected to the faces of TE elements 801 and 802 to electrically connect them in a fashion similar to that shown in Figure 1 , but with the shunts looped past heat exchangers 803 and 808.
  • DC current 804 passing from N-type 801 to P-type TE elements 802 will, for example, cool the first side heat exchanger 803 sandwiched between them, and current 804 passing from P-type TE elements 802 to N-type TE elements 801 will then heat the second side heat exchanger 808 sandwiched between them.
  • the Array 800 can exhibit minimal size and thermal losses since the shunts, substrates and multiple electric connector wires of standard TE modules can be eliminated or reduced. Further, TE elements 801 and 802 can be heterostructures that accommodate high currents if the components are designed to have high electrical conductivity and capacity. In such a configuration, the array 800 can produce high thermal power densities.
  • FIG. 9 depicts a thermoelectric system 900 of the same general type as described in Figure 8, with P-type TE elements 901 and N-type TE elements 902 between, and in good thermal contact with first side heat transfer members 903 and second side heat transfer members 905.
  • the heat transfer members 903 and 905 have the form of thermally conductive rods or heat pipes. Attached to, and in good thermal communication with the heat transfer members 903 and 905 are heat exchanger fins 904 7 906, or the like.
  • a first conduit 907 confines the flow of a first working medium 908 and 909 and a second conduit 914 confines the flow of a second working fluid 910 and 91 1.
  • Electrical connectors 912 and 913 conduct current to the stack of alternating P-type and N-type TE elements 901 , 902, as described in Figure 8.
  • the second working media 910 enters through the second conduit 914. is cooled (in this example) as it passes through the second side heat exchangers 906 and exits as cooled fluid 91 1.
  • the TE elements 901 , 902 provide cooling to the second side heat transfer members 905 and hence, to heal exchanger fins 906.
  • the second side conduit 914 acts to confine the second (cooled in this example) working media 910, and to insulate it from other parts of array 900.
  • TE modules may be substituted for the TE elements 901 , 902.
  • the heat exchangers 904, 906 can be of any design that is advantageous to the function of the system.
  • the configurations of Figures 8 and 9 provide a relatively easily manufacturable system that also provides enhanced efficiency from thermal isolation.
  • the heat exchangers 808, 803 which alternate between P-type and N-type thermal electric elements, will either be of the colder or hotter heat exchanger type, but will be reasonably thermally isolated from each other and cause the thermoelectric elements of the P and N type to be reasonably thermally isolated from one another.
  • FIG. 10 depicts another thermoelectric array system (1000) that provides thermal isolation.
  • this configuration may perform the function of a system that utilizes cooling and heating of the same medium to dehumidify, or remove precipitates, mist, condensable vapors, reaction products and the like and return the medium to somewhat above its original temperature.
  • the system 1000 consists of a stack of alternating P-type TE elements 1001 and N-type TE elements 1002 with interspersed cold side heat transfer elements 1003 and hot side heat transfer elements 1004.
  • heat exchanger fins 1005, 1006 are provided for both the colder side heat transfer elements 1003 and the hotter side heat transfer elements 1004.
  • a colder side conduit 1018 and a hotter side conduit 1019 direct working fluid 1007, 1008 and 1009 within the array 1000.
  • a fan 1010 pulls the working fluid 1007, 1008 and 1009 through the array 1000.
  • colder side insulation 1012 thermally isolates the working fluid 1007 while travelling through the colder side from the TE element stack and hotter side insulation 1020 preferably isolates the working fluid while travelling through the hotter side from the TE element stack.
  • a baffle 1010 or the like separates the colder and hotter sides.
  • the baffle 1010 has passages 1010 for working fluids 1021 to pass through.
  • fluid passages 1017 allow fluid 1016 to enter the hot side flow passage.
  • a screen 101 1 or other porous working fluid flow restrictor separates the colder from the hotter side of array 1000. Condensate, solid precipitate, liquids and the like
  • some of the working fluid 1021 can be passed from the colder to the hotter side through bypass passages 1020.
  • the colder side fluid 1007 passes through the flow restrictor 101 1. but instead can be used to reduce locally the temperature of the hotter side working fluid, and thereby improve the thermodynamic efficiency of the array 1000 under some circumstances.
  • Proper proportioning of flow between bypass passages 1020 and flow restrictor 101 1, is achieved by suitable design of the flow properties of the system.
  • valves can be incorporated to control flow and specific passages can be opened or shut off.
  • the flow restrictor 1011 may also act as a filter to remove precipitates from liquid or gaseous working fluids 1008, or mist or fog from gaseous working fluids 1008.
  • additional hotter side coolant 1016 can enter array 1000 through side passages 1017, also for the purpose of reducing the hotter side working fluid temperature or increasing array 1000 efficiency.
  • power to the fan 1010 can be reversed and the system operated so as to heat the working fluid and return it to a cool state. This can be advantageous for removing reaction products, precipitates, condensates, moisture and the like that is formed by the heating process.
  • flow restrictor 1011, and/or heat exchangers 1005 and 1006 can have catalytic properties to enhance, modify, enable, prevent or otherwise affect processes that could occur in the system.
  • one or more pumps can replace fan/motor 1010 to achieve advantageous performance.
  • FIG 11 depicts a thermoelectric array 1 100 similar in design to that of Figures 2 and 3, but in which working media has alternate paths through the system.
  • the array 1 100 has TE modules 1 101 interdispersed between heat exchangers 1 102.
  • a plurality of inlet ports 1 103, 1 105 and 1 107 conduct working media through the array 1100.
  • a plurality of exit ports 1 104, 1 106 and 1108 conduct working media from the array 1100.
  • working media to be cooled enters at a first inlet port 1 103 and passes through several of the heat exchangers 1102, thereby progressively cooling (in this example), and exits through a first exit port 1 104.
  • a portion of the working media that removes heat from array 1 100 enters through a second inlet port 1 105, passes through heat exchangers 1102, is progressively heated in the process, and exits through a second exit port 1106.
  • a second portion of working media to remove heat enters a third inlet port 1 107, is heated as it passes through some of the heat exchangers 1 102 and exits through a third exit port 1 108.
  • This design allows the cool side working media which passes from the first inlet port 1 103 to the first exit port 1104 to be efficiently cooled, since the hot side working media enters at two locations in this example, and the resultant temperature differential across the TE modules 1101 can be on average lower than if working media entered at a single port. If the average temperature gradient is lower on average, then under most circumstances, the resultant system efficiency will be higher.
  • the relative flow rates through the second and third inlet port 1 105 and 1 107 can be adjusted to achieve desired performance or to respond to changing external conditions.
  • thermoelectric 100 The basic underlying connections for a conventional thermoelectric 100 are shown in additional detail in Figure 1 C.
  • a P-type element 1 10 and an TV-type element 1 12 are of the type well known to the art.
  • Shunts 106 are attached to, and in good electrical connection with, /'-type and /V-type TE elements 1 10 and 1 12. Generally, large numbers of such TE elements and shunts are connected together to form a TE module, as shown in Figure I A.
  • the length of TE elements 1 10, 112 in the direction of current flow is L c 1 16; their breadth is B c 1 17; their width is W c 1 18. and their distance apart is G c 120.
  • the thickness of shunts 106 is T c 109.
  • a TE configuration 1200 has a plurality of first side TE elements 1201 , 1202 of alternating conductivity types sandwiched in series between shunts 1203 and a plurality of second side shunts 1204, so that a current 1209 passes perpendicular to the breadth B B and width W B of the shunts rather than generally parallel to the breadth as in Figure 1 C.
