Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/80—Constructional details
  • H10H20/862—Resonant cavity structures
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/01—Manufacture or treatment
  • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
  • H10H20/018—Bonding of wafers
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/80—Constructional details
  • H10H20/81—Bodies
  • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
  • H10H20/82—Roughened surfaces, e.g. at the interface between epitaxial layers
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/80—Constructional details
  • H10H20/83—Electrodes
  • H10H20/832—Electrodes characterised by their material
  • H10H20/835—Reflective materials
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/80—Constructional details
  • H10H20/882—Scattering means

Definitions

• An optoelectronic semiconductor component is specified.
• An object to be solved is to specify an optoelectronic semiconductor component which has a particularly long service life. Another object to be achieved is to specify an optoelectronic semiconductor component which has a particularly high efficiency. Another object is to provide a method for producing such an optoelectronic semiconductor component.
• the optoelectronic semiconductor component described here is, for example, a light-emitting diode, that is to say a light-emitting diode or a laser diode.
• the optoelectronic semiconductor component may also be an RCLED (resonant cavity light emitting diode) or a VCSEL (vertical cavity surface emitting laser).
• the optoelectronic component has a carrier substrate.
• the functional layers of the optoelectronic semiconductor component - that is to say a component structure of the optoelectronic semiconductor component which is one for generating radiation provided active layer - are mechanically fixedly connected to the carrier substrate.
• the component structure of the optoelectronic component it is possible for the component structure of the optoelectronic component to be electrically contactable via the carrier substrate.
• the carrier substrate is preferably not a growth substrate on which the component structure of the optoelectronic
• Semiconductor device is epitaxially deposited, but to a substrate on which the device structure is applied after its preparation or to which a wear layer is applied, is deposited on the epitaxial deposition of the device structure after application.
• the optoelectronic semiconductor component comprises an intermediate layer which mediates adhesion between the carrier substrate and the component structure of the optoelectronic semiconductor component.
• the intermediate layer can be, for example, a bonding layer, by means of which the carrier substrate is bonded to the component structure.
• the intermediate layer it is possible for the intermediate layer to mechanically bond the carrier substrate to a wear layer.
• the device structure On the side facing away from the carrier substrate side of the wear layer, the device structure may then be grown epitaxially.
• the optoelectronic semiconductor component comprises a component structure with an active layer, which is provided for generating radiation.
• the active layer is suitable for generating electromagnetic radiation in the blue and / or ultraviolet spectral range.
• the active layer may include multiple semiconductor layers.
• the active layer comprises a pn junction, a heterostructure, a single quantum well structure and / or a multiple quantum well structure.
• the term quantum well structure also encompasses any structure in which charge carriers can undergo quantization of their energy states by confinement.
• the term quantum well structure does not include an indication of the dimensionality of the quantization. It thus includes quantum wells, quantum wires and quantum dots and any combination of these structures.
• the optoelectronic semiconductor component comprises a carrier substrate, an intermediate layer which mediates adhesion between the carrier substrate and a component structure, wherein the component structure comprises an active layer which is provided for generating radiation.
• the component structure has a wear layer.
• the wear layer is connected to the carrier substrate by means of the intermediate layer.
• the device structure is epitaxially grown. That is, the device structure with the active layer follows the wear layer in the growth direction.
• the wear layer preferably consists of GaN with a particularly low dislocation density.
• the dislocation density is less than 10 8 per cm 2 , more preferably less than 10 7 per cm 2 .
• the wear layer is for example, a layer of high-quality, low-defect semiconductor material such as GaN.
• the carrier substrate may be formed from a less expensive material, for example defect-rich GaN.
• the useful layer has a separating surface which faces away from the carrier substrate.
• the wear layer is triggered, for example, from a thicker Nutzsubstrat along the separation surface.
• the separation surface is preferably planarized and epitaxially overgrown.
• the device structure is epitaxially deposited on this planarized interface.
• the intermediate layer is electrically insulating.
• the intermediate layer can consist of a silicon nitride or a silicon oxide or contain at least one of these materials.
• the intermediate layer contains at least one of the following materials: SiN, SiO 2 / Si 3 N 4, Al 2 O 3, Ta 2 O, HfO 2.
