EP1952449A4 - OPTICAL COMPONENTS WITH TEXTURED SEMICONDUCTOR LAYERS - Google Patents
OPTICAL COMPONENTS WITH TEXTURED SEMICONDUCTOR LAYERSInfo
- Publication number
- EP1952449A4 EP1952449A4 EP06827176A EP06827176A EP1952449A4 EP 1952449 A4 EP1952449 A4 EP 1952449A4 EP 06827176 A EP06827176 A EP 06827176A EP 06827176 A EP06827176 A EP 06827176A EP 1952449 A4 EP1952449 A4 EP 1952449A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- semiconductor layers
- optical devices
- devices featuring
- textured semiconductor
- featuring textured
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 230000003287 optical effect Effects 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
- H01L33/24—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
- H01L33/06—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/02428—Structure
- H01L21/0243—Surface structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/02433—Crystal orientation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02439—Materials
- H01L21/02455—Group 13/15 materials
- H01L21/02458—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02436—Intermediate layers between substrates and deposited layers
- H01L21/02494—Structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/08—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
- Luminescent Compositions (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US73203405P | 2005-10-31 | 2005-10-31 | |
PCT/US2006/042483 WO2007053624A2 (en) | 2005-10-31 | 2006-10-31 | Optical devices featuring textured semiconductor layers |
Publications (2)
Publication Number | Publication Date |
---|---|
EP1952449A2 EP1952449A2 (en) | 2008-08-06 |
EP1952449A4 true EP1952449A4 (en) | 2011-06-29 |
Family
ID=38006465
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP06827176A Withdrawn EP1952449A4 (en) | 2005-10-31 | 2006-10-31 | OPTICAL COMPONENTS WITH TEXTURED SEMICONDUCTOR LAYERS |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1952449A4 (ja) |
JP (1) | JP2009515340A (ja) |
CN (1) | CN101506937A (ja) |
CA (1) | CA2627880A1 (ja) |
WO (1) | WO2007053624A2 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101502195B1 (ko) * | 2007-11-21 | 2015-03-12 | 미쓰비시 가가꾸 가부시키가이샤 | 질화물 반도체 및 질화물 반도체의 결정 성장 방법 그리고 질화물 반도체 발광 소자 |
EP2232591A4 (en) * | 2007-12-10 | 2013-12-25 | 3M Innovative Properties Co | FREQUENCY-REDUCED LIGHT EMITTING DIODE WITH SIMPLIFIED LIGHT EXTRACTION |
US8492737B2 (en) | 2010-11-18 | 2013-07-23 | The Arizona Board Of Regents On Behalf Of The University Of Arizona | Tunable infrared emitter |
TW201436263A (zh) * | 2013-01-25 | 2014-09-16 | Corsam Technologies Llc | 光伏雙重紋理化玻璃 |
CN103280504A (zh) * | 2013-05-14 | 2013-09-04 | 西安神光皓瑞光电科技有限公司 | 一种用于提高发光器件效率的方法 |
CN104253179A (zh) * | 2013-06-28 | 2014-12-31 | 晶能光电(江西)有限公司 | 一种GaN基LED外延片的制备方法 |
CN103413876A (zh) * | 2013-08-09 | 2013-11-27 | 西安神光皓瑞光电科技有限公司 | 一种发光器件及其制备方法 |
JP6434878B2 (ja) * | 2015-09-10 | 2018-12-05 | 株式会社東芝 | 発光装置 |
JP6846913B2 (ja) * | 2016-11-11 | 2021-03-24 | 日本碍子株式会社 | 広波長域発光素子および広波長域発光素子の作製方法 |
FR3068484B1 (fr) * | 2017-06-29 | 2019-11-22 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Projecteur couleur a deux ecrans emissifs. |
CN113228309B (zh) * | 2019-11-26 | 2022-04-29 | 重庆康佳光电技术研究院有限公司 | 发光二极管结构 |
CN113140618B (zh) * | 2021-03-31 | 2023-02-10 | 福建中晶科技有限公司 | 一种蓝宝石复合衬底及其制备方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050056850A1 (en) * | 2003-09-17 | 2005-03-17 | Toyoda Gosei Co., Ltd. | GaN based semiconductor light emitting device and method of making the same |
US20050082544A1 (en) * | 2003-10-20 | 2005-04-21 | Yukio Narukawa | Nitride semiconductor device, and its fabrication process |
US20050242364A1 (en) * | 2004-04-15 | 2005-11-03 | Moustakas Theodore D | Optical devices featuring textured semiconductor layers |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3424465B2 (ja) * | 1996-11-15 | 2003-07-07 | 日亜化学工業株式会社 | 窒化物半導体素子及び窒化物半導体の成長方法 |
JP3282174B2 (ja) * | 1997-01-29 | 2002-05-13 | 日亜化学工業株式会社 | 窒化物半導体発光素子 |
CN1159750C (zh) * | 1997-04-11 | 2004-07-28 | 日亚化学工业株式会社 | 氮化物半导体的生长方法 |