  • the ratio, ⁇ B of R ?B to R 0n is:
  • L B is the TE element length
  • P SB is the shunt resistivity
  • B B is the TE element and shunt active breadth
  • W B is the TE elements and shunt active width
  • thermoelectric modules B c ⁇ 1 .6 mm.
  • thermoelectric material of the two is;
  • V c A f -L x .
  • the TE stack configuration 1200 of Figure 12 has P-type TE elements 1201 and TV-type TE elements 1202 of length L B 1205. The direction of current flow is indicated by the arrow 1209. The TE elements have a breadth B B and a width W B . Between
  • the PN shunts 1204 extend generally in the opposite direction from the stack 1200 than the NP shunts 1203. Angles other than 180° are also advantageous.
  • FIG. 13 A An illustration of a preferred embodiment 1300 of a shunt combined to form a heat exchanger 1302 is depicted in Figure 13 A.
  • at least one TE element 1301 is electrically connected, such as with solder, to a raised electrode surface 1303 of a heat exchange shunt 1302.
  • the shunt 1302 can be constructed primarily of a good thermal conductor, such as aluminum, and have integral clad overlay material 1304, 1305, made of a high-electrical conductivity material, such as copper, to facilitate TE element 1301 attachment and current flow at low resistance.
  • Figure 13B depicts a detailed side view of a portion of a stack thermoelectric assembly 1310 made up of the thermoelectric shunts 1302 and TE elements 1301 of Figure 13 A.
  • a plurality of shunts 1302 with raised electrode surfaces 1303 are electrically connected in series to TE elements 1301 of alternating conductivity types.
  • the shunts 1302 will be alternately heated and cooled when an appropriate current is applied.
  • the thermal power produced is transported away from the TE elements 1301 by the shunts 1302.
  • the raised electrodes 1303 facilitate reliable, low- cost, stable surfaces to which to attach the TE elements 1301.
  • a stack of a plurality of these assemblies 1310 may be provided.
  • An array of stacks could also be used which also further facilitates thermal isolation.
  • the electrodes 1303 advantageously can be shaped to prevent solder from shorting out the TE elements 1301. Also, the electrodes 1303 advantageously can be shaped to control the contact area and hence, current density, through the TE elements 1301.
  • FIG. 14 An example of a portion of a shunt heat exchanger 1400 is depicted in Figure 14. This portion 1400 has increased surface area to aid heat transfer.
  • a TE element 1401 is attached to a shunt 1402, preferably constructed as depicted in Figure 13 A, or as in other embodiments in this application.
  • Heat exchangers 1403, 1404, such as fins, are attached with good thermal contact, such as by brazing, to the shunt 1402.
  • a working fluid 1405 passes through the heat exchangers 1403, 1404.
  • the shunt portion 1400 is configured so that as the working fluid 1405 passes through the heat exchangers 1403, 1404. the ⁇ nal power is transferred efficiently.
  • the size of materials and proportions of the shunt 1402 and heat exchangers 1403. 1404 are designed to optimize operating efficiency when combined into a stack such as described in Figures 12 and 13B.
  • the heat exchangers 1403, 1404 can be louvered, porous or be replaced by any other heat exchanger design that accomplishes the stated purposes such as those described in "Compact Heat Exchangers " . Third Edition, by W. M. Kays and A. L. London.
  • the heat exchangers 1403, 1404 can be attached to the shunt 1402 by epoxy, solder, braze, weld or any other attachment method that provides good thermal contact.
  • FIG. 15 Another example of a shunt segment 1500 is depicted in Figure 15.
  • the shunt segment 1500 is constructed of multiple shunt elements 1501 , 1502, 1503 and 1504.
  • the shunt elements 1501. J 502, 1503 and 1504 may be folded over, brazed, riveted to each other or connected in any other way that provides a low electrical resistance path for a current 1507 to pass and to provide low thermal resistance from a TE element 1506 to the shunts 1501 , 1502, 1503 and 1504.
  • the TE element 1506 is advantageously attached to segment 1500 at or near a base portion 1505.
  • the shunt segment 1500 depicts a design alternative to the shunt segment 1400 of Figure 14, and can be configured in stacks as depicted in Figures 12 and 13, and then in arrays of stacks if desired. Both the configurations in Figures 14 and 15 can be automatically assembled to lower the labor cost of the TE systems made from these designs.
  • Shunt segments can also be formed into stack assemblies 1600 as depicted in Figure 16.
  • Center shunts 1602 have first side TE elements 1601 of the same conductivity type at each end on a first side and second side TE elements 1605 of the opposite conductivity type at each end of the opposite side of the center shunts 1602.
  • the right shunts 1603 are placed such that the left end is sandwiched between, the TE elements 1601 , 1605 in good thermal and electrical contact.
  • the left side shunts 1604 are positioned such that the right end is sandwiched between TE elements 1601, 1605, and are in good thermal and electrical contact.
  • the shunts 1602, 1603 and 1604 are alternately stacked and electrically connected to form a shunt stack 1600.
  • a first working fluid 1607 and a second working fluid 1608 pass through the assembly 1600.
  • the stack may be, and likely will, consist of many additional shunt elements in the stack.
  • the small portions of a stack assembly 1600 are merely depicted to provide the reader with an understanding. Further replication of such stacks is clear from the figures.
  • additional stacks, thermally isolated in a direction of working fluid flow could be provided.
  • the stack assembly 1600 forms a solid-state heat pump for conditioning fluids. It is important to note that the stack 1600 can have few or many segments and can thereby operate at different power levels, depending on the amount of current and voltage applied, component dimensions and the number of segments incorporated into the assembly. Arrays of such stacks may also be advantageous. In a situation where arrays of such stacks 1600 are used, it would be preferable to provide thermal isolation in the direction of fluid flow as described in U.S. Patent No. 6,539,725 for improved efficiency.
  • shunts 1602, 1603, 1604 can be replaced by other shapes such as, but not limited to, those depicted in Figures 14 and 15, to improve performance.
  • a TE assembly 1700 is constructed of right side shunts 1703 and left side shunts 1704 to form a generally circular shape.
  • the right side shunts 1703 are advantageously configured to form a partial circle as are the left side shunts 1704.
  • the shunts which become cold during operation may be either larger or smaller than the shunts that become hot, depending on the particular goals of the device. It should be noted that the substantially circular configuration is not necessary, and other configurations of the shunt segments shown in Figure 17 to create a center flow portion could be used.
  • the right side shunts could be half rectangles or half squares
  • the left side shunts 1704 could be half rectangles or squares.
  • one side could be multi- sided and one side could be arcuate.
  • the particular shape of the shunts are changeable.
  • the TE elements 1701 and 1702, of alternating conductivity type, as discussed for Figure 16, are electrically connected in series in the stack assembly 1700.
  • a fluid 1712 passes into the central region formed by the shunts 1703, 1704.
  • a first portion 1707 of the fluid 1712 passes between the right side shunts 1703 and a second portion 1706 of the working fluid 1712 passes between the left side shunts 1704.
  • a power supply .
  • a fan 1709 may be attached to one (or both) ends of the stack.
  • a pump, blower, or the like could be used as well.
  • the fan 1709 When power is applied to the fan 1709, it pumps the working fluid 1712 through the assembly 1700.
  • current is supplied with a polarity such that the right shunts 1703 are cooled, the first fluid portion 1707 of working fluid 1712 is cooled as it passes through them.
  • the second portion 1706 of working fluid is heated as it passes through heated left side shunts 1704.
  • the assembly 1700 forms a simple, compact cooler/heater with a capacity and overall size that can be adjusted by the number of shunts 1703, 1704 utilized in its construction. It is apparent that the shunts 1703, 1704 could be angular, oval or of any other advantageous shape. Further, the shunts can be of the designs depicted in Figures 14, 15 or any other useful configuration.
