EP1970764A3 - Lithographische Vorrichtung und Verfahren - Google Patents

Lithographische Vorrichtung und Verfahren Download PDF

Info

Publication number
EP1970764A3
EP1970764A3 EP08250736A EP08250736A EP1970764A3 EP 1970764 A3 EP1970764 A3 EP 1970764A3 EP 08250736 A EP08250736 A EP 08250736A EP 08250736 A EP08250736 A EP 08250736A EP 1970764 A3 EP1970764 A3 EP 1970764A3
Authority
EP
European Patent Office
Prior art keywords
substrate
radiation
constructed
lithographic apparatus
patterning device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08250736A
Other languages
English (en)
French (fr)
Other versions
EP1970764A2 (de
Inventor
Christiaan Alexander Hoogendam
Franciscus Johannes Joseph Janssen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ASML Netherlands BV
Original Assignee
ASML Netherlands BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ASML Netherlands BV filed Critical ASML Netherlands BV
Publication of EP1970764A2 publication Critical patent/EP1970764A2/de
Publication of EP1970764A3 publication Critical patent/EP1970764A3/de
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0432—Apparatus for thermal treatment mainly by conduction

Landscapes

  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Electron Beam Exposure (AREA)
EP08250736A 2007-03-12 2008-03-04 Lithographische Vorrichtung und Verfahren Withdrawn EP1970764A3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/716,670 US8760621B2 (en) 2007-03-12 2007-03-12 Lithographic apparatus and method

Publications (2)

Publication Number Publication Date
EP1970764A2 EP1970764A2 (de) 2008-09-17
EP1970764A3 true EP1970764A3 (de) 2010-07-07

Family

ID=39590611

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08250736A Withdrawn EP1970764A3 (de) 2007-03-12 2008-03-04 Lithographische Vorrichtung und Verfahren

Country Status (7)

Country Link
US (1) US8760621B2 (de)
EP (1) EP1970764A3 (de)
JP (1) JP4700076B2 (de)
KR (1) KR100952445B1 (de)
CN (1) CN101266412B (de)
SG (1) SG146541A1 (de)
TW (1) TWI470362B (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL2003470A (en) * 2008-10-07 2010-04-08 Asml Netherlands Bv Lithographic apparatus and device manufacturing method.
NL2007834A (en) 2010-12-23 2012-06-27 Asml Netherlands Bv Lithographic apparatus and removable member.
EP2515170B1 (de) * 2011-04-20 2020-02-19 ASML Netherlands BV Wärmekonditionierungssystem zur Wärmekonditionierung eines Teils einer lithografischen Vorrichtung und Wärmekonditionierungsverfahren
CN104281019B (zh) * 2013-07-08 2016-02-17 中芯国际集成电路制造(上海)有限公司 光刻的迭对值校准方法
US11222783B2 (en) * 2017-09-19 2022-01-11 Taiwan Semiconductor Manufacturing Co., Ltd. Using cumulative heat amount data to qualify hot plate used for postexposure baking