• the intermediate layer comprises at least one oxide, nitride and / or fluoride of at least one of the following elements: Si, Mg, Al, Hf, Nb, Zr, Sc, Ta, Ga, Zn, Y, B Ti.
• the intermediate layer consists of an oxygen-containing compound.
• the intermediate layer has a refractive index which is smaller than the refractive index of the material from which the wear layer is formed. The intermediate layer may then form a mirror for the electromagnetic radiation generated in the active layer.
• the reflectivity of the intermediate layer is increased by a layer sequence of high and low-refraction layers for small angles of incidence. That is, the intermediate layer comprises a layer sequence of alternating high and low refractive layers, which may form, for example, a Bragg mirror structure.
• the intermediate layer is formed particularly smoothly on the side which faces the component structure. Such a smooth intermediate layer allows a particularly good reflectivity of the intermediate layer.
• the side of the intermediate layer which faces the carrier substrate is made rough. This allows a good transmission of electromagnetic radiation in the direction of the radiation exit surface of the semiconductor device. This is because such a rough interface of the intermediate layer reduces the probability of total reflection at the intermediate layer.
• the intermediate layer mediates a electrical contact between the carrier substrate and the device structure.
• the intermediate layer then contains or consists, for example, of a transparent conductive oxide (TCO), for example ITO (indium tin oxide) or ZnO.
• TCO transparent conductive oxide
• ITO indium tin oxide
• ZnO zinc oxide
• the intermediate layer is at least partially permeable to the electromagnetic radiation generated in the active layer.
• the refractive index of the intermediate layer is adapted to the refractive index of the material from which the wear layer is formed, and / or the material from which the carrier substrate is formed. That is, the refractive index of the intermediate layer is then approximately equal to the refractive index of the material from which the wear layer is formed, and / or approximately equal to the refractive index of the material from which the carrier substrate is formed.
• the refractive index of the intermediate layer differs by a maximum of 20% from the refractive index of the material, preferably at most 10%, more preferably at most 5% of the refractive index of the material of the wear layer and / or the carrier substrate.
• a radiation exit surface of the optoelectronic semiconductor component is roughened.
• a roughening can take place, for example, by means of in-situ roughening during the epitaxy through V-shaped openings, which preferably occur at dislocations.
• Another possible technique for roughening the radiation exit surface is the formation of mesets on the radiation exit surface. That means on the Radiation exit surface mesa structures are produced by epitaxial growth or etching.
• a highly transparent contact layer is applied to at least one side of the optoelectronic semiconductor component.
• the highly transparent contact layer may for example contain or consist of a transparent conductive oxide.
• the semiconductor component is designed in the manner of a flip-chip.
• the component structure is preferably provided with a reflective electrode.
• Component side facing away from the carrier substrate is then preferably, as described above, roughened and structured to improve the light extraction by the substrate. That is, the radiation exit surface of the optoelectronic semiconductor component is formed at least in places by the side of the carrier substrate which faces away from the component structure.
• the side of the carrier substrate facing away from the component structure is mirrored so that the electromagnetic radiation generated in the active layer is reflected.
• at least a part of the radiation exit surface is given by the side of the component structure which faces away from the carrier substrate.
• the intermediate layer comprises a dielectric mirror or forms such a dielectric mirror.
• the intermediate layer comprises a Bragg mirror or forms such a Bragg mirror.
• the intermediate layer contains at least one of the following materials: SiN, SiO 2 , Si 3 N 4, Al 2 O 3, Ta 2 O 5 , HfO 2 .
• the intermediate layer comprises a Bragg mirror or forms a Bragg mirror which contains a multiplicity of alternating first and second layers.
• the first layers are preferably formed from SiO 2 and / or Al 2 O 3
• the second layers are preferably formed from Ta 2 Os and / or HfO 2 .
• the intermediate layer formed as a dielectric mirror or Bragg mirror is a bonding layer, which mediates adhesion between the carrier substrate and the component structure of the optoelectronic semiconductor component. That is to say, the intermediate layer performs a dual function in this embodiment: it serves to reflect the electromagnetic radiation generated in operation in the active layer of the optoelectronic semiconductor component and provides a mechanical adhesion between the carrier substrate and the component structure.
