EP1989818A4 - PROCESS FOR MANUFACTURING INCLUDED LAYERS AND EQUIPMENT MADE THEREFOR - Google Patents

PROCESS FOR MANUFACTURING INCLUDED LAYERS AND EQUIPMENT MADE THEREFOR

Info

Publication number
EP1989818A4
EP1989818A4 EP06749552A EP06749552A EP1989818A4 EP 1989818 A4 EP1989818 A4 EP 1989818A4 EP 06749552 A EP06749552 A EP 06749552A EP 06749552 A EP06749552 A EP 06749552A EP 1989818 A4 EP1989818 A4 EP 1989818A4
Authority
EP
European Patent Office
Prior art keywords
same
devices made
contained layers
making contained
making
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06749552A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP1989818A2 (en
Inventor
Charles D Lang
Stephen Sorich
Charles K Taylor
Douglas R Anton
Alberto Goenaga
Paul A Sant
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EIDP Inc
Original Assignee
EI Du Pont de Nemours and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of EP1989818A2 publication Critical patent/EP1989818A2/en
Publication of EP1989818A4 publication Critical patent/EP1989818A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L9/00—Cryptographic mechanisms or cryptographic arrangements for secret or secure communications; Network security protocols
    • H04L9/30—Public key, i.e. encryption algorithm being computationally infeasible to invert or user's encryption keys not requiring secrecy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Computing Systems (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Security & Cryptography (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electroluminescent Light Sources (AREA)
  • Thin Film Transistor (AREA)
  • Solid State Image Pick-Up Elements (AREA)
EP06749552A 2006-03-02 2006-04-10 PROCESS FOR MANUFACTURING INCLUDED LAYERS AND EQUIPMENT MADE THEREFOR Withdrawn EP1989818A4 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US75154906P 2006-03-02 2006-03-02
PCT/US2006/013118 WO2007106101A2 (en) 2006-03-02 2006-04-10 Process for making contained layers and devices made with same

Publications (2)

Publication Number Publication Date
EP1989818A2 EP1989818A2 (en) 2008-11-12
EP1989818A4 true EP1989818A4 (en) 2011-05-18

Family

ID=38470737

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06749552A Withdrawn EP1989818A4 (en) 2006-03-02 2006-04-10 PROCESS FOR MANUFACTURING INCLUDED LAYERS AND EQUIPMENT MADE THEREFOR

Country Status (6)

Country Link
EP (1) EP1989818A4 (zh)
JP (2) JP2009528663A (zh)
KR (1) KR20080108100A (zh)
CN (1) CN101507177B (zh)
TW (1) TW200735435A (zh)
WO (1) WO2007106101A2 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011501360A (ja) * 2007-10-15 2011-01-06 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 溶液処理された電子デバイス
KR20100094475A (ko) * 2007-10-26 2010-08-26 이 아이 듀폰 디 네모아 앤드 캄파니 격납된 층을 제조하기 위한 방법 및 재료, 및 이를 사용하여 제조된 소자
WO2009079327A1 (en) 2007-12-14 2009-06-25 E. I. Du Pont De Nemours And Company Backplane structures for electronic devices
WO2015065499A2 (en) * 2013-10-31 2015-05-07 Kateeva, Inc Polythiophene-containing ink compositions for inkjet printing

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5922481A (en) * 1995-01-13 1999-07-13 Basf Aktiengesellschaft Electroluminescent arrangement
EP1128438A1 (en) * 2000-02-23 2001-08-29 Dai Nippon Printing Co., Ltd. Electroluminescent device and process for producing the same
US20030017360A1 (en) * 2001-07-20 2003-01-23 Elizabeth Tai Structure-defining material for OLEDs
US20030129321A1 (en) * 2001-12-12 2003-07-10 Daigo Aoki Process for manufacturing pattern forming body
US20030222250A1 (en) * 2002-02-28 2003-12-04 Che-Hsiung Hsu Polymer buffer layers and their use in light-emitting diodes
WO2004042474A1 (ja) * 2002-11-06 2004-05-21 Asahi Glass Company, Limited ネガ型感光性樹脂組成物
US20050236614A1 (en) * 2004-04-22 2005-10-27 Parker Ian D Processes for forming organic layers, organic electronic devices, and transistors