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997014077A1 (en) * 1995-10-12 1997-04-17 Megapanel Corporation Magnification control and thermal substrate chuck for photolithography
US6215642B1 (en) * 1999-03-11 2001-04-10 Nikon Corporation Of Japan Vacuum compatible, deformable electrostatic chuck with high thermal conductivity
US20040200226A1 (en) * 2003-04-08 2004-10-14 Shinichi Hara Exposure apparatus
EP1548503A2 (de) * 2003-12-22 2005-06-29 ASML Netherlands BV Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung
EP1650604A2 (de) * 2004-10-22 2006-04-26 ASML Netherlands B.V. Apparat und Verfahren zur Halterung und thermischen Konditionierung eines Substrats, eine Haltevorrichtung, ein Chuck und ein diese Haltevorrichtung enthaltender lithographischer Apparat
US20060102277A1 (en) * 2004-11-16 2006-05-18 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03102850A (ja) * 1989-09-18 1991-04-30 Fujitsu Ltd ウェハホルダ
US5220171A (en) 1990-11-01 1993-06-15 Canon Kabushiki Kaisha Wafer holding device in an exposure apparatus
US5155652A (en) * 1991-05-02 1992-10-13 International Business Machines Corporation Temperature cycling ceramic electrostatic chuck
JPH06283594A (ja) * 1993-03-24 1994-10-07 Tokyo Electron Ltd 静電チャック
US5738165A (en) 1993-05-07 1998-04-14 Nikon Corporation Substrate holding apparatus
JPH07142555A (ja) 1993-06-29 1995-06-02 Hitachi Ltd ウエハチャック
JPH0729831U (ja) * 1993-11-11 1995-06-02 株式会社ニコン 露光装置の基板保持装置
US6073681A (en) 1997-12-31 2000-06-13 Temptronic Corporation Workpiece chuck
US6019164A (en) * 1997-12-31 2000-02-01 Temptronic Corporation Workpiece chuck
JP4700819B2 (ja) * 2000-03-10 2011-06-15 キヤノン株式会社 基板保持装置、半導体製造装置および半導体デバイス製造方法
JP2004505443A (ja) * 2000-07-10 2004-02-19 テンプトロニック　コーポレイション 交互配置された加熱および冷却要素と交換可能な上面アセンブリと硬膜層表面とをもつ熱プレートを有するウェーハチャック
JP2003068626A (ja) * 2001-08-29 2003-03-07 Canon Inc 露光装置内ユニットの輻射冷却方法及び輻射冷却装置
JP2003282685A (ja) 2002-03-27 2003-10-03 Sumitomo Metal Ind Ltd 冷却プレート
EP1359466A1 (de) * 2002-05-01 2003-11-05 ASML Netherlands B.V. Halter, lithographischer Projektionsapparat, Verfahren zur Herstellung eines Halters und Verfahren zur Herstellung einer Vorrichtung
JP2004103799A (ja) * 2002-09-09 2004-04-02 Canon Inc 基板保持装置、デバイス製造装置及びデバイス製造方法
US7105836B2 (en) * 2002-10-18 2006-09-12 Asml Holding N.V. Method and apparatus for cooling a reticle during lithographic exposure
CN100568101C (zh) * 2002-11-12 2009-12-09 Asml荷兰有限公司 光刻装置和器件制造方法
EP1491967A1 (de) * 2003-06-27 2004-12-29 ASML Netherlands B.V. Verfahren und Vorrichtung zur Positionierung eines Substrats auf einem Substrattisch
US7061579B2 (en) * 2003-11-13 2006-06-13 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
WO2005074450A2 (en) * 2004-01-30 2005-08-18 Tokyo Electron Limited Substrate holder having a fluid gap and method of fabricating the substrate holder
US8749762B2 (en) * 2004-05-11 2014-06-10 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
FR2873497B1 (fr) * 2004-07-23 2014-03-28 Accumulateurs Fixes Accumulateur electrochimique au lithium fonctionnant a haute temperature
US7196768B2 (en) 2004-10-26 2007-03-27 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
JP2006211812A (ja) * 2005-01-27 2006-08-10 Canon Inc 位置決め装置、露光装置、並びにデバイス製造方法
JP2006310374A (ja) 2005-04-26 2006-11-09 Sumitomo Electric Ind Ltd ウェハ保持体及びウェハ保持体を備えた露光装置
JP2007081279A (ja) * 2005-09-16 2007-03-29 Nikon Corp ステージ装置および露光装置
US7649611B2 (en) * 2005-12-30 2010-01-19 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997014077A1 (en) * 1995-10-12 1997-04-17 Megapanel Corporation Magnification control and thermal substrate chuck for photolithography
US6215642B1 (en) * 1999-03-11 2001-04-10 Nikon Corporation Of Japan Vacuum compatible, deformable electrostatic chuck with high thermal conductivity
US20040200226A1 (en) * 2003-04-08 2004-10-14 Shinichi Hara Exposure apparatus
EP1548503A2 (de) * 2003-12-22 2005-06-29 ASML Netherlands BV Lithographischer Apparat und Verfahren zur Herstellung einer Vorrichtung
EP1650604A2 (de) * 2004-10-22 2006-04-26 ASML Netherlands B.V. Apparat und Verfahren zur Halterung und thermischen Konditionierung eines Substrats, eine Haltevorrichtung, ein Chuck und ein diese Haltevorrichtung enthaltender lithographischer Apparat
US20060102277A1 (en) * 2004-11-16 2006-05-18 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

Also Published As

Publication number Publication date
TW200848948A (en) 2008-12-16
KR100952445B1 (ko) 2010-04-12
US20080225244A1 (en) 2008-09-18
EP1970764A2 (de) 2008-09-17
CN101266412A (zh) 2008-09-17
SG146541A1 (en) 2008-10-30
TWI470362B (zh) 2015-01-21
JP4700076B2 (ja) 2011-06-15
KR20080083572A (ko) 2008-09-18
US8760621B2 (en) 2014-06-24
JP2008227489A (ja) 2008-09-25
CN101266412B (zh) 2011-02-16

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