• the optoelectronic component comprises an output mirror, which is arranged on the side of the component structure facing away from the intermediate layer.
• the coupling-out mirror is formed by at least one of the following mirrors: metallic mirror, dielectric mirror, Bragg mirror.
• the coupling-out mirror comprises a Bragg mirror which contains a multiplicity of alternating first and second layers.
• the first layers are preferably formed from SiO 2 and / or Al 2 O 3 and the second layers are preferably formed from Ta 2 ⁇ s and / or HfO 2.
• the intermediate layer formed as a mirror and the coupling-out mirror to form a resonator for the electromagnetic radiation generated in the active layer of the component structure of the optoelectronic semiconductor component in accordance with at least one embodiment of the optoelectronic semiconductor component.
• This embodiment is particularly well suited for an RCLED or a VCSEL.
• the distance between the intermediate layer and the outcoupling mirror is at most 10 ⁇ m, preferably at most 3 ⁇ m, particularly preferably at most 2 ⁇ m.
• a contact layer which is a contact layer, is arranged between the component structure and the outcoupling mirror transparent conductive oxide comprises or consists of such.
• the contact layer contains or consists of ITO. That is, between the side of the component structure facing away from the intermediate layer and the outcoupling mirror, a contact layer is arranged which contains or consists of a transparent conductive oxide.
• the component structure and the coupling-out mirror preferably each directly adjoin this contact layer.
• the method comprises growing an active layer on a wear layer.
• the wear layer is, for example, a layer of GaN which has a particularly small dislocation density.
• the method comprises providing a carrier substrate.
• the carrier substrate may be for Example, to a low-cost GaN substrate act, which has a relatively high dislocation density.
• the method comprises connecting the carrier substrate to a useful substrate by means of an intermediate layer.
• the payload substrate is a thick, low dislocation GaN substrate.
• the method comprises producing a break seed layer in the payload substrate.
• this fracture seed layer can take place by means of the implantation of hydrogen ions into the payload substrate.
• a fracture seed layer is formed, along which a part of the useful substrate can be detached in a subsequent method step, so that a useful layer remains, which is connected to the carrier substrate via the intermediate layer.
• the wear layer can be removed by annealing from the remaining useful substrate.
• the method comprises the following steps:
• FIG. 1 shows a schematic sectional view of a first exemplary embodiment of an optoelectronic semiconductor component described here.
• FIG. 2 shows a schematic sectional illustration of a second exemplary embodiment of an optoelectronic semiconductor component described here.
• FIG. 3 shows a schematic sectional illustration of a third exemplary embodiment of an optoelectronic semiconductor component described here.
• FIG. 4 shows a schematic sectional representation of a fourth exemplary embodiment of an optoelectronic semiconductor component described here.
• FIG. 5 shows a schematic sectional illustration of a fifth exemplary embodiment of an optoelectronic semiconductor component described here.
• FIG. 6 shows a schematic plot of the reflectivity at the intermediate layer.
• FIG. 7 shows a schematic plot of the intensity of the radiation emitted by the component.
• FIG. 1 shows a schematic sectional illustration of a first exemplary embodiment of an optoelectronic semiconductor component described here.
• the optoelectronic semiconductor component comprises a carrier substrate 1.
• the carrier substrate 1 is formed from a low-cost GaN which has a relatively high dislocation density.
• An intermediate layer 2 which has a lower refractive index and good adhesion to GaN, is applied to the carrier substrate .1.
• the intermediate layer 2 is formed of SiO 2.
• the thickness of the intermediate layer 2 is preferably at least 100 ran.
• the device structure 50 includes a Wear layer 3, which consists of GaN and is at least partially separated from a Nutzsubstrat.
• the dislocation density of the wear layer is less than 10 ⁇ per cm 2 , preferably smaller
• the wear layer 3 has a release layer 4 which faces away from the support substrate 1.
• the wear layer 3 was separated along the release layer 4 from the Nutzsubstrat.
• the wear layer 3 follows an electron injection layer 12 after.
