Classifications

• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
  • C03B33/00—Severing cooled glass
  • C03B33/09—Severing cooled glass by thermal shock
  • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
  • C03B33/00—Severing cooled glass
  • C03B33/09—Severing cooled glass by thermal shock
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/36—Removing material
  • B23K26/40—Removing material taking account of the properties of the material involved
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
  • B23K26/50—Working by transmitting the laser beam through or within the workpiece
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B28—WORKING CEMENT, CLAY, OR STONE
  • B28D—WORKING STONE OR STONE-LIKE MATERIALS
  • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
  • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
  • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B28—WORKING CEMENT, CLAY, OR STONE
  • B28D—WORKING STONE OR STONE-LIKE MATERIALS
  • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
  • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
  • B28D5/0052—Means for supporting or holding work during breaking
• • C—CHEMISTRY; METALLURGY
  • C03—GLASS; MINERAL OR SLAG WOOL
  • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
  • C03B33/00—Severing cooled glass
  • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
  • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
  • C03B33/033—Apparatus for opening score lines in glass sheets
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
  • B23K2103/00—Materials to be soldered, welded or cut
  • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T225/00—Severing by tearing or breaking
  • Y10T225/30—Breaking or tearing apparatus
  • Y10T225/304—Including means to apply thermal shock to work

