EP1902152B1 - Apparatus and method for coating a substrate - Google Patents

Apparatus and method for coating a substrate Download PDF

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Publication number
EP1902152B1
EP1902152B1 EP06724611A EP06724611A EP1902152B1 EP 1902152 B1 EP1902152 B1 EP 1902152B1 EP 06724611 A EP06724611 A EP 06724611A EP 06724611 A EP06724611 A EP 06724611A EP 1902152 B1 EP1902152 B1 EP 1902152B1
Authority
EP
European Patent Office
Prior art keywords
container
substrate
coil
conductive material
openings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP06724611A
Other languages
German (de)
English (en)
French (fr)
Other versions
EP1902152A1 (en
Inventor
Johannes Alphonsus F. M. Schade Van Westrum
Laurent Christophe Bernard Baptiste
Gerardus Gleijm
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Corus Technology BV
Original Assignee
Corus Technology BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corus Technology BV filed Critical Corus Technology BV
Priority to EP06724611A priority Critical patent/EP1902152B1/en
Publication of EP1902152A1 publication Critical patent/EP1902152A1/en
Application granted granted Critical
Publication of EP1902152B1 publication Critical patent/EP1902152B1/en
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/26—Vacuum evaporation by resistance or inductive heating of the source
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating

Definitions

  • the levitation and evaporation of conductive material is known from WO 03/071000 A1 .
  • a technology is described for coating a substrate with a layer of the conductive material that is condensed from the vapour phase on the substrate in a vacuum chamber.
  • An amount of conductive material is kept floating above a coil in which a varying electric current is fed. Due to this current, an alternating electromagnetic field is generated in the coil.
  • the electromagnetic field exerts an upward directed force on the conductive material.
  • the electric current also provides electrical energy for heating the levitated conductive material, such that it melts and eventually evaporates; however, some conductive materials do not melt but sublimate.
  • the above apparatus has the drawback that it is difficult to control the coating layer on the substrate. Especially when the apparatus is used to continuously coat a strip passing through the vacuum chamber, it is difficult to produce a coating having a uniform thickness and composition over the width of the strip.
  • JP7252639 discloses an apparatus and method for coating a substrate by physical vapour deposition comprising a vacuum chamber wherein a high frequency coil is placed for keeping an amount of conductive material heated and in levitation. A quartz pipe is placed in the coil to isolate the coil from the levitated material.
  • the container has the form of a duct which has seals at both ends, one or more openings being present in a seal.
  • a simple type of container is provided, with which the plasma is contained in the container and partly released through the openings to coat a substrate during use.
  • the container has been provided with heating means to heat the container.
  • the container should be heated, since the vapour and the plasma would condense against a cold wall.
  • the container has been provided with heating elements made from conductive material, such as resistive wire of molybdenum or tungsten.
  • heating elements made from conductive material, such as resistive wire of molybdenum or tungsten.
  • conductive material such as resistive wire of molybdenum or tungsten.
  • the container has been produced of ceramic material, such as boron nitride or silicon nitride. Ceramic material is very suitable for the conditions to which the apparatus is subjected, such as a high temperature and high thermal shocks and stresses. Moreover, ceramic material has a high thermal conductivity.
  • a method for coating a substrate using physical vapour deposition, using a coil in vacuum for keeping an amount of conductive material in levitation and for heating and evaporating that material, wherein a varying electric current is present in the coil, and wherein isolating means are placed between the coil and the levitated material, the isolating means being part of a container made of non-conductive material that is heated, the container having one or more openings for guiding evaporated conductive material to the substrate to be coated, wherein the evaporated material forms a plasma inside the container, which plasma is released through the openings in the container to coat the substrate.
  • the pressure outside the container in the vacuum chamber has to be lower than the pressure of the plasma, so the plasma can be released through the openings in the container.
  • the pressure in the vacuum chamber is 10 to 1000 times lower than the pressure in the vacuum chamber, more preferably approximately 100 times lower.
  • the substrate coated is a strip that is continuously transported relative to the container.
  • the method according to the invention it is possible to provide a strip having a dense, well adhering coating.
  • a potential gradient is maintained between the substrate and the container, such that the ions are accelerated towards the substrate. Due to the potential gradient, the ions have a high kinetic energy when they impinge on the surface of the substrate. This high kinetic energy either results in the ion adhering to the substrate or the coating already on the substrate, resulting in a very dense and very good adhering coating on the substrate, or in the rebounding of the ion on the surface of the substrate because the energy of the ion is too high. In the latter case, however, part of the energy of the ion is absorbed by the coating on the substrate, resulting in an additional compaction of the coating.
  • the potential between the substrate and the container can be 10 to 40 Volt.
  • a container 2 has a duct-like portion 3 that is placed in the coil 1, in which a vapour is produced. This portion 3 is closed at its lower end and at its higher end is connected to a box-like portion 4 that is designed to fit to a substrate to be coated. In a surface of the portion 4 openings 5 are present.
  • the container 2 is suitable for coating a strip (not shown) that is transported at short distance above the container. For this reason the portion 4 of the container 2 is elongated, so as to be able to coat the full width of the strip.
  • conductive material is introduced in the duct-like portion 3 of the container 2 using a feeding device (not shown).
  • a varying electric current is produced, generating an alternating electromagnetic field. Due to this electromagnetic field, the conductive material is kept levitating above the coil, while at the same time the conductive material is heated.
  • the conductive material in most cases melts to form a droplet 10 and evaporates, and in some cases sublimates without melting.
  • the plasma in the container has a pressure between 10 -1 and 10 -5 mbar, preferably between 10 -2 and 10 -4 mbar. At a pressure above 10 -5 mbar, preferably above 10 -4 mbar a plasma will be generated in the container, an this plasma will be maintained as long as the pressure does not become too high, so not above 10 -1 mbar, preferably not above 10 -2 mbar.
  • the container has to be heated to a temperature equal to or above the temperature of the vapour/plasma, to prevent condensation of the vapour/plasma on the walls of the container.
  • electric coils or wires 8 are used inside the walls of the container.
  • a ceramic material is used, such as boron nitride or silicon nitride, but other ceramics are also possible, such as zirconium oxide, yttrium oxide, hafnium bromide or zirconium bromide, since ceramics are electrically non-conductive.
  • the ions in the plasma Due to the fact that the ions in the plasma are charged, the ions will adhere better to the substrate and form a denser coating.
  • the adherence and the density of the coating can be further improved by applying a potential difference between the container and the substrate to be coated. Due to the potential difference, the ions are accelerated towards the substrate and thus will impinge on the surface having a high velocity. This results in a very good adhering coating having a high density.
  • a suitable potential difference is 10 to 40 Volt.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
EP06724611A 2005-05-31 2006-04-27 Apparatus and method for coating a substrate Not-in-force EP1902152B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP06724611A EP1902152B1 (en) 2005-05-31 2006-04-27 Apparatus and method for coating a substrate