• the electron injection layer 12 is, for example, a layer composed of n-AlInGaN. It is also possible for the wear layer 3 to form the electron injection layer 12. In this case, the wear layer 3 is separated from an n-AlInGaN Nutzsubstrat.
• the electron injection layer 12 is followed by an active layer 5.
• the active layer 5 comprises at least one structure provided for the generation of radiation.
• the active layer 5 may comprise a pn junction, a heterostructure, a quantum well structure and / or a multiple quantum well structure.
• the active layer 5 is followed by a second conductive layer, for example a p-AHnGaN hole injection layer 6, which is preferably roughened and / or patterned on its side facing away from the active layer 5, in order to increase the probability of a radiation exit.
• a second conductive layer for example a p-AHnGaN hole injection layer 6, which is preferably roughened and / or patterned on its side facing away from the active layer 5, in order to increase the probability of a radiation exit.
• the mesettes it is also possible for the mesettes to be structured in the hole injection layer 6.
• the hole injection layer 6 is followed by a contact layer 7, which for example contains or consists of a transparent conductive oxide, such as ITO.
• a bonding pad 8 is applied, by means of which the device can be contacted electrically, for example by wire bonding.
• the wear layer 3 or the electron injection layer 12 is exposed at least in places from the side facing away from the carrier substrate.
• the optoelectronic semiconductor component described in connection with FIG. 1 is, for example, a light-emitting diode.
• the carrier substrate 1 may be electrically insulating and transparent.
• the carrier substrate 1 is then made of sapphire.
• the intermediate layer 2 then preferably has a refractive index which is smaller than that of sapphire.
• n- and p-type layers are reversed. That is, the carrier substrate may also adjoin a p-type layer.
• the component is designed as a flip-chip component, in which a highly reflective mirror is applied to the hole injection layer 6 or the contact layer 7.
• the internal efficiency strongly depends on the defect density. This defect density is essentially determined by the substrate. Thus, defect areas are possible in the heteroepitaxy of gallium nitride on sapphire or of gallium nitride on silicon carbide 10 8 to 10 1 O p ro cm 2.
• the second factor for the component efficiency is the coupling of the light beams generated in the semiconductor layer from the semiconductor into the environment. This decoupling is limited by reflections at the interface and by total reflection angle for the material transition.
• Efficient light extraction is achieved with thin-film technology.
• the principle is to give the generated light beams several times a chance to extract light.
• the radiation exit surface is structured or roughened to obtain an angle change in the case of reflection, the opposite side is mirrored.
• the structure between surface and mirror is kept as thin as possible in order to minimize absorption in the material.
• the laser lift-off process today dominates for substrate separation in conjunction with eutectic bonding.
• a wafer bonding process combined with grinding and etching away the mother substrate is possible.
• Light-emitting diode chips in thin-film construction are described, for example, in the publications WO 02/13281 A1 and EP 0 905 797 A2, the disclosure content of which with regard to the thin-film construction is hereby expressly incorporated by reference.
• Another possibility for obtaining high light decoupling are epitaxial structures on a highly transparent substrate (for example sapphire) in conjunction with highly transparent ones Front-side current spreading layers (contacts) and in conjunction with changes in the paths of the reflected light, such as structuring or roughening surfaces and / or interfaces.
• a highly transparent substrate for example sapphire
• Front-side current spreading layers contacts
• changes in the paths of the reflected light such as structuring or roughening surfaces and / or interfaces.
• the efficiency of such structuring is greatly reduced, since gallium nitride is highly absorbent, especially for radiation in the UV range.
• FIG. 2 shows a second embodiment of an optoelectronic semiconductor device described here in a schematic sectional view.
• the intermediate layer 2 is designed to be electrically conductive and establishes a contact with the component structure 50.
• the intermediate layer 2 is or contains a transparent conductive oxide such as ITO or ZnO.
• the side of the carrier substrate 1 facing away from the component structure 50 is then preferably designed to be reflective for the electromagnetic radiation 20 generated in the active layer 5.
• the active layer is preferably suitable for generating electromagnetic radiation 20 having a wavelength which is smaller than 380 nm.
