EP2027461A1 - Dispositif de contrôle non destructif d'une structure par analyse vibratoire - Google Patents

Dispositif de contrôle non destructif d'une structure par analyse vibratoire

Info

Publication number
EP2027461A1
EP2027461A1 EP07729207A EP07729207A EP2027461A1 EP 2027461 A1 EP2027461 A1 EP 2027461A1 EP 07729207 A EP07729207 A EP 07729207A EP 07729207 A EP07729207 A EP 07729207A EP 2027461 A1 EP2027461 A1 EP 2027461A1
Authority
EP
European Patent Office
Prior art keywords
control device
vibratory
microsensors
waves
vibratory waves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP07729207A
Other languages
German (de)
English (en)
French (fr)
Inventor
Marie-Anne De Smet
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Airbus Operations SAS
Original Assignee
Airbus Operations SAS
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Airbus Operations SAS filed Critical Airbus Operations SAS
Publication of EP2027461A1 publication Critical patent/EP2027461A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01HMEASUREMENT OF MECHANICAL VIBRATIONS OR ULTRASONIC, SONIC OR INFRASONIC WAVES
    • G01H11/00Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties
    • G01H11/06Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means
    • G01H11/08Measuring mechanical vibrations or ultrasonic, sonic or infrasonic waves by detecting changes in electric or magnetic properties by electric means using piezoelectric devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01MTESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M5/00Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings
    • G01M5/0033Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings by determining damage, crack or wear
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01MTESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M5/00Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings
    • G01M5/0066Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings by exciting or detecting vibration or acceleration
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/14Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object using acoustic emission techniques
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22Details, e.g. general constructional or apparatus details
    • G01N29/223Supports, positioning or alignment in fixed situation
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00Indexing codes associated with group G01N29/00
    • G01N2291/26Scanned objects
    • G01N2291/269Various geometry objects
    • G01N2291/2694Wings or other aircraft parts