US6294440B1 (en) * | 1998-04-10 | 2001-09-25 | Sharp Kabushiki Kaisha | Semiconductor substrate, light-emitting device, and method for producing the same |
WO1999066565A1 (en) * | 1998-06-18 | 1999-12-23 | University Of Florida | Method and apparatus for producing group-iii nitrides |
US6252261B1 (en) * | 1998-09-30 | 2001-06-26 | Nec Corporation | GaN crystal film, a group III element nitride semiconductor wafer and a manufacturing process therefor |
JP3511923B2 (ja) * | 1998-12-25 | 2004-03-29 | 日亜化学工業株式会社 | 発光素子 |
JP3619053B2 (ja) * | 1999-05-21 | 2005-02-09 | キヤノン株式会社 | 光電変換装置の製造方法 |
JP4145437B2 (ja) * | 1999-09-28 | 2008-09-03 | 住友電気工業株式会社 | 単結晶GaNの結晶成長方法及び単結晶GaN基板の製造方法と単結晶GaN基板 |
JP3725382B2 (ja) * | 1999-11-11 | 2005-12-07 | 株式会社東芝 | 半導体素子の製造方法および半導体発光素子の製造方法 |
JP4197814B2 (ja) * | 1999-11-12 | 2008-12-17 | シャープ株式会社 | Led駆動方法およびled装置と表示装置 |
JP4055503B2 (ja) * | 2001-07-24 | 2008-03-05 | 日亜化学工業株式会社 | 半導体発光素子 |
JP4158519B2 (ja) * | 2002-12-26 | 2008-10-01 | 住友電気工業株式会社 | 白色発光素子およびその製造方法 |
JP4397394B2 (ja) * | 2003-01-24 | 2010-01-13 | ディジタル・オプティクス・インターナショナル・コーポレイション | 高密度照明システム |
-
2006
- 2006-10-31 CN CNA2006800496104A patent/CN101506937A/zh active Pending
- 2006-10-31 EP EP06827176A patent/EP1952449A4/en not_active Withdrawn
- 2006-10-31 CA CA002627880A patent/CA2627880A1/en not_active Abandoned
- 2006-10-31 WO PCT/US2006/042483 patent/WO2007053624A2/en active Application Filing
- 2006-10-31 JP JP2008538970A patent/JP2009515340A/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050056850A1 (en) * | 2003-09-17 | 2005-03-17 | Toyoda Gosei Co., Ltd. | GaN based semiconductor light emitting device and method of making the same |
US20050082544A1 (en) * | 2003-10-20 | 2005-04-21 | Yukio Narukawa | Nitride semiconductor device, and its fabrication process |
US20050242364A1 (en) * | 2004-04-15 | 2005-11-03 | Moustakas Theodore D | Optical devices featuring textured semiconductor layers |
Non-Patent Citations (3)
Title |
---|
BHATTACHARYYA A ET AL: "Comparative study of GaN/AlGaN MQWs grown homoepitaxially on (1100) and (0001) GaN", JOURNAL OF CRYSTAL GROWTH, ELSEVIER, AMSTERDAM, NL, vol. 251, no. 1-4, 1 April 2003 (2003-04-01), pages 487 - 493, XP004416295, ISSN: 0022-0248, DOI: 10.1016/S0022-0248(02)02433-8 * |
CABALU J S ET AL: "Nitride LEDs based on flat and "wrinkled" quantum wells", PROCEEDINGS OF THE SPIE - THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING SPIE-INT. SOC. OPT. ENG. USA, vol. 5732, no. 1, 25 March 2005 (2005-03-25), pages 185 - 196, XP002635688, ISSN: 0277-786X, DOI: 10.1117/12.588360 * |
See also references of WO2007053624A2 * |
Also Published As
Publication number | Publication date |
---|---|
CA2627880A1 (en) | 2007-05-10 |
EP1952449A2 (en) | 2008-08-06 |
JP2009515340A (ja) | 2009-04-09 |
CN101506937A (zh) | 2009-08-12 |
WO2007053624A2 (en) | 2007-05-10 |
WO2007053624A3 (en) | 2009-04-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 20080530 |
|
AK | Designated contracting states |
Kind code of ref document: A2 Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR |
|
AX | Request for extension of the european patent |
Extension state: AL BA HR MK RS |
|
R17D | Deferred search report published (corrected) |
Effective date: 20090430 |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: CABALU, JASPER S. Inventor name: MOUSTAKAS, THEODORE, D. |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01L 33/00 20060101ALI20090617BHEP Ipc: H01L 21/00 20060101AFI20090617BHEP |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: CABALU, JASPER S. Inventor name: MOUSTAKAS, THEODORE, D. |
|
RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01L 33/32 20100101ALN20110518BHEP Ipc: H01L 33/08 20100101ALN20110518BHEP Ipc: H01L 33/24 20100101ALI20110518BHEP Ipc: H01L 33/06 20100101ALI20110518BHEP Ipc: H01L 21/00 20060101AFI20090617BHEP |
|
A4 | Supplementary search report drawn up and despatched |
Effective date: 20110527 |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN |
|
18D | Application deemed to be withdrawn |
Effective date: 20110503 |