EP1979875A2 - Procede et systeme destines a l'inspection optique d'une structure periodique - Google Patents

Procede et systeme destines a l'inspection optique d'une structure periodique

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Publication number
EP1979875A2
EP1979875A2 EP06841039A EP06841039A EP1979875A2 EP 1979875 A2 EP1979875 A2 EP 1979875A2 EP 06841039 A EP06841039 A EP 06841039A EP 06841039 A EP06841039 A EP 06841039A EP 1979875 A2 EP1979875 A2 EP 1979875A2
Authority
EP
European Patent Office
Prior art keywords
phase
reference image
image
periodic structure
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP06841039A
Other languages
German (de)
English (en)
Inventor
Enis Ersü
Wolfram Laux
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Isra Vision AG
Original Assignee
Isra Vision AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Isra Vision AG filed Critical Isra Vision AG
Publication of EP1979875A2 publication Critical patent/EP1979875A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/001—Industrial image inspection using an image reference approach
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/40—Analysis of texture
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/40—Extraction of image or video features
    • G06V10/42—Global feature extraction by analysis of the whole pattern, e.g. using frequency domain transformations or autocorrelation
    • G06V10/435—Computation of moments
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N2021/9513—Liquid crystal panels
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30121—CRT, LCD or plasma display

Definitions

  • the invention relates to a method and a system for inspecting a periodic structure by an optical image sensor having a pixel structure, the recorded image is compared in particular by means of a known image evaluation with a defect-free reference image of the periodic structure, for example, errors in the periodic structure of the recorded To determine image.
  • the invention can be used to inspect very fine periodic structures with a small period, in particular compared to the total surface area of the surface to be inspected.
  • An example of this is the checking of color filters for LCD screens in which red, yellow and green filter elements are arranged next to one another in a periodic sequence, through the selective backlighting of which a colored image can be generated for the viewer.
  • a known method is to record the structures to be checked and compare them by means of a corresponding image processing with error-free reference images of these structures.
  • the optical image sensors used for image recording have a periodic pixel structure due to their structure, on which the image to be recorded is imaged with the periodic structure and digitized in pixels.
  • a periodic structure to be recorded is large in comparison with the pixel resolution of the optical Transducer of the periodic structure in the picked-up image can be easily identified, since an area appearing in the image within the period of the structure to be photographed is imaged on a large number of pixels of the image sensor and a transition in the periodic structure in a Compared to this small number of pixels is done.
  • the periodic structure is thus recorded with a high resolution.
  • the value in one pixel of the recorded image thus depends strongly on the phase position during the recording, so that an immediate Comparable comparison with a reference image does not allow a sufficiently accurate statement about the presence of an error in the periodic structure to be inspected.
  • DE 101 61 737 C1 discloses a method for detecting an error in a periodic surface structure in which the measured original value of at least one current section of a period is compared with at least two further measured original values of corresponding sections of other periods of the structure to be examined.
  • the median of the considered original values is determined and set in an image as the value of the section of the periodic structure corresponding to the current section.
  • No. 5,513,275 A is described in which a reference image recorded by an optical recording device is not used for the comparison of the recorded image with a reference image, but instead determines the periodic structure thereof after the detection of a pattern.
  • This requires a very high computational effort.
  • the object of the present invention is to provide a simple and cost-effective way of inspecting a small periodic structure on a large area, with which errors in the periodic structure can be reliably detected.
  • the phase position of the periodic structure imaged in the reference image to the pixel structure of the optical image sensor is determined in at least one or preferably several positions in the reference image and is preferably stored together with the reference image.
  • the recorded image of the surface to be inspected is then divided into inspection areas. For each inspection area, the phase position of the periodic structure imaged in the inspection area is determined relative to the pixel structure of the image recorder, with which the reference image can in particular also be accommodated in a comparable arrangement.
  • a corresponding reference image area is selected whose phase position corresponds to the phase angle of the inspection area.
  • the size of the reference image area is preferably adapted to the size of the inspection area.
  • phase relationship of the periodic structure imaged in an inspection region to the pixel structure of the optical image sensor which can be carried out by methods familiar to the person skilled in the art, it is possible to select a reference image region in the reference image which has the same or at least a very similar phase position , Thereby, the influences of the different phase positions between the pixel structure and the periodic structure to be inspected in the comparison of the recorded Image with the reference image easily eliminated without much effort, so that errors can be detected with great reliability.
  • a position of the reference image is selected whose phase position has the smallest phase difference relative to the phase position of the inspection area.
  • the different phase directions for example in the X direction and Y direction, can be weighted differently, in particular if there are sharp contours in a phase direction which have a major effect on the evaluation of the pixels. In principle, however, the different phase directions in the image can also be weighted equally.