  • thermoelectric system of Figures 12, 14, 15, 16 and 17, more than one TE element can be used in one or more portions of an array as is depicted in Figure 18.
  • TE elements 1801 , 1804 are connected to raised electrode surfaces 1804 on each side of shunts 1802, 1803.
  • a number of TE elements 1801, electrically in parallel, can increase mechanical stability, better distribute thermal power and add electrical redundancy to the system. More than two TE elements 1801 can be used in parallel.
  • FIG. 19 An electrical insulation 1905 isolates an electrode portion 1903 of a shunt 1900 from a heat exchange portion 1904 of the shunt 1900.
  • TE elements 1901 , 1902 are preferably mounted on the electrode portion 1903.
  • the electrical insulation 1905 is a very good thermal conductor such as alumina, thermally conductive epoxy or the like.
  • the interface shape formed by electrical insulation 1905 is a shallow "V" shape to minimize thermal resistance. Any other shape and material combination that has suitably low interfacial thermal resistance can be used as well.
  • a stack of such shunts 1900 can be used as described previously.
  • First TE elements 2001 are connected to a left shunt 2003 of shunt segment array 2000
  • second TE elements 2002 are connected to a right shunt 2004 of shunt segment array 2000
  • Electrical insulation 2005 is positioned between left side shunt segments 2003 and right side shunt segments 2004.
  • a shunt portion 2103 with two first TE elements 2101 is mechanically attached to a second shunt portion 2104 with two second TE elements 2102.
  • Electrical insulation 2106 mechanically attaches shunt portions 2103 and 2104, which are also separated from one another by a gap 2105.
  • the electrical insulation 2106 need not be a good thermal conductor.
  • the TE elements 2101 and 2102 each provide thermal power to the respective shunt portions 2103 and 2104.
  • Electrical insulation 2106 can be adhesive-backed Kapton tape, injection molded plastic, hot melt adhesive or any other suitable material.
  • the shunt portions 2103 2104 do not overlap to form a lap joint. Such a joint, with epoxy or other electrically insulating bonding agent could also be used.
  • FIG. 22 Another shunt segment array 2200, depicted in top view in Figure 22, has electrically isolated shunt segments in a rectangular TE array 2200.
  • First TE elements 2201 are thermally connected to first shunt portions 2202
  • second TE elements 2203 are thermally connected to second shunt portions 2204.
  • Each shunt portion is separated electrically from the other shunt portions by gaps 2210, 2211.
  • Electrical insulation 2208 at the left side of the assembly, insulation 2207 in the middle and insulation 2209 on the right side are preferably provided.
  • An arrow 2212 indicates working fluid flow direction. This configuration can be operated at higher voltage and lower current than a similar array without electrical isolation.
  • first TE elements 2201 and second TE elements 2203 need not, but may be, of differing conductivity types. This will depend on the direction of desired current flow.
  • the TE elements 2202, 2203 may, however, be at different potentials.
  • the gaps 2210 serve to effectively thermally isolate first shunt portions 2202 from each other, and second shunt portions 2204 from each other.
  • the side insulation 2208, 2209 provide both thermal and electrical isolation while mechanically attaching the shunts together.
  • Center insulation 2207 provides electrical insulation and thermal isolation along its length.
  • array 2200 is constructed to produce thermal isolation in the direction of arrow 2212 as described in U.S. Patent No. 6,539,725. This configuration can be operated at higher voltage and lower current than a similar array without electrical isolation.
  • a cooling system 2300 that employs shunt segment arrays generally of the type described in Figure 22, is depicted in Figure 23.
  • the cooling system 2300 has inner shunt segments 2301. 2302 connected mechanically by electrically insulating material 2320 such as tape.
  • the inner shunt segments 2302 are mechanically connected by electrically and thermally insulating material 2321.
  • the inner segments 2301 are mechanically connected by electrically and thermally insulating material 2307.
  • the inner shunt segments 2301 , 2302 separately are connected to TE elements at the ends (not shown) in a manner described for Figure 22.
  • the TEs are sandwiched in the stack between inner shunt segments 2301 , 2302 and respective outer shunt segments 2303, 2305.
  • the center shunt segments 2301 separately are connected to outer left shunt segments 2305, and the inner shunt segments 2302 are connected to right outer shunt segments 2303.
  • the right outer shunt segments 2303 are similarly mechanically connected by electrically and thermally insulating material 2322 which is similar to electrically insulating material 2321 connecting the inner shunt segments 2302.
  • the left outer shunt segments 2305 are similarly mechanically connected.
  • a housing 2311 holds a stack array of shunt segments and TEs.
  • Terminal posts 2312 and 2314 are electrically connected to inner segments 2301.
  • terminals 2315 and 2316 connect to inner shunt segments 2302.
  • thermally and electrically insulating spacers 2309. 2310 are positioned between each inner and outer segment.
  • a first working fluid 2317 passes through the inner region and a second working fluid 2318, 2319 passes through the outer regions.
  • the inner shunt segments 2301 , 2302 are cooled.
  • the outer shunt segments 2303, 2305 are heated.
  • the working fluid 2317 passing through the inner region is cooled, and the working fluid 2318, 2319 passing through the outer shunt segments 2303, 2305 is heated.
  • the housing 2311 and the insulators 2309, 2310 contain and separate the cooled fluid 2317 from the heated fluid 2318, 2319.
  • each stack in the system 2300 can be in series to operate at high voltage, in series/parallel to operate at about half the voltage or in parallel to operate at about % the voltage.
  • Polarity could be reversed to heat the inner working fluid 2317 and cool the outer working fluids 2318, 2319. More segments could be utilized in the direction of working fluids 2317, 2318, 2319 flow to operate at even higher voltage and to achieve higher efficiency from the resultant more effective thermal isolation.
  • FIG. 24A and 24B Another compact design that achieves enhanced performance from thermal isolation uses combined shunt and heat transfer segments 2400 as depicted in Figure 24A and 24B.
  • This design is very similar to that of Figure 14, but with TE elements 2401, 2402 aligned in the general direction of fluid flow.
  • the TE elements 2401, 2402 of opposite conductivity type are connected to an extension 2403 of a shunt 2404.
  • heat exchangers 2405, 2406 such as fins, are in good thermal contact with the shunt 2404.
  • a working fluid 2409 is heated or cooled as it passes through heat exchanger fins 2405, and 2406, depending on the direction of current flow.
  • Figure 24B depicts a portion of a stack 2410 consisting of TE shunt segments 2400 as shown in Figure 24A.
  • Current 2417 flows in the direction indicated by the arrow.
  • a plurality of first side shunts 2400 and a plurality of second side shunts 2400a are connected to TE elements 241 1.
  • a first working fluid 2418 flows along the lower portion of stack 2410 through the heat exchangers on the second side shunts 2400a in Figure 24a, and a working fluid 2419 flows advantageously in the opposite direction through the heat exchangers of first side shunts 2400.
  • FIG. 25A An alternative TE stack configuration 2500 is depicted in Figure 25A.
  • This TE stack achieves the benefits of thermal isolation with a working fluid 2513 flowing generally perpendicular to the direction of current flow 2512.
  • a first shunt 2502 is connected electrically to a first TE element 2501 and is in good thermal contact with heat exchangers 2503, 2504.
  • a second first side shunt 2506 is similarly in good thermal contact with its heat exchangers 2508, and a third first side shunt 2505 is in good thermal contact with its heat exchangers 2507.
  • Interspersed between each first side shunt 2502, 2506 and 2505 are TE elements 2501 of alternating type and second side shunts 2509, 2510 and 2511 projecting generally in the opposite direction, as with Figure 12.