• the wear layer 3 then consists or preferably contains AlGaN.
• Such a wear layer can be epitaxied on a GaN Nutzsubstrat. This layer relaxes during bonding to the carrier substrate after detachment from the Nutzsubstrat, so that for the epitaxial growth of the subsequent layers of the device structure 50 is a low-defect AlGaN wear layer 3 is available, which is integrated into the device structure 50.
• Such a wear layer 3 can then simultaneously form an electron injection layer 12. It is also possible that the wear layer 3 consists of AlGaInN or contains this material.
• a quasi-substrate 10 is first produced.
• a high-quality GaN Nutzsubstrat is provided, preferably a
• an epitaxially grown layer or layer sequence which may contain at least one of the following materials: GaN, AlGaN, InGaN, AlInGaN, is already present on the GaN Nutzsubstrat.
• a breaker seed layer is formed which extends in a lateral direction parallel to a major surface of the gallium nitride substrate.
• the break seed layer is preferably generated by the implantation of hydrogen ions from one side of the GaN payload substrate.
• the GaN useful substrate is bonded to a carrier substrate 1 before or after generation of the break seed layer.
• the break seed layer is brought to form a lateral fracture. This can be done for example by tempering.
• the result is a wear layer 3, which is transferred from the Nutzsubstrat on the carrier substrate 1.
• FIG. 3 shows a third exemplary embodiment of an optoelectronic semiconductor component described here in a schematic sectional illustration.
• the optoelectronic semiconductor component in turn comprises a carrier substrate 1, which is formed, for example, from low-cost GaN, which may have a relatively high dislocation density of greater than 10 9 per cm 2 .
• the carrier substrate 1 may also be formed of sapphire.
• the intermediate layer 2 is a Bragg mirror.
• the intermediate layer 2 then comprises a Bragg mirror or forms a Bragg mirror containing a plurality of alternating first and second layers.
• the first layers are preferably formed from SiO 2 and / or Al 2 O 3 and the second layers are preferably formed from Ta 2 O 5 and / or HfO 2.
• the device structure 50 comprises a wear layer 3, which consists of high-quality GaN and is separated from a Nutzsubstrat.
• the dislocation density of the wear layer 3 is less than 10 8 per cm 2 , preferably less than 10 7 per cm 2 .
• the interface between the wear layer 3 and the remaining device structure 50 is trouble-free.
• the wear layer 3 has a release layer 4 which faces away from the support substrate 1.
• the wear layer 3 is separated, for example by a detachment process along the release layer 4 from the Nutzsubstrat after bonding of the Nutzsubstrats on the carrier substrate 1 by means of the intermediate layer 2.
• the wear layer 3 follows a first conductive layer, which is, for example, an electron injection layer 12.
• the electron injection layer 12 contains or consists of n-AlInGaN in the exemplary embodiment of FIG.
• the electron injection layer 12 is followed by an active layer 5, which comprises at least one structure provided for the generation of radiation.
• the active layer 5 is followed by a second conductive layer, for example a hole injection layer 6.
• the hole injection layer 6 contains or consists of p-doped AlInGaN, for example.
• the hole layer 6 is followed by a contact layer 7.
• the contact layer 7 is formed, for example, from ITO (indium tin oxide).
• the thickness of the contact layer 7 is preferably a multiple of half the wavelength of the electromagnetic radiation 20 generated in the active layer divided by the refractive index of the material of the contact layer 7. More preferably, the thickness of the contact layer 7 is the wavelength of the electromagnetic radiation generated in the active layer 5
• the contact layer 7 may be combined with a p + / n + tunnel junction.
• a metallic contact 8 is applied, which is for example annular.
• a Auskoppelapt 13 is applied to the contact layer 7.
• the output mirror 13 forms a resonator with the mirror formed by the intermediate layer 2 the electromagnetic radiation 20 generated in the active layer 5.
• the output mirror 13 is embodied, for example, as a dielectric mirror, preferably as a Bragg mirror.
• the Auskoppelapt 13 may correspond in its structure, for example, the mirror of the intermediate layer 2.
• the outcoupling mirror 13 then comprises a Bragg mirror or forms a Bragg mirror containing a plurality of alternating first and second layers.