  • a corresponding reference image area as an image and / or position in an image and the associated phase position can be stored at each position at which the phase position of the periodic structure in the reference image is determined. If this information is retrievable in a memory, the time required for the comparison can be shortened, thereby increasing the overall inspection speed.
  • a table For storing the reference image area and the phase position, it is particularly advantageous to store a table into which the phase positions in different phase directions and the position of a defined point from the reference image area, for example a defined corner, are stored.
  • the table can be optimally organized such that the search for the table entries with the smallest phase differences in the different phase directions, in particular the X and Y direction, succeeds with minimal search time.
  • Such a discrete table allows a special dis- ders fast assignment of suitable reference image areas to an inspection area.
  • the phase angle of the periodic structure to the pixel structure is determined at each repetitive period of the periodic structure.
  • the entire reference image is covered so that the determination of virtually all practically occurring phase positions becomes possible and a very good agreement of the phase positions between the reference image region and the inspection region can be achieved.
  • a reference image area can be used for comparison with the inspection area, which lies in spatial proximity to the inspection area, in particular with respect to the image detail of the overall image taken by the image recorder.
  • This selection is preferably used when several reference image areas with a comparatively good phase angle are available for an inspection area.
  • a lower weighting is given in favor of the phase accuracy according to the invention in principle in the overall image of a preferably immediate spatial proximity of reference image area and inspection area.
  • a common evaluation of the phase match with subordinate weighting of the spatial neighborhood of the areas to be compared can be done by defining a quality function.
  • the inspection area does not cover the entire recorded image, but rather selects a section of the captured image, because in smaller image sections optical aberrations of the image recorder or non-periodic phase fluctuations, for example due to inaccuracies in the transport system, have less effect, so that constant conditions can be assumed for these inspection areas.
  • the inspection area is selected to be significantly smaller than the area of the captured image, the reference image area and the inspection area can also be obtained from the same image taken in accordance with the invention.
  • a reference image area is checked for freedom from errors by comparison with other reference image areas in accordance with the method described above.
  • the test can be carried out, for example, such that after generating a reference phase table with the stored reference image areas, a self-examination of each reference image is carried out analogously to a normal inspection.
  • the exact position of the local defect can then be determined in a further comparison, and the section of the reference image containing the local defect can thus be deleted from the reference phase table. In this way, freedom from errors of the reference image areas used can be achieved.
  • a dynamic reference image area administration it is also possible according to the invention to subsequently identify inspection areas recognized as defect-free used as reference image areas and in particular be stored with the phase position, for example in the reference phase table.
  • the administration can be organized in the form of a first-in-first-out memory (FIFO), so that older reference image areas are successively deleted with the filling in the current inspection mode.
  • FIFO first-in-first-out memory
  • a dynamic reference image management also allows a start of the inspection system according to the invention with only a few stored reference image areas and a self-learning system.
  • a reference image can also be calculated from a plurality of, in particular recorded reference image areas. This can be done in such a way that a mathematical model for the relationship between the phase position and the corresponding image is calculated from a plurality of recorded reference images or reference image regions in different phase positions. Then, during the inspection, the reference image can be calculated for each actually occurring phase position in order to obtain a comparable phase position between the reference image region and the inspection region. In this case, in the reference image, therefore, the phase angle of the optical structure to the pixel structure of the optical image pickup at a position can be determined by calculation and used for comparison with the inspection area.
  • the invention also relates to a system for inspecting a periodic structure with an optical image sensor having a pixel structure for recording images of the periodic structure and image processing with memory.
  • the image processing is set up in such a way that the phase angle of the optical structure to the pixel structure of the optical image sensor is determined in at least one or more positions in a reference image recorded in particular, that the recorded image is subdivided into inspection regions and for each inspection region the phase position of the periodic Structure is determined to the pixel structure of the optical image pickup and that for the comparison of an inspection area with the reference image, a reference image area is selected, the phase angle corresponds to the phase position of the inspection area.
  • the further method steps and variants of the method described above can also be implemented in the image processing.
  • the image processing can have a field programmable gate array (FPGA) in which the individual method steps are calculated.
  • FPGA field programmable gate array
  • the reference images and / or reference image areas can then be stored, for example, in a memory connected directly to the field programmable gate array.
  • An increase in the processing speed can be achieved in that the reference images and / or reference image areas are stored with the associated phase in the field programmable gate array itself, because the access times are shortened as a whole. It is particularly space-saving if the image data of the reference image are stored only once and the reference image areas by specifying the position (X, Y), which are correlated with the pixels in the reference image. From the position (X, Y) and the desired size of the area, the reference picture area can then be easily selected in the stored reference picture.