Definitions

• the invention relates to a device of the type mentioned in the preamble of claim 1 for the cutting-through processing of components made of brittle material, for example glass, ceramic, glass-ceramic, by generating a thermally induced stress crack on the component in a separation zone.
• components made of brittle material for example glass, ceramic, glass-ceramic
• WO 02/48059 Al is a device of the type in question for the severing processing of components made of brittle material, for example
• the known device has a bearing surface. Furthermore, the known from the document device comprises means for acting on the component with mechanical stresses to promote the thermally induced stress crack.
• the basic idea of the teaching according to the invention is to provide a bearing surface with at least two bearing surface sections which are movable relative to one another.
• a first position of the bearing surface sections relative to each other is the component stored substantially free of mechanical stresses on the bearing surface.
• mechanical stresses in this sense, such mechanical stresses are understood according to the invention, which are generated by the means for acting on the component with mechanical stresses, but not other mechanical stresses resulting for example from the weight of the component.
• the component In the second position of the bearing surface sections relative to each other, the component is, in contrast, subjected to mechanical stresses which are generated by the means for acting on the component with mechanical stresses for promoting the thermally induced stress crack.
• thermally induced stress crack is fundamentally based on the fact that brittle fracture chiges material with appropriate heating, for example by laser radiation, and corresponding subsequent cooling breaks. Moreover, the generation of a thermally induced stress crack is generally known to the person skilled in the art and will therefore not be explained in more detail here. In this context, reference is made to WO 02/48059 A1, the entire disclosure content of which is hereby incorporated by reference into the present application.
• An advantageous development of the teaching according to the invention provides that the bearing surface sections lie in the first position substantially in a common plane and in a second position at least partially in different planes. This embodiment is particularly well suited for processing substantially planar components, for example flat glass panes.
• the bearing surface sections on a common bearing surface, for example a bearing surface, which consists of a flexible material.
• a reflector made of a flexible material, on which the component rests.
• the component can be subjected to mechanical stresses, for example, by applying a pressurizing element to the side of the component facing away from the reflector. Due to the pressurization, the component and the flexible reflector bend through, causing the both sides of the
• Bending line lying bearing surface portions are moved to the second position in which the component is subjected to mechanical stresses.
• the bearing surface sections are each formed on a bearing element.
• a development of the aforementioned embodiment provides that between the bearing elements at least one gap is formed, on which the laser beam is directed during processing, and that the means for acting on the component with mechanical stresses are designed such that the mechanical stresses in Area of the gap act on the component.
• This embodiment allows a particularly precise loading of the component with mechanical stresses with a simple and relatively inexpensive construction, wherein a reflector can be arranged in the gap, which reflects the laser beam emitted by the laser beam.
• the component can be acted upon according to the invention with mechanical stresses of any suitable type, for example tensile stresses, insofar as these promote the processing or separation process.
• mechanical stresses of any suitable type, for example tensile stresses, insofar as these promote the processing or separation process.
• the device according to the invention can be designed particularly simple and therefore cost. Another advantage of applying the component with bending stresses is that with regard to the achievement of a desired stress distribution in the component a particularly high precision is made possible.
• Separation zone which also lies in the region of the gap in this embodiment.
• the means for acting on the component can be designed with mechanical stresses in any suitable manner.
• at least one of the bearing elements is movable perpendicular to the surface of the component, such that the means for applying the component with mechanical stresses at least partially is formed by the bearing element or the bearing elements or are.
• the bearing elements serve not only the storage, but also the loading of the component with mechanical stresses.
• the bearing elements are movable relative to each other.
• a development of the aforementioned embodiment provides that at least one of the bearing elements along a linear adjustment axis, in particular in the vertical direction, is adjustable. In this embodiment, a particularly simple construction of the device according to the invention results.
• At least one of the bearing elements is movable, provides that at least one of the bearing elements is pivotable about a preferably substantially horizontal pivot axis. Due to the pivotable mounting of at least one of the bearing elements, the construction Part particularly uniform and precise with mechanical stresses, in particular bending stresses acted upon.
• a further development of this embodiment provides that at least two bearing elements can be pivoted in opposite directions about preferably mutually substantially parallel pivot axes.
• the means for acting on the component with mechanical stresses are formed completely or partially by the bearing elements or one of the bearing elements.
• the means for acting on the component with mechanical stresses have at least one loading element which can be brought into contact with the component for acting on the component.
• the loading element on that side of the component on which the laser is also arranged.
• an application element which consists of a material that is highly transmissive to laser radiation of the wavelength used and in the beam path of the
• the biasing element acts on the component directly in the sphere of action of the laser, namely in the separation zone, with mechanical stresses.
• the Beaufschlagungselement on the side facing away from the laser side of the component is arranged.
• Another development of the embodiment with the loading element provides that the loading element is arranged in the gap.
• the loading element can be designed in any way suitable for acting on the component with mechanical stresses.
• the admission element is designed as a pressure element for pressurizing the component.
• the pressurization of the component can serve according to the invention, in particular, to generate bending stresses in the component.
• the urging element is designed as a wheel rolling on the component.
• a pressurization of the component is made possible in a simple manner, without causing excessive friction between the urging member and the component.
• a development of the aforementioned embodiment provides that the wheel follows the laser beam in the direction of movement along the separation zone.
• the mechanical stresses are generated in the region in which the material of the component cools after irradiation with the laser beam and in which thus the thermally induced stress crack occurs.
• the thermally induced and mechanical stresses act at the same point in the separation zone.
• FIG. 1 is an indicated perspective side view of a first embodiment of a device according to the invention in a state in which the component is not subjected to mechanical stresses
• FIG. 3 in the same representation as FIG. 2 shows a second embodiment of a device according to the invention
• FIG. 4 shows, in the same representation as FIG. 2, a third exemplary embodiment of a device according to the invention
• FIG. 5 in the same representation as FIG. 2, a fourth embodiment of a device according to the invention, FIG. 6 in the same representation as FIG. 2, a fifth embodiment of a device according to the invention, FIG.
• Fig. 7 is a side view of the device according to FIGS. 6 and Fig. 8 in the same representation as Fig. 2 shows a sixth embodiment of a device according to the invention.
• the device 2 is used in this embodiment for cutting through a component formed by a glass plate 4.
• the device 2 has a laser 6 for directing a laser beam 8 on the component to be machined, such that the component of the laser beam simultaneously or temporally successive along a separation zone, in which the thermally induced stress crack is formed, at least partially twice transmitted at the same point or at mutually spaced apart spots with partial absorption.
• the device 2 has a first reflector 10 arranged on the side facing away from the laser 6 and a second reflector 12 arranged on the side of the laser 6.
• the laser beam 8 is reflected back and forth between the reflectors 10, 12, so that the component transmits the laser beam 8 multiple times under partial absorption.
• the device 2 has a bearing surface 14, which in this exemplary embodiment is formed according to the invention on two flat bearing elements 16, 18, on each of which a bearing surface section 13, 15 and between which a gap 20 is formed, in which the first reflector 10 is arranged, as shown in FIG. 1 can be seen.
• the laser beam 8 is thus directed to the gap 20 between the bearing elements 16, 18.
• Inventively provided means for acting on the component 4 with mechanical stresses are formed in this embodiment by the bearing elements 16, 18, as will be explained in more detail below with reference to FIG. 2.
• FIG. 2 shows the device 2 according to FIG. 1 in a state in which the component 4 is subjected to mechanical stresses, namely bending stresses, which are superimposed on the thermally induced stresses which arise in the component 4 as a result of irradiation with the laser beam 8
• the means for acting on the component 4 with mechanical stresses are formed in this embodiment by the bearing elements 16, 18, which are movable relative to each other and perpendicular to the surface of the component 4, namely to pivot axes 22, 24 parallel to each other in opposite directions.
• the component 4 is deflected in the opposite pivoting of the bearing elements 16, 18, so that in the separation zone, which is located above the gap 20, mechanical bending stresses form that generated by the laser beam 8 thermally induced voltages are superimposed.
• the maximum is a by applying the component 4 with mechanical stresses in the construction Part 4 achieved stress distribution in the region of the gap 20.
• the mechanical bending stress promotes the propagation of the generated by the laser beam 8, thermally induced stress crack and accelerated significantly.
• a second embodiment of a device 2 according to the invention is shown, which differs from the embodiment of FIG. 1 in that only the bearing member 18 is pivotable about a pivot axis 24, while the bearing member 16 is arranged stationary.
• FIG. 4 shows a third exemplary embodiment of a device 2 according to the invention, which differs from the exemplary embodiment according to FIG. 1 in that the means for acting on the component 4 with mechanical stresses are not formed by the bearing elements 16, 18, but instead that, moreover, a separate loading element 30 is provided on whose side facing the component 4 the first reflector 10 is formed.
• the biasing member 30 is for applying the component 4 with mechanical stresses in contact with the same brought and for this purpose in the illustrated embodiment in
• the loading element 30 For loading the component 4 with mechanical stresses, the loading element 30 is brought into contact with the component 4 and practices; a compressive force on the component 4, so that form in the same bending stresses.
• a fourth embodiment of a device 2 according to the invention is shown, which differs from the embodiment of FIG. 4 in that the biasing member 30 is disposed on that side of the component 4, on which the laser 6 is arranged.
• the loading element 30 consists of a material which is highly transmissive to the laser radiation of the wavelength used and is irradiated by the laser beam 8, as shown in FIG.
• a fifth embodiment of a device 2 according to the invention is shown, which differs from the embodiment of FIG. 5 in that the biasing element is formed by a rolling on the component 4 wheel 34.
• the wheel 34 follows the laser beam 8 in its direction of movement along the separation zone indicated in FIG. 7 by an arrow 36.
• a sixth embodiment of a device 2 according to the invention is shown, which differs from the embodiments according to FIGS. 1 to 7 in that the bearing surface 14 is not formed on two bearing elements, but on a single bearing element 38.
• the bearing element 38 is made of a flexible material, for example an elastomer with a suitable modulus of elasticity.
• On its the component 4 facing surface carries the bearing element
• the embodiment shown in FIG. Form further comprises a rod-like pressure application element 40, through which the component 4 can be acted upon by a pressure force.
• the operation of the embodiment illustrated in FIG. 8 is as follows:
• the pressurizing element 40 exerts a compressive force acting in the direction of an arrow 42 on the component 4, on the basis of which the component 4 together with the bearing element 38 and deflects the reflector 10. In this way, mechanical stresses are introduced into the component 4.
• the pressure force exerted by the pressure-exerting element 40 is selected such that it promotes the formation of the thermally induced stress crack in a defined manner.