• the first layers are preferably formed from SiO 2 and / or Al 2 O 3 and the second layers are preferably formed from Ta 2 O 5 and / or HfO 2.
• At least one metallic bonding pad 9, by means of which the optoelectronic semiconductor component can be electrically contacted on the n-side, is applied to a surface of the electron injection layer 12 which is exposed, for example, by means of a mesa etching.
• the optoelectronic semiconductor component of FIG. 1 preferably forms an RCLED or a VCSEL.
• the principle of RCLED or VCSEL is to embed a light-generating layer between two mirrors.
• the mirrors may be metal or dielectric layers.
• a method for VCSEL and RCLED nitride-based is presented, which allows a resonant embedding of the active layer 5 between two mirrors 2, 13 with close proximity and at the same time includes a low-defect crystal structure.
• a new method is presented which uses a lattice-matched, low-offset epitaxy to produce an RCLED or VCSEL structure with a small number of low mirror gap modes. It can be optimally decoupled by the substrate light.
• the substrate is prepared for a later detachment process, for example by means of hydrogen implantation.
• the substrate is optionally planarized and a Bragg mirror is applied to the substrate.
• a Bragg mirror for example, SiO 2 -TiO 2 layer sequences or SiO 2 -Ta 2 O 5 or SiO 2 -HfC> 2 or, instead of SiO 2, also Al 2 O 3 are suitable.
• an SiO 2 release is not advantageous.
• the SiO 2 layer is bonded directly to a carrier substrate, for example sapphire or cost-effective - possibly defect-rich - GaN.
• a substrate wear layer 3 with the dielectric layers of the intermediate layer 2 is separated from the substrate by blisters and lateral cracking. The order of the steps can be varied.
• the preferred thickness is less than 10 microns, preferably less than 3 microns.
• the mirror coating may be metallic, for example, of or silver or dielectric.
• a highly transparent contact layer by means of, for example, ITO in combination with an overlying dielectric mirror is preferred.
• the thickness of the contact layer is preferably a multiple of (Wavelength / 2) / refractive index, in particular Ix wavelength / refractive index.
• the novel component consists of an AlGaInN layer package with a light-generating, active layer and a
• the layer package lies at least partially between two mirrors, the layer thickness between the mirrors 2, 13 is less than 2 ⁇ m, preferably less than 10 ⁇ emission wavelength / (refractive index of the material between the mirrors 2, 13).
• FIG. 4 shows a fourth exemplary embodiment of an optoelectronic semiconductor component described here in a schematic sectional illustration.
• the coupling-out mirror 13 is formed by a metal mirror which forms an ohmic contact with the contact layer 7.
• the output mirror 13 serves in addition to its optical properties for current injection into the opto-electronic semiconductor device.
• FIG. 5 shows a fifth exemplary embodiment of an optoelectronic semiconductor component described here in a schematic sectional illustration.
• the metallic contact 8 is of annular design, such that it is located at the edge of the component.
• the uncovered by the metallic contact 8 surface of the active layer 5 facing away from the contact layer 7 is covered with a Auskoppelapt 13, which is formed for example by a Bragg mirror.
• FIG. 6 shows the reflectivity at the interface between a SiO 2 intermediate layer 2 and GaN as a function of the thickness d of the intermediate layer 2 for one wavelength, and the radiation of 460 nm generated by the active layer 5.
• the reflectivity here was for example for an optoelectronic Semiconductor device, as described in connection with Figure 1, determined.
• the intermediate layer 2 proves to be particularly advantageous if the electromagnetic radiation generated in the active layer 5 is strongly absorbed in the carrier substrate 1. This is the case, in particular, for emission wavelengths of less than 380 nm for a GaN carrier substrate.
• FIG. 7 shows the intensity ratio of the electromagnetic radiation generated by the active layer 5 for a defect density (DD) of 2 ⁇ 10 -4 per cm 2 in comparison to a defect density of 2 ⁇ 10 -4 per cm 2.
• DD defect density
• the reduced defect density due to the wear layer 3 has a particularly advantageous effect, for example in the case of a component as described in connection with FIG.

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