  • the particular advantage of the present invention is therefore that when comparing a recorded inspection area with a reference image area, the phase relationship between the periodic structure to be examined and the pixel structure of the image recorder is taken into account so that different phase positions in the reference image area and the inspection area no longer apply Artifacts that falsely indicate supposed defects in the periodic structure.
  • FIG. 1 shows the image of a periodic structure to be inspected and an associated image line of an optical image sensor
  • Fig. 2 is a reference image according to the present invention, in which the
  • Phase relationship between the periodic structure to be inspected and the pixel structure of the image sensor is determined
  • a periodic structure 1 is shown, which is to be inspected by an optical image sensor.
  • the periodic structure P1 to Pn has periods small compared with the total area of the pattern to be inspected having the periodic structure 1.
  • the optical image recorder with which the periodic structure 1 is accommodated, in turn has a pixel structure 2 which corresponds to its resolution. A pixel is given by the width of an entry in the pixel structure 2.
  • the illustrated pixel structure 2 corresponds to a horizontal image line 3 in the periodic structure 1.
  • a well-known, classical method for inspecting such structures 1 lies in a comparison with a stored desired pattern.
  • This is very difficult to realize when fine structures of, for example, a few microns in size are applied on relatively large areas of 1 to 2 m 2 , because then a very large amount of data would have to be stored. Therefore, for periodic structures, methods have been developed in which the surrounding features are used as patterns for the feature to be inspected so that the entire pattern is not stored as a reference image.
  • the classical algorithm for this inspection is a comparison of each individual pixel with the mean of the two pixels of the preceding and following periods corresponding to the period spacing P, respectively. In this case, for example, an error is assumed if the pixel to be checked deviates too much from this mean value.
  • the pixel structure 2 is predetermined by the resolution of the optical image recorder, which is to be read in the pixel structure 2 by the length of the smallest horizontal entry in the intensity profile.
  • the intensity of a pixel in the transition from a region B1 into a region B2 depends on how far the one pixel of the pixel structure 2 can still be assigned to the respective region or is already located in an intermediate region. If an image taken in the correct phase were to be used as a reference image or a transformation into the correct phase position were to be carried out, the inspection could be achieved by a simple comparison between the reference image and the recorded image. This is implemented by the method proposed by the invention or a corresponding system and explained below with reference to FIGS. 2 and 3.
  • FIG. 2 shows a reference image 4 with the periodic structure 1, in which the phase position phase X 1 phase Y of the periodic structure 1 relative to the pixel structure 2 of the optical image sensor is determined at several positions X, Y.
  • the determination of the phase position of an image relative to a structure recorded by the image can be carried out by a person skilled in the art using conventional methods known per se, so that these need not be explained in more detail.
  • the positions X, Y are selected such that the phase position of the periodic structure 1 at each period P1, P2, P3, etc. in the X direction is determined. The same applies to the phase position in the Y direction.
  • the determined values are entered into a reference phase table 5 which has the positions X, Y in the reference image 4 together with the associated phase X, phase Y phases in the X and Y directions, so that the reference image 4 at each period Pi is examined for the actually occurring sub-pixel phase shifts in the X and Y directions. All determined phase shifts are stored in a reference phase table, so that arbitrarily large reference image areas can be extracted from the reference image 4 with known phase angle with the additionally stored in the memory of the image processing reference image 4 at the positions X and Y shown in the table.
  • FIG. 3 shows a recorded image 6 with the periodic structure 1 to be examined.
  • inspection areas 7 are defined with a small overlap, which are each inspected one after the other.
  • the size of the inspection areas 7 is adjusted in such a way that 7 constant optical conditions can be assumed for the size of the inspection area.
  • phase position (phase X, phase Y) of the periodic structure 1 imaged in the inspection area 7 to the pixel structure 2 of the optical image recorder is first determined for each inspection area 7.
  • a reference image area 8 is selected in the reference phase table 5 for the comparison of the inspection area 7 with the reference image 4, which has the same size as the inspection area 7 and its phase position with the phase angle of the Inspection area 7 corresponds.
  • a phase pair phase X, phase Y is selected from the reference phase table 5, which has the smallest phase difference to the phase position phase X, phase Y of the inspection area 7.
  • the mutually associated inspection areas 7 and reference image areas 8 are each subtracted from each other. Due to the almost identical phase position of the two regions 7, 8 results in a comparison image with almost constant intensity, in which individual errors can be easily identified.
  • FIG. 4a shows a section of the pixel structure 2 shown in Fig. 1 along the image line 3.
  • an error (defect) is located.
  • FIG. 4b shows a difference image in which FIG. 4a is subtracted from an image in which the mean values of the pixels of the preceding and following periods are entered in each case. Since intensity fluctuations occur at the transitions of the respective regions B1, B2, B3 of the periodic structure 1 due to the different phase position between the recorded image 6 and the reference image 4, the error at pixel No. 30 can hardly be identified. By comparison, in the intensity distribution shown in FIG. 4c, the defect at pixel no. 30 can be clearly seen.
  • This intensity distribution was generated by the above-described inspection of periodic structures with a phase-exact comparison by a subtraction of the captured image 6 and the reference image 4. Therefore, with the present invention, a periodic structure can be examined for errors very reliably.