  • Second side shunts 2509, 2510 and 251 are generally of the same shape and bear the same spatial relationship as first side shunts 2502, 2506 and 2505.
  • a working fluid 2513 passes through the stack assembly in the direction indicated by the arrow.
  • first side shunts 2502, 2505 and 2506 are heated and second side shunts 2509, 2510 and 251 1 arc cooled.
  • the working fluid 2513 passes first through heat exchanger 2507, then through the heat exchanger 2508 and finally through the heat exchanger 2503, it is progressively heated.
  • a full stack assembly has repeated sections of the array 2500, in the direction of current flow, assembled so that the top of heat exchanger 2503 would be spaced closely to the bottom of the next sequential heat exchanger 2504 of another array portion.
  • the thermal isolation in the direction of woiking fluid 2513 flow is readily apparent.
  • Figure 25B is a plan view of the array portion 2500 depicted in Figure 25 A.
  • the cooling of a plurality of TE elements 2501 are interspersed with the plurality of first side shunts 2502, 2506, 2505, and a plurality of second side shunts 251 1 , 2509 and 2510, so that the first side shunts 2502, 2506 and 2505 alternate with the second side shunts 2511 , 2509 and 2510.
  • the shunts are separated by gaps 2534 and are in good thermal contact with heat exchangers for each shunt.
  • a first working fluid 2531 passes along the upper section from right to left and a working fluid 2532 passes advantageously from left to right along the lower section.
  • Thermal and electrical insulation 2533 is preferably provided between each pair of shunts, except where the electrical current flows through the TEs and shunts.
  • the working fluid 2531 is progressively heated and the working fluid 2532 is progressively cooled.
  • the insulation 2533 prevents unnecessary thermal losses and also prevents the working fluids 2531 , 2532 from mixing.
  • the array 2500 operates in counter flow mode, and employs thermal isolation to enhance performance.
  • the same array 2500 can operate with the working fluids 2531 , 2532 moving in the same direction in parallel flow mode, and still have the benefits of thermal isolation to enhance performance.
  • the TE elements 2521 are not all of the same resistance, but have resistances that vary depending on the temperature and power differentials between individual TE elements, as described in U.S. Patent No. 6,539.735.
  • FIG. 26A- Another TE module 2600 is depicted in Figure 26A- that uses the principles discussed in the present description to achieve operation at higher voltages and possible other benefits such as higher power density, compact size, ruggedness, higher efficiency.
  • a first TE element 2601 is sandwiched between a first end shunt 2603 and a second shunt 2604.
  • a second TE element 2602, of opposite conductivity type is sandwiched between the second shunt 2604 and a third shunt 2605. This pattern is continued to final end shunt 2606.
  • a current 2607 flows into final end shunt 2606, through the TE modules and out the first end shunt 2603, as indicated by arrows 2608 and 2609.
  • Gaps 261 1 prevent electrical conduction and reduce thermal conduction between adjacent shunts.
  • the first end shunt 2603 and the final end shunt 2606 have an electrode surface 2612.
  • the other shunts have shunt surfaces 2614 that are thermally conductive but electrically insulating from the body of the shunts.
  • suitable current 2608 passes through the TE module 2600 heating the upper surface- and cooling the lower surface (or vice versa).
  • the TE module 2600 depicted in Figure 26A consists of five TE elements and six shunts.
  • any odd number of TE elements can be employed, spaced alternately with shunts as depicted.
  • more than one TE element (of the same type as explained for Figure 18) may be connected in parallel between each pair of shunts.
  • an even number of TEs can be used, such as to have electrical power confined to electrically isolated portions of one surface.
  • FIG. 26B An array 2620 of TE modules 2600 is depicted in Figure 26B.
  • Figure 26B depicts two TE modules 2600, of the type shown in Figure 26A, stacked on top of each other with a center heat transfer member 2635 sandwiched between first side shunts 2604.
  • Outer heat transfer members 2632 and 2636 are thermally coupled to second side shunts 2605.
  • the shunt and heat transfer members can also be of any other suitable types, for example, the types presented in Figures 14 and 1 5.
  • a first end shunt 2603 of a first TE module is electrically connected to the outer heat transfer members 2632.
  • the other end shunt 2606 of the first or upper TE module is electrically connected to the center heat transfer member 2635.
  • a second end shunt 2606a of the second TE module is electrically coupled to the center heat transfer member 2635 and the first end shunt 2603a of the second TE module is electrically coupled to the outer heat transfer member 2636 on the bottom of Figure 26B.
  • the other shunts 2604, 2605 have electrical insulation 2612 that is thermally conductive.
  • the shunts have gaps 2611 to electrically isolate them from one another. Current flow is indicated by the arrows 2628, 2629, 2630, 2631 and 2637.
  • the TE elements 2601 , 2602 alternate in conductivity type.
  • second side shunts 2605 and the outer heat transfer members 2632 and 2636 are heated.
  • the first side shunts 2604 and center heat transfer member 2635 are cooled.
  • the operating current can be adjusted along with the corresponding voltage by adjusting the dimensions and number of TE elements 2601, 2602.
  • power density can be adjusted.
  • a larger number of shunts and TE elements could be used, which would widen the configuration shown in Figure 26B.
  • further TE modules 2600 could be stacked in a vertical direction.
  • an array of such stacks into or out of the plane of Figure 26B could be provided or any combination of the above could be utilized.
  • thermal isolation principles in the direction of heat transfer or working fluid flow could be utilized in accordance with the description in U.S. Patent No. 6,539, 725.
  • FIG. 27 An alternative embodiment of a TE module 2700, similar in type to the TE module 2600 of Figure 26A, is illustrated in Figure 27.
  • End shunts 2705, 2704 are electrically connected to a power source 2720 and ground 2709.
  • TE elements 2701 , 2702 are electrically connected to between the series of shunts 2703, 2704, 2705, 2706.
  • all shunts 2703, 2704, 2705, 2706 are electrically isolated by insulation 271 1 from first and second heat transfer members 2707, 2708.
  • the shunts are in good thermal contact with the heat transfer members 2707, 2708.
  • First side heat transfer member 2708 moves in the direction indicated by an arrow 2712.
  • the second side heat transfer member 2707 moves in the opposite direction, as indicated by an arrow 2710.
  • the second side heat transfer member 2707 is cooled and the first side heat transfer member 2708 is heated. Operation is similar to that associated with the description of Figure 7A 7 7B, 7C, and 7D. It should be noted that the first and second heat transfer members 2707, 2708, need not be rectangular in shape as might be inferred from Figure 27 7 but may be disk shaped or any other advantageous shape, such as those discussed in Figure 7A. With effective design, the TE module 2700 can also achieve the performance benefits associated with thermal isolation as discussed in U.S. Patent No. 6,539.725.
  • heat transfer components 2707 and 2708 do not move.
  • the TE module 2700 is similar to a standard module as depicted in Figure I 3 but can operate with a high power density and utilize relative thin TE elements 2701 , 2702.
  • the TE module 2700 induces low shear stresses on the TE elements 2701 , 2702 that are produced by thermal expansion differences between the first side and second side shunts, for example. Because shear is generated in the TE module 2700 by the temperature differential across TE elements 2701 , 2702, and is proportional to the width dimension, it can be much less than the shear in a standard TE module, in which the shear is proportional to the overall module width. The differences can be seen from a comparison of Figure 12 with a standard module depicted in Figure 1. Standard modules with more than two TE elements of the same dimensions as those in the configuration of Figure 12 will exhibit disadvantageously high shear stresses. Such stresses limit thermal cycling durability and module size.
  • Figure 27 also provides a good illustration to describe how the embodiments described in this specification can be used for power generation as well.
  • the terminals 2709, 2720 are connected to a load rather than a power source in order to provide power to a load.