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5416203A (en) * 1977-07-07 1979-02-06 Nippon Paint Co Ltd Dry making method of photosensitive resin plate
US5435887A (en) * 1993-11-03 1995-07-25 Massachusetts Institute Of Technology Methods for the fabrication of microstructure arrays
US5392980A (en) * 1993-12-29 1995-02-28 Dell Usa, L.P. Method and apparatus for reworking ball grid array packages to allow reuse of functional devices
JPH09203803A (ja) * 1996-01-25 1997-08-05 Asahi Glass Co Ltd カラーフィルタの製造方法及びそれを用いた液晶表示素子
JP4413035B2 (ja) * 1997-08-08 2010-02-10 大日本印刷株式会社 パターン形成体およびパターン形成方法
JP2001237069A (ja) * 2000-02-23 2001-08-31 Dainippon Printing Co Ltd Ｅｌ素子およびその製造方法
EP1411088B1 (en) * 2001-07-26 2013-08-21 Nissan Chemical Industries, Ltd. Polyamic acid resin composition
JP4092261B2 (ja) * 2002-08-02 2008-05-28 三星エスディアイ株式会社 基板の製造方法及び有機エレクトロルミネッセンス素子の製造方法
JP2004177793A (ja) * 2002-11-28 2004-06-24 Seiko Epson Corp 微細構造物の製造方法およびこの微細構造物の製造方法を用いて製造された自発光素子、光学素子、デバイス並びにこのデバイスを備えた電子機器
JP2004234901A (ja) * 2003-01-28 2004-08-19 Seiko Epson Corp ディスプレイ基板、有機ｅｌ表示装置、ディスプレイ基板の製造方法および電子機器
WO2004070836A1 (ja) * 2003-02-06 2004-08-19 Neomax Co., Ltd. 気密封止用キャップおよびその製造方法
JP4632193B2 (ja) * 2003-09-18 2011-02-16 大日本印刷株式会社 パターニング用基板の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5922481A (en) * 1995-01-13 1999-07-13 Basf Aktiengesellschaft Electroluminescent arrangement
EP1128438A1 (en) * 2000-02-23 2001-08-29 Dai Nippon Printing Co., Ltd. Electroluminescent device and process for producing the same
US20030017360A1 (en) * 2001-07-20 2003-01-23 Elizabeth Tai Structure-defining material for OLEDs
US20030129321A1 (en) * 2001-12-12 2003-07-10 Daigo Aoki Process for manufacturing pattern forming body
US20030222250A1 (en) * 2002-02-28 2003-12-04 Che-Hsiung Hsu Polymer buffer layers and their use in light-emitting diodes
WO2004042474A1 (ja) * 2002-11-06 2004-05-21 Asahi Glass Company, Limited ネガ型感光性樹脂組成物
US20050236614A1 (en) * 2004-04-22 2005-10-27 Parker Ian D Processes for forming organic layers, organic electronic devices, and transistors

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
H. SUGIMURA ET AL.: "Micropatterning of Alkyl- and Fluoroalkylsilane Self-Assembled Monolayers Using Vacuum Ultraviolet Light", LANGMUIR, vol. 16, 1 June 2000 (2000-06-01), pages 885 - 888, XP002629628 *

Also Published As

Publication number Publication date
JP2013048118A (ja) 2013-03-07
EP1989818A2 (en) 2008-11-12
KR20080108100A (ko) 2008-12-11
WO2007106101A2 (en) 2007-09-20
JP2009528663A (ja) 2009-08-06
TW200735435A (en) 2007-09-16
WO2007106101A3 (en) 2009-04-16
CN101507177B (zh) 2014-08-13
CN101507177A (zh) 2009-08-12

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Effective date: 20110418

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