Definitions

  • the present invention relates to a device for non-destructive testing of a structure by vibratory analysis, comprising means for measuring the vibratory waves emitted by the structure to determine abnormal vibrations induced by the presence of defects in the structure.
  • the measuring means are integrated in a flexible support capable of adhering to the surface of the structure to be controlled.
  • the present invention finds applications for the non-destructive testing (NDT) of aircraft structures, but can be used in all industrial sectors where the integrity control of workpieces is important, such as automobile, railway , shipbuilding or nuclear power.
  • NDT non-destructive testing
  • the present invention is thus particularly intended to detect abnormal vibrations induced in aircraft structures when the aircraft is in flight. These vibrations in some cases are indicators of the appearance of defects in the structures, for example the appearance of cracks or cracks in the material constituting the aircraft structure.
  • X-ray or magnetic induction X-ray inspection means which make it possible to detect the failures of a structure but these means are difficult to implement and unsuitable for an aircraft structure without immobilization of the aircraft.
  • the present invention provides a device adapted to such a control that monitors the structural health of a structure throughout its period of use by local measurements of the vibratory behavior of said structure.
  • the problems to be solved for such a device are: to have a non-destructive control means adapted to be easily affixed to the surface of the structures to be controlled whether they are accessible or not while remaining negligible in weight and space and by requiring only a small electrical power for its operation, - to have a control means adapted to be permanently installed on the structures to be controlled during their use to perform predictive maintenance by detecting the appearance of defects rather possible, This makes it possible to schedule interventions and carry out less expensive repairs and to ensure maximum safety of the structures, to have a means of control that allows automatic management of controls and to provide a complete diagnosis of the health of the structures in order to Minimize the operator's work to reduce the cost of maintenance.
  • the present invention has a device for non-destructive testing of a structure that may have a defect.
  • said device comprises means for measuring the vibratory waves emitted by said structure at different points of a surface of said structure, said measuring means being integrated in a flexible support able to adhere to the surface of said structure to control, regulate.
  • Said means for measuring vibratory waves comprise a set of microsensors able to generate a mapping of the vibrations on the surface of the structure.
  • the dimensions and arrangement of the microsensors are determined to be able to detect the vibration variations induced by the presence of the defect having the smallest dimensions whose detection is sought.
  • the detection means are piezoelectric microsensors organized in matrix column lines, said microsensors transforming said vibratory waves emitted by said structure into electrical signals.
  • the device further comprises an interface electronics connecting said detection and measurement means to a recording memory, said interface electronics and said memory being also integrated on said flexible support. in order to advantageously produce a monolithic control device.
  • each microsensor comprises an array of piezoelectric lamellae arranged between two conductive plates, the ends of said lamellae being secured to the plates by means of a conductive adhesive material, one of the two plates being rendered integral to said support flexible, said two plates being connected themselves to said interface electronics.
  • control device comprises a computer system such as a microprocessor system for automatically determining the vibratory waves induced by the defect present in the structure from the vibratory waves measured by the microsensors.
  • a computer system such as a microprocessor system for automatically determining the vibratory waves induced by the defect present in the structure from the vibratory waves measured by the microsensors.
  • said control device comprises transmission means for sending electrical signals stored in the memory to said calculating system. using a wireless, radio or infrared link.
  • the computer system is integrated on the flexible medium and is connected between said interface and the recording memory.
  • the computing system comprises a memory containing at least one mapping of the vibratory reference waves of the structure or structures, computing means converting the electrical signals sent by the control device into vibratory waves, means for differential analysis and spectral analysis of said vibratory waves measured by the microsensors relative to the vibratory reference waves.
  • the differential analysis means comprise means for generating a state signal S, characteristic of the fact that a differential value between the reference vibratory waves and the vibratory waves measured by the microsensors exceeds a value threshold.
  • the spectral analysis means comprise means for generating a state signal S 'characteristic of the fact that the frequency representation of the vibratory waves measured by the microsensors with respect to the frequency representation of the reference vibratory waves has spectral lines corresponding to the vibratory waves induced by the presence of the defect in the structure.
  • the generated state signals S and S ' are either transmitted by the computer system to alarm means or stored in the memory recording of the control device, then transmitted to alarm means using a wireless link, radio or infrared.
  • the alarm means comprise for example a display screen and light and / or sound indicators.
  • the piezoelectric strips are adapted to detect vibratory waves at low frequencies and vibratory waves at high frequencies.
  • control device comprises a self-feeding system in which at least one line or a column of said microsensors is connected to an electrical energy accumulator intended to store the electrical energy generated by said microsensors and to restore said energy. electrical current form for powering the control device.