  • the heat transfer members 2708, 2707 provide thermal power in the form of a temperature gradient.
  • the temperature gradient between the first heat transfer member 2708 and second heat transfer member 2707 causes the thermoelectric system 2700 to generate a current at terminals 2709, 2720, which in turn would connect to a load or a power storage system.
  • the system 2700 could operate as a power generator.
  • the other configurations depicted in this description could also be coupled in similar manners to provide a power generation system by applying a temperature gradient and deriving a current.
  • a TE heat transfer system 2800 is depicted in Figure 28 that uses a gas working fluid 2810. and a liquid working fluid 2806.
  • first side shunt heat exchangers 2803 are of construction depicted in Figure 24A and Figure 24B.
  • the shunt heat exchangers 2803 transfer thermal power with the gaseous working media 2810.
  • second side shunts heat exchanger 2804, 2805 transfer thermal power with liquid working media 2806.
  • a plurality of TE elements 2801 of opposite conductivity types are sandwiched between second side shunts 2804, 2805 and the shunt heat exchanger 2803.
  • the second side shunt heat exchangers 2804, 2805 are similarly sandwiched between TE elements 2801 of alternating conductivity type.
  • a current 2812, 2813 passes through the system 2800 as represented by the arrows 2812, 2813.
  • tubes 2814, 2815 pass the liquid working media 2806 from one shunt heat exchanger 2804, 2805 to the next one.
  • Operation of the TE heat transfer system 2800 is similar to that of the description of Figure 24B, with one working fluid 2810 being gaseous and the other 2806 being liquid.
  • the benefits of thermal isolation as described in U.S. Patent No. 6,539,725 are also achieved with the design depicted in system 2800.
  • Figure 29 depicts details of a shunt heat exchanger 2900.
  • the assembly advantageously has a container 2901 constructed of very good thermally conductive material, an electrode 2902 constructed of very good electrically conductive material, and heat transfer fins 2905 and 2906 in good thermal contact with the top and bottom surfaces of container 2901.
  • the container 2901 and the electrode 2902 are constructed of a single material, and could be unitary in construction.
  • an interface 2904 between the bottom surface of container 2901 and electrode 2902 has very low electrical resistance. Fluid 2909 passes through the shunt heat exchanger 2900.
  • TE elements are electrically connected to the top and bottom portions of the electrode 2902.
  • the container 2901 and the fins 2905, 2906 are heated or cooled.
  • the working fluid 2909 passing through the shunt heat exchanger 2900 is heated or cooled by the heat exchange 2900.
  • the shunt heat exchanger 2900 is of sufficiently good electrical conductivity that it does not contribute significantly to parasitic losses. Such losses can be made smaller by minimizing the current path length through electrode 2902, maximizing electrical conductivity throughout the current path, and increasing electrode 2902 cross sectional area.
  • the container 2901 top and bottom surfaces, and fins 2905 and 2906 provide sufficient electrical conductivity in the direction of current flow, that the solid electrode body 2902 can be reduced in cross sectional area or completely eliminated as shown in the embodiment in Figure 4B.
  • a heat sink and fluid system 3000 is depicted in Figure 30.
  • TE elements 3001 of alternating conductivity types are interspersed between fluid heat exchanges 3004, each having shunt portions 3003, and shunts 3002 and 3005.
  • Current 3006, 3007 flows through the shunt portions 3003, the shunts 3002 and 3005 and the TE elements 3001.
  • a working fluid 3009 flows as indicated by the arrow.
  • Heat sinks 3010, 3011 are in good thermal contact with and electrically insulated from the shunts 3002, 3005.
  • FIG. 3 IA An alternative shunt heat exchanger embodiment 3100 is depicted in Figure 3 IA.
  • a shunt portion 3101 has electrodes 3102 for connection to TE elements (not shown) and heat transfer extensions 3108 in good thermal contact with heat exchangers 3103, such as fins.
  • a fluid 3107 passes through the heat exchangers 3103.
  • the shunt heat exchanger 3100 preferably has electrodes 3102 located generally centered between heat transfer extensions 3108.
  • thermal power can flow into and out of the TE assemblies in two directions, and thus can increase heat transfer capacity by about a factor of two per TE element in comparison to the embodiment depicted in Figure 24A.
  • the shunt side may have increased heat transfer characteristics such as by incorporation heat pipes, convective heat flow, or by utilizing any other method of enhancing heat transfer.
  • Figure 31 B depicts a heat transfer shunt assembly 31 ] 0 with a shunt 31 11, electrodes 3112 and influent fluid ports 31 13, 31 14, and effluent fluid ports 3115, 31 16.
  • the heat transfer shunt assembly 3110 can have increased heat transfer capacity per TE element and more fluid transport capacity than the system depicted in Figure 29.
  • Figure 31C depicts a shunt assembly 3120 with shunt member 3121 , electrodes 3122 and heat exchange surfaces 3123, 3124.
  • the shunt assembly 3120 can have approximately two times the heat transfer capacity per TE assembly as the embodiment depicted in Figures 26A and 26B.
  • stacks of shunt assemblies 3120 would alternate at approximately right angles to one another and the surfaces 3123, 3124 opposite one another would both be heated, for example, and the next pair of surfaces in the stack at about a right angle to the heated pair, would be cooled.
  • the surfaces 3123, 3214 could be at other angles such as 120° and be interdispersed with shunts 2604 as depicted in Figure 26. Any combination of m ⁇ ltisided shunts is part of the inventions.
  • thermoelectric elements discussed herein may be as thin as 5 microns to 1.2 mm in one general embodiment.
  • thermoelectric elements may be between 20 microns and 300 microns thick, more preferably from 20 microns to 200 microns, and even from 20 microns to 100 microns.
  • the thickness of the thermoelectric elements is between 100 microns and 600 microns. These thicknesses for the thermoelectric elements are substantially thinner than conventional thermoelectric systems.
  • TE elements are advantageously attached directly to heat transfer members, thereby reducing system complexity and cost. It should also be noted that the features described above may be combined in any advantageous way without departing from the invention. In addition, it should be noted that although the TE elements are shown in the various figures to appear to be of similar sizes, the TE elements could vary in size across the array or stack, the end type TE elements could be of different size and shape than the P-type TE elements, some TE elements could be hetero structures while others could be non-hetero structure in design.
  • Thermoelectric cooling, heating and temperature control devices have important features that make them of great interest for use in several growing market sectors. For example, increased cooling capacity requirements for electronic chasses use small cooling systems with form factors not easily achieved with two-phase compressor systems. Similarly, local cooling and heating systems, quiet room heat pumps, and other applications could benefit by conversion from two-phase compressor-based technology to quiet, vibration-free solid-state solutions. However, while finding success in limited niche applications, adapting the technology has been slow, in part due to three deficiencies of such solid-state systems: • TE devices are generally about 1 A as efficient as two-phase compressor-based cooling systems, resulting in 4 times the operating costs and larger heat rejection components;
  • thermoelectric designs described herein advantageously optimize alternative thermodynamic cycles capable of approximately doubling efficiency in important applications.
  • the improvements in efficiency of certain embodiments are associated with working fluid movement, such as found in HVAC and temperature control systems. Results have been experimentally verified in air- and liquid-based devices.
  • high power density thermoelectric designs reduce thermoelectric material usage to a practical minimum, subject to the limitations of present thermoelectric material fabrication and heat transfer technology. Material use reduction has been enabled in certain embodiments described herein by improved heat transfer technology and more accurate modeling software. Certain embodiments described herein employ these technological advances and achieve substantial material reduction.
  • Certain embodiments described herein have been accurately and comprehensively modeled with simultaneous, multidimensional optimization algorithms that efficiently optimize complex designs.