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP05076265 2005-05-31
EP06724611A EP1902152B1 (en) 2005-05-31 2006-04-27 Apparatus and method for coating a substrate
PCT/EP2006/003924 WO2006128532A1 (en) 2005-05-31 2006-04-27 Apparatus and method for coating a substrate

Publications (2)

Publication Number Publication Date
EP1902152A1 EP1902152A1 (en) 2008-03-26
EP1902152B1 true EP1902152B1 (en) 2010-06-23

Family

ID=34981132

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06724611A Not-in-force EP1902152B1 (en) 2005-05-31 2006-04-27 Apparatus and method for coating a substrate

Country Status (21)

Country Link
US (1) US8435352B2 (es)
EP (1) EP1902152B1 (es)
JP (1) JP5394061B2 (es)
KR (1) KR101235457B1 (es)
CN (1) CN101175866B (es)
AR (1) AR053487A1 (es)
AT (1) ATE471997T1 (es)
AU (1) AU2006254452B2 (es)
BR (1) BRPI0610874A2 (es)
CA (1) CA2605147C (es)
DE (1) DE602006015055D1 (es)
ES (1) ES2346902T3 (es)
HK (1) HK1118871A1 (es)
MX (1) MX2007014483A (es)
MY (1) MY141409A (es)
NZ (1) NZ562697A (es)
RU (1) RU2388846C2 (es)
TW (1) TWI461553B (es)
UA (1) UA87916C2 (es)
WO (1) WO2006128532A1 (es)
ZA (1) ZA200709026B (es)

Families Citing this family (19)

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Publication number Priority date Publication date Assignee Title
US20060226003A1 (en) * 2003-01-22 2006-10-12 John Mize Apparatus and methods for ionized deposition of a film or thin layer
US9659758B2 (en) 2005-03-22 2017-05-23 Honeywell International Inc. Coils utilized in vapor deposition applications and methods of production
DE102009042972A1 (de) 2009-09-16 2011-03-24 Technische Universität Ilmenau Vorrichtung und Verfahren zum Manipulieren einer levitierten elektrisch leitfähigen Substanz
US9267203B2 (en) * 2010-12-13 2016-02-23 Posco Continuous coating apparatus
KR101207719B1 (ko) 2010-12-27 2012-12-03 주식회사 포스코 건식 코팅 장치
DE102011018675A1 (de) 2011-04-18 2012-10-18 Technische Universität Ilmenau Vorrichtung und Verfahren zum aktiven Manipulieren einer elektrisch leitfähigen Substanz
CN109070504A (zh) * 2016-04-27 2018-12-21 依视路国际公司 装备有可移动遮板的用于涂覆的基材支架及其使用方法
US11183373B2 (en) 2017-10-11 2021-11-23 Honeywell International Inc. Multi-patterned sputter traps and methods of making
WO2019116082A1 (en) * 2017-12-14 2019-06-20 Arcelormittal Vacuum deposition facility and method for coating a substrate
WO2019116081A1 (en) 2017-12-14 2019-06-20 Arcelormittal Vacuum deposition facility and method for coating a substrate
CN112553578B (zh) 2019-09-26 2022-01-14 宝山钢铁股份有限公司 一种具有抑流式喷嘴的真空镀膜装置
CN112553577A (zh) 2019-09-26 2021-03-26 宝山钢铁股份有限公司 一种提高真空镀膜收得率的真空镀膜装置
CN112575308B (zh) 2019-09-29 2023-03-24 宝山钢铁股份有限公司 一种能在真空下带钢高效镀膜的真空镀膜装置
CN113957392B (zh) 2020-07-21 2022-09-20 宝山钢铁股份有限公司 一种采用混匀缓冲结构均匀分配金属蒸汽的真空镀膜装置
CN113957389B (zh) * 2020-07-21 2023-08-11 宝山钢铁股份有限公司 一种具有多孔降噪及均匀化分配金属蒸汽的真空镀膜装置
CN113957391B (zh) * 2020-07-21 2023-09-12 宝山钢铁股份有限公司 一种采用芯棒加热结构均匀分配金属蒸汽的真空镀膜装置
CN113957390B (zh) * 2020-07-21 2024-03-08 宝山钢铁股份有限公司 一种具有气垫缓冲腔的真空镀膜装置
CN113957388B (zh) 2020-07-21 2022-08-16 宝山钢铁股份有限公司 一种采用导流板式结构均匀分配金属蒸汽的真空镀膜装置
KR102547666B1 (ko) * 2021-01-21 2023-06-27 울산대학교 산학협력단 진공 박막 증착용 분자빔 증발원

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Also Published As

Publication number Publication date
CA2605147A1 (en) 2006-12-07
JP2008542537A (ja) 2008-11-27
AU2006254452B2 (en) 2010-11-18
MX2007014483A (es) 2008-02-05
AU2006254452A1 (en) 2006-12-07
EP1902152A1 (en) 2008-03-26
WO2006128532A1 (en) 2006-12-07
KR20080016642A (ko) 2008-02-21
NZ562697A (en) 2009-12-24
ATE471997T1 (de) 2010-07-15
JP5394061B2 (ja) 2014-01-22
CA2605147C (en) 2011-12-13
AR053487A1 (es) 2007-05-09
US20080280066A1 (en) 2008-11-13
CN101175866A (zh) 2008-05-07
ES2346902T3 (es) 2010-10-21
RU2388846C2 (ru) 2010-05-10
BRPI0610874A2 (pt) 2010-08-03
TW200730648A (en) 2007-08-16
TWI461553B (zh) 2014-11-21
KR101235457B1 (ko) 2013-02-20
HK1118871A1 (en) 2009-02-20
UA87916C2 (ru) 2009-08-25
US8435352B2 (en) 2013-05-07
ZA200709026B (en) 2009-01-28
MY141409A (en) 2010-04-30
DE602006015055D1 (de) 2010-08-05
CN101175866B (zh) 2010-12-15
RU2007148502A (ru) 2009-07-20

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