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• Engineering & Computer Science (AREA)
• Chemical & Material Sciences (AREA)
• Physics & Mathematics (AREA)
• Mechanical Engineering (AREA)
• Optics & Photonics (AREA)
• Organic Chemistry (AREA)
• Materials Engineering (AREA)
• Plasma & Fusion (AREA)
• Thermal Sciences (AREA)
• Health & Medical Sciences (AREA)
• Toxicology (AREA)
• Chemical Kinetics & Catalysis (AREA)
• General Chemical & Material Sciences (AREA)
• Oil, Petroleum & Natural Gas (AREA)
• Laser Beam Processing (AREA)
• Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
• Processing Of Stones Or Stones Resemblance Materials (AREA)

Applications Claiming Priority (3)

Publications (1)

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• 2006
  • 2006-04-21 DE DE200610018622 patent/DE102006018622B3/de not_active Expired - Fee Related
  • 2006-12-06 WO PCT/EP2006/011714 patent/WO2007079847A1/de active Application Filing
  • 2006-12-06 KR KR1020087016195A patent/KR20080095846A/ko not_active Application Discontinuation
  • 2006-12-06 JP JP2008547867A patent/JP2009522129A/ja active Pending
  • 2006-12-16 EP EP06829344A patent/EP1968906A1/de not_active Withdrawn
  • 2006-12-27 TW TW095149278A patent/TW200732262A/zh unknown
• 2008
  • 2008-06-30 US US12/216,178 patent/US20090014492A1/en not_active Abandoned

Non-Patent Citations (1)

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