  • FIG. 1 a schematic representation of a sectional profile view of a control device comprising an array of piezoelectric microsensors according to an embodiment of the invention covering the surface of a structure to be controlled, the control device being itself covered by a layer of paint;
  • FIG. 2 a schematic representation in partial section of a piezoelectric microsensor of FIG. 1 comprising an array of piezoelectric lamellae arranged between two plates, the microsensor being integrated on a flexible support;
  • FIG. 3 a schematic representation of a view from above of the control device illustrating an embodiment of the device;
  • FIG. 4 a schematic representation of an embodiment of the control device of FIG.
  • FIGS. 5A, 5B and 5C a schematic representation of the different steps of a technical example of UV photolithography to obtain a network of lamellae
  • FIG. 6 a schematic representation of a sectional profile view of the integrated lamella network on a flexible support
  • FIG. 7 a schematic view of a network of control devices disposed on the surface of the structures of a ground plane in the position of transmission of signals recorded during the flight of the aircraft;
  • the various structures of the aircraft are excited in vibration by various energy sources.
  • the thruster pressure waves excite vibratory modes structures whose responses are characteristic of said structures.
  • the structure is modified, for example following the appearance of a structural anomaly such as a crack or a disorder in these structures, the vibratory response of the structure is modified.
  • the corresponding vibrations are superimposed on the structural vibrations of the excitation sources.
  • a temporal and spectral analysis of the vibratory waves makes it possible to extract the characteristics of the vibrations and to detect the presence of abnormal modes which are potentially at the appearance of the defects.
  • There are generally two categories of characteristic signals of a vibrating structure There are generally two categories of characteristic signals of a vibrating structure.
  • Low-frequency vibratory waves in the low frequency band 0 to about 25 KHz, which translate macro-displacements of the structure around a fixed position (macroscopic strain), and high frequency waves, in the band from about 20 kHz to some MHz, which translate microscopic displacements within the material constituting the structure (microscopic deformation).
  • An analysis of vibratory waves at low frequencies makes it possible to detect the presence of defects of mechanical origin while the analysis of vibratory waves at high frequencies makes it possible to detect the initiation of defects of small dimensions such as cracks, see related defects corrosion, generally evolving character and follow the evolution of these defects.
  • Figure 1 is shown a non-destructive testing device 1 of a structure 4 according to the invention for detecting and measuring vibration waves induced by the presence of the defect in a structure.
  • the flexible support 2 comprises a flexible support 2 on which are integrated measuring means 3 vibratory waves emitted by said structure at different points on the surface of the structure.
  • the flexible support 2 is for example made of a plastic material thus making it possible to fix the device on the surface of the structure to be checked by marrying the shape of the structure.
  • the flexible support of the control device 1 is made integral with the surface of the structure 4 to be controlled by means of an adhesive material.
  • this device is fixed on a critical area of the structure where cracks are likely to appear.
  • the device can be placed on critical areas considered for example at the level of the attachment zones of the fins, at the junction areas of panels constituting the fuselage, at the level of important fastening elements by example those of engines.
  • this control device 1 is adapted to receive a coating layer 5 which may be for example a paint layer which is superimposed on the control device 1.
  • the measuring means comprise an array of piezoelectric microsensors 3 preferably organized in a matrix of rows and columns. Each microsensor is able to transform the vibratory waves that it receives from the structure on which it is disposed in electrical signals.
  • Figure 2 schematically shows a sectional view of one of the network microsensors. It comprises a set of piezoelectric strips 6. Said set of strips is arranged between two conductive plates 8, 9.
  • each lamella are made integral with the two conductive plates 8, 9 by means of a conductive adhesive material 7, one of the two plates being secured to the flexible support 2 which is intended to cover the surface of an area of the structure to control.
  • FIG. 3 diagrammatically represents a view from above of the control device, according to a particular embodiment of the invention, which has a substantially rectangular shape, here for example illustrative of an array of 56 piezoelectric microsensors 3 organized in a matrix of lines 31 and columns 3c.
  • the device advantageously comprises an interface electronics 10 connecting the network of microsensors 3 to a recording memory 11.
  • the electronics 10 and the memory 11 are preferably integrated on the flexible support 2 so as to advantageously produce a device monolithic control.
  • the electrical signals collected by the plates 8, 9 of each microsensor are transmitted to the interface electronics 10 which preferably comprises means for amplifying said electrical signals.
  • the amplified signals are then routed to the recording memory 11.
  • the interface electronics 10 is disposed at the end of the microsensor lines in the embodiment of the device shown in FIG. 3. In another embodiment the interface electronics may be disposed at the end of the microsensor columns, but other relative devices between the microsensors and the interface electronics are possible within the scope of the invention.
  • Each microsensor 3 gives information on the vibrations of the structure at the location of the microsensor and the distribution of the microsensors makes it possible to obtain a mapping of the vibratory waves on the surface of said structure so that a defect in the structure which induces a Local modification of vibratory waves can be localized according to the microsensors.
  • the pitch between the microsensors is set at a value less than the minimum defect dimensions to be detected so that the discrimination of the position of the defects is possible and so that in the event of localized damage to the defect network.