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Quality & Reliability (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Computing Systems (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Multimedia (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Processing (AREA)
  • Image Analysis (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Optical Devices Or Fibers (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

L'invention concerne un procédé et un système destinés à l'inspection d'une structure périodique (1) au moyen d'un appareil de prise de vue optique présentant une structure pixel (2), dont l'image reproduite (6) est comparée avec une image de référence exempte d'erreurs (4) de la structure périodique (1). En vue de pouvoir détecter les erreurs avec des moyens simples et de manière fiable, on détermine dans l'image de référence (4), en au moins une position (X, Y), la position de phases (phase X, phase Y) de la structure périodique (1) par rapport à la structure pixel (2) de l'appareil de prise de vue optique. L'image reproduite (6) est subdivisée en zones d'inspection (7) et l'on détermine, pour chaque zone d'inspection (7), la position de phases (phase X, phase Y) de la structure périodique (1) par rapport à la structure pixel (2) de l'appareil de prise de vue optique. Pour la comparaison d'une zone d'inspection (7) avec l'image de référence (4), une zone d'image de référence (8) est sélectionnée, zone dont la position de phases (phaseX, phase Y) correspond à la zone d'inspection (7).
EP06841039A 2006-01-07 2006-12-19 Procede et systeme destines a l'inspection optique d'une structure periodique Withdrawn EP1979875A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006000946A DE102006000946B4 (de) 2006-01-07 2006-01-07 Verfahren und System zur Inspektion einer periodischen Struktur
PCT/EP2006/012233 WO2007079934A2 (fr) 2006-01-07 2006-12-19 Procede et systeme destines a l'inspection optique d'une structure periodique