  • the models allow design input variables to be constrained to ranges suitable for ease of manufacture, and other purposes. Also, design output can be constrained by imposing limits on volume, pressure drop, flow rate and other parameters.
  • thermoelectric-based solid-state cooling, heating and temperature control systems with 80 watts and 3500 watts of thermal power output.
  • Certain other embodiments described herein provide thermoelectric systems with other ranges of thermal power output.
  • Certain embodiments described herein comprise a liquid-based heating, cooling, and temperature control system. Certain embodiments described herein include one or more of the following specific technical design objectives: • Operating efficiencies at least 50% greater than that with conventional thermoelectric technology;
  • thermoelectric material usage less than 25% of commercial thermoelectric modules with the same thermal output
  • FIG 32 schematically illustrates a partial cut-away view of an example heal transfer device 3200 in accordance with certain embodiments described herein and
  • Figure 33 is a view of an example thermoelectric system subassembly 3300 compatible with certain embodiments described herein.
  • the thermoelectric system comprises a plurality of thermoelectric modules (not visible in Figure 33) and a plurality of heat transfer devices 3200.
  • Each heat transfer device 3200 comprises a housing 3210 and one or more heat exchanger elements 3220 inside the housing 3210.
  • Each heat transfer device 3200 accepts a working fluid to flow therethrough.
  • At least some of the heat transfer devices 3200 are in thermal communication with and sandwiched between at least two thermoelectric modules of the plurality of thermoelectric modules so as to form a stack of alternating thermoelectric modules and heat transfer devices 3200.
  • the stack is arranged to provide thermal isolation in the direction of a working medium movement.
  • the subassembly 3300 is compressively loaded to assure mechanical stability.
  • the housing 3210 comprises copper and the one or more heat exchanger elements 3220 comprises copper fins.
  • the housing 3210 of certain embodiments comprises a plurality of portions (e.g., two drawn copper shells) which are fitted together to form the housing 3210.
  • the housing 3210 is unitary in construction, with bends, folds, and/or removed material to define a volume through which the working fluid can flow.
  • the heat exchanger elements 3220 comprise a plurality of copper fins.
  • the heat exchanger elements 3220 of a heat transfer device 3200 in certain embodiments are unitary in construction, with bends, folds, and/or removed material to form a portion across which the working fluid can flow to transfer heat between the heat exchanger elements 3220 and the working fluid.
  • the heat exchanger elements 3220 can comprise folded copper fins positioned within the copper shells of the housing 3210.
  • the heat exchanger elements 3220 comprise two or more fin assemblies, as schematically illustrated by Figure 32.
  • the housing 3210 and the one or more heat exchanger elements 3220 are unitary in construction, with bends, folds, and/or removed material to form the heat transfer device 3200.
  • the housing 3210 comprises a first surface 3212 and a second surface 3214 generally parallel to the first surface 3212.
  • first surface 3212 is in thermal communication and in electrical communication with at least a first thermoelectric module of the plurality of thermoelectric modules.
  • second surface 3214 is in thermal communication and in electrical communication with at least a second thermoelectric module of the plurality of thermoelectric modules. This second thermoelectric module is also in thermal communication and in electrical communication with at least a second thermoelectric module.
  • alternate N- and P-type thermoelectric elements are soldered or brazed directly to the first surface 3212 and the second surface 3214, respectively, of the heat transfer device 3200.
  • the alternate N- and P- type thermoelectric elements are also soldered or brazed directly to the neighboring heat transfer devices 3200 of the thermoelectric system.
  • each heat transfer device 3200 comprises an inlet 3230 through which the working fluid enters the heat transfer device 3200 and an outlet 3240 through which the working fluid exits the heat transfer device 3200.
  • the working fluid in certain embodiments flows through the inlet 3230 in a direction generally perpendicular to the first surface 3212 and flows through the outlet 3240 in a direction generally perpendicular to the second surface 3214.
  • the outlet 3240 of a heat transfer device 3200 is fluidically coupled (e.g., by a fluid duct or conduit 3250) to the inlet 3230 of another heat transfer device 3200.
  • the two heat transfer devices 3200 fluidically coupled to one another by the fluid conduit 3250 are spaced apart by a thermoelectric module, another heat transfer device 3200. and another thermoelectric module, such that the working fluids move in a counter-flow pattern, with each fluid passing through every second heat transfer device 3200.
  • Figure 34 schematically illustrates the working fluid paths and the electrical connections of a heat exchanger subassembly 3300 (e.g., the stack) of an example thermoelectric system compatible with certain embodiments described herein.
  • the current flows along the length of the heat exchanger subassembly (e.g., the stack) 3300.
  • the subassembly 3300 achieves a degree of electrical redundancy by incorporating electrical circuits through parallel thermoelectric elements.
  • the series parallel redundancy shown in Figure 34 can advantageously add to device ruggedness, stability, and reliability of the thermoelectric system.
  • the thermoelectric system of certain embodiments comprises a first plurality of thermoelectric elements 3410, a second plurality of thermoelectric elements 3420, and a plurality of heat transfer devices 3200.
  • Each heat transfer device 3200 has a first side 3432 in thermal communication with two or more thermoelectric elements 3410 of the first plurality of thermoelectric elements 3410 and a second side 3434 in thermal communication with one or more thermoelectric elements 3420 of the second plurality of thermoelectric elements 3420, so as to form a stack of thermoelectric elements and heat transfer devices.
  • the two or more thermoelectric elements 3410 of the first plurality of thermoelectric elements 3410 are in parallel electrical communication with one another.
  • thermoelectric elements 3410 of the first plurality of thermoelectric elements 3410 are in series electrical communication with the one or more thermoelectric elements 3420 of the second plurality of thermoelectric elements 3420.
  • the one or more thermoelectric elements 3420 of the second plurality of thermoelectric elements 3420 comprises two or more thermoelectric elements 3420 that are in parallel electrical communication with one another.
  • thermoelectric elements 3410 of the first plurality of thermoelectric elements 3410 are P-type, and in certain such embodiments, the thermoelectric elements 3420 of the second plurality of thermoelectric elements 3420 are N-type.
  • Each heat transfer device 3200 in certain embodiments thermally isolates the two or more thermoelectric elements 3410 of the first plurality of thermoelectric elements 3410 from the two or more thermoelectric elements 3420 of the second plurality of thermoelectric elements 3420.
  • the stack is arranged to provide thermal isolation in the direction of a working medium movement.
  • each heat transfer device 3200 accepts a working fluid to flow therethrough in a general direction of the heat transfer device 3200.
  • the general directions of two or more heat transfer devices 3200 of the plurality of heat transfer devices 3200 are substantially parallel to one another.
  • the arrows of the heat transfer devices 3200 in Figure 34 show the general directions for fluid flow of the heat transfer devices 3200.
  • the general directions of at least two heat transfer devices 3200 of the plurality of heat transfer devices 3200 are substantially opposite to one another.
  • the outlet 3240 of a heat transfer device 3430 is fluidically coupled to the inlet 3230 of another heat transfer device 3430.
  • a first working fluid 3440 is cooled by flowing through a first set of the heat transfer devices 3200 and a second working fluid 3450 is heated by flowing through a second set of the heat transfer devices 3200.
  • the first working fluid 3440 flows generally along the stack in a first direction and the second working fluid 3450 flows generally along the stack in a second direction.
  • the first direction and the second direction are generally parallel to one another. In certain embodiments, the first direction and the second direction are generally opposite to one another.
  • the working fluids move in a counter-flow pattern, with each fluid passing through every second heat transfer device 3200.