  • the microsensors located around the damaged area of the network can always make it possible to carry out a monitoring of the zones sufficiently close to the defect likely to appear so that the defect is effective and detected.
  • the mode of transfer of electrical signals from the microsensors 3 to the interface electronics 10 is an interline transfer mode.
  • a storage line 23 Above each line of microsensors is arranged a storage line 23. The signals are temporarily stored in this storage line 23. The content of the storage lines is then transferred to the interface electronics 10 in a parallel mode. Then the electrical signals are evacuated in series to a recording memory 11.
  • each microsensor is addressed directly to send the electrical signals directly to the interface electronics 10.
  • the control device further comprises a calculator system 13 as shown schematically in FIG. 4 for converting the electrical signals characteristic of the vibratory waves measured into digital values and for determining the vibratory waves induced by the presence of the defect in the structure from the vibratory waves measured by microsensors.
  • the computer system is for example a microprocessor system.
  • the device comprises transmission means referenced by the number 12 in FIG. electrical signals recorded in the recording memory 11 to the computer system 13 using a wireless link, radio or infrared.
  • These transmission means comprise for example a transponder integrated on the flexible support which preferably operates at a fixed frequency, said frequency being chosen so that the emission of the electrical signals representative of the vibrations does not interfere with the emission of the others. data by devices other than the control device.
  • the computer system preferably includes an analog / digital converter for converting the analog electrical signals from the recording memory into digital values. These numerical values are then converted into vibratory waves by means of calculation in which is advantageously integrated a theoretical model or Experimental establishing the relationship between the detected vibration and the generated electrical charge.
  • the system comprises analysis means for performing a comparative study in amplitude and in frequency between the vibratory waves measured by the microsensors and reference vibratory waves.
  • the calculating system comprises a memory in which is recorded a database of reference vibratory wave mapping of the structure.
  • the reference cartography constitutes a predefined comparison model with respect to the behavior of the area covered by the control device. This mapping can be predetermined on a reference structure.
  • Reference structure means a structure deemed to have no defect, for example a structure at the exit of its production line and having passed all the qualification steps. It can also be predetermined by modeling.
  • the analysis means make an amplitude comparison between the reference vibratory waves and the vibratory waves measured by the microsensors, if the differential value determined between the reference vibration waves and the vibratory waves measured exceeds a threshold value, a signal d state S is generated by the analysis means.
  • This amplitude comparison is advantageously completed by a spectral analysis.
  • the analysis means first perform a Fourier transform of the vibratory waves measured to obtain a frequency representation of the vibration, by comparing the frequency representation of the vibratory reference waves and the frequency representation of the measured vibratory waves, lines spectral waves corresponding to the vibratory waves induced by the presence of the defect in the structure are then extracted by the analysis means which generates a second state signal S '.
  • the spectral analysis makes it possible to identify the nature of the defects encountered.
  • a vibratory spectrum comprises a set of lines. To easily identify the lines corresponding to the defects and to classify them according to the type of defects encountered preferably a library of Spectral configurations are also stored in the computer system memory.
  • the status signals S and S 'as well as all the information such as the nature of the faults, the size of the faults and the location of the faults are transmitted by the computer system to alarm means 14 which comprise, for example, a display screen.
  • alarm means 14 comprise, for example, a display screen.
  • display 22 to display the information and lights and / or audible indicators 20 to warn the maintenance operator.
  • the transmission of electrical signals stored in the memory 11 to the computer system can be programmed so that it is performed automatically at the end of a flight of the aircraft, for example. This transmission can also be activated manually by the maintenance operator by interrogating the control device during the inspection of the aircraft.
  • the computer system 13 is integrated directly on the flexible support 2 and connected between the interface electronics 10 and the recording memory 11.
  • the computer system 13 directly receives electrical signals from the interface electronics 10 and sends to the recording memory 11 only the state signals S and S 'and the information on the defects.
  • the operator discharges the status signals and the information stored in the memory of the control device to alarm means 14 using a wireless link, radio or infrared.
  • control device In the context of a real-time control of the structures, the control device is for example programmed to be activated when the aircraft is no longer on the ground and then performs measurements at regular intervals, for example every 5 minutes. minutes for a period of time to map over time.
  • the control device allows a mapping of the monitored area as a function of time to establish the evolution of the field of vibratory waves emitted by the room.
  • the slat array is made according to techniques known in the field of microelectronics.
  • the slat array can be obtained for example by the UV photolithography technique.
  • Figures 5.A, 5.B and 5.C show an embodiment of the lamellae by the technique of photolithography.
  • the piezoelectric film 17 is deposited on a hard substrate 16, silicon or glass type, the thickness of the film 17 may be from about ten nanometers to several tens of microns.
  • a photosensitive film, for example resin 19 is deposited on the piezoelectric film and subjected to UV irradiation through a mask 18.