Publications (1)

Publication Number Publication Date
EP1979875A2 true EP1979875A2 (fr) 2008-10-15

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Application Number Title Priority Date Filing Date
EP06841039A Withdrawn EP1979875A2 (fr) 2006-01-07 2006-12-19 Procede et systeme destines a l'inspection optique d'une structure periodique

Country Status (9)

Country Link
US (1) US20090129682A1 (fr)
EP (1) EP1979875A2 (fr)
JP (1) JP2009522561A (fr)
KR (1) KR101031618B1 (fr)
CN (1) CN101405766B (fr)
DE (1) DE102006000946B4 (fr)
IL (1) IL192020A (fr)
TW (1) TWI403718B (fr)
WO (1) WO2007079934A2 (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010053759A1 (de) 2010-12-08 2012-06-14 Soft Control Gmbh Automatisierungstechnik Verfahren zur Prüfung periodischer Strukturen an fortlaufender Ware mit zwei Kameras
DE102010061559A1 (de) * 2010-12-27 2012-06-28 Dr. Schneider Kunststoffwerke Gmbh Vorrichtung zum Erkennen von Folienverarbeitungsfehlern
EP2497734B1 (fr) * 2011-03-10 2015-05-13 SSM Schärer Schweiter Mettler AG Procédé d'investigation de la qualité de densité du renvideur de fil sur une bobine de fil
DE102012101242A1 (de) * 2012-02-16 2013-08-22 Hseb Dresden Gmbh Inspektionsverfahren
TWI496091B (zh) * 2012-04-06 2015-08-11 Benq Materials Corp 薄膜檢測方法及檢測裝置
KR20140067840A (ko) * 2012-11-27 2014-06-05 엘지디스플레이 주식회사 주기적인 패턴이 형성된 이미지의 결함 검출장치 및 결함 검출방법
US10062155B2 (en) 2013-11-19 2018-08-28 Lg Display Co., Ltd. Apparatus and method for detecting defect of image having periodic pattern
CN103630547B (zh) * 2013-11-26 2016-02-03 明基材料有限公司 具有周期性结构的光学薄膜的瑕疵检测方法及其检测装置
DE102015223853A1 (de) 2015-12-01 2017-06-01 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Anordnung zur Bestimmung der Tiefe von in Oberflächen eines Substrates, auf dem mindestens eine Schicht aus einem vom Substratmaterial abweichenden Material ausgebildet ist, ausgebildeten Vertiefungen
RU2688239C1 (ru) * 2018-08-07 2019-05-21 Акционерное общество "Гознак" (АО "Гознак") Способ видеоконтроля качества повтора квазиидентичных объектов на основе скоростных алгоритмов сравнения плоских периодических структур рулонного полотна
CN111325707B (zh) * 2018-12-13 2021-11-30 深圳中科飞测科技股份有限公司 一种图像处理方法和系统、检测方法和系统
JP7317747B2 (ja) * 2020-02-28 2023-07-31 株式会社Ｉｈｉエアロスペース 検査装置および検査方法
US11867630B1 (en) 2022-08-09 2024-01-09 Glasstech, Inc. Fixture and method for optical alignment in a system for measuring a surface in contoured glass sheets

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4805123A (en) * 1986-07-14 1989-02-14 Kla Instruments Corporation Automatic photomask and reticle inspection method and apparatus including improved defect detector and alignment sub-systems

