TW200735435A - Process for making contained layers and devices made with same - Google Patents

Process for making contained layers and devices made with same

Info

Publication number
TW200735435A
TW200735435A TW095112893A TW95112893A TW200735435A TW 200735435 A TW200735435 A TW 200735435A TW 095112893 A TW095112893 A TW 095112893A TW 95112893 A TW95112893 A TW 95112893A TW 200735435 A TW200735435 A TW 200735435A
Authority
TW
Taiwan
Prior art keywords
layer
same
devices made
contained layers
making contained
Prior art date
Application number
TW095112893A
Other languages
English (en)
Inventor
Charles D Lang
Stephen Sorich
Charles Kenneth Taylor
Douglas Robert Anton
Alberto Goenaga
Paul A Sant
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of TW200735435A publication Critical patent/TW200735435A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L9/00—Cryptographic mechanisms or cryptographic arrangements for secret or secure communications; Network security protocols
    • H04L9/30—Public key, i.e. encryption algorithm being computationally infeasible to invert or user's encryption keys not requiring secrecy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computing Systems (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Security & Cryptography (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Electroluminescent Light Sources (AREA)
  • Thin Film Transistor (AREA)
  • Solid State Image Pick-Up Elements (AREA)
TW095112893A 2006-03-02 2006-04-11 Process for making contained layers and devices made with same TW200735435A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US75154906P 2006-03-02 2006-03-02

Publications (1)

Publication Number Publication Date
TW200735435A true TW200735435A (en) 2007-09-16

Family

ID=38470737

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095112893A TW200735435A (en) 2006-03-02 2006-04-11 Process for making contained layers and devices made with same

Country Status (6)

Country Link
EP (1) EP1989818A4 (zh)
JP (2) JP2009528663A (zh)
KR (1) KR20080108100A (zh)
CN (1) CN101507177B (zh)
TW (1) TW200735435A (zh)
WO (1) WO2007106101A2 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009052085A1 (en) * 2007-10-15 2009-04-23 E. I. Du Pont De Nemours And Company Solution processed electronic devices
WO2009055628A1 (en) * 2007-10-26 2009-04-30 E. I. Du Pont De Nemours And Company Process and materials for making contained layers and devices made with same
US8772774B2 (en) 2007-12-14 2014-07-08 E. I. Du Pont De Nemours And Company Backplane structures for organic light emitting electronic devices using a TFT substrate
JP6438041B2 (ja) * 2013-10-31 2018-12-12 カティーバ， インコーポレイテッド インクジェット印刷のためのポリチオフェン含有インク組成物

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5416203A (en) * 1977-07-07 1979-02-06 Nippon Paint Co Ltd Dry making method of photosensitive resin plate
US5435887A (en) * 1993-11-03 1995-07-25 Massachusetts Institute Of Technology Methods for the fabrication of microstructure arrays
US5392980A (en) * 1993-12-29 1995-02-28 Dell Usa, L.P. Method and apparatus for reworking ball grid array packages to allow reuse of functional devices
DE19500912A1 (de) * 1995-01-13 1996-07-18 Basf Ag Elektrolumineszierende Anordnung
JPH09203803A (ja) * 1996-01-25 1997-08-05 Asahi Glass Co Ltd カラーフィルタの製造方法及びそれを用いた液晶表示素子
JP4413035B2 (ja) * 1997-08-08 2010-02-10 大日本印刷株式会社 パターン形成体およびパターン形成方法
KR20010085420A (ko) * 2000-02-23 2001-09-07 기타지마 요시토시 전계발광소자와 그 제조방법
JP2001237069A (ja) * 2000-02-23 2001-08-31 Dainippon Printing Co Ltd Ｅｌ素子およびその製造方法
US6656611B2 (en) * 2001-07-20 2003-12-02 Osram Opto Semiconductors Gmbh Structure-defining material for OLEDs
EP1411088B1 (en) * 2001-07-26 2013-08-21 Nissan Chemical Industries, Ltd. Polyamic acid resin composition
JP4231645B2 (ja) * 2001-12-12 2009-03-04 大日本印刷株式会社 パターン形成体の製造方法
US6955773B2 (en) * 2002-02-28 2005-10-18 E.I. Du Pont De Nemours And Company Polymer buffer layers and their use in light-emitting diodes
JP4092261B2 (ja) * 2002-08-02 2008-05-28 三星エスディアイ株式会社 基板の製造方法及び有機エレクトロルミネッセンス素子の製造方法
JP4609071B2 (ja) * 2002-11-06 2011-01-12 旭硝子株式会社 隔壁を製造する方法及び隔壁
JP2004177793A (ja) * 2002-11-28 2004-06-24 Seiko Epson Corp 微細構造物の製造方法およびこの微細構造物の製造方法を用いて製造された自発光素子、光学素子、デバイス並びにこのデバイスを備えた電子機器
JP2004234901A (ja) * 2003-01-28 2004-08-19 Seiko Epson Corp ディスプレイ基板、有機ｅｌ表示装置、ディスプレイ基板の製造方法および電子機器
JPWO2004070836A1 (ja) * 2003-02-06 2006-06-01 株式会社Ｎｅｏｍａｘマテリアル 気密封止用キャップおよびその製造方法
JP4632193B2 (ja) * 2003-09-18 2011-02-16 大日本印刷株式会社 パターニング用基板の製造方法
US7067841B2 (en) * 2004-04-22 2006-06-27 E. I. Du Pont De Nemours And Company Organic electronic devices

Also Published As

Publication number Publication date
WO2007106101A3 (en) 2009-04-16
EP1989818A2 (en) 2008-11-12
EP1989818A4 (en) 2011-05-18
CN101507177A (zh) 2009-08-12
WO2007106101A2 (en) 2007-09-20
CN101507177B (zh) 2014-08-13
KR20080108100A (ko) 2008-12-11
JP2013048118A (ja) 2013-03-07
JP2009528663A (ja) 2009-08-06

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