  • the thermoelectric elements 3410, 3420 of certain embodiments are alternately P- and N-type in the direction of current flow, such that alternate heat transfer devices 3200 are heat sources and heat sinks.
  • the cooled working fluid 3440 is thereby progressively cooled as it passes through the heat transfer devices 3200, and the heated working fluid 3450 is thereby progressively heated as ' it passes through the heat transfer devices 3200.
  • the working fluids 3440, 3450 can flow in opposite directions, as shown schematically in Figure 34. In certain other embodiments, the working fluids 3440, 3450 can flow in the same direction and can achieve similar improvements in performance compared to operation with the standard thermodynamic cycle. Under certain conditions, such as very small temperature differentials, efficiency can be slightly greater than that achieved with opposing flow. In certain embodiments, this geometry satisfies the basic condition of thermal isolation without the addition of extra components, and in practice, can reduce the total number of components used to achieve the intended performance characteristics.
  • thermoelectric elements • Area, thickness, and number of the thermoelectric elements
  • thermoelectric electrodes • Electrical and thermal interfacial properties of the thermoelectric electrodes. The first four parameters listed above (except construction materials) were simultaneously optimized to yield the design parameters described below. Constraints were placed on the material thicknesses and spacing parameters to assure manufacturability. Liquid flow rates and temperature changes were fixed, and hence, were constraints applied during the optimization procedure to optimize the coefficient of performance (COP). Outputs of the simulations included: operating current and voltage, liquid pressure drops, number of thermoelectric elements, volume of thermoelectric material; and device weight and volume (excluding: manifolds, electrical and mechanical interface components, external insulation, and mounting brackets).
  • the example breadboard subassembly 3300 shown in Figure 33 was constructed in accordance with the model outputs for the optimized design.
  • the example subassembly 3300 is 87mm by 39mm by 15mm.
  • Each thermoelectric section sandwiched between two heat transfer devices 3200 has four thermoelectric elements, each 4mm by 3mm in cross-sectional area and a thickness of 0.6mm in the direction of current flow.
  • the four thermoelectric elements are electrically in parallel with one another between adjacent heat transfer devices 3200.
  • water was used as the working fluid.
  • the uniformity of heat transfer and heat capacity properties facilitated repeatable measurement of flow rates and the inlet and outlet temperatures. Thermal heat exchange with the environment and other sources of experimental inaccuracies were addressed and minimized. Test results were analyzed for accuracy by computing performance using two independent computational methods for the power input to the device, Q 1n .
  • Test methodologies were developed so that the test values as measured by the two methods were within at least 5% of one another.
  • the subassembly 3300 was mounted in a test fixture as shown in Figure 35.
  • the subassembly 3300 was mounted between two electrodes maintained at the inlet water temperature, lnterfacial electrical and thermal losses were minimized by using liquid metal (GaInSn) external electrical interfaces to simulate solder (PbSn) electrical connection of an example complete system.
  • the subassembly 3300 was placed in a foam insulation structure to reduce heat exchange with ambient.
  • Figure 36 shows a comparison of the measured performance results of the testing of the subassembly 3300 with simulated model results. These results show good correlation over a broad range of operating parameters. Accuracy of the model results were within 4% for operating conditions at and to the right (higher currents) of the point of peak COP for all of the temperature differentials tested. Test points to the left of the peak COP have not been included in the accuracy analysis. Such operating conditions are not typically of interest since they represent operating conditions that use much bulkier and more costly devices than those operating at the same COP on the right side of the peak. In addition, the very large slopes associated with this operating regime introduce both test errors and operating instabilities.
  • the parameter, epsilon is the ratio of current 1 to I maX: , the calculated current for maximum cooling power.
  • Imax 440 amperes.
  • the subassembly 3300 was tested at input currents from 30 to 150 amperes. Heated side to cooled side outlet temperature differentials ranged from 15°C to 55°C. Input electrical power to the subassembly 3300 varied from 4.89 to 87.49 watts.
  • thermoelectric material usage and hence, material cost
  • specific power increased by about a factor of 3.3.
  • thermoelectric elements were changed to three elements per layer, each 12 mm by 3 mm in cross-sectional area and 0.6 mm thick, thereby increasing the area of each thermoelectric layer. This was done to meet the need for a particular application in which the temperature differential was lower, by advantageously using more thermoelectric area per stage. As shown by comparing the results of Figures 36 and 37, the device was predicted to have slightly higher efficiency than the thermoelectric subassembly 3300 under the specific operating condition plotted.
  • the device was constructed in a 9 x 3 array with 1.5mm semi-rigid insulation between thermoelectric subassemblies, so that the core thermoelectric assembly was compact.
  • Ancillary parts were spaced apart with gaps filled with insulation, so as to allow access for thermocouples and other monitoring devices.
  • the ancillary parts included: fluid manifolds, electrical connections between subassemblies, and springs to uniformly compress the subassemblies. No attempt was made to minimize weight or volume of the ancillary parts.
  • Thermal cooling power 3500 watts
  • Liquid flow rate 0.16 liters/second
  • Thermoelectric material weight 306 grams
  • thermoelectric subassemblies (see, e.g., Figure 33) were connected in parallel for fluid flow and in series for current flow. Manifolds to direct the fluid flow also acted as top and bottom structural members. The manifolds also housed the electrical connections.
  • Tests of the completed device of Figure 38 show comparable accuracy to that of the example thermoelectric subassembly 3300, but testing was limited to fewer operating conditions because of power supply and working fluid flow rate capabilities of the test equipment used. Over the range of conditions tested, results did validate the model's performance perditions. Further, since the performance of the completed device and thermoelectric subassembly each agreed with the same predicted results for the subassembly, system level losses were shown to be sufficiently small so as to not invalidate the predicted performance at the system level. Hence, results for the completed device follow the predicted performance for the thermoelectric subassembly.
  • thermoelectric cooler compatible with certain embodiments described herein with liquid working fluid can have a high COP.
  • thermal power levels between 50 and 3,500 watts, such systems are viable candidates for liquid-based cooling applications. Since multiple identical subassemblies were used to demonstrate operation at 3,500 watts, it can be expected that very similar results would be observed for devices of at least 5,000 watt thermal capacity. Further, similar performance and model accuracy is obtained for operation in heating mode.
  • a class of cooling, heating and temperature control applications can be targets for the TE technology of certain embodiments described herein.
  • At least a portion of a single working fluid is circulated on both the heated and cooled sides of a thermoelectric system utilizing thermal isolation in the direction of flow.
  • the working fluid is cooled, and is re-heated to somewhat above its original temperature during the return pass on the heated side.
  • the thermal conductivity of the substrate and the heat exchange members on which the thermoelectric circuitry is mounted tends to make the temperature rather uniform over the entire surface of the device.
  • thermoelectric device minimizes the thermal conductivity in the direction of flow, then by cooling the heat transfer fluid as it flows over the first side, and then heating it again by flowing it in counter-flow on the other side, the temperature difference across any part of the thermoelectric device is advantageously made smaller, resulting in large improvements in COP, ⁇ T, or both.
  • thermoelectric system 400 comprises a plurality of thermoelectric modules 402 and a plurality of heat transfer devices 403.
  • Each heat transfer device 403 accepts a working fluid to flow therethrough.
  • At least some of the heat transfer devices 403 are in thermal communication with and sandwiched between at least two thermoelectric modules 402 of the plurality of thermoelectric modules 402 so as to form a stack of alternating thermoelectric modules 402 and heat transfer devices 403.
  • the stack is arranged to provide thermal isolation along a direction of a working medium movement.
  • a first working fluid is cooled by flowing through a first set of the heat transfer devices 403 and a second working fluid is heated by flowing through a second set of the heat transfer devices 403.
  • Figure 33 shows an example subassembly 3300 compatible with certain embodiments described herein.
  • Figure 40 schematically illustrates the temperature profiles of three thermoelectric systems as the working fluid circumnavigates the thermoelectric system.
  • the second working fluid comprises the first working fluid after having flowed through the first set of heat transfer devices.
  • the first working fluid receives an increase in temperature at the cold end from the load due to Q L .
  • the first working fluid is then fed back into the heated side as the second working fluid and exits at a temperature raised from the inlet temperature due to the sum of the input power, IV, and the load power Q L .
  • the temperature at which the first working fluid is fed back into the heated side depends upon the relative sizes of the heat load and the ability of the coldest stage of the device to pump heat.
  • the three profiles in Figure 40 show a range of possibilities for (i) small or no heat load, (H) moderate heat load, and (iii) large heat load.
  • the first working fluid is introduced to the cooled side at an inlet temperature T IN and is progressively cooled as it flows through along the cooled side to an end section where a heat load is applied.
  • the first working fluid is heated by the heat load and is introduced as the second working fluid to the heated side and is progressively heated further as it flows along the heated side to the outlet.
  • the outlet temperature T OUT of the second working fluid is higher than the inlet temperature T IN of the first working fluid.
  • thermoelectric devices 10243
  • thermoelectric system 4200 used to validate the model under various conditions.
  • the thermoelectric system 4200 comprises an inlet 4210 in fluidic communication with the cooled side of the thermoelectric system 4200, a heater 4220 attached to the cooled end 4230 to provide a heat load, an outlet 4240 in fluidic communication with the heated side of the thermoelectric system 4200, and a pair of electrodes 4250 to apply a current to the thermoelectric elements of the thermoelectric system 4200.
  • Insulating foam is used to insulate the thermoelectric system 4200 from ambient.
  • Figure 43 shows the effect of thermal isolation on maximum ⁇ Tc by plotting the maximum ⁇ Tc achievable for various numbers of thermal isolation stages.
  • Figure 44 shows the effect of thermal isolation on maximum power.
  • N is used for the number of stages of thermal isolation present in the thermoelectric system.
  • the second working fluid comprises one or more portions of the first working fluid after having flowed through one or more portions of the first set of heat transfer devices.
  • the one or more portions of the first working fluid comprise a plurality of portions of the first working fluid after having flowed through a plurality of portions of the first set of heat transfer devices.
  • Figure 45 schematically illustrates a configuration utilizing the cross connection of fluids compatible with certain embodiments described herein. Multiple portions of the first working fluid are diverted from the cooled side to the second working fluid on the heated side at several points along the thermally isolated stack. This configuration results in high flows at the inlet and outlet and low flows at the cold end. The smaller temperature difference across the high flow end is the factor improving performance.
  • the second working fluid comprises a portion of the first working fluid that does not flow through at least a portion of the first set of heat transfer devices.
  • Figure 46 schematically illustrates the effect of introduction of moderate temperature fluid into the heated side where its temperature matches that of the original flow in accordance with certain embodiments described herein. This introduction of a moderate temperature first working fluid into the second working fluid effectively removes the restriction of equal flows.
  • the benefit of the use of the cooled flow in certain embodiments is to make use of the cool fluid to further enhance the performance above that of one with simply independent flows.
  • the thermoelectric system provides increased cooling capacity at large temperature differential from ambient, in a way that is much more efficient than that achieved with the conventional cascade geometry.
  • the waste heat from each colder device must be passed through all of the higher temperature supporting devices, thus placing additional heat removal burdens on them over and above the heat removal from the cold surface of the coldest one.
  • the wast heat does not accumulate as it passes from one set of thermoelectric elements to the next. Since the use of the same fluid on both sides of the thermoelectric system removes the degree of freedom associated with differing flow rates, there is advantageously an external reason for applying this restriction. In certain embodiments, this reason can be due to the nature of the working fluid, the pumping means, the efficiency or cost of pumping, or the nature of the necessary containment of the fluid, as well as others.
  • Figure 47 shows an example temperature profile for an example thermoelectric system for removing vapor from a gas (e.g., dehumidif ⁇ cation of air) in accordance with certain embodiments described herein.
  • Figure 47 illustrates an example in which a first working fluid comprises vapor at a temperature above a condensation point of the vapor.
  • the first working fluid is cooled to a temperature below the condensation point by flowing through at least a portion of the first set of heat transfer devices (e.g., the cooled side of the thermoelectric system) such that at least a portion of the vapor condenses to a liquid.
  • the second working fluid comprises the first working fluid without the at least a portion of the vapor.
  • the first working fluid of humid air is introduced to the inlet of the thermoelectric system at a temperature T IN - AS the humid air flows through the cooled side of the thermoelectric system, it is cooled to the condensation point or dew point of the water vapor to be removed. Once the condensation point is reached, the humidity is then 100% and beginning there, the thermoelectric system not only advantageously cools the air, but also removes enough heat to condense at least a portion of the water vapor out from the air. At the lowest temperature, the desired concentration of water vapor is achieved and the now dehumidified air (without a portion of the water Vapor) is ducted to the heated side of the thermoelectric system to return to a higher temperature (e.g.. warm up as less humid air).
  • the exit air temperature T OUT is elevated above the inlet air temperature T IN . for example to provide the warmth needed for typical defogging and demisting applications. Other gases and vapors are also compatible with certain embodiments described herein.
  • thermoelectric system was simulated as both a conventional thermoelectric system and as one with thermal isolation.
  • a particular scenario was chosen as an example of the analysis, namely to determine the reduction in the relative humidity from 90% in 40 °C air. Current and flow rate were varied to optimize the power available to cool and condense the moisture.
  • Figure 48 shows the relative abilities of a conventional thermoelectric system and of a thermoelectric system utilizing thermal isolation to remove water from the air stream.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Devices For Blowing Cold Air, Devices For Blowing Warm Air, And Means For Preventing Water Condensation In Air Conditioning Units (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Measuring Temperature Or Quantity Of Heat (AREA)
  • Control Of Temperature (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

L'invention concerne un système thermoélectrique comprenant une première pluralité d'éléments thermoélectriques et une seconde pluralité d'éléments thermoélectriques. Le système thermoélectrique comprend en outre une pluralité de dispositifs de transfert de chaleur. Chaque dispositif de transfert de chaleur présente un premier côté en communication thermique avec deux éléments thermoélectriques ou plus de la première pluralité d'éléments thermoélectriques et un second côté en communication thermique avec un ou plusieurs éléments thermoélectriques de la seconde pluralité d'éléments thermoélectriques, de manière à former une pile d'éléments thermoélectriques et des dispositifs de transfert de chaleur. Les deux éléments thermoélectriques ou plus de la première pluralité d'éléments thermoélectriques sont en communication électrique parallèle les uns avec les autres, et les deux éléments thermoélectriques ou plus de la première pluralité d'éléments thermoélectriques sont en communication électrique en série avec un ou plusieurs éléments thermoélectriques de la seconde pluralité d'éléments thermoélectriques.
EP07836303A 2006-07-28 2007-07-27 Systèmes de commande de la température thermoélectriques à forte capacité Withdrawn EP2050148A2 (fr)

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US83400706P 2006-07-28 2006-07-28
US83400506P 2006-07-28 2006-07-28
PCT/US2007/016924 WO2008013946A2 (fr) 2006-07-28 2007-07-27 Systèmes de commande de la température thermoélectriques à forte capacité

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CN101517764B (zh) 2011-03-30
JP2009544929A (ja) 2009-12-17
WO2008013946A3 (fr) 2008-09-12
WO2008013946A2 (fr) 2008-01-31
CN101517764A (zh) 2009-08-26

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