  • FIG. 5.B shows the assembly after having been dipped in a bath of developing solvent and after having The surface of the piezoelectric film 17 then comprises metallized zones deposited on the surface of the piezoelectric film and zones of resins.
  • the resin zones By disappearing in a solvent bath, the resin zones remove the metal which has been deposited on its surface, leaving on the surface of the piezoelectric film 17 desired metallic patterns which constitute a mask for the dry etching step.
  • the deposited metal has a much lower etch rate than that of the piezoelectric film 17 and, by controlling the etch time and the etch rate, a lattice array spaced at regular intervals is achieved by performing the dry etching through the metallic mask.
  • the width of the lamellae can be from a few tens of nanometers to a few micrometers and the pitch between lamellae can be from a few tens of nanometers to a few micrometers.
  • first conductive plate 8 which is fixed on the network of lamellae by means of a conductive adhesive material 7.
  • the hard substrate 16 can be ablatively removed by means of a laser.
  • the lamellae network is then fixed on a second plate 9 by means of the conductive adhesive material 7.
  • the last step consists in fixing the assembly on the flexible support 2 by means of an adhesive.
  • FIG. 6 represents a cross-sectional side view of a network of piezoelectric strips 17 sandwiched between two conductive plates 8, 9 thus obtained.
  • the microsensor thus produced is then arranged at regular intervals to produce a network of microsensors as represented for example in FIG. 3.
  • the material used to make the piezoelectric strips is, for example, a piezoelectric material film 17 of zircotitanate lead type ( PZT).
  • PZT zircotitanate lead type
  • the piezoelectric strips 6 are made from the materials having a high piezoelectric coefficient, and a sufficiently high Curie temperature, which is the temperature above which the material loses its piezoelectricity to operate in a temperature range encountered by the device during its operation.
  • the piezoelectric lamellae are adapted to receive vibratory waves at low frequencies which are induced by macrodéplacement of the structure around a fixed position and also high frequency waves induced by internal microdéplacement of the material.
  • All other electronic components integrated on the flexible support are made from a hard substrate microfrabrication technology such as silicon or glass, transposed here on a plastic substrate.
  • the temperature used during the microfabrication process is likely to destroy the plastic substrate and therefore does not allow to directly produce the components on the flexible substrate.
  • one of the solutions currently proposed is to first make the components on a hard substrate deposited itself on glass.
  • Another layer of protective glass is attached to the components by means of a soluble adhesive, the hard substrate is then removed from the stack by ablation by means of a laser.
  • the components are then applied to a plastic substrate and attached thereto by means of a permanent adhesive and the protective glass is removed.
  • the control device has a thickness less than or equal to 50 microns, and a surface of the order of 10 x 10 cm side.
  • the size of each microsensor is of the order of a hundred microns and the interval between two microsensors is of the order of tens of microns.
  • FIG. 7 is a schematic view comprising a network of several control devices according to the invention arranged on surfaces of the structures of an aircraft 15.
  • the airplane is on the ground and the network of control devices is in a transmission situation.
  • signals recorded during a flight or several flights of the aircraft to a computer system 13 which is connected to alarm means 14 which here comprise for example a computer with a display screen and sound indicators 20.
  • the device comprises a self-feeding system for piezoelectric microsensors, for example at least one line or a column of the microsensors of the device are connected to an electric energy accumulator 21 intended to store the electrical energy generated by the at least one a line or the at least one column of microsensors under the effect of the vibrations of the structure. This accumulator restores the electrical energy in the form of current to power the control device.
  • the invention is presented in the context of the control of aircraft structures, but may be used whenever a structure subject to vibrating excitation sources must be monitored to detect the presence of defect for example in other industrial sectors such as the automotive, railway, shipbuilding and nuclear industries.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Immunology (AREA)
  • Health & Medical Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Measurement Of Mechanical Vibrations Or Ultrasonic Waves (AREA)
  • Testing Of Devices, Machine Parts, Or Other Structures Thereof (AREA)
EP07729207A 2006-05-24 2007-05-16 Dispositif de contrôle non destructif d'une structure par analyse vibratoire Withdrawn EP2027461A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0651903A FR2901610B1 (fr) 2006-05-24 2006-05-24 Dispositif de controle non destructif d'une struture par analyse vibratoire
PCT/EP2007/054759 WO2007135057A1 (fr) 2006-05-24 2007-05-16 Dispositif de contrôle non destructif d'une structure par analyse vibratoire

Publications (1)

Publication Number Publication Date
EP2027461A1 true EP2027461A1 (fr) 2009-02-25

Family

ID=37622215

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Application Number Title Priority Date Filing Date
EP07729207A Withdrawn EP2027461A1 (fr) 2006-05-24 2007-05-16 Dispositif de contrôle non destructif d'une structure par analyse vibratoire

Country Status (9)

Country Link
US (1) US8151643B2 (zh)
EP (1) EP2027461A1 (zh)
JP (1) JP5450058B2 (zh)
CN (1) CN101449157B (zh)
BR (1) BRPI0712212A2 (zh)
CA (1) CA2650832A1 (zh)
FR (1) FR2901610B1 (zh)
RU (1) RU2435161C2 (zh)
WO (1) WO2007135057A1 (zh)

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CN101449157B (zh) 2013-07-10
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FR2901610A1 (fr) 2007-11-30
RU2008151161A (ru) 2010-06-27
CN101449157A (zh) 2009-06-03
CA2650832A1 (fr) 2007-11-29
WO2007135057A1 (fr) 2007-11-29
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FR2901610B1 (fr) 2009-01-16
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JP5450058B2 (ja) 2014-03-26

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