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4595289A (en) * 1984-01-25 1986-06-17 At&T Bell Laboratories Inspection system utilizing dark-field illumination
US4969198A (en) * 1986-04-17 1990-11-06 International Business Machines Corporation System for automatic inspection of periodic patterns
US5586058A (en) * 1990-12-04 1996-12-17 Orbot Instruments Ltd. Apparatus and method for inspection of a patterned object by comparison thereof to a reference
US5513275A (en) * 1993-01-12 1996-04-30 Board Of Trustees Of The Leland Stanford Junior University Automated direct patterned wafer inspection
JPH10213422A (ja) * 1997-01-29 1998-08-11 Hitachi Ltd パタ−ン検査装置
US6219443B1 (en) * 1998-08-11 2001-04-17 Agilent Technologies, Inc. Method and apparatus for inspecting a display using a relatively low-resolution camera
JP2000121570A (ja) * 1998-10-20 2000-04-28 Hitachi Electronics Eng Co Ltd 欠陥検査装置
US6831995B1 (en) * 1999-03-23 2004-12-14 Hitachi, Ltd. Method for detecting a defect in a pixel of an electrical display unit and a method for manufacturing an electrical display unit
US6879391B1 (en) * 1999-05-26 2005-04-12 Kla-Tencor Technologies Particle detection method and apparatus
US6603877B1 (en) * 1999-06-01 2003-08-05 Beltronics, Inc. Method of and apparatus for optical imaging inspection of multi-material objects and the like
US6463184B1 (en) * 1999-06-17 2002-10-08 International Business Machines Corporation Method and apparatus for overlay measurement
JP2001148017A (ja) * 1999-11-24 2001-05-29 Hitachi Electronics Eng Co Ltd 基板検査装置
WO2001067390A1 (fr) * 2000-03-08 2001-09-13 Seiko Instruments Inc. Lecteur d'image
JP4674002B2 (ja) * 2001-05-29 2011-04-20 株式会社アドバンテスト 位置検出装置、位置検出方法、電子部品搬送装置及び電子ビーム露光装置
DE10161737C1 (de) * 2001-12-15 2003-06-12 Basler Ag Verfahren zum optischen Erfassen von lokalen Fehlern in einer periodischen Struktur
JP4008291B2 (ja) * 2002-06-10 2007-11-14 大日本スクリーン製造株式会社 パターン検査装置、パターン検査方法およびプログラム
US7043071B2 (en) * 2002-09-13 2006-05-09 Synopsys, Inc. Soft defect printability simulation and analysis for masks
US8111898B2 (en) * 2002-12-06 2012-02-07 Synopsys, Inc. Method for facilitating automatic analysis of defect printability
DE10258371B4 (de) * 2002-12-12 2004-12-16 Infineon Technologies Ag Verfahren zur Inspektion von periodischen Gitterstrukturen auf Lithographiemasken
JP2004212221A (ja) * 2002-12-27 2004-07-29 Toshiba Corp パターン検査方法及びパターン検査装置
JP4381847B2 (ja) * 2004-02-26 2009-12-09 株式会社トプコン 光画像計測装置
JP4061289B2 (ja) * 2004-04-27 2008-03-12 独立行政法人科学技術振興機構 画像検査方法及び装置
US7215808B2 (en) * 2004-05-04 2007-05-08 Kla-Tencor Technologies Corporation High throughout image for processing inspection images

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4805123A (en) * 1986-07-14 1989-02-14 Kla Instruments Corporation Automatic photomask and reticle inspection method and apparatus including improved defect detector and alignment sub-systems
US4805123B1 (en) * 1986-07-14 1998-10-13 Kla Instr Corp Automatic photomask and reticle inspection method and apparatus including improved defect detector and alignment sub-systems

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IL192020A (en) 2015-05-31
KR101031618B1 (ko) 2011-04-27
WO2007079934A2 (fr) 2007-07-19
US20090129682A1 (en) 2009-05-21
CN101405766A (zh) 2009-04-08
TW200732655A (en) 2007-09-01
TWI403718B (zh) 2013-08-01
CN101405766B (zh) 2011-08-17
IL192020A0 (en) 2008-12-29
WO2007079934A3 (fr) 2008-10-02
KR20080100341A (ko) 2008-11-17
DE102006000946B4 (de) 2007-11-15
JP2009522561A (ja) 2009-06-11
DE102006000946A1 (de) 